JP6534024B2 - 熱交換器 - Google Patents
熱交換器 Download PDFInfo
- Publication number
- JP6534024B2 JP6534024B2 JP2013060899A JP2013060899A JP6534024B2 JP 6534024 B2 JP6534024 B2 JP 6534024B2 JP 2013060899 A JP2013060899 A JP 2013060899A JP 2013060899 A JP2013060899 A JP 2013060899A JP 6534024 B2 JP6534024 B2 JP 6534024B2
- Authority
- JP
- Japan
- Prior art keywords
- flow path
- annular wall
- heat exchanger
- wall
- liquid refrigerant
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000007788 liquid Substances 0.000 claims description 60
- 238000005192 partition Methods 0.000 claims description 55
- 239000003507 refrigerant Substances 0.000 claims description 50
- 239000000463 material Substances 0.000 claims description 31
- 238000001816 cooling Methods 0.000 claims description 23
- 238000010438 heat treatment Methods 0.000 claims description 20
- 229920003002 synthetic resin Polymers 0.000 claims description 9
- 239000000057 synthetic resin Substances 0.000 claims description 9
- 239000013536 elastomeric material Substances 0.000 claims description 4
- 238000004891 communication Methods 0.000 claims description 2
- 229920005989 resin Polymers 0.000 description 26
- 239000011347 resin Substances 0.000 description 26
- 239000007769 metal material Substances 0.000 description 22
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 12
- 239000004065 semiconductor Substances 0.000 description 12
- -1 polypropylene Polymers 0.000 description 10
- 239000000498 cooling water Substances 0.000 description 9
- 239000000806 elastomer Substances 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 229920001971 elastomer Polymers 0.000 description 8
- 238000003825 pressing Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 239000010408 film Substances 0.000 description 6
- 229910052742 iron Inorganic materials 0.000 description 6
- 229910052759 nickel Inorganic materials 0.000 description 6
- 239000010935 stainless steel Substances 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 6
- 238000003466 welding Methods 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 4
- 239000012530 fluid Substances 0.000 description 4
- 230000020169 heat generation Effects 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 239000002826 coolant Substances 0.000 description 3
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000009499 grossing Methods 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 238000004806 packaging method and process Methods 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229920003051 synthetic elastomer Polymers 0.000 description 3
- 238000010998 test method Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 2
- 239000004696 Poly ether ether ketone Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000004743 Polypropylene Substances 0.000 description 2
- 230000002528 anti-freeze Effects 0.000 description 2
- 239000011737 fluorine Substances 0.000 description 2
- 229910052731 fluorine Inorganic materials 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002101 nanobubble Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920001707 polybutylene terephthalate Polymers 0.000 description 2
- 229920005668 polycarbonate resin Polymers 0.000 description 2
- 239000004431 polycarbonate resin Substances 0.000 description 2
- 229920002530 polyetherether ketone Polymers 0.000 description 2
- 229920013716 polyethylene resin Polymers 0.000 description 2
- 239000005020 polyethylene terephthalate Substances 0.000 description 2
- 229920000139 polyethylene terephthalate Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920001155 polypropylene Polymers 0.000 description 2
- 229920005990 polystyrene resin Polymers 0.000 description 2
- 229920000915 polyvinyl chloride Polymers 0.000 description 2
- 239000004800 polyvinyl chloride Substances 0.000 description 2
- 239000005060 rubber Substances 0.000 description 2
- 229920002725 thermoplastic elastomer Polymers 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- PMHQVHHXPFUNSP-UHFFFAOYSA-M copper(1+);methylsulfanylmethane;bromide Chemical compound Br[Cu].CSC PMHQVHHXPFUNSP-UHFFFAOYSA-M 0.000 description 1
- 239000008151 electrolyte solution Substances 0.000 description 1
- 230000005669 field effect Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-L phthalate(2-) Chemical compound [O-]C(=O)C1=CC=CC=C1C([O-])=O XNGIFLGASWRNHJ-UHFFFAOYSA-L 0.000 description 1
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 239000011112 polyethylene naphthalate Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
- 239000003981 vehicle Substances 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013060899A JP6534024B2 (ja) | 2013-03-05 | 2013-03-05 | 熱交換器 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013060899A JP6534024B2 (ja) | 2013-03-05 | 2013-03-05 | 熱交換器 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014175648A JP2014175648A (ja) | 2014-09-22 |
| JP2014175648A5 JP2014175648A5 (enrdf_load_stackoverflow) | 2016-04-21 |
| JP6534024B2 true JP6534024B2 (ja) | 2019-06-26 |
Family
ID=51696544
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013060899A Active JP6534024B2 (ja) | 2013-03-05 | 2013-03-05 | 熱交換器 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP6534024B2 (enrdf_load_stackoverflow) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023210093A1 (ja) | 2022-04-28 | 2023-11-02 | 日本軽金属株式会社 | 熱交換器 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP3951865A4 (en) | 2019-03-28 | 2022-12-28 | Mitsui Chemicals, Inc. | COOLING UNIT, COOLING DEVICE, BATTERY STRUCTURE AND ELECTRIC VEHICLE |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05235572A (ja) * | 1992-02-20 | 1993-09-10 | Mitsubishi Shindoh Co Ltd | 回路基板の冷却装置 |
| JP2004006563A (ja) * | 2002-05-31 | 2004-01-08 | Nippon Light Metal Co Ltd | 放熱機構 |
| JP4913668B2 (ja) * | 2007-05-28 | 2012-04-11 | 株式会社リコー | 冷却装置、電子機器及び画像形成装置 |
-
2013
- 2013-03-05 JP JP2013060899A patent/JP6534024B2/ja active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023210093A1 (ja) | 2022-04-28 | 2023-11-02 | 日本軽金属株式会社 | 熱交換器 |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2014175648A (ja) | 2014-09-22 |
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