JP6538607B2 - 電子機器 - Google Patents

電子機器 Download PDF

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Publication number
JP6538607B2
JP6538607B2 JP2016073336A JP2016073336A JP6538607B2 JP 6538607 B2 JP6538607 B2 JP 6538607B2 JP 2016073336 A JP2016073336 A JP 2016073336A JP 2016073336 A JP2016073336 A JP 2016073336A JP 6538607 B2 JP6538607 B2 JP 6538607B2
Authority
JP
Japan
Prior art keywords
wall
frame
electronic device
metal plate
cooling fan
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2016073336A
Other languages
English (en)
Japanese (ja)
Other versions
JP2017183670A (ja
JP2017183670A5 (enExample
Inventor
健治 廣瀬
健治 廣瀬
和人 中川
和人 中川
土田　真也
真也 土田
康宏 鳳
康宏 鳳
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Interactive Entertainment Inc
Original Assignee
Sony Interactive Entertainment Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Interactive Entertainment Inc filed Critical Sony Interactive Entertainment Inc
Priority to JP2016073336A priority Critical patent/JP6538607B2/ja
Priority to US15/458,556 priority patent/US9847104B2/en
Priority to CN201710180702.6A priority patent/CN107278090B/zh
Publication of JP2017183670A publication Critical patent/JP2017183670A/ja
Priority to US15/827,046 priority patent/US10090021B2/en
Publication of JP2017183670A5 publication Critical patent/JP2017183670A5/ja
Priority to US16/058,040 priority patent/US10446192B2/en
Application granted granted Critical
Publication of JP6538607B2 publication Critical patent/JP6538607B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • G—PHYSICS
    • G11—INFORMATION STORAGE
    • G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
    • G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
    • G11B33/14—Reducing influence of physical parameters, e.g. temperature change, moisture, dust
    • G11B33/1406—Reducing the influence of the temperature
    • G11B33/1413—Reducing the influence of the temperature by fluid cooling
    • G11B33/142—Reducing the influence of the temperature by fluid cooling by air cooling
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/1613—Constructional details or arrangements for portable computers
    • G06F1/1615—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function
    • G06F1/1616—Constructional details or arrangements for portable computers with several enclosures having relative motions, each enclosure supporting at least one I/O or computing function with folding flat displays, e.g. laptop computers or notebooks having a clamshell configuration, with body parts pivoting to an open position around an axis parallel to the plane they define in closed position
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/181—Enclosures
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/184—Mounting of motherboards
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/18—Packaging or power distribution
    • G06F1/183—Internal mounting support structures, e.g. for printed circuit boards, internal connecting means
    • G06F1/188—Mounting of power supply units
    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K5/00—Casings, cabinets or drawers for electric apparatus
    • H05K5/02—Details
    • H05K5/0213—Venting apertures; Constructional details thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/14—Mounting supporting structure in casing or on frame or rack
    • H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/18—Construction of rack or frame
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00—Screening of apparatus or components against electric or magnetic fields
    • H05K9/0007—Casings
    • H05K9/0041—Ventilation panels having provisions for screening
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air

Landscapes

  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Mathematical Physics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Casings For Electric Apparatus (AREA)
JP2016073336A 2016-03-31 2016-03-31 電子機器 Active JP6538607B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2016073336A JP6538607B2 (ja) 2016-03-31 2016-03-31 電子機器
US15/458,556 US9847104B2 (en) 2016-03-31 2017-03-14 Electronic apparatus
CN201710180702.6A CN107278090B (zh) 2016-03-31 2017-03-24 电子设备
US15/827,046 US10090021B2 (en) 2016-03-31 2017-11-30 Electronic apparatus
US16/058,040 US10446192B2 (en) 2016-03-31 2018-08-08 Electronic apparatus with air duct and fan

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2016073336A JP6538607B2 (ja) 2016-03-31 2016-03-31 電子機器

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2019106441A Division JP6783349B2 (ja) 2019-06-06 2019-06-06 電子機器

Publications (3)

Publication Number Publication Date
JP2017183670A JP2017183670A (ja) 2017-10-05
JP2017183670A5 JP2017183670A5 (enExample) 2018-01-25
JP6538607B2 true JP6538607B2 (ja) 2019-07-03

Family

ID=59961146

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016073336A Active JP6538607B2 (ja) 2016-03-31 2016-03-31 電子機器

Country Status (3)

Country Link
US (3) US9847104B2 (enExample)
JP (1) JP6538607B2 (enExample)
CN (1) CN107278090B (enExample)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US12194375B2 (en) 2017-01-25 2025-01-14 Kieran S. Lyden Game controller
WO2019182014A1 (ja) 2018-03-20 2019-09-26 株式会社ソニー・インタラクティブエンタテインメント 電子機器
WO2019181804A1 (ja) 2018-03-22 2019-09-26 株式会社ソニー・インタラクティブエンタテインメント 電子機器
US20230013869A1 (en) * 2019-12-20 2023-01-19 Hewlett-Packard Development Company, L.P. Back covers
JP7203784B2 (ja) 2020-03-27 2023-01-13 株式会社ソニー・インタラクティブエンタテインメント 電子機器及びその外装パネル
KR20240160234A (ko) * 2020-03-27 2024-11-08 주식회사 소니 인터랙티브 엔터테인먼트 전자 기기 및 그 외장 패널
US20250286351A1 (en) * 2024-03-05 2025-09-11 Hong Liu Co., Ltd. Dust-proof filter structure for power supply panel

Family Cites Families (35)

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JPH0713660A (ja) * 1993-06-21 1995-01-17 Toshiba Corp 携帯型電子機器
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Also Published As

Publication number Publication date
CN107278090B (zh) 2019-08-09
CN107278090A (zh) 2017-10-20
US9847104B2 (en) 2017-12-19
US10446192B2 (en) 2019-10-15
US20170287527A1 (en) 2017-10-05
JP2017183670A (ja) 2017-10-05
US10090021B2 (en) 2018-10-02
US20180082718A1 (en) 2018-03-22
US20180350408A1 (en) 2018-12-06

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