JP6554440B2 - 部品供給装置、部品供給方法および表面実装機 - Google Patents

部品供給装置、部品供給方法および表面実装機 Download PDF

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Publication number
JP6554440B2
JP6554440B2 JP2016090289A JP2016090289A JP6554440B2 JP 6554440 B2 JP6554440 B2 JP 6554440B2 JP 2016090289 A JP2016090289 A JP 2016090289A JP 2016090289 A JP2016090289 A JP 2016090289A JP 6554440 B2 JP6554440 B2 JP 6554440B2
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JP
Japan
Prior art keywords
tape
component supply
component
main body
support
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016090289A
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English (en)
Japanese (ja)
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JP2017199832A5 (enExample
JP2017199832A (ja
Inventor
朝暖 倉山
朝暖 倉山
友和 大貫
友和 大貫
紘子 垣内
紘子 垣内
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamaha Motor Co Ltd
Original Assignee
Yamaha Motor Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamaha Motor Co Ltd filed Critical Yamaha Motor Co Ltd
Priority to JP2016090289A priority Critical patent/JP6554440B2/ja
Priority to US16/092,656 priority patent/US11606891B2/en
Priority to DE112017001068.3T priority patent/DE112017001068T5/de
Priority to PCT/JP2017/004227 priority patent/WO2017187704A1/ja
Priority to CN201780008779.3A priority patent/CN108605430B/zh
Publication of JP2017199832A publication Critical patent/JP2017199832A/ja
Publication of JP2017199832A5 publication Critical patent/JP2017199832A5/ja
Application granted granted Critical
Publication of JP6554440B2 publication Critical patent/JP6554440B2/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H05K13/0419—Feeding with belts or tapes tape feeders
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/02—Feeding of components
    • H05K13/0215—Interconnecting of containers, e.g. splicing of tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0404—Pick-and-place heads or apparatus, e.g. with jaws
    • H05K13/0408—Incorporating a pick-up tool
    • H05K13/0409—Sucking devices
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/04—Mounting of components, e.g. of leadless components
    • H05K13/0417—Feeding with belts or tapes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/086—Supply management, e.g. supply of components or of substrates
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/087—Equipment tracking or labelling, e.g. tracking of nozzles, feeders or mounting heads
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Supply And Installment Of Electrical Components (AREA)
JP2016090289A 2016-04-28 2016-04-28 部品供給装置、部品供給方法および表面実装機 Active JP6554440B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016090289A JP6554440B2 (ja) 2016-04-28 2016-04-28 部品供給装置、部品供給方法および表面実装機
US16/092,656 US11606891B2 (en) 2016-04-28 2017-02-06 Component supply device and surface mounting machine
DE112017001068.3T DE112017001068T5 (de) 2016-04-28 2017-02-06 Bauteilzuführungsvorrichtung, Bauteilzuführungsverfahren und Oberflächenmontagemaschine
PCT/JP2017/004227 WO2017187704A1 (ja) 2016-04-28 2017-02-06 部品供給装置、部品供給方法および表面実装機
CN201780008779.3A CN108605430B (zh) 2016-04-28 2017-02-06 元件供给装置、元件供给方法及表面安装机

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016090289A JP6554440B2 (ja) 2016-04-28 2016-04-28 部品供給装置、部品供給方法および表面実装機

Publications (3)

Publication Number Publication Date
JP2017199832A JP2017199832A (ja) 2017-11-02
JP2017199832A5 JP2017199832A5 (enExample) 2018-07-19
JP6554440B2 true JP6554440B2 (ja) 2019-07-31

Family

ID=60160248

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016090289A Active JP6554440B2 (ja) 2016-04-28 2016-04-28 部品供給装置、部品供給方法および表面実装機

Country Status (5)

Country Link
US (1) US11606891B2 (enExample)
JP (1) JP6554440B2 (enExample)
CN (1) CN108605430B (enExample)
DE (1) DE112017001068T5 (enExample)
WO (1) WO2017187704A1 (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6554440B2 (ja) * 2016-04-28 2019-07-31 ヤマハ発動機株式会社 部品供給装置、部品供給方法および表面実装機
JP6929189B2 (ja) 2017-10-13 2021-09-01 Ｔｏｙｏ Ｔｉｒｅ株式会社 空気入りタイヤ
US11974402B2 (en) 2018-06-27 2024-04-30 Yamaha Hatsudoki Kabushiki Kaisha Component supply device
JP7199549B2 (ja) * 2019-08-27 2023-01-05 ヤマハ発動機株式会社 部品補給支援装置、部品実装システム、部品補給支援方法
CN114041330B (zh) * 2019-08-27 2023-10-17 雅马哈发动机株式会社 元件安装机、带式送料器、带放置单元
US12227380B2 (en) * 2020-03-03 2025-02-18 Fuji Corporation Wind-up drum, tape feeder, and component mounting machine
CN112272512B (zh) * 2020-10-23 2021-10-19 湖南大学 一种smd用贴装系统

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4952113A (en) * 1988-11-14 1990-08-28 Tenryu Technics Co., Ltd. Chip feeder for chip mounter
EP1381265B1 (en) 1998-12-22 2007-08-01 Mydata Automation AB Tape guide, magazine and system at a component mounting machine
JP3840968B2 (ja) 2001-12-18 2006-11-01 松下電器産業株式会社 テープフィーダ
WO2003103362A1 (en) * 2002-06-03 2003-12-11 Assembleon N. V. Component supplying device
TWI236321B (en) * 2003-04-10 2005-07-11 Protec Co Ltd Tape feeder for chip mounters
US7243828B2 (en) * 2004-11-12 2007-07-17 Samsung Techwin Co., Ltd. Tape feeder for component mounter and method of automatically setting tape initial position by the same
JP2008041732A (ja) 2006-08-02 2008-02-21 Matsushita Electric Ind Co Ltd テープフィーダ
JP4762193B2 (ja) * 2007-04-27 2011-08-31 パナソニック株式会社 部品供給装置
US8678065B2 (en) 2010-03-30 2014-03-25 Sts Co., Ltd. Carrier tape feeder
JP5423644B2 (ja) * 2010-10-14 2014-02-19 パナソニック株式会社 テープフィーダおよびテープフィーダにおけるテープ装着方法
JP5909643B2 (ja) * 2012-04-13 2016-04-27 パナソニックＩｐマネジメント株式会社 テープフィーダおよびテープフィーダにおける設定情報の表示方法
JP6026796B2 (ja) 2012-06-29 2016-11-16 ヤマハ発動機株式会社 電子部品装着装置及び電子部品装着方法
JP6002937B2 (ja) * 2012-11-28 2016-10-05 パナソニックＩｐマネジメント株式会社 テープフィーダ
EP3041332B1 (en) * 2013-08-26 2018-01-10 Fuji Machine Mfg. Co., Ltd. Feeder
JP6174547B2 (ja) 2014-10-30 2017-08-02 株式会社小野測器 分布図表示装置及び方法
JP6554440B2 (ja) * 2016-04-28 2019-07-31 ヤマハ発動機株式会社 部品供給装置、部品供給方法および表面実装機

Also Published As

Publication number Publication date
US11606891B2 (en) 2023-03-14
DE112017001068T5 (de) 2018-11-29
JP2017199832A (ja) 2017-11-02
US20190133009A1 (en) 2019-05-02
CN108605430A (zh) 2018-09-28
WO2017187704A1 (ja) 2017-11-02
CN108605430B (zh) 2020-04-28

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