JP6533018B1 - 有機elデバイスの製造方法 - Google Patents
有機elデバイスの製造方法 Download PDFInfo
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- JP6533018B1 JP6533018B1 JP2018538904A JP2018538904A JP6533018B1 JP 6533018 B1 JP6533018 B1 JP 6533018B1 JP 2018538904 A JP2018538904 A JP 2018538904A JP 2018538904 A JP2018538904 A JP 2018538904A JP 6533018 B1 JP6533018 B1 JP 6533018B1
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- 239000011147 inorganic material Substances 0.000 description 14
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 12
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000003384 imaging method Methods 0.000 description 6
- 239000011368 organic material Substances 0.000 description 5
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- 239000000178 monomer Substances 0.000 description 4
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- 239000000126 substance Substances 0.000 description 2
- 229920001621 AMOLED Polymers 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000010538 cationic polymerization reaction Methods 0.000 description 1
- 238000005229 chemical vapour deposition Methods 0.000 description 1
- 230000008878 coupling Effects 0.000 description 1
- 238000010168 coupling process Methods 0.000 description 1
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- 125000003700 epoxy group Chemical group 0.000 description 1
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- VSQYNPJPULBZKU-UHFFFAOYSA-N mercury xenon Chemical compound [Xe].[Hg] VSQYNPJPULBZKU-UHFFFAOYSA-N 0.000 description 1
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- 238000007740 vapor deposition Methods 0.000 description 1
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 1
- 238000005406 washing Methods 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/873—Encapsulations
- H10K59/8731—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/131—Interconnections, e.g. wiring lines or terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
- H10K50/8445—Encapsulations multilayered coatings having a repetitive structure, e.g. having multiple organic-inorganic bilayers
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/122—Pixel-defining structures or layers, e.g. banks
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K2102/00—Constructional details relating to the organic devices covered by this subclass
- H10K2102/301—Details of OLEDs
- H10K2102/311—Flexible OLED
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Inorganic Chemistry (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
V0=(4−π)πR3 ・・・(1)
2 :回路(バックプレーン)
3 :OLED層(OLED)
4 :偏光板
10 :TFE構造
12、12a、12b :第1無機バリア層(SiN層)
12c :クラック
14 :有機バリア層
16 :第2無機バリア層
30 :引出し配線
34 :引出し配線の部分
36 :引出し配線の部分
38 :端子部
40 :異物検出装置
42 :コントローラ
44 :検出ヘッド
50 :インクジェット装置
52 :コントローラ
54 :インクジェットヘッド
56 :UV照射ヘッド
100 :OLED表示装置
P :パーティクル
R1 :アクティブ領域
R2 :周辺領域
TSF :順テーパー側面部分
Claims (5)
- 基板と、前記基板に支持された複数の有機EL素子とを有する素子基板を用意する工程と、
前記複数の有機EL素子を覆う薄膜封止構造を形成する工程とを包含し、
前記薄膜封止構造を形成する工程は、
第1無機バリア層を形成する工程Aと、
前記工程Aの後で、前記第1無機バリア層の下または上の球相当直径が0.2μm以上0.3μm未満の第1パーティクルを含むパーティクルを検出し、パーティクルごとの位置情報を取得する工程Bと、
前記工程Aの後で、前記無機バリア層の表面をアッシングする工程C0と、
前記工程C0の後で、前記位置情報に基づいて、パーティクルごとに、光硬化性樹脂を含む塗液の微小液滴をインクジェット法で付与し、パーティクルの周辺に前記光硬化性樹脂の凹状の表面を形成する工程Cと、
前記工程Cの後で、前記光硬化性樹脂に紫外線を照射し、前記光硬化性樹脂を硬化させることによって、有機バリア層を形成する工程Dと、
前記工程Dの後で、前記第1無機バリア層および前記有機バリア層の上に、第2無機バリア層を形成する工程Eと
を包含し、
前記工程Cは、前記第1パーティクルごとに、1つの体積が0.1fL以上10fL未満の第1微小液滴を付与する工程を包含する、有機ELデバイスの製造方法。 - 前記工程Bは、前記第1パーティクルおよび前記第1無機バリア層の下または上の球相当直径が0.3μm以上5μm以下の第2パーティクルを含むパーティクルを検出し、パーティクルごとのサイズ情報を取得する工程を包含し、
前記工程Cにおいて、前記微小液滴は、前記第1微小液滴よりもサイズの大きい第2微小液滴を含み、前記工程Cは、パーティクルごとの前記サイズ情報に基づいて、前記第1パーティクルに対して前記第1微小液滴を選択し、前記第2パーティクルの内の少なくとも前記球相当直径が5μmのパーティクルに対して前記第2微小液滴を選択する工程を包含する、請求項1に記載の製造方法。 - 前記第1微小液滴は、染料および顔料を含まず、前記第2微小液滴は、染料または顔料を含む、請求項2に記載の製造方法。
- 前記第2微小液滴の1つの体積は、10fL以上0.5pL以下である、請求項2または3に記載の製造方法。
- 前記工程Dは、前記光硬化性樹脂を硬化させることによって形成された光硬化樹脂層を部分的にアッシングする工程をさらに包含する、請求項1から4のいずれかに記載の製造方法。
Applications Claiming Priority (1)
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PCT/JP2017/042913 WO2019106770A1 (ja) | 2017-11-29 | 2017-11-29 | 有機elデバイスの製造方法および有機elデバイス |
Publications (2)
Publication Number | Publication Date |
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JP6533018B1 true JP6533018B1 (ja) | 2019-06-19 |
JPWO2019106770A1 JPWO2019106770A1 (ja) | 2019-12-12 |
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JP2018538904A Expired - Fee Related JP6533018B1 (ja) | 2017-11-29 | 2017-11-29 | 有機elデバイスの製造方法 |
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US (1) | US10950682B2 (ja) |
JP (1) | JP6533018B1 (ja) |
WO (1) | WO2019106770A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6703201B1 (ja) * | 2019-05-28 | 2020-06-03 | 堺ディスプレイプロダクト株式会社 | 有機elデバイスの製造方法 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11825683B2 (en) | 2018-04-20 | 2023-11-21 | Sakai Display Products Corporation | Organic electroluminescent device including thin film encapsulation structure and method for producing same |
CN113809263B (zh) * | 2021-08-25 | 2022-11-01 | 惠州华星光电显示有限公司 | 一种显示面板及显示面板的制作方法 |
Family Cites Families (22)
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US637009A (en) * | 1898-03-01 | 1899-11-14 | Ott Mergenthaler Company | Apparatus for locally hardening pieces of metal. |
US637003A (en) * | 1899-05-09 | 1899-11-14 | Lewis Kintz | Brake. |
US665817A (en) * | 1900-09-11 | 1901-01-08 | William M Moore | Street-lamp and ventilator. |
US720603A (en) * | 1902-10-06 | 1903-02-17 | Jeremiah Murray | Tie-spacing jack. |
JP2007250370A (ja) | 2006-03-16 | 2007-09-27 | Canon Inc | 有機発光素子及びその製造方法 |
JP2013247021A (ja) | 2012-05-28 | 2013-12-09 | Canon Inc | 表示装置及びその製造方法 |
US9246036B2 (en) * | 2012-08-20 | 2016-01-26 | Universal Display Corporation | Thin film deposition |
JP6054763B2 (ja) | 2013-02-12 | 2016-12-27 | 株式会社ジャパンディスプレイ | 有機el表示装置 |
CN105284186B (zh) | 2013-06-07 | 2017-05-17 | 株式会社爱发科 | 元件结构体及其制造方法 |
JP6405637B2 (ja) * | 2014-02-03 | 2018-10-17 | セイコーエプソン株式会社 | 画像形成装置、及び、ドットパターン決定方法 |
JP6374188B2 (ja) | 2014-03-14 | 2018-08-15 | 東京エレクトロン株式会社 | 封止構造の形成方法、封止構造の製造装置、並びに有機el素子構造の製造方法、及びその製造装置 |
JP2015220001A (ja) * | 2014-05-15 | 2015-12-07 | 株式会社ジャパンディスプレイ | 有機エレクトロルミネッセンス表示装置 |
JP6307384B2 (ja) | 2014-08-11 | 2018-04-04 | 株式会社ジャパンディスプレイ | 有機el表示装置 |
JP2016105052A (ja) | 2014-12-01 | 2016-06-09 | 東レエンジニアリング株式会社 | 基板検査装置 |
JP2017151313A (ja) | 2016-02-25 | 2017-08-31 | 株式会社ジャパンディスプレイ | 表示装置の製造方法 |
JP6487123B2 (ja) * | 2017-01-31 | 2019-03-20 | 堺ディスプレイプロダクト株式会社 | 有機el表示装置およびその製造方法 |
WO2018163338A1 (ja) * | 2017-03-08 | 2018-09-13 | 堺ディスプレイプロダクト株式会社 | 有機elデバイスの製造方法および成膜装置 |
CN114267812A (zh) * | 2017-03-30 | 2022-04-01 | 堺显示器制品株式会社 | 有机el器件及其制造方法 |
WO2019106771A1 (ja) * | 2017-11-29 | 2019-06-06 | 堺ディスプレイプロダクト株式会社 | 有機el表示装置およびその製造方法 |
WO2019106769A1 (ja) * | 2017-11-29 | 2019-06-06 | 堺ディスプレイプロダクト株式会社 | 有機el表示装置およびその製造方法 |
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- 2017-11-29 JP JP2018538904A patent/JP6533018B1/ja not_active Expired - Fee Related
- 2017-11-29 WO PCT/JP2017/042913 patent/WO2019106770A1/ja active Application Filing
- 2017-11-29 US US16/610,622 patent/US10950682B2/en active Active
Cited By (1)
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JP6703201B1 (ja) * | 2019-05-28 | 2020-06-03 | 堺ディスプレイプロダクト株式会社 | 有機elデバイスの製造方法 |
Also Published As
Publication number | Publication date |
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US10950682B2 (en) | 2021-03-16 |
WO2019106770A1 (ja) | 2019-06-06 |
JPWO2019106770A1 (ja) | 2019-12-12 |
US20200235335A1 (en) | 2020-07-23 |
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