JP2016211917A5 - - Google Patents
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- Publication number
- JP2016211917A5 JP2016211917A5 JP2015094219A JP2015094219A JP2016211917A5 JP 2016211917 A5 JP2016211917 A5 JP 2016211917A5 JP 2015094219 A JP2015094219 A JP 2015094219A JP 2015094219 A JP2015094219 A JP 2015094219A JP 2016211917 A5 JP2016211917 A5 JP 2016211917A5
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- semiconductor chip
- semiconductor
- tsv
- tsvs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 10
- 238000001514 detection method Methods 0.000 claims description 9
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 230000000087 stabilizing effect Effects 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims 2
- 230000005856 abnormality Effects 0.000 claims 2
- 238000007689 inspection Methods 0.000 claims 2
- 230000000149 penetrating effect Effects 0.000 claims 2
- 241000724291 Tobacco streak virus Species 0.000 description 6
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015094219A JP6570055B2 (ja) | 2015-05-01 | 2015-05-01 | 半導体チップ、半導体装置及び半導体検査システム |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2015094219A JP6570055B2 (ja) | 2015-05-01 | 2015-05-01 | 半導体チップ、半導体装置及び半導体検査システム |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2016211917A JP2016211917A (ja) | 2016-12-15 |
| JP2016211917A5 true JP2016211917A5 (enrdf_load_stackoverflow) | 2018-06-14 |
| JP6570055B2 JP6570055B2 (ja) | 2019-09-04 |
Family
ID=57551651
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015094219A Active JP6570055B2 (ja) | 2015-05-01 | 2015-05-01 | 半導体チップ、半導体装置及び半導体検査システム |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6570055B2 (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW201838094A (zh) * | 2017-02-16 | 2018-10-16 | 學校法人慶應義塾 | 層疊半導體積體電路裝置 |
| KR102726176B1 (ko) * | 2020-09-01 | 2024-11-06 | 에스케이하이닉스 주식회사 | 반도체 장치 및 그의 동작 방법 |
| JP7558424B2 (ja) | 2021-10-26 | 2024-09-30 | 三菱電機株式会社 | 半導体集積回路装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2892474B2 (ja) * | 1990-09-07 | 1999-05-17 | 新光電気工業株式会社 | セラミック基板のビア検査方法 |
| JP4982543B2 (ja) * | 2002-12-27 | 2012-07-25 | 日置電機株式会社 | 多層基板のスルーホール断線検出方法 |
| WO2009147717A1 (ja) * | 2008-06-02 | 2009-12-10 | 株式会社アドバンテスト | プローブウエハ、プローブ装置および試験システム |
| JP2010219425A (ja) * | 2009-03-18 | 2010-09-30 | Toshiba Corp | 半導体装置 |
| JP2012083262A (ja) * | 2010-10-13 | 2012-04-26 | Advantest Corp | 試験装置および試験方法 |
| JP5967713B2 (ja) * | 2012-12-13 | 2016-08-10 | 国立研究開発法人産業技術総合研究所 | 積層型ｌｓｉチップの絶縁膜の検査方法及び積層型ｌｓｉチップの製造方法 |
| JP6259254B2 (ja) * | 2013-10-18 | 2018-01-10 | 株式会社日本マイクロニクス | 検査装置および検査方法 |
-
2015
- 2015-05-01 JP JP2015094219A patent/JP6570055B2/ja active Active
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