JP6557424B2 - 半導体接着用樹脂組成物、半導体用接着フィルムおよびダイシングダイボンディングフィルム - Google Patents
半導体接着用樹脂組成物、半導体用接着フィルムおよびダイシングダイボンディングフィルム Download PDFInfo
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- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
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- H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding
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Description
本出願は、2016年10月5日付の韓国特許出願第10−2016−0128444号に基づく優先権の利益を主張し、当該韓国特許出願の文献に開示された全ての内容は本明細書の一部として含まれる。
トルエン100gにブチルアクリレート70g、アクリロニトリル15g、グリシジルメタクリレート5gおよびベンジルメタクリレート10gを混合して80℃で約12時間反応してグリシジル基が分枝鎖に導入されたアクリレート樹脂1(重量平均分子量約90万、ガラス転移温度10℃)を合成した。
実施例1
(1)半導体接着用樹脂組成物溶液の製造
エポキシ樹脂の硬化剤であるフェノール樹脂KH−6021(DIC社製品、ビスフェノールAノボラック樹脂、水酸基当量121g/eq、軟化点:125℃)57g、エポキシ樹脂EOCN−104S(日本化薬(株)製品、クレゾールノボラック型エポキシ樹脂、エポキシ当量214g/eq、軟化点:83℃)85g、前記合成例のアクリレート樹脂1 425g、R972 61.7g、DICY 0.96gおよび2MAOK 0.11gをメチルエチルケトン溶媒に混合して、半導体接着用樹脂組成物溶液(固形分20重量%濃度)を得た。
前記製造された半導体接着用樹脂組成物溶液を離型処理されたポリエチレンテレフタレートフィルム(厚さ38μm)上に塗布した後、110℃で3分間乾燥して、約60μm厚さの半導体用接着フィルム(ダイボンディングフィルム)を得た。
下記表1に記載された成分および使用量を適用した点を除いて、実施例1と同様の方法で半導体接着用樹脂組成物溶液(固形分20重量%濃度)および60μm厚さの半導体用接着フィルム(ダイボンディングフィルム)を得た。
下記表1の成分および含有量を用いて半導体接着用樹脂組成物溶液(メチルエチルケトン20重量%濃度)を製造した点を除いて、実施例1と同様の方法で半導体用接着フィルム(ダイボンディングフィルム)を製造した。
KA−1160:クレゾールノボラック樹脂(DIC社、軟化点:約90℃、水酸基当量:110g/eq)
KPH−65:ザイロックノボラック樹脂(DIC社、軟化点:約90℃、水酸基当量:175g/eq)
MF−8080EK80:ビスフェノールAエポキシ樹脂(エポキシ当量:218g/eq、軟化点:60℃)
EOCN−104S:クレゾールノボラックエポキシ(日本化薬(株)、エポキシ当量:180g/eq、軟化点:90℃)
NC−3000−H:ビフェニルノボラックエポキシ樹脂(エポキシ当量:180g/eq、軟化点:65℃)
R972:エボニックインダストリーズ社、ヒュームドシリカ、平均粒径17nm
RY200:エボニックインダストリーズ社、ヒュームドシリカ、平均粒径50nm
KG−3082:ブチルアクリレート:アクリロニトリル:グリシジルメタクリレート:ベンジルメタクリレート=46:20:6:28の組成比で合成したアクリル樹脂(重量平均分子量:約66万、ガラス転移温度:14℃、水酸基当量:約0.05eq/kg)
KG−3077:ブチルアクリレート:エチルアクリレート:アクリロニトリル:グリシジルメタクリレート:2−ヒドロキシエチルアクリレート=45:20:20:4:11の組成比で合成したアクリル樹脂(重量平均分子量:約75万、ガラス転移温度:7.5℃、水酸基当量:約0.65eq/kg)
DICY:Dicyandiamide
2MAOK:Imidazole−based hardening accelerator
実験例1:常温引張特性評価(モジュラスおよび引張率の測定)
前記実施例および比較例でそれぞれ得られた接着フィルムの引張特性を測定するために、Texture Analyzer(Stable Micro System社)を用いた。具体的には、前記実施例および比較例でそれぞれ得られた接着フィルムを幅15mmおよび長さ100mmの大きさに裁断してサンプルを製作し、サンプルの中央部を50mm残した状態で両端をテーピングした。
そして、前記テーピングされたサンプルの両端を前記装備に固定し、0.3mm/secの速度で引張しながら引張曲線を作成した。前記引張曲線からそれぞれ5%、10%、15%引張時の傾き値を測定してモジュラスを測定し、前記サンプルが完全に破断する時点を測定して引張率を決定した。
(1)ダイシングフィルムの製造
2−エチルヘキシルアクリレート75g、2−エチルヘキシルメタクリレート10g、および2−ヒドロキシエチルアクリレート15gを酢酸エチル300g下で共重合して、重量平均分子量が850、000の共重合体(ガラス転移温度が10℃)を収得した後、これに光硬化物質のアクリルイソシアネート化合物10gを添加して反応物を得た。その後、これに多官能イソシアネートオリゴマー10gと光開始剤としてダロカーTPOを1g混合して、紫外線硬化型粘着剤組成物を製造した。
前記紫外線硬化型粘着剤組成物を離型処理された厚さ38umのポリエステルフィルム上に乾燥後の厚さが10umとなるように塗布し、110℃で3分間乾燥した。乾燥した粘着層を厚さが100μmのポリオレフィンフィルムにラミネートしてダイシングフィルムを製造した。
前記過程で得られた粘着層および前記実施例および比較例でそれぞれ得られた接着フィルム(幅18mm、長さ10cm)を貼り合わせて、ダイシングダイボンディング用多層構造の接着フィルムを製造した。
100μmのウェハーおよびウェハーリングマウンタを用いて、50℃で前記製造されたそれぞれのダイシングダイボンディングフィルムをラミネーションした後、ダイシング装備を用いて、40K rpmおよび20mm/secの速度、10mm*10mmのチップサイズの条件でダイシングした後、ダイ上にバリが発生した個数を確認して、バリ発生率を測定した。
実施例および比較例から得られた粘着剤をダイシングフィルムにラミネートして、ダイシングダイボンディングフィルムを製造した。
Claims (17)
- エポキシ系作用基を含む(メタ)アクリレート系繰り返し単位と芳香族作用基を含む(メタ)アクリレート系繰り返し単位(BzMA)を含み、水酸基当量が0.15eq/kg以下である(メタ)アクリレート系樹脂;
100℃以上の軟化点を有するフェノール樹脂を含む硬化剤;および
エポキシ樹脂;を含み、
前記(メタ)アクリレート系樹脂中の芳香族作用基を含む(メタ)アクリレート系作用基の含有量が2〜40重量%である、半導体接着用樹脂組成物。 - 前記(メタ)アクリレート系樹脂、エポキシ樹脂およびフェノール樹脂総重量対比前記(メタ)アクリレート系樹脂の重量比率が0.55〜0.95である、請求項1に記載の半導体接着用樹脂組成物。
- 前記(メタ)アクリレート系樹脂は、前記芳香族作用基を含む(メタ)アクリレート系作用基を3〜30重量%含む、請求項1に記載の半導体接着用樹脂組成物。
- 前記芳香族作用基は、炭素数6〜20のアリール(aryl)基;または炭素数6〜20のアリール基および炭素数1〜10のアルキレン基を含むアリールアルキレン基;である、請求項1に記載の半導体接着用樹脂組成物。
- 前記エポキシ系作用基を含む(メタ)アクリレート系繰り返し単位は、エポキシ炭素数3〜20のシクロアルキルメチル(メタ)アクリレート繰り返し単位を含む、請求項1に記載の半導体接着用樹脂組成物。
- 前記(メタ)アクリレート系樹脂は、反応性作用基を含むビニル系繰り返し単位および炭素数1〜10のアルキル基を含む(メタ)アクリレート系作用基からなる群より選択された1以上の繰り返し単位をさらに含む、請求項1に記載の半導体接着用樹脂組成物。
- 前記100℃以上の軟化点を有するフェノール樹脂は、110℃〜160℃以下の軟化点を有する、請求項1に記載の半導体接着用樹脂組成物。
- 前記フェノール樹脂は、ビスフェノールAノボラック樹脂およびビフェニルノボラック樹脂からなる群より選択された1種以上を含む、請求項1に記載の半導体接着用樹脂組成物。
- 前記エポキシ樹脂は、ビフェニル系エポキシ樹脂、ビスフェノールAエポキシ樹脂、ビスフェノールFエポキシ樹脂、クレゾールノボラックエポキシ樹脂、フェノールノボラックエポキシ樹脂、4官能性エポキシ樹脂、トリフェノールメタン型エポキシ樹脂、アルキル変性トリフェノールメタン型エポキシ樹脂、ナフタレン型エポキシ樹脂、ジシクロペンタジエン型エポキシ樹脂およびジシクロペンタジエン変性フェノール型エポキシ樹脂からなる群より選択された1種以上を含む、請求項1に記載の半導体接着用樹脂組成物。
- 前記エポキシ樹脂の軟化点は50℃〜120℃である、請求項1に記載の半導体接着用樹脂組成物。
- 前記エポキシ樹脂のエポキシ当量は100〜300g/eqである、請求項1に記載の半導体接着用樹脂組成物。
- 前記(メタ)アクリレート系樹脂は、−10℃〜20℃のガラス転移温度を有する(メタ)アクリレート系樹脂である、請求項1に記載の半導体接着用樹脂組成物。
- 請求項1に記載の半導体接着用樹脂組成物を含む、半導体用接着フィルム。
- 前記接着フィルムは1μm〜300μmの厚さを有する、請求項13に記載の半導体用接着フィルム。
- 前記半導体用接着フィルムを常温で0.3mm/secの速度で5%まで引張時、モジュラスが100MPa以上である、請求項13に記載の半導体用接着フィルム。
- 基材フィルム;前記基材フィルム上に形成される粘着層;および前記粘着層上に形成され、請求項1に記載の半導体接着用樹脂組成物を含む接着層;を含む、ダイシングダイボンディングフィルム。
- 前記基材フィルムは10μm〜200μmの厚さを有し、
前記粘着層は1μm〜600μmの厚さを有し、
前記接着フィルムは1μm〜300μmの厚さを有する、請求項16に記載のダイシングダイボンディングフィルム。
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