JP6534024B2 - 熱交換器 - Google Patents

熱交換器 Download PDF

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Publication number
JP6534024B2
JP6534024B2 JP2013060899A JP2013060899A JP6534024B2 JP 6534024 B2 JP6534024 B2 JP 6534024B2 JP 2013060899 A JP2013060899 A JP 2013060899A JP 2013060899 A JP2013060899 A JP 2013060899A JP 6534024 B2 JP6534024 B2 JP 6534024B2
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JP
Japan
Prior art keywords
flow path
annular wall
heat exchanger
wall
liquid refrigerant
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2013060899A
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English (en)
Japanese (ja)
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JP2014175648A (ja
JP2014175648A5 (enExample
Inventor
伸季 睦月
伸季 睦月
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mutsuki Electric KK
Original Assignee
Mutsuki Electric KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mutsuki Electric KK filed Critical Mutsuki Electric KK
Priority to JP2013060899A priority Critical patent/JP6534024B2/ja
Publication of JP2014175648A publication Critical patent/JP2014175648A/ja
Publication of JP2014175648A5 publication Critical patent/JP2014175648A5/ja
Application granted granted Critical
Publication of JP6534024B2 publication Critical patent/JP6534024B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP2013060899A 2013-03-05 2013-03-05 熱交換器 Active JP6534024B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2013060899A JP6534024B2 (ja) 2013-03-05 2013-03-05 熱交換器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013060899A JP6534024B2 (ja) 2013-03-05 2013-03-05 熱交換器

Publications (3)

Publication Number Publication Date
JP2014175648A JP2014175648A (ja) 2014-09-22
JP2014175648A5 JP2014175648A5 (enExample) 2016-04-21
JP6534024B2 true JP6534024B2 (ja) 2019-06-26

Family

ID=51696544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013060899A Active JP6534024B2 (ja) 2013-03-05 2013-03-05 熱交換器

Country Status (1)

Country Link
JP (1) JP6534024B2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023210093A1 (ja) 2022-04-28 2023-11-02 日本軽金属株式会社 熱交換器

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20210135570A (ko) 2019-03-28 2021-11-15 미쯔이가가꾸가부시끼가이샤 냉각 유닛, 냉각 장치, 전지 구조체 및 전동 차량

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05235572A (ja) * 1992-02-20 1993-09-10 Mitsubishi Shindoh Co Ltd 回路基板の冷却装置
JP2004006563A (ja) * 2002-05-31 2004-01-08 Nippon Light Metal Co Ltd 放熱機構
JP4913668B2 (ja) * 2007-05-28 2012-04-11 株式会社リコー 冷却装置、電子機器及び画像形成装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023210093A1 (ja) 2022-04-28 2023-11-02 日本軽金属株式会社 熱交換器

Also Published As

Publication number Publication date
JP2014175648A (ja) 2014-09-22

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