JP6570055B2 - 半導体チップ、半導体装置及び半導体検査システム - Google Patents

半導体チップ、半導体装置及び半導体検査システム Download PDF

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JP6570055B2
JP6570055B2 JP2015094219A JP2015094219A JP6570055B2 JP 6570055 B2 JP6570055 B2 JP 6570055B2 JP 2015094219 A JP2015094219 A JP 2015094219A JP 2015094219 A JP2015094219 A JP 2015094219A JP 6570055 B2 JP6570055 B2 JP 6570055B2
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tsv
semiconductor chip
substrate
circuit
semiconductor
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JP2016211917A5 (enrdf_load_stackoverflow
JP2016211917A (ja
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佑樹 荒賀
佑樹 荒賀
菊地　克弥
克弥 菊地
青柳　昌宏
昌宏 青柳
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National Institute of Advanced Industrial Science and Technology AIST
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  • Semiconductor Integrated Circuits (AREA)
  • Testing Of Short-Circuits, Discontinuities, Leakage, Or Incorrect Line Connections (AREA)
  • Tests Of Electronic Circuits (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
JP2015094219A 2015-05-01 2015-05-01 半導体チップ、半導体装置及び半導体検査システム Active JP6570055B2 (ja)

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JP2015094219A JP6570055B2 (ja) 2015-05-01 2015-05-01 半導体チップ、半導体装置及び半導体検査システム

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JP2015094219A JP6570055B2 (ja) 2015-05-01 2015-05-01 半導体チップ、半導体装置及び半導体検査システム

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JP2016211917A JP2016211917A (ja) 2016-12-15
JP2016211917A5 JP2016211917A5 (enrdf_load_stackoverflow) 2018-06-14
JP6570055B2 true JP6570055B2 (ja) 2019-09-04

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TW201838094A (zh) * 2017-02-16 2018-10-16 學校法人慶應義塾 層疊半導體積體電路裝置
KR102726176B1 (ko) * 2020-09-01 2024-11-06 에스케이하이닉스 주식회사 반도체 장치 및 그의 동작 방법
JP7558424B2 (ja) 2021-10-26 2024-09-30 三菱電機株式会社 半導体集積回路装置

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JP2892474B2 (ja) * 1990-09-07 1999-05-17 新光電気工業株式会社 セラミック基板のビア検査方法
JP4982543B2 (ja) * 2002-12-27 2012-07-25 日置電機株式会社 多層基板のスルーホール断線検出方法
WO2009147717A1 (ja) * 2008-06-02 2009-12-10 株式会社アドバンテスト プローブウエハ、プローブ装置および試験システム
JP2010219425A (ja) * 2009-03-18 2010-09-30 Toshiba Corp 半導体装置
JP2012083262A (ja) * 2010-10-13 2012-04-26 Advantest Corp 試験装置および試験方法
JP5967713B2 (ja) * 2012-12-13 2016-08-10 国立研究開発法人産業技術総合研究所 積層型ｌｓｉチップの絶縁膜の検査方法及び積層型ｌｓｉチップの製造方法
JP6259254B2 (ja) * 2013-10-18 2018-01-10 株式会社日本マイクロニクス 検査装置および検査方法

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