JP6555455B1 - 電気Ｓｎめっき鋼板 - Google Patents

電気Ｓｎめっき鋼板 Download PDF

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Publication number
JP6555455B1
JP6555455B1 JP2019517105A JP2019517105A JP6555455B1 JP 6555455 B1 JP6555455 B1 JP 6555455B1 JP 2019517105 A JP2019517105 A JP 2019517105A JP 2019517105 A JP2019517105 A JP 2019517105A JP 6555455 B1 JP6555455 B1 JP 6555455B1
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Japan
Prior art keywords
electric
content
layer
plating
plating layer
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JP2019517105A
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English (en)
Japanese (ja)
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JPWO2019088229A1 (ja
Inventor
後藤　靖人
靖人 後藤
雄太 田島
雄太 田島
亜暢 小林
亜暢 小林
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Nippon Steel Corp
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Nippon Steel Corp
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Publication of JP6555455B1 publication Critical patent/JP6555455B1/ja
Publication of JPWO2019088229A1 publication Critical patent/JPWO2019088229A1/ja
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    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/30—Electroplating: Baths therefor from solutions of tin
    • C25D3/32—Electroplating: Baths therefor from solutions of tin characterised by the organic bath constituents used
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/16—Regeneration of process solutions
    • C25D21/18—Regeneration of process solutions of electrolytes
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D7/00—Electroplating characterised by the article coated
    • C25D7/06—Wires; Strips; Foils
    • C25D7/0614—Strips or foils
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/48—After-treatment of electroplated surfaces
    • C25D5/50—After-treatment of electroplated surfaces by heat-treatment
    • C25D5/505—After-treatment of electroplated surfaces by heat-treatment of electroplated tin coatings, e.g. by melting

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating Methods And Accessories (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
JP2019517105A 2017-11-01 2018-11-01 電気Ｓｎめっき鋼板 Active JP6555455B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2017211788 2017-11-01
JP2017211788 2017-11-01
PCT/JP2018/040727 WO2019088229A1 (ja) 2017-11-01 2018-11-01 電気Ｓｎめっき鋼板

Publications (2)

Publication Number Publication Date
JP6555455B1 true JP6555455B1 (ja) 2019-08-07
JPWO2019088229A1 JPWO2019088229A1 (ja) 2019-11-14

Family

ID=66331998

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2019517105A Active JP6555455B1 (ja) 2017-11-01 2018-11-01 電気Ｓｎめっき鋼板

Country Status (6)

Country Link
EP (1) EP3705608B8 (de)
JP (1) JP6555455B1 (de)
KR (1) KR102412968B1 (de)
CN (1) CN111164239B (de)
ES (1) ES2980111T3 (de)
WO (1) WO2019088229A1 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113493880A (zh) * 2020-04-08 2021-10-12 上海梅山钢铁股份有限公司 一种超低铅冷轧电镀锡钢板及其制造方法
CN113740321A (zh) * 2020-05-29 2021-12-03 上海梅山钢铁股份有限公司 一种冷轧电镀锡钢板镀层中钡含量的检测方法
CN114277416A (zh) * 2020-09-28 2022-04-05 上海梅山钢铁股份有限公司 一种不溶性阳极的甲基磺酸镀层低铅含量镀锡板生产方法及设备
CN113564644A (zh) * 2021-06-29 2021-10-29 武汉钢铁有限公司 一种提高镀层附着力的电镀锡液、制备方法及镀锡板
CN117907562B (zh) * 2024-03-19 2024-06-04 张家港扬子江冷轧板有限公司 一种同时检测镀层中多种元素含量的方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005314750A (ja) * 2004-04-28 2005-11-10 Ishihara Chem Co Ltd スズ又はスズ合金メッキ方法
JP2006519311A (ja) * 2003-02-17 2006-08-24 コミツサリア タ レネルジー アトミーク 表面の被覆プロセス
JP2017523300A (ja) * 2014-05-14 2017-08-17 ヒェメタル ゲゼルシャフト ミット ベシュレンクテル ハフツングＣｈｅｍｅｔａｌｌ ＧｍｂＨ 基材の金属表面を被覆する方法及びこの方法により被覆された物品

Family Cites Families (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN87103732A (zh) * 1987-05-25 1988-12-14 北京无线电仪器二厂 锡铈钴电镀液及其配制方法
JPH0678594B2 (ja) * 1987-09-14 1994-10-05 日本鋼管株式会社 耐食性に優れた鉛−錫合金めつき鋼板の製造方法
JPH03191097A (ja) * 1989-12-19 1991-08-21 Nippon Steel Corp 複合電気めっき鋼板
US5346607A (en) * 1992-09-30 1994-09-13 Weirton Steel Corporation Electrolytic tinplating and product
WO1994008075A1 (en) * 1992-10-05 1994-04-14 Usx Engineers And Consultants, Inc. Method of reducing the lead content of electrodeposited tin coatings
US5614328A (en) * 1995-01-19 1997-03-25 The Furukawa Electric Co. Ltd. Reflow-plated member and a manufacturing method therefor
JPH10158886A (ja) * 1996-12-04 1998-06-16 Furukawa Electric Co Ltd:The 半田めっきリードおよびその製造方法
JP3882608B2 (ja) 2001-12-14 2007-02-21 三菱マテリアル株式会社 高純度錫の電解精製方法とその装置
US7391116B2 (en) * 2003-10-14 2008-06-24 Gbc Metals, Llc Fretting and whisker resistant coating system and method
JP5210103B2 (ja) * 2007-09-28 2013-06-12 富士フイルム株式会社 平版印刷版用アルミニウム合金板およびその製造方法
JP2009270154A (ja) 2008-05-07 2009-11-19 Toyota Motor Corp Ｓｎめっき層を有するめっき基材およびめっき層から針状ウィスカが成長するのを抑制する方法
JP4949353B2 (ja) 2008-11-06 2012-06-06 株式会社タムラ製作所 鉛を除去する方法
EP2221396A1 (de) * 2008-12-31 2010-08-25 Rohm and Haas Electronic Materials LLC Bleifreie Elektroplattierungszusammensetzungen aus Blechlegierung und Verfahren
RU2586377C2 (ru) * 2010-10-06 2016-06-10 Тата Стил Эймейден Бв Способ получения слоя сплава железо-олово на тароупаковочной стальной подложке
CN104512923A (zh) * 2013-09-30 2015-04-15 上海梅山钢铁股份有限公司 一种纳米硫酸钡的制备方法
WO2016076073A1 (ja) * 2014-11-10 2016-05-19 新日鐵住金株式会社 めっき鋼板およびその製造方法
JP6666555B2 (ja) 2016-05-25 2020-03-18 富士通株式会社 情報処理装置、ジョブ投入方法、およびジョブ投入プログラム
CN110885997A (zh) * 2018-09-10 2020-03-17 上海梅山钢铁股份有限公司 一种冷轧电镀锡钢板的制造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006519311A (ja) * 2003-02-17 2006-08-24 コミツサリア タ レネルジー アトミーク 表面の被覆プロセス
JP2005314750A (ja) * 2004-04-28 2005-11-10 Ishihara Chem Co Ltd スズ又はスズ合金メッキ方法
JP2017523300A (ja) * 2014-05-14 2017-08-17 ヒェメタル ゲゼルシャフト ミット ベシュレンクテル ハフツングＣｈｅｍｅｔａｌｌ ＧｍｂＨ 基材の金属表面を被覆する方法及びこの方法により被覆された物品

Also Published As

Publication number Publication date
EP3705608B1 (de) 2024-05-22
WO2019088229A1 (ja) 2019-05-09
ES2980111T3 (es) 2024-09-30
KR20200044915A (ko) 2020-04-29
EP3705608C0 (de) 2024-05-22
JPWO2019088229A1 (ja) 2019-11-14
EP3705608B8 (de) 2024-07-03
EP3705608A4 (de) 2021-08-11
KR102412968B1 (ko) 2022-06-24
EP3705608A1 (de) 2020-09-09
CN111164239A (zh) 2020-05-15
CN111164239B (zh) 2021-11-19

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