JP6563703B2 - 半導体発光装置 - Google Patents
半導体発光装置 Download PDFInfo
- Publication number
- JP6563703B2 JP6563703B2 JP2015122754A JP2015122754A JP6563703B2 JP 6563703 B2 JP6563703 B2 JP 6563703B2 JP 2015122754 A JP2015122754 A JP 2015122754A JP 2015122754 A JP2015122754 A JP 2015122754A JP 6563703 B2 JP6563703 B2 JP 6563703B2
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- JP
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- Prior art keywords
- layer
- light emitting
- semiconductor layer
- light emitter
- light
- Prior art date
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/02—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies
- H01L33/20—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor bodies with a particular shape, e.g. curved or truncated substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/36—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes
- H01L33/38—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the electrodes with a particular shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/15—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission
- H01L27/153—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components with at least one potential-jump barrier or surface barrier specially adapted for light emission in a repetitive configuration, e.g. LED bars
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/005—Processes
- H01L33/0093—Wafer bonding; Removal of the growth substrate
Description
図1(a)は、第1実施形態に係る半導体発光装置1を模式的に表す上面図である。図1(b)は、図1(a)中に示すA−A線に沿った半導体発光装置1の模式断面図である。半導体発光装置1は、チップ状の光源であり、例えば、実装基板上にマウントされる。
図10(a)は、第2実施形態に係る半導体発光装置3を模式的に表す上面図である。図10(b)および(c)は、半導体発光装置3の要部模式断面図である。図10(b)は、図10(a)中に示すC-C線に沿った断面を表し、図10(c)は、図10(a)中に示すD-D線に沿った断面を表している。
Claims (8)
- 第1導電形の第1半導体層と、第2導電形の第2半導体層と、前記第1半導体層と前記第2半導体層との間に設けられた発光層と、を含む発光体と、
前記発光体の前記第2半導体層側に配置された基板と、
前記基板と前記発光体との間において前記第1半導体層および前記第2半導体層のいずれかに接し、且つ電気的に接続され、前記基板と前記発光体との間から前記基板に沿って前記発光体の外側へ延びる第1金属層と、
前記発光体の外側に位置する前記第1金属層の延出部を覆い、前記第1金属層の前記発光体に接しない部分と前記発光体との間に延在する導電層と、
前記基板上において前記発光体と並設され、前記導電層を介して前記延出部上に設けられた第2金属層と、
を備え、
前記導電層は、前記第1半導体層を除去するエッチング液に対し、前記第1金属層よりもエッチング耐性を有する半導体発光装置。 - 前記発光体は、前記第1半導体層の表面を含む第1面と、前記第2半導体層の表面を含み、前記第1面の反対側に位置する第2面と、前記第1半導体層の外縁を含む側面と、を有し、
前記第1面に平行な方向に前記側面から内側に向かって窪んだ窪み部を有し、
前記第2金属層は、前記窪み部に設けられた請求項1記載の半導体発光装置。 - 前記窪み部の側壁は、前記側面に曲面を介してつながり、
前記曲面は、0マイクロメートル以上30マイクロメートル未満の曲率半径を有する請求項2記載の半導体発光装置。 - 前記発光体は、
前記発光層を含む発光部と、
前記第2面から前記第1半導体層に至る段差を介して前記発光部の周りに設けられた非発光部と、
を有し、
前記第1金属層は、前記非発光部において前記第1半導体層に電気的に接続された請求項2または3のいずれかに記載の半導体発光装置。 - 前記発光体は、前記第2面から前記第1半導体層に至る凹部を有し、
前記第1半導体層は、前記凹部を介して前記基板に電気的に接続され、
前記第1金属層は、前記第2面上において前記第2半導体層に電気的に接続された請求項2または3のいずれかに記載の半導体発光装置。 - 前記発光体の外縁と、前記第2金属層と、の間の間隔は、50マイクロメートル以下である請求項1〜5のいずれか1つに記載の半導体発光装置。
- 前記導電層は、金属、導電性を有する金属酸化物および導電性を有する金属窒化物の少なくともいずれか1つからなる請求項1〜6のいずれか1つに記載の半導体発光装置。
- 前記発光体と、前記第1金属層の前記発光体に接しない部分と、の間に設けられた誘電体膜をさらに備え、
前記誘電体膜は、前記導電層に沿って前記発光体の外側に延在し、
前記第1金属層の延出部は、前記発光体の外側において前記誘電体膜に接しない請求項1〜7のいずれか1つに記載の半導体発光装置。
Priority Applications (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015122754A JP6563703B2 (ja) | 2015-06-18 | 2015-06-18 | 半導体発光装置 |
US15/051,433 US20160372627A1 (en) | 2015-06-18 | 2016-02-23 | Semiconductor light emitting device |
CN201610137734.3A CN106257698B (zh) | 2015-06-18 | 2016-03-10 | 半导体发光装置 |
TW105107647A TWI599068B (zh) | 2015-06-18 | 2016-03-11 | Semiconductor light-emitting device |
TW106119884A TWI688117B (zh) | 2015-06-18 | 2016-03-11 | 半導體發光裝置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015122754A JP6563703B2 (ja) | 2015-06-18 | 2015-06-18 | 半導体発光装置 |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2017011016A JP2017011016A (ja) | 2017-01-12 |
JP2017011016A5 JP2017011016A5 (ja) | 2018-09-20 |
JP6563703B2 true JP6563703B2 (ja) | 2019-08-21 |
Family
ID=57588409
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015122754A Active JP6563703B2 (ja) | 2015-06-18 | 2015-06-18 | 半導体発光装置 |
Country Status (4)
Country | Link |
---|---|
US (1) | US20160372627A1 (ja) |
JP (1) | JP6563703B2 (ja) |
CN (1) | CN106257698B (ja) |
TW (2) | TWI599068B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6909983B2 (ja) | 2018-11-29 | 2021-07-28 | 日亜化学工業株式会社 | 発光素子 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011112000B4 (de) * | 2011-08-31 | 2023-11-30 | OSRAM Opto Semiconductors Gesellschaft mit beschränkter Haftung | Leuchtdiodenchip |
KR101827975B1 (ko) * | 2011-10-10 | 2018-03-29 | 엘지이노텍 주식회사 | 발광소자 |
TWI458122B (zh) * | 2011-11-23 | 2014-10-21 | Toshiba Kk | 半導體發光元件 |
JP5776535B2 (ja) * | 2011-12-16 | 2015-09-09 | 豊田合成株式会社 | Iii族窒化物半導体発光素子 |
JP5694215B2 (ja) * | 2012-03-07 | 2015-04-01 | 株式会社東芝 | 半導体発光素子 |
JP6013931B2 (ja) * | 2013-02-08 | 2016-10-25 | 株式会社東芝 | 半導体発光素子 |
JP2016134422A (ja) * | 2015-01-16 | 2016-07-25 | 株式会社東芝 | 半導体発光素子およびその製造方法 |
-
2015
- 2015-06-18 JP JP2015122754A patent/JP6563703B2/ja active Active
-
2016
- 2016-02-23 US US15/051,433 patent/US20160372627A1/en not_active Abandoned
- 2016-03-10 CN CN201610137734.3A patent/CN106257698B/zh active Active
- 2016-03-11 TW TW105107647A patent/TWI599068B/zh not_active IP Right Cessation
- 2016-03-11 TW TW106119884A patent/TWI688117B/zh active
Also Published As
Publication number | Publication date |
---|---|
CN106257698B (zh) | 2020-07-21 |
TWI599068B (zh) | 2017-09-11 |
CN106257698A (zh) | 2016-12-28 |
JP2017011016A (ja) | 2017-01-12 |
TW201701498A (zh) | 2017-01-01 |
TW201735395A (zh) | 2017-10-01 |
US20160372627A1 (en) | 2016-12-22 |
TWI688117B (zh) | 2020-03-11 |
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