JP6565759B2 - 半導体装置の製造方法 - Google Patents
半導体装置の製造方法 Download PDFInfo
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- JP6565759B2 JP6565759B2 JP2016063771A JP2016063771A JP6565759B2 JP 6565759 B2 JP6565759 B2 JP 6565759B2 JP 2016063771 A JP2016063771 A JP 2016063771A JP 2016063771 A JP2016063771 A JP 2016063771A JP 6565759 B2 JP6565759 B2 JP 6565759B2
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- semiconductor device
- semiconductor layer
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- magnesium
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- 239000004065 semiconductor Substances 0.000 title claims description 297
- 238000004519 manufacturing process Methods 0.000 title claims description 76
- 238000000034 method Methods 0.000 claims description 116
- 239000011777 magnesium Substances 0.000 claims description 113
- 230000008569 process Effects 0.000 claims description 88
- 238000010438 heat treatment Methods 0.000 claims description 76
- FYYHWMGAXLPEAU-UHFFFAOYSA-N Magnesium Chemical compound [Mg] FYYHWMGAXLPEAU-UHFFFAOYSA-N 0.000 claims description 67
- 229910052749 magnesium Inorganic materials 0.000 claims description 67
- 238000005468 ion implantation Methods 0.000 claims description 58
- 230000001681 protective effect Effects 0.000 claims description 33
- 239000007789 gas Substances 0.000 claims description 31
- 229910052790 beryllium Inorganic materials 0.000 claims description 30
- ATBAMAFKBVZNFJ-UHFFFAOYSA-N beryllium atom Chemical compound [Be] ATBAMAFKBVZNFJ-UHFFFAOYSA-N 0.000 claims description 30
- 238000000137 annealing Methods 0.000 claims description 29
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 26
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 claims description 18
- 150000004767 nitrides Chemical class 0.000 claims description 17
- 239000001257 hydrogen Substances 0.000 claims description 13
- 229910052739 hydrogen Inorganic materials 0.000 claims description 13
- 229910021529 ammonia Inorganic materials 0.000 claims description 12
- 238000002513 implantation Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 10
- NWAIGJYBQQYSPW-UHFFFAOYSA-N azanylidyneindigane Chemical compound [In]#N NWAIGJYBQQYSPW-UHFFFAOYSA-N 0.000 claims description 9
- 229910002601 GaN Inorganic materials 0.000 claims description 8
- RNQKDQAVIXDKAG-UHFFFAOYSA-N aluminum gallium Chemical compound [Al].[Ga] RNQKDQAVIXDKAG-UHFFFAOYSA-N 0.000 claims description 6
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 4
- 229910052733 gallium Inorganic materials 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- AJGDITRVXRPLBY-UHFFFAOYSA-N aluminum indium Chemical compound [Al].[In] AJGDITRVXRPLBY-UHFFFAOYSA-N 0.000 claims description 3
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 153
- 239000000758 substrate Substances 0.000 description 20
- 239000012535 impurity Substances 0.000 description 14
- 150000002431 hydrogen Chemical class 0.000 description 9
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 8
- 229910052710 silicon Inorganic materials 0.000 description 8
- 239000010703 silicon Substances 0.000 description 8
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 8
- 239000013078 crystal Substances 0.000 description 7
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 6
- 238000000231 atomic layer deposition Methods 0.000 description 6
- 238000001312 dry etching Methods 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 239000010936 titanium Substances 0.000 description 6
- 229910052782 aluminium Inorganic materials 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000002344 surface layer Substances 0.000 description 5
- 125000004429 atom Chemical group 0.000 description 4
- 230000004888 barrier function Effects 0.000 description 4
- 238000005229 chemical vapour deposition Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- -1 nitrogen ions Chemical class 0.000 description 4
- 238000004544 sputter deposition Methods 0.000 description 4
- 238000001039 wet etching Methods 0.000 description 4
- PIGFYZPCRLYGLF-UHFFFAOYSA-N Aluminum nitride Chemical compound [Al]#N PIGFYZPCRLYGLF-UHFFFAOYSA-N 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 3
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 3
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000010030 laminating Methods 0.000 description 3
- QBJCZLXULXFYCK-UHFFFAOYSA-N magnesium;cyclopenta-1,3-diene Chemical compound [Mg+2].C1C=CC=[C-]1.C1C=CC=[C-]1 QBJCZLXULXFYCK-UHFFFAOYSA-N 0.000 description 3
- 229910052757 nitrogen Inorganic materials 0.000 description 3
- 235000012239 silicon dioxide Nutrition 0.000 description 3
- 239000000377 silicon dioxide Substances 0.000 description 3
- 229910052719 titanium Inorganic materials 0.000 description 3
- OAKJQQAXSVQMHS-UHFFFAOYSA-N Hydrazine Chemical compound NN OAKJQQAXSVQMHS-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000010292 electrical insulation Methods 0.000 description 2
- 238000001704 evaporation Methods 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 239000007943 implant Substances 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 229910052581 Si3N4 Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- QCWXUUIWCKQGHC-UHFFFAOYSA-N Zirconium Chemical compound [Zr] QCWXUUIWCKQGHC-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 239000012159 carrier gas Substances 0.000 description 1
- 230000005465 channeling Effects 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 239000002178 crystalline material Substances 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 229910052735 hafnium Inorganic materials 0.000 description 1
- VBJZVLUMGGDVMO-UHFFFAOYSA-N hafnium atom Chemical compound [Hf] VBJZVLUMGGDVMO-UHFFFAOYSA-N 0.000 description 1
- CJNBYAVZURUTKZ-UHFFFAOYSA-N hafnium(iv) oxide Chemical compound O=[Hf]=O CJNBYAVZURUTKZ-UHFFFAOYSA-N 0.000 description 1
- 238000001459 lithography Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229910000069 nitrogen hydride Inorganic materials 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 238000001004 secondary ion mass spectrometry Methods 0.000 description 1
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052726 zirconium Inorganic materials 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
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Description
[形態1]半導体装置の製造方法であって、主に、III族窒化物により形成されている第1半導体層に、マグネシウムをイオン注入するイオン注入工程と、前記イオン注入工程の後、マグネシウムを含んだアニールガスを含む雰囲気下において、前記第1半導体層を加熱する加熱工程と、を備え、前記アニールガスには、さらに、水素とアンモニアが含まれる、半導体装置の製造方法。
[形態2]半導体装置の製造方法であって、主に、III族窒化物により形成されている第1半導体層に、マグネシウムとベリリウムとのうちの少なくとも一方をイオン注入するイオン注入工程と、前記イオン注入工程の後、マグネシウムとベリリウムとのうちの少なくとも一方のアニールガスを含む雰囲気下において、前記第1半導体層を加熱する加熱工程と、を備え、前記加熱工程における圧力が、10kPa以上100kPa以下である、半導体装置の製造方法。
A−1.半導体装置の構成
図1は、第1実施形態における半導体装置100の構成を模式的に示す断面図である。図1には、相互に直交するXYZ軸が図示されている。図1のXYZ軸のうち、X軸は、図1の紙面左から紙面右に向かう軸である。+X軸方向は、紙面右に向かう方向であり、−X軸方向は、紙面左に向かう方向である。図1のXYZ軸のうち、Y軸は、図1の紙面手前から紙面奥に向かう軸である。+Y軸方向は、紙面奥に向かう方向であり、−Y軸方向は、紙面手前に向かう方向である。図1のXYZ軸のうち、Z軸は、図1の紙面下から紙面上に向かう軸である。+Z軸方向は、紙面上に向かう方向であり、−Z軸方向は、紙面下に向かう方向である。図1のXYZ軸は、他の図のXYZ軸に対応する。
図2は、第1実施形態における半導体装置100の製造方法を示す工程図である。まず、製造者は、基板110の上にn型半導体層112を結晶成長によって形成する(工程P110)。本実施形態では、製造者は、基板110における+Z軸方向側の表面にn型半導体層112を形成する。本実施形態では、製造者は、有機金属気相成長法(MOCVD:Metal Organic Chemical Vapor Deposition)によってn型半導体層112を形成する。n型半導体層112は、主に、III族窒化物から形成されており、本実施形態では、窒化ガリウム(GaN)から形成されている。
以上説明した第1実施形態の製造方法では、イオン注入工程(工程P123)の後に、マグネシウム(Mg)のアニールガスを含む雰囲気下において、n型半導体層112を加熱する加熱工程(工程P124)を備える。このため、加熱工程(工程P124)において、イオン注入されたマグネシウム(Mg)が活性化し、また、n型半導体層112の+Z軸方向側の表層に、マグネシウム(Mg)をドープすることができる。この結果として、イオン注入の回数を減らすことができ、製造コストを削減できる。以下、加熱工程(工程P124)により、n型半導体層112の+Z軸方向側の表層に、マグネシウム(Mg)がドープされることを裏付ける評価試験の結果を示す。
図12は、評価試験の結果を示す図である。評価試験には、以下の試料を用いた。具体的には、試験者は、まず、基板110にn型半導体層112を形成した後に、以下の条件によりイオン注入を1回行った。
・注入温度:500℃
・注入エネルギー:230keV
・ドーズ量:1.7×1015cm−2
・注入角度:厚み方向(Z軸方向)に対して7°
・加熱時間:15分
・加熱温度:1050℃
・圧力:100kPa
・アンモニア(NH3)流量:3.7×10−2sccm
・水素(H2)流量:3.7×10−2sccm
・ビズシクロペンタジエニルマグネシウム(Cp2Mg)流量:100sccm
図13は、第2実施形態における半導体装置200の構成を模式的に示す断面図である。図13は、図1と同様に相互に直交するXYZ軸が図示されている。
本発明は、上述の実施形態に限られるものではなく、その趣旨を逸脱しない範囲において種々の構成で実現することができる。例えば、発明の概要の欄に記載した各形態中の技術的特徴に対応する実施形態、実施例、変形例中の技術的特徴は、上述の課題の一部または全部を解決するために、あるいは、上述の効果の一部または全部を達成するために、適宜、差し替えや、組み合わせを行うことが可能である。また、その技術的特徴が本明細書中に必須なものとして説明されていなければ、適宜、削除することが可能である。
110…基板
112…n型半導体層
113…p型半導体領域
113A…p型注入領域
114…p型半導体層
116…n型半導体層
122…トレンチ
124…リセス
130…絶縁膜
142…ゲート電極
144…ボディ電極
146…ソース電極
148…ドレイン電極
200…半導体装置
210…基板
211…メサ
212…n型半導体層
213…p型半導体領域
251…ショットキー電極
252…裏面電極
253…絶縁膜
912…保護膜
Claims (9)
- 半導体装置の製造方法であって、
主に、III族窒化物により形成されている第1半導体層に、マグネシウムをイオン注入するイオン注入工程と、
前記イオン注入工程の後、マグネシウムを含んだアニールガスを含む雰囲気下において、前記第1半導体層を加熱する加熱工程と、を備え、
前記アニールガスには、さらに、水素とアンモニアが含まれる、半導体装置の製造方法。 - 半導体装置の製造方法であって、
主に、III族窒化物により形成されている第1半導体層に、マグネシウムとベリリウムとのうちの少なくとも一方をイオン注入するイオン注入工程と、
前記イオン注入工程の後、マグネシウムとベリリウムとのうちの少なくとも一方のアニールガスを含む雰囲気下において、前記第1半導体層を加熱する加熱工程と、を備え、
前記加熱工程における圧力が、10kPa以上100kPa以下である、半導体装置の製造方法。 - 請求項1または請求項2に記載の半導体装置の製造方法であって、
前記イオン注入工程において注入される元素にマグネシウムが含まれる場合、前記アニールガスにマグネシウムが含まれ、
前記イオン注入工程において注入される元素にベリリウムが含まれる場合、前記アニールガスにベリリウムが含まれる、半導体装置の製造方法。 - 請求項1から請求項3のいずれか1項に記載の半導体装置の製造方法であって、
前記イオン注入工程における注入温度は、20℃以上500℃以下である、半導体装置の製造方法。 - 請求項1から請求項4のいずれか1項に記載の半導体装置の製造方法であって、さらに、
前記イオン注入工程の前に、前記第1半導体層の表面に保護膜を形成する工程を備え、
前記加熱工程の後に、前記保護膜を除去する工程を備える、半導体装置の製造方法。 - 請求項5に記載の半導体装置の製造方法であって、
前記保護膜は、窒化アルミニウム、窒化ガリウム、窒化インジウム、窒化アルミニウムガリウム、窒化ガリウムインジウム、窒化アルミニウムインジウム、窒化アルミニウムガリウムインジウムからなる群より選ばれた少なくとも一つの非晶質な材料を含む、半導体装置の製造方法。 - 請求項1から請求項6のいずれか1項に記載の半導体装置の製造方法であって、
前記加熱工程における加熱温度が、800℃以上1200℃以下である、半導体装置の製造方法。 - 請求項1から請求項7のいずれか1項に記載の半導体装置の製造方法であって、
前記加熱工程における加熱時間が、1分以上60分以下である、半導体装置の製造方法。 - 請求項1から請求項8のいずれか1項に記載の半導体装置の製造方法であって、さらに、
前記加熱工程の後に、前記第1半導体層の表面に、主に、III族窒化物により第2半導体層を形成する工程を備える、半導体装置の製造方法。
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