JP2017201709A5 - - Google Patents
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- Publication number
- JP2017201709A5 JP2017201709A5 JP2017127985A JP2017127985A JP2017201709A5 JP 2017201709 A5 JP2017201709 A5 JP 2017201709A5 JP 2017127985 A JP2017127985 A JP 2017127985A JP 2017127985 A JP2017127985 A JP 2017127985A JP 2017201709 A5 JP2017201709 A5 JP 2017201709A5
- Authority
- JP
- Japan
- Prior art keywords
- wiring
- semiconductor substrate
- imaging apparatus
- semiconductor
- imaging device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004065 semiconductor Substances 0.000 claims 23
- 238000003384 imaging method Methods 0.000 claims 18
- 239000000758 substrate Substances 0.000 claims 16
- 238000006243 chemical reaction Methods 0.000 claims 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims 1
- 229910052782 aluminium Inorganic materials 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 239000012528 membrane Substances 0.000 claims 1
- 230000001681 protective effect Effects 0.000 claims 1
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2010149483 | 2010-06-30 | ||
| JP2010149483 | 2010-06-30 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015226855A Division JP6173410B2 (ja) | 2010-06-30 | 2015-11-19 | 固体撮像装置および固体撮像装置の製造方法 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019121959A Division JP7140718B2 (ja) | 2010-06-30 | 2019-06-28 | 固体撮像装置および固体撮像装置の製造方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2017201709A JP2017201709A (ja) | 2017-11-09 |
| JP2017201709A5 true JP2017201709A5 (enrdf_load_stackoverflow) | 2018-01-25 |
| JP6598825B2 JP6598825B2 (ja) | 2019-10-30 |
Family
ID=55541082
Family Applications (5)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015226855A Active JP6173410B2 (ja) | 2010-06-30 | 2015-11-19 | 固体撮像装置および固体撮像装置の製造方法 |
| JP2017127985A Active JP6598825B2 (ja) | 2010-06-30 | 2017-06-29 | 固体撮像装置および固体撮像装置の製造方法 |
| JP2019121959A Active JP7140718B2 (ja) | 2010-06-30 | 2019-06-28 | 固体撮像装置および固体撮像装置の製造方法 |
| JP2021141410A Pending JP2022000897A (ja) | 2010-06-30 | 2021-08-31 | 固体撮像装置および固体撮像装置の製造方法 |
| JP2023012108A Active JP7612724B2 (ja) | 2010-06-30 | 2023-01-30 | 固体撮像装置および固体撮像装置の製造方法 |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2015226855A Active JP6173410B2 (ja) | 2010-06-30 | 2015-11-19 | 固体撮像装置および固体撮像装置の製造方法 |
Family Applications After (3)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2019121959A Active JP7140718B2 (ja) | 2010-06-30 | 2019-06-28 | 固体撮像装置および固体撮像装置の製造方法 |
| JP2021141410A Pending JP2022000897A (ja) | 2010-06-30 | 2021-08-31 | 固体撮像装置および固体撮像装置の製造方法 |
| JP2023012108A Active JP7612724B2 (ja) | 2010-06-30 | 2023-01-30 | 固体撮像装置および固体撮像装置の製造方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (5) | JP6173410B2 (enrdf_load_stackoverflow) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7102119B2 (ja) | 2017-09-29 | 2022-07-19 | キヤノン株式会社 | 半導体装置および機器 |
| JPWO2023131994A1 (enrdf_load_stackoverflow) * | 2022-01-05 | 2023-07-13 | ||
| US20230299109A1 (en) * | 2022-03-18 | 2023-09-21 | Taiwan Semiconductor Manufacturing Company, Ltd. | Stacked image sensors and methods of manufacturing thereof |
Family Cites Families (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5376679A (en) * | 1976-12-17 | 1978-07-07 | Nec Corp | Semiconductor device |
| US6927432B2 (en) * | 2003-08-13 | 2005-08-09 | Motorola, Inc. | Vertically integrated photosensor for CMOS imagers |
| JP4432502B2 (ja) * | 2004-01-20 | 2010-03-17 | ソニー株式会社 | 半導体装置 |
| JP4389626B2 (ja) | 2004-03-29 | 2009-12-24 | ソニー株式会社 | 固体撮像素子の製造方法 |
| KR100610481B1 (ko) | 2004-12-30 | 2006-08-08 | 매그나칩 반도체 유한회사 | 수광영역을 넓힌 이미지센서 및 그 제조 방법 |
| KR100782463B1 (ko) * | 2005-04-13 | 2007-12-05 | (주)실리콘화일 | 3차원 구조를 갖는 이미지 센서의 분리형 단위화소 및 그제조방법 |
| EP2095422A4 (en) * | 2006-12-11 | 2013-08-28 | Fujifilm Corp | TUBE-FREE IMAGE ASSEMBLY |
| FR2910707B1 (fr) * | 2006-12-20 | 2009-06-12 | E2V Semiconductors Soc Par Act | Capteur d'image a haute densite d'integration |
| JP5422914B2 (ja) | 2008-05-12 | 2014-02-19 | ソニー株式会社 | 固体撮像装置の製造方法 |
| JP5985136B2 (ja) * | 2009-03-19 | 2016-09-06 | ソニー株式会社 | 半導体装置とその製造方法、及び電子機器 |
| JP5442394B2 (ja) * | 2009-10-29 | 2014-03-12 | ソニー株式会社 | 固体撮像装置とその製造方法、及び電子機器 |
| JP5685898B2 (ja) * | 2010-01-08 | 2015-03-18 | ソニー株式会社 | 半導体装置、固体撮像装置、およびカメラシステム |
| JP5853351B2 (ja) * | 2010-03-25 | 2016-02-09 | ソニー株式会社 | 半導体装置、半導体装置の製造方法、及び電子機器 |
| JP5843475B2 (ja) * | 2010-06-30 | 2016-01-13 | キヤノン株式会社 | 固体撮像装置および固体撮像装置の製造方法 |
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2015
- 2015-11-19 JP JP2015226855A patent/JP6173410B2/ja active Active
-
2017
- 2017-06-29 JP JP2017127985A patent/JP6598825B2/ja active Active
-
2019
- 2019-06-28 JP JP2019121959A patent/JP7140718B2/ja active Active
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2021
- 2021-08-31 JP JP2021141410A patent/JP2022000897A/ja active Pending
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2023
- 2023-01-30 JP JP2023012108A patent/JP7612724B2/ja active Active