JP6507266B2 - Printing apparatus and printing method - Google Patents

Description

  The present invention relates to a printing apparatus and a printing method, and more particularly to a printing apparatus and a printing method for printing a viscous material on a mask on a substrate.

  2. Description of the Related Art Conventionally, a printing apparatus for printing a viscous material on a mask on a substrate is known. Such a printing apparatus is disclosed, for example, in Japanese Patent No. 5150092.

  The above-mentioned Japanese Patent No. 5150092 includes a screen holding device for holding a screen (mask) in which a plurality of through holes are formed, and a squeegee unit for printing solder (viscous material) on the screen on a circuit board (Printing device) is disclosed. The squeegee unit is provided with a thin plate-like squeegee. In this screen printing machine, with the squeegee in contact with the screen, the squeegee is moved along the screen to print the solder on the screen onto the circuit board through the plurality of through holes. During printing, the solder on the screen is moved as it is rolled, thereby forming roll-shaped solder (solder roll). In this screen printing machine, when the printing of the solder is completed, the squeegee is separated from the solder roll at a preset separation speed.

Patent No. 5150092

  Here, when the separation speed is too fast, the amount of solder attached to the squeegee and pulled out from the solder roll increases, so that the solder which falls toward the solder roll after being pulled out increases. For this reason, an air layer is likely to be formed between the solder that has been pulled out of the solder roll and then collapsed toward the solder roll. In this case, since the formed air layer is caught in the solder roll when printing on the next circuit board, the solder can not be stably printed on the board due to the air inclusion. The inconvenience of this arises. The separation speed at which such air entrapment occurs varies depending on the type of solder and the condition of the solder. For this reason, in the case of the screen printing machine described in the above-mentioned Japanese Patent No. 5150092 in which the squeegee is driven at a preset separation speed, when the types of solder (viscous material) are different or when the state of the solder is different, etc. It is considered that there is a problem that entrapment of air may occur because the squeegee can not be driven at an appropriate separation speed.

  The present invention has been made to solve the problems as described above, and one object of the present invention is to suppress the occurrence of air entrainment by driving the squeegee at an appropriate separation speed. It is an object of the present invention to provide a printing apparatus and printing method capable of stably printing a viscous material on a substrate.

  A printing apparatus according to a first aspect of the present invention is a squeegee for printing a viscous material on a mask onto a substrate by being moved in a printing direction on a mask having a printing pattern, and a printing operation of the viscous material on the substrate A control unit for moving the squeegee away from the viscous material, and based on the adhesion amount of the viscous material to the separated squeegee, the separation speed of the squeegee in the operation for separating the squeegee from the viscous material is determined Is configured.

  In the printing apparatus according to the first aspect of the present invention, as described above, printing is performed such that the separation speed of the squeegee in the operation of separating the squeegee from the viscous material is determined based on the adhesion amount of the viscous material to the separated squeegee. Configure the device. Thereby, when the separation speed of the squeegee is determined based on the adhesion amount of the viscous material to the separated squeegee, when the state of the viscous material is different, an appropriate separation speed according to the actual state of the viscous material is determined. It can be decided. Therefore, by driving the squeegee at an appropriate separation speed, it is possible to stably print the viscous material on the substrate while suppressing the occurrence of air entrainment.

  In the printing apparatus according to the first aspect, preferably, the initial value of the separation speed is determined based on the physical property value information of the viscous material. According to this structure, an appropriate separation speed can be determined from the start of printing, so that the squeegee can be driven at an appropriate separation speed from the start of printing. Further, since the initial value of the separation speed is determined based on the physical property value information of the viscous material, it is appropriate that the user is not a skilled user, unlike the case where the user needs to determine (input) the initial value of the separation speed. The initial value of the separation speed can be easily determined.

  In this case, preferably, the initial value of the separation speed determined based on the physical property value information of the viscous material is adjusted based on the adhesion amount of the viscous material to the separated squeegee to determine the separation speed of the squeegee Is configured. According to this structure, since the appropriate separation speed determined based on the physical property value information of the viscous material can be adjusted based on the adhesion amount of the viscous material to the separated squeegee, a more appropriate separation speed can be obtained. Can be determined.

  In the configuration for determining the initial value of the separation speed based on the physical property value information of the viscous material, preferably, the physical property value information of the viscous material is information on the viscosity of the viscous material or information on the thixotropy index of the viscous material. At least one of them is included. Here, in the operation of separating the squeegee from the viscous material, the ease of cutting the viscous material from the squeegee largely depends on the viscosity of the viscous material and the thixotropy index of the viscous material. Therefore, when configured as described above, at least one of the information on the viscosity of the viscous material which greatly contributes to the ease of cutting of the viscous material, and the information on the thixotropy index of the viscous material which largely contributes to the ease of cutting of the viscous material. Based on one or the other, a more appropriate separation speed can be determined.

  In the printing apparatus according to the first aspect, preferably, the separation speed of the squeegee is adjusted and determined in accordance with the difference between the adhesion amount of the viscous material to the squeegee separated and the threshold value of the adhesion amount. It is done. According to this structure, since the separation speed can be determined reflecting the actual state of the viscous material, an appropriate separation speed can be easily determined according to the actual state of the viscous material.

  In this case, preferably, a plurality of squeegees whose widths in the direction substantially orthogonal to the printing direction are different from each other can be used, and the threshold value of the adhesion amount is the width in the direction substantially orthogonal to the printing direction of the squeegee. It is provided accordingly. According to this structure, even in the case where a plurality of squeegees having different widths in the direction substantially orthogonal to the printing direction are used in exchange, it is possible to determine an appropriate separation speed according to the width of each squeegee.

  In the printing apparatus according to the first aspect, preferably, the separation speed of the squeegee is determined based on the adhesion amount of the viscous material to the spaced squeegee as well as the remaining amount of the viscous material on the mask. It is done. According to this configuration, even when the printing operation is performed and the remaining amount of the viscous material on the mask changes, it is possible to determine an appropriate separation speed according to the remaining amount of the viscous material on the mask. As a result, the squeegee can be driven at an even more appropriate separation speed.

  In this case, preferably, in addition to determining the separation speed of the squeegee, the timing of adjusting the separation speed of the squeegee is also determined based on the remaining amount of the viscous material on the mask. According to this structure, the separation speed can be adjusted at an appropriate timing according to the remaining amount of the viscous material on the mask. As a result, even when the printing operation is performed and the remaining amount of the viscous material on the mask changes, the separation speed of the squeegee can be maintained at an appropriate separation speed.

  In the above-described configuration in which the separation speed of the squeegee is determined based on the remaining amount of the viscous material on the mask, preferably, the supply amount of the viscous material supplied on the mask, the adhesion amount of the viscous material to the separated squeegee, The remaining amount of the viscous material on the mask is acquired based on the printing amount of the viscous material by the mask on one substrate and the number of printed substrates. According to this structure, the remaining amount of the viscous material on the mask can be acquired without providing a dedicated measuring device for acquiring the remaining amount of the viscous material on the mask. It is possible to suppress the complication of the device configuration for acquiring the remaining amount of.

  The printing apparatus according to the first aspect preferably further comprises a load measuring unit for measuring the load of the squeegee on the mask, and the adhesion amount of the viscous material to the squeegee separated based on the measurement result by the load measuring unit. It is configured to get According to this structure, the load of the squeegee on the mask and the amount of adhesion of the viscous material on the separated squeegee can be acquired using the common load measurement unit, so that the amount of adhesion of the viscous material can be acquired. It is possible to suppress the complication of the device configuration.

  In the printing method according to the second aspect of the present invention, the viscous material on the mask is printed on the substrate by moving the squeegee on the mask having the printing pattern, and after the printing operation of the viscous material on the substrate, the viscous material The separation speed of the squeegee in the operation of separating the squeegee from the squeegee and the separation of the squeegee from the viscous material is determined based on the adhesion amount of the viscous material to the separated squeegee.

  In the printing method according to the second aspect of the present invention, as described above, the separation speed of the squeegee in the operation of separating the squeegee from the viscous material is determined based on the adhesion amount of the viscous material to the separated squeegee. Thus, as in the case of the printing apparatus according to the first aspect, by driving the squeegee at an appropriate separation speed, the occurrence of air entrapment is suppressed, and the viscous material is stably printed on the substrate. be able to.

  According to the present invention, as described above, by driving the squeegee at an appropriate separation speed, it is possible to suppress the occurrence of air entrapment, and to print the viscous material stably on the substrate. And printing methods can be provided.

FIG. 1 is a schematic view showing an overall configuration of a printing apparatus according to an embodiment of the present invention. FIG. 2 is a block diagram showing a control configuration of the printing apparatus of an embodiment. It is a figure for demonstrating the state of the solder in the operation | movement which spaces apart a squeegee from the solder by the printing apparatus of one Embodiment, and FIG. 3 (A) is a front view which shows the state of the solder in case separation speed is comparatively high. 3 (B) is a side view showing the state of the solder when the separation speed is relatively fast, and FIG. 3 (C) is a front view showing the state of the solder when the separation speed is relatively slow, 3 (D) is a side view showing the state of the solder when the separation speed is relatively low. It is a figure for demonstrating the relationship between the viscosity of a solder, the thixotropy index (thixo index) of a solder, and the easiness of a solder. It is a figure for demonstrating the initial value table of the printing apparatus of one Embodiment. It is a figure for demonstrating adjustment of the separation speed according to the adhesion amount of the solder to the squeegee by the printing apparatus of one Embodiment. It is a figure for demonstrating the threshold value of the adhesion amount according to the squeegee width | variety of the printing apparatus of one Embodiment. 5 is a flowchart for explaining processing at the time of printing by the printing apparatus of one embodiment.

  Hereinafter, an embodiment of the present invention will be described based on the drawings.

[One embodiment]
(Configuration of printing device)
The configuration of a printing apparatus 100 according to an embodiment of the present invention will be described with reference to FIGS. 1 to 7.

  The printing apparatus 100 is an apparatus for printing the paste-like solder Sp on the substrate P through a mask M having a printing pattern, as shown in FIG. The substrate P is a substrate such as a printed circuit board on which electronic components are mounted. The solder Sp is a viscous material for bonding the electronic component to the substrate P. The solder Sp is an example of the “viscous material” in the claims.

  As shown in FIG. 1, the printing apparatus 100 includes a substrate conveyance unit 1, a substrate holding unit 2, a squeegee unit 3, a substrate recognition camera 4, a mask recognition camera 5, and a control unit 6.

  The substrate transfer unit 1 is configured to transfer the substrate P in the transfer direction (X direction). Specifically, the substrate conveyance unit 1 carries in the substrate P before printing from the conveyance path (not shown) on the upstream side (X2 side), and conveys the carried-in substrate P to the delivery position to the substrate holding unit 2. The substrate P after printing is carried out to a conveyance path (not shown) on the downstream side (X1 side).

  Moreover, the board | substrate conveyance part 1 has a pair of conveyor part 11 extended in a conveyance direction (X direction). Further, the pair of conveyor units 11 are arranged at predetermined intervals in the direction (Y direction) orthogonal to the transport direction. The substrate transport unit 1 is configured to transport the substrate P in the transport direction while supporting the both ends in the direction orthogonal to the transport direction of the substrate P from the lower side by the pair of conveyor units 11.

  The substrate holding unit 2 is disposed below the mask M, and is configured to receive the substrate P delivered from the substrate transfer unit 1 at the delivery position and to receive the delivered substrate P. Further, the substrate holding unit 2 is configured to be able to align the held substrate P and the mask M. Further, the substrate holding unit 2 is configured to be capable of bringing the substrate P into contact with the mask M by moving the substrate P upward.

  The substrate holder 2 includes a backup unit 21, a clamp mechanism 22, and a drive mechanism 23.

  The backup unit 21 is configured to support the substrate P from below. The backup unit 21 has a backup plate 21a, a plurality of backup pins 21b, and a lifting mechanism 21c. The backup plate 21a is configured to move in the vertical direction by the driving force of the elevating mechanism 21c. The plurality of backup pins 21b are provided on the backup plate 21a. The backup unit 21 is configured to lift the substrate P from the pair of conveyor units 11 by a plurality of backup pins 21 b by moving the backup plate 21 a upward, and to support the substrate P from below.

  The clamp mechanism unit 22 is configured to hold and fix the substrate P in a state of being supported by the backup unit 21. Specifically, the clamp mechanism units 22 are provided above the pair of conveyor units 11 respectively. That is, like the pair of conveyor units 11, the pair of clamp mechanism units 22 are arranged at predetermined intervals in the direction (Y direction) orthogonal to the conveyance direction. The pair of clamp mechanisms 22 hold the substrate P by clamping the substrate P from both sides (Y1 side and Y2 side) in the direction orthogonal to the transport direction by adjusting the spacing in the direction orthogonal to the transport direction. It is configured to be fixed.

  The drive mechanism unit 23 is a drive mechanism unit for aligning the substrate P held by the pair of clamp mechanism units 22 and the mask M and bringing the substrate P and the mask M into contact with each other.

  The drive mechanism 23 includes a base plate 231, a Y-axis drive mechanism 232, an X-axis drive mechanism 233, an R-axis drive mechanism 234, and a Z-axis drive mechanism 235.

  On the base plate 231, an X-axis drive mechanism 233, an R-axis drive mechanism 234, and a Z-axis drive mechanism 235 are provided in this order from the lower side (Z2 side). A plurality of bracket members 22a extending in the vertical direction are provided on a support plate 235a, which will be described later, of the Z-axis drive mechanism 235. The pair of clamp mechanisms 22 is attached to the support plate 235 a of the Z-axis drive mechanism 235 via a plurality of bracket members 22 a. That is, the pair of clamp mechanisms 22 is attached to the base plate 231 via the bracket member 22 a, the Z-axis drive mechanism 235, the R-axis drive mechanism 234, and the X-axis drive mechanism 233.

  Further, below the base plate 231, a Y-axis drive mechanism portion 232 is provided. On the lower surface of the base plate 231, a ball nut 231a engaged (screwed) with a later-described ball screw shaft 232b of the Y-axis drive mechanism portion 232 is provided.

  The Y-axis drive mechanism unit 232 is configured to move the substrate P held by the pair of clamp mechanism units 22 in a direction (Y direction) orthogonal to the transport direction. The Y-axis drive mechanism portion 232 includes a drive motor 232a, a ball screw shaft 232b, and a guide rail 232c.

  The drive motor 232a is configured to generate a drive force for rotating the ball screw shaft 232b. The ball screw shaft 232b is formed to extend along a direction (Y direction) orthogonal to the transport direction, and is configured to rotate around an axis extending along the Y direction by the driving force of the drive motor 232a. There is. The guide rails 232 c are formed to extend along the Y direction, and are configured to guide the movement of the base plate 231 in the Y direction.

  The base plate 231 is configured to be movable in the Y direction along the guide rail 232c together with the ball nut 231a engaged (screwed) with the ball screw shaft 232b by rotating the ball screw shaft 232b by the drive motor 232a. . Thus, the Y-axis drive mechanism 232 is configured to move the substrate P held by the pair of clamp mechanisms 22 together with the base plate 231 in the direction (Y direction) orthogonal to the transport direction.

  The X-axis drive mechanism unit 233 is provided on the base plate 231. In addition, the X-axis drive mechanism 233 is configured to move the substrate P held by the pair of clamp mechanisms 22 in the transport direction (X direction). The R-axis drive mechanism 234 is provided on the X-axis drive mechanism 233. In addition, the R-axis drive mechanism unit 234 is configured to rotate the substrate P held by the pair of clamp mechanism units 22 in a horizontal plane (XY plane). The drive mechanism 23 moves the substrate P in the Y direction by the Y-axis drive mechanism 232, moves the substrate P in the X direction by the X-axis drive mechanism 233, or rotates the substrate P by the R-axis drive mechanism 234. Horizontal alignment between P and the mask M is performed.

  The Z-axis drive mechanism 235 is provided on the R-axis drive mechanism 234. Further, the Z-axis drive mechanism portion 235 is configured to move the substrate P held by the pair of clamp mechanism portions 22 in the vertical direction (Z direction). The Z-axis drive mechanism 235 includes a support plate 235a, a plurality of ball screw shafts 235b, and a plurality of ball nuts 235c.

  The backup unit 21 is mounted on the support plate 235a. The clamp mechanism 22 is attached on the support plate 235a via the bracket member 22a.

  Each of the plurality of ball screw shafts 235 b is formed to extend along the vertical direction (Z direction). Each of the plurality of ball screw shafts 235b is configured to rotate about an axis extending along the Z direction by the driving force of a driving motor (not shown). The plurality of ball nuts 235c are provided on the support plate 235a, and are engaged (screwed) with the corresponding ball screw shafts 235b.

  The support plate 235a is vertically movable along the ball screw shaft 235b together with the ball nut 235c engaged (screwed) with the ball screw shaft 235b by rotating a plurality of ball screw shafts 235b by a drive motor (not shown). It is configured. Accordingly, the Z-axis drive mechanism portion 235 is configured to move the substrate P held by the pair of clamp mechanism portions 22 in the vertical direction together with the support plate 235a. Therefore, for example, the drive mechanism unit 23 can move the substrate P in a state in which alignment with the mask M has been performed upward, and bring the substrate P and the mask M into contact with each other. Further, for example, the drive mechanism unit 23 can move the substrate P after printing downward to separate the mask M and the substrate P from each other.

  The squeegee unit 3 is disposed above the mask M, and is a unit for printing the solder Sp on the mask M on the substrate P. The squeegee unit 3 includes a squeegee 31, a squeegee Y-axis drive mechanism portion 32, a squeegee Z-axis drive mechanism portion 33, a squeegee R-axis drive mechanism portion 34, and a solder supply portion 35.

  The squeegee 31 prints the solder Sp on the mask M on the substrate P by being moved in the printing direction (in the present embodiment, the Y direction) on the mask M having the printing pattern in a state in contact with the mask M Is configured as.

  The squeegee 31 has a rectangular shape, and is provided with a plate-like portion 31 a for moving the solder Sp in contact with the solder Sp. The plate-like portion 31a of the squeegee 31 is formed to extend along the direction orthogonal to the printing direction such that the direction (X direction) orthogonal to the printing direction is the longitudinal direction.

  The mask M has a flat plate shape of a rectangular shape in plan view, and is a metal mask made of metal. The mask M is provided with a plurality of openings Ap that constitute a print pattern. The solder Sp on the mask M contacts the plate-like portion 31 a of the squeegee 31 and is moved in the printing direction on the mask M, whereby the opening Ap of the mask M is filled. As a result, the solder Sp is printed on the substrate P disposed below the mask M in a print pattern of the mask M. In addition, the mask M is disposed between the substrate holding unit 2 and the squeegee unit 3 in a state of being attached to the frame 90. In the printing apparatus 100, the frame 90 is held by a mask holding unit (not shown).

  Further, as shown in FIG. 3, the squeegee 31 is provided with a support shaft 31 b. The support shaft 31 b is formed to extend along the X direction (longitudinal direction of the squeegee 31). The support shaft 31 b is rotatably attached to the squeegee R-axis drive mechanism unit 34. The squeegee 31 is provided with a connection portion 31 c. The connection portion 31c is provided on both sides (X1 side and X2 side) of the support shaft 31b, and is configured to connect the plate-like portion 31a and the support shaft 31c.

  As shown in FIG. 1, the squeegee Y-axis drive mechanism unit 32 is configured to move the squeegee 31 in the printing direction (Y direction). The squeegee Y-axis drive mechanism portion 32 has a drive motor 321, a ball screw shaft 322, and an attachment portion 323.

  The drive motor 321 is configured to generate a drive force for rotating the ball screw shaft 322. The ball screw shaft 322 is formed to extend in the Y direction, and is configured to rotate around an axis extending in the Y direction by the driving force of the drive motor 321. The squeegee Z-axis drive mechanism 33 is attached to the attachment portion 323. Further, the solder supply unit 35, the squeegee R-axis drive mechanism unit 34, and the squeegee 31 are attached to the attachment unit 323 via the squeegee Z-axis drive mechanism unit 33. Further, the mounting portion 323 is provided with a ball nut 323 a engaged (screwed) with the ball screw shaft 322.

  The mounting portion 323 is configured to be movable in the Y direction along the ball screw shaft 322 together with the ball nut 323a engaged (screwed) with the ball screw shaft 322 when the ball screw shaft 322 is rotated by the drive motor 321. There is. Thereby, the squeegee Y-axis drive mechanism 32 moves the squeegee 31, the squeegee Z-axis drive mechanism 33, the squeegee R-axis drive mechanism 34, and the solder supply unit 35 in the printing direction (Y direction) together with the mounting portion 323. Is configured as.

  The squeegee Z-axis drive mechanism 33 is attached to the side of the attachment portion 323 on the Y1 side. The squeegee R-axis drive mechanism 34 and the squeegee 31 are attached to the side of the squeegee Z-axis drive mechanism 33 on the Y1 side via the squeegee R-axis drive mechanism 34. The squeegee Z-axis drive mechanism unit 33 is configured to move the squeegee 31 in the vertical direction (Z direction).

  The squeegee 31 is rotatably attached to the squeegee R-axis drive mechanism portion 34 via a support shaft 31 b (see FIG. 3). The squeegee R-axis drive mechanism section 34 is configured to rotate the squeegee 31 about an axis extending along the X direction and passing through the center of the support shaft 31 b of the squeegee 31.

  The solder supply unit 35 is attached to the side of the squeegee Z-axis mechanism 33 on the Y1 side. The solder supply unit 35 includes a solder storage unit 35a in which the solder Sp is stored, and is configured to be able to supply the solder Sp stored in the solder storage unit 35a onto the mask M.

  In addition, the squeegee unit 3 is provided with a load cell 36 (see FIG. 2). The load cell 36 is configured to measure the load (load) of the squeegee 31. The load cell 36 is provided to measure the load of the squeegee 31 on the mask M in a state where the mask M and the squeegee 31 are in contact with each other. The control unit 6 is configured to acquire the load (printing pressure) of the squeegee 31 on the mask M based on the measurement result of the load cell 36. Further, the control unit 6 is configured to adjust the load (printing pressure) at the time of the printing operation of the solder Sp on the substrate P, based on the load (printing pressure) of the squeegee 31 to the acquired mask M. . The load cell 36 is an example of the “load measurement unit” in the claims.

  The substrate recognition camera 4 is configured to be movable above the substrate holding unit 2. The substrate recognition camera 4 is configured to pick up an unshown mark attached to the substrate P from above the substrate P prior to the printing of the solder Sp on the substrate P. The imaging result of the substrate P by the substrate recognition camera 4 is acquired by the control unit 6. The control unit 6 is configured to recognize the position of the substrate P based on the acquired imaging result of the substrate P.

  The mask recognition camera 5 is attached to the Y1 side of the substrate holding unit 2. The mask recognition camera 5 is configured to pick up an unshown mark attached to the mask M from below the mask M prior to the printing of the solder Sp on the substrate P. An imaging result of the mask M by the mask recognition camera 5 is acquired by the control unit 6. The control unit 6 is configured to recognize the position of the mask M based on the acquired imaging result of the mask M. Further, the control unit 6 is configured to perform accurate alignment between the substrate P and the mask M based on the recognized position of the substrate P and the position of the mask M.

  As shown in FIG. 2, the control unit 6 includes a CPU (Central Processing Unit), and is configured to control the operation of the printing apparatus 100. Further, the control unit 6 is provided with a storage unit 6a. An initial value table 6 b is stored in the storage unit 6 a. As shown in FIG. 5, the initial value table 6b is a table for determining the initial value of the separation speed of the squeegee 31 based on the physical property value information of the solder Sp.

  During production of the substrate P, the control unit 6 controls the substrate conveyance unit 1, the substrate holding unit 2, the squeegee unit 3, the substrate recognition camera 4, the mask recognition camera 5 and the like according to a production program stored in advance to It is configured to print the solder Sp.

  When printing the solder Sp on the substrate P, the controller 6 brings the upper surface of the mask M into contact with the plate-like portion 31a of the squeegee 31 in a state where the upper surface of the substrate P and the lower surface of the mask M are in contact. . Then, the control unit 6 moves the squeegee 31 in the printing direction (Y direction) on the mask M in a state in which the mask M and the plate-like portion 31a of the squeegee 31 are in contact with each other. The printing operation is performed to print the solder Sp supplied on M onto the substrate P. During the printing operation, the solder Sp is moved on the mask M while being rolled by the squeegee 31. As a result, the solder Sp forms a solder roll (see FIG. 3) having a general bar shape on the mask M.

  In addition, after the printing operation of the solder Sp on the substrate P, the control unit 6 performs an operation of separating the squeegee 31 from the solder Sp and the mask M in the separating direction (in the present embodiment, upward (Z1 direction)). It is configured. Thereafter, the control unit 6 is configured to turn the squeegee 31 in the opposite direction by rotating the squeegee 31 about an axis passing through the center of the support shaft 31 b.

  For example, as shown in FIG. 1, the squeegee 31 is moved in the printing direction (Y1 direction) from the Y2 side to the Y1 side of the mask M, and the squeegee 31 is separated from the solder Sp and the mask M on the Y1 side of the mask M Later, the contact surface of the plate-like portion 31 a of the squeegee 31 with the solder Sp is reversed from the direction of the Y 1 side to the direction of the Y 2 side. Further, after the squeegee 31 is moved in the printing direction (Y2 direction) from the Y1 side to the Y2 side of the mask M and the squeegee 31 is separated from the solder Sp and the mask M on the Y2 side of the mask M The contact surface of the portion 31a with the solder Sp is reversed from the Y2 direction to the Y1 direction.

  Then, the control unit 6 is configured to bring the squeegee 31 in the opposite direction into contact with the mask M again, and to perform the printing operation of the solder Sp on the next substrate P.

(Separation speed in separation operation)
Here, with reference to FIG. 3, the separation speed in the separation operation of the squeegee 31 will be described. Here, two cases of the case where the separation speed of the squeegee 31 is relatively high and the case where the separation speed of the squeegee 31 is relatively low will be described.

  First, the case where the separation speed of the squeegee 31 is relatively fast will be described. As shown in FIGS. 3A and 3B, when the separation speed is relatively high, the solder breakage becomes worse. Therefore, the amount of solder attached to the squeegee 31 and drawn out from the main body (solder roll) of the solder Sp increases, and the drawing distance of the solder Sp becomes longer. As a result, the solder Sp which is pulled out from the main body (solder roll) of the solder Sp and falls toward the main body (solder roll) of the solder Sp increases. Therefore, when the separation speed of the squeegee 31 is relatively fast, an air layer is likely to be formed between the pulled out and fallen solder Sp and the main body (solder roll) of the solder Sp. Since the formed air layer is caught in the main body (solder roll) of the solder Sp at the time of printing on the next substrate P, printing defects (openings of the mask M due to the inclusion of the air) Insufficient amount of filling of solder Sp to Ap) occurs.

  Next, the case where the separation speed of the squeegee 31 is relatively low will be described. As shown in FIGS. 3 (C) and 3 (D), when the separation speed is relatively slow, the solder breakage is improved. Therefore, the amount of solder attached to the squeegee 31 and drawn out from the main body (solder roll) of the solder Sp is reduced, and the drawing distance of the solder Sp is shortened. As a result, the solder Sp which is pulled out from the main body (solder roll) of the solder Sp and falls toward the main body (solder roll) of the solder Sp is reduced. Therefore, when the separation speed of the squeegee 31 is relatively low, an air layer is less likely to be formed between the pulled out and fallen solder Sp and the main body (solder roll) of the solder Sp. However, when the separation speed is too slow, the printing operation time is increased, which lowers the productivity.

  Therefore, the separation speed in the separation operation of the squeegee 31 is preferably an appropriate separation speed. As shown in FIG. 3, in the separation operation of the squeegee 31, the solder Sp in an amount corresponding to the separation speed adheres to the plate-like portion 31 a of the squeegee 31.

(Configuration of control unit related to determination of separation speed)
Next, with reference to FIGS. 4 to 7, the configuration of the control unit 6 related to the determination of the separation speed of the squeegee 31 will be described.

  Here, in the present embodiment, the controller 6 separates the squeegee 31 in the operation of separating the squeegee 31 from the solder Sp based on the physical property value information of the solder Sp and the adhesion amount of the solder Sp to the separated squeegee 31. It is configured to determine the speed. At this time, the control unit 6 sets the separation speed of the squeegee 31 at a relatively high separation speed (for example, a separation speed near the upper limit among separation speeds at which air does not occur) among separation speeds at which air does not occur. Is configured to determine.

<Determination of initial value of separation speed>
In the present embodiment, the control unit 6 is configured to first determine the initial value of the separation speed of the squeegee 31 based on the physical property value information of the solder Sp.

  Here, as shown in FIG. 4, there is a relationship between the ease of cutting of the solder Sp (the goodness of breaking of the solder), the thixotropy index of the solder Sp (hereinafter referred to as “thixo index”) and the viscosity of the solder Sp. There is sex. That is, as the thixotropy of the solder Sp is larger, the solder Sp is more likely to be broken, and as the thixotropy of the solder Sp is smaller, the solder Sp is less likely to be broken. Also, the larger the viscosity of the solder Sp, the easier it is to break the solder Sp, and the smaller the viscosity of the solder Sp, the harder the solder Sp is to break.

  Therefore, the control unit 6 acquires at least one of information related to the viscosity of the solder Sp or information related to the thixotropy of the solder Sp as physical property value information of the solder Sp, and the acquired information (the solder Sp It is configured to determine the initial value of the separation speed of the squeegee 31 based on the information on the viscosity, the information on the thixotropy of the solder Sp, or both information).

  In the printing apparatus 100 according to the present embodiment, the viscosity of the solder Sp used for printing is input by the user as information on the viscosity of the solder Sp. Further, in the printing apparatus 100, the thixotropy of the solder Sp used for printing is input by the user as information on the thixotropy of the solder Sp. That is, in accordance with catalog information and the like owned by the user, at least one of the viscosity of the solder Sp and the thixotropy of the solder Sp under a predetermined condition (for example, a predetermined temperature condition) is input by the user.

  The control unit 6 sets the initial value of the separation speed from the initial value table 6 b stored in the storage unit 6 a based on at least one of the information on the viscosity of the solder Sp and the information on the thixotropy of the solder Sp. It is configured to get.

  The initial value table 6b is a first initial value table 6c for determining the initial value of the separation speed based on both the viscosity of the solder Sp and the thixotropy of the solder Sp, and the separation speed based on only the viscosity of the solder Sp. Three tables are included: a second initial value table 6d for determining an initial value, and a third initial value table 6e for determining an initial value of the separation speed based only on the thixotropy of the solder Sp. Thus, even if neither the viscosity of the solder Sp nor the thixotropy of the solder Sp is acquired (input), the initial value of the separation speed is based on the viscosity of the solder Sp and / or the thixotropy of the solder Sp. It will be possible to determine Note that FIG. 5 shows the first initial value table 6c.

  The control unit 6 is configured to acquire an initial value of the separation speed from the first initial value table 6 c when both the viscosity of the solder Sp and the thixotropy of the solder Sp are acquired. As shown in FIG. 5, in the first initial value table 6c, the initial value of the separation speed is set such that the value increases as the viscosity of the solder Sp increases. Further, in the first initial value table 6c, the initial value of the separation speed is set such that the value becomes larger as the thixotropy of the solder Sp becomes larger. In the first initial value table 6c, as the initial value of the separation speed according to the viscosity of the solder Sp and the thixotropy of the solder Sp, the separation speed which is previously determined by experiments etc. is relatively large among the separation speeds that do not occur The separation speed is set. Further, in FIG. 5, the initial value of the separation speed when the reference speed of the separation speed is 100% is represented by percentage. For example, when the viscosity is 200 Pa · s and the thixo index is 0.5, the separation speed having a value of 80% with respect to the reference speed is acquired by the control unit 6 as the initial value of the separation speed.

  Further, when only the viscosity of the solder Sp is obtained (inputted), the control unit 6 is configured to obtain the initial value of the separation speed from the second initial value table 6d. Although illustration is omitted, in the second initial value table 6d, the initial value of the separation speed is set such that the value becomes larger as the viscosity of the solder Sp becomes larger. In the second initial value table 6d, as the initial value of the separation speed according to the viscosity of the solder Sp, a relatively large separation speed is set among separation speeds at which air entrainment does not occur, which is determined in advance by experiments. .

  Further, the control unit 6 is configured to acquire the initial value of the separation speed from the third initial value table 6 e when only the thixotropy of the solder Sp is acquired (input). Although illustration is omitted, in the third initial value table 6e, the initial value of the separation speed is set such that the value becomes larger as the thixotropy of the solder Sp becomes larger. In the third initial value table 6e, as the initial value of the separation speed according to the thixotropy of the solder Sp, a relatively high separation speed is set among separation speeds at which air entrainment does not occur, which is determined in advance by experiments. ing.

  Therefore, the control unit 6 is configured to obtain, from the initial value table 6b, the initial value of the separation speed so that the value becomes larger as the viscosity of the solder Sp becomes larger. Further, the control unit 6 is configured to obtain an initial value of the separation speed so that the value becomes larger from the initial value table 6 b as the thixotropy of the solder Sp becomes larger.

<Adjustment of initial value of separation speed at test printing>
Further, in the present embodiment, the printing apparatus 100 is configured to perform test printing to determine the separation speed. In test printing, the printing operation of the solder Sp by the squeegee 31 on one substrate P and the separation operation from the solder Sp of the squeegee 31 after the printing operation are performed.

  At the time of the separation operation, the control unit 6 is configured to acquire the amount of adhesion of the solder Sp to the separated squeegee 31 in a state where the squeegee 31 and the solder Sp are separated. Specifically, the control unit 6 acquires the adhesion amount of the solder Sp to the separated squeegee 31 based on the measurement result of the load of the squeegee 31 by the load cell 36 in a state where the squeegee 31 and the solder Sp are separated. Is configured as.

  In addition, the control unit 6 adjusts the initial value of the separation speed determined based on the physical property value information of the solder Sp based on the adhesion amount of the solder Sp on the separated squeegee 31 to separate the separation speed of the squeegee 31 It is configured to make decisions.

  At this time, as shown in FIG. 6, the control unit 6 acquires the difference between the adhesion amount of the solder Sp on the squeegee 31 separated and the threshold value of the adhesion amount, and the solder Sp to the acquired squeegee 31 The initial value of the separation speed of the squeegee 31 is adjusted and determined in accordance with the difference between the adhesion amount and the adhesion amount threshold value. In the printing apparatus 100, the adhesion amount of the squeegee 31 is set to be a relatively high separation speed among separation speeds at which air entrainment does not occur, which is determined in advance by experiments as a threshold value of the adhesion amount.

  Specifically, when the difference between the adhesion amount of the solder Sp on the squeegee 31 and the threshold value of the adhesion amount is a positive value, the control unit 6 adheres the solder Sp to the squeegee 31. The separation speed is adjusted to decrease as the difference between the amount and the adhesion amount threshold increases. That is, when the difference between the adhesion amount of the solder Sp on the squeegee 31 and the threshold value of the adhesion amount is a positive value, the adhesion amount of the solder Sp on the squeegee 31 and the threshold value of the adhesion amount Since the actual separation speed is considered to be faster with respect to the appropriate separation speed as the difference with is larger, the separation speed is adjusted so that the value becomes smaller.

  In addition, when the difference between the adhesion amount of the solder Sp on the squeegee 31 and the threshold value of the adhesion amount is a negative value, the control unit 6 adheres the adhesion amount and adhesion of the solder Sp on the squeegee 31 The separation speed is configured to be adjusted to increase as the absolute value of the difference between the amount and the threshold increases. That is, when the difference between the adhesion amount of the solder Sp on the squeegee 31 and the threshold value of the adhesion amount is a negative value, the adhesion amount of the solder Sp on the squeegee 31 and the threshold value of the adhesion amount Since the actual separation speed is considered to be slower with respect to the appropriate separation speed as the absolute value of the difference with the above becomes larger, the separation speed is adjusted so that the value becomes larger.

  Further, the control unit 6 is configured to change the adjustment amount of the separation speed (shown as an adjustment ratio in FIG. 6) in accordance with the viscosity of the solder Sp and the thixotropy of the solder Sp. Specifically, the control unit 6 is configured to change the adjustment amount of the separation speed so that the absolute value of the adjustment amount of the separation speed decreases as the viscosity of the solder Sp increases. Further, the control unit 6 is configured to change the adjustment amount of the separation speed so that the absolute value of the adjustment amount of the separation speed decreases as the thixotropy of the solder Sp increases.

  In FIG. 6, a solder Sp having a viscosity of 130 Pa · s / thixo index of 0.45, a solder Sp having a viscosity of 130 Pa · s / thixo index of 0.75, a solder Sp having a viscosity of 270 Pa · s / thixo index of 0.45, and a viscosity The separation speed of the squeegee 31 according to the difference between the adhesion amount of the solder Sp on the squeegee 31 and the adhesion amount threshold in four kinds of solder Sp with 270 Pa · s / solder Sp of 0.75 index Indicates the adjustment amount (adjustment ratio) of.

  For example, when a solder Sp having a viscosity of 130 Pa · s / thixo index of 0.45 and a solder Sp having a viscosity of 270 Pa · s / thixo index of 0.45 are compared, a solder having a large viscosity of 270 Pa · s / thixo index of 0.45 Sp has a smaller absolute value of the separation speed adjustment amount.

  Further, for example, when a solder Sp having a viscosity of 130 Pa · s / thixo index of 0.45 and a solder Sp having a viscosity of 130 Pa · s / thixo index of 0.75 are compared, a viscosity of 130 Pa · s / thixo index of 0. The 75 solder Sp has a smaller absolute value of the separation speed adjustment amount.

  Further, in the present embodiment, the printing apparatus 100 is configured to be able to use (replaceable) a plurality of squeegees 31 having different widths in the direction substantially orthogonal to the printing direction. Specifically, as shown in FIG. 7, the printing apparatus 100 is configured to be able to use six squeegees 31 of 250 mm, 300 mm, 350 mm, 400 mm, 440 mm, and 530 mm. Moreover, in the printing apparatus 100, the threshold value of the adhesion amount is provided in accordance with the width in the direction (longitudinal direction) substantially orthogonal to the printing direction of the squeegee 31. Specifically, in the printing apparatus 100, as the width in the direction (longitudinal direction) substantially orthogonal to the printing direction of the squeegee 31 increases, the adhesion amount threshold is set so that the value increases. There is.

<Adjustment of separation speed at production>
Further, in the present embodiment, the control unit 6 acquires the remaining amount of the solder Sp on the mask M at the time of production, and adjusts the separation speed of the squeegee 31 based on the acquired remaining amount of the solder Sp. It is configured to make decisions.

  At this time, the control unit 6 supplies the supply amount of the solder Sp supplied on the mask M, the adhesion amount of the solder Sp on the squeegee 31 separated, and the print amount of the solder Sp by the mask M on one substrate P. The remaining amount of the solder Sp on the mask M is obtained based on the number of printed sheets of the substrate P.

Specifically, when the supply amount of the solder Sp supplied on the mask M in the first time (during test printing) is ma, and the adhesion amount of the solder Sp on the squeegee 31 in the first time (during test printing) is mb The remaining amount M1 of the solder Sp on the mask M for the first time is expressed by the following equation (1).
M1 = ma-mb (1)

Further, assuming that the printed amount of the solder Sp by the mask M on one substrate P is mc and the printed number of the substrate P is n, the current consumed amount M2 of the solder Sp is expressed by the following equation (2) . The printed amount of the solder Sp by the mask M on one substrate P corresponds to the total area of the plurality of openings Ap of the mask M, the thickness (vertical size) of the mask M, and the specific gravity of the solder Sp. It is possible to acquire based on.
M2 = mc × n (2)

Then, the current remaining amount M3 of the solder Sp on the mask M can be obtained by the following equation (3).
M3 = M1-M2 (3)

  Further, in the present embodiment, in addition to determining the separation speed of the squeegee 31, the control unit 6 adjusts the separation speed of the squeegee 31 based on the remaining amount of the solder Sp on the mask M (adjustment timing ) Is also configured to determine. Further, the control unit 6 is configured to adjust and determine the separation speed of the squeegee 31 at adjustment timing determined based on the acquired remaining amount of the solder Sp on the mask M.

  The control unit 6 determines, for example, the timing at which the remaining amount of the solder Sp on the mask M decreases by a predetermined amount as the adjustment timing. In this case, the control unit 6 determines a plurality of timings as adjustment timing, such as a timing when the remaining amount of the solder Sp on the mask M decreases by about 50 g and a timing when the remaining amount of the solder Sp on the mask M decreases by about 100 g. Do.

  The control unit 6 is configured to adjust the separation speed so that the value becomes smaller as the remaining amount of the solder Sp on the mask M becomes smaller at the determined adjustment timing. Thereby, since the separation speed of the squeegee 31 can be reduced, it is possible to reduce the amount of adhesion of the solder Sp to the separated squeegee 31. As a result, when the remaining amount of the solder Sp on the mask M decreases, it is possible to increase the amount of the solder Sp remaining on the mask M.

  Specifically, the control unit 6 is configured to change the adhesion amount threshold value shown in FIG. 7 so as to decrease as the remaining amount of the solder Sp on the mask M decreases. . Further, the control unit 6 is configured to acquire the difference between the adhesion amount of the solder Sp on the squeegee 31 at the adjustment timing and the threshold value of the adhesion amount changed to be smaller. Then, the control unit 6 controls the squeegee 31 according to the difference between the adhesion amount of the solder Sp on the squeegee 31 at the adjustment timing and the threshold value of the adhesion amount changed to be smaller, as in the test printing. It is configured to adjust and determine the initial value of the separation speed of. As a result, as the remaining amount of the solder Sp on the mask M becomes smaller, the separation speed is adjusted so that the value becomes smaller.

(Processing at the time of printing)
Next, with reference to FIG. 8, processing at the time of printing in the present embodiment will be described based on a flowchart. The processing at the time of printing is performed by the control unit 6.

  As shown in FIG. 6, first, in step S1, an input of solder physical property value information is accepted. Specifically, at least one input of the viscosity of the solder Sp or the thixotropy of the solder Sp is accepted. At this time, if the solder physical value information has already been input, the selection of the input solder physical value information can be accepted.

  Then, in step S2, an initial value of the separation speed of the squeegee 31 in the separation operation is determined from the initial value table 6b based on the solder physical property value information received in step S1.

  Then, in step S3, the solder Sp is supplied from the solder supply unit 35 of the squeegee unit 3 to the upper surface of the mask M.

  Then, in step S4, the load cell 36 is reset to zero. That is, in step S4, the load (load) measured by the load cell 36 is made zero.

  Then, in step S5, test printing of the solder Sp on the substrate P is started. That is, in step S5, the printing operation of the solder Sp by the squeegee 31 on one substrate P for test and the separation operation from the solder Sp of the squeegee 31 after the printing operation are performed. As the test substrate P, for example, it is possible to use a substrate P whose printing surface is protected by a film.

  Then, in step S6, the adhesion amount of the solder Sp on the squeegee 31 separated is obtained based on the measurement result by the load cell 36 in the state where the squeegee 31 and the solder Sp are separated.

  Then, in step S7, the initial value of the separation speed determined in step S2 is adjusted based on the adhesion amount of the solder Sp to the squeegee 31 acquired in step S6.

  Then, in step S8, printing is started (production is started). That is, in step S8, the printing operation of the solder Sp by the squeegee 31 on one substrate P to be produced, and the separation operation from the solder Sp of the squeegee 31 after the printing operation are performed.

  Then, in step S9, the remaining amount of the solder Sp on the mask M is acquired by the above-described equation (3).

  Then, in step S10, it is determined whether the remaining amount of the solder Sp on the mask M is the value of the adjustment timing of the separation speed. For example, in step S10, it is determined whether the remaining amount of solder Sp on the mask M is a value of adjustment timing reduced by a predetermined amount. If it is determined that the remaining amount of the solder Sp on the mask M is not the adjustment timing value, printing of the next substrate P is started. If it is determined that the remaining amount of the solder Sp on the mask M is the value of the adjustment timing, the process proceeds to step S11.

  Then, in step S11, the separation speed adjusted in step S7 is further adjusted based on the amount of adhesion of the solder Sp to the squeegee 31 at the adjustment timing. At this time, the separation speed is adjusted so that the value becomes smaller as the remaining amount of the solder Sp on the mask M becomes smaller. Thereafter, the separation speed is adjusted so that the value becomes smaller each time the adjustment timing is reached. Then, printing of the next substrate P is started.

(Effect of this embodiment)
In the present embodiment, the following effects can be obtained.

  In the present embodiment, as described above, the separation speed of the squeegee 31 in the operation of separating the squeegee 31 from the solder Sp is determined based on the physical property value information of the solder Sp and the adhesion amount of the solder Sp to the separated squeegee 31. The control unit 6 of the printing apparatus 100 is configured as follows. Thereby, when the separation speed of the squeegee 31 is determined based on the physical property value information of the solder Sp, when the type of the solder Sp is different, it is possible to determine an appropriate separation speed according to the type of the solder Sp. . When the separation speed of the squeegee 31 is determined based on the adhesion amount of the solder Sp on the squeegee 31 separated, when the state of the solder Sp is different, an appropriate separation speed according to the actual state of the solder Sp Can be determined. Therefore, by driving the squeegee 31 at an appropriate separation speed, it is possible to stably print the solder Sp on the substrate P while suppressing the occurrence of air entrainment. Further, in the present embodiment, as described above, the separation speed is achieved by configuring the control unit 6 to determine the separation speed of the squeegee 31 to a relatively large separation speed among the separation speeds at which the entrainment of air does not occur. Can be suppressed too late, and an increase in printing time can be suppressed, so that a decrease in productivity can be suppressed. As a result of these, the solder Sp can be stably printed on the substrate P while suppressing the decrease in productivity.

  Further, in the present embodiment, as described above, the control unit 6 is configured to determine the initial value of the separation speed based on the physical property value information of the solder Sp. As a result, since an appropriate separation speed can be determined from the start of printing, the squeegee 31 can be driven at an appropriate separation speed from the start of printing. Further, since the initial value of the separation speed is determined based on the physical property value information of the solder Sp, it is appropriate that the user is not required to be an expert user, unlike the case where the user needs to determine (input) the initial value of the separation speed. The initial value of the separation speed can be easily determined.

  Further, in the present embodiment, as described above, the initial value of the separation speed determined based on the physical property value information of the solder Sp is adjusted based on the adhesion amount of the solder Sp on the separated squeegee 31, The control unit 6 is configured to determine the separation speed of 31. Thereby, since the appropriate separation speed determined based on the physical property value information of the solder Sp can be adjusted based on the adhesion amount of the solder Sp to the separated squeegee 31, the more appropriate separation speed is determined. be able to.

  In the embodiment, as described above, the physical property value information of the solder Sp is information on the viscosity of the solder Sp or information on the thixotropy index of the solder Sp. Here, in the operation of separating the squeegee 31 from the solder Sp, the easiness of cutting the solder Sp from the squeegee 31 largely depends on the viscosity of the solder Sp and the thixotropy index of the solder Sp. Therefore, when configured as described above, at least one of the information on the viscosity of the solder Sp that greatly contributes to the easiness of the solder Sp or the information on the thixotropy index of the solder Sp that greatly contributes to the easiness of the solder Sp. Based on one or the other, a more appropriate separation speed can be determined.

  Further, in the present embodiment, as described above, the separation speed of the squeegee 31 is adjusted and determined in accordance with the difference between the adhesion amount of the solder Sp on the squeegee 31 separated and the threshold value of the adhesion amount. The control unit 6 is configured. Thus, the separation speed can be determined reflecting the actual state of the solder Sp, so that an appropriate separation speed can be easily determined according to the actual state of the solder Sp.

  Further, in the present embodiment, as described above, the printing apparatus 100 is configured to be able to use a plurality of squeegees 31 having different widths in the direction (X direction) substantially orthogonal to the printing direction. Then, a threshold value of the adhesion amount is provided according to the width in the direction substantially orthogonal to the printing direction of the squeegee 31. As a result, even in the case where a plurality of squeegees 31 whose widths in the direction substantially orthogonal to the printing direction are different from one another are used, the appropriate separation speed can be determined according to the width of each squeegee 31.

  Further, in the present embodiment, as described above, in addition to the physical property value information of the solder Sp and the adhesion amount of the solder Sp on the squeegee 31 separated, the squeegee is also based on the remaining amount of the solder Sp on the mask M. The control unit 6 is configured to determine the separation speed of 31. Thereby, even when the printing operation is performed and the remaining amount of the solder Sp on the mask M changes, it is possible to determine an appropriate separation speed according to the remaining amount of the solder Sp on the mask M. As a result, the squeegee 31 can be driven at an even more appropriate separation speed.

  Further, in the present embodiment, as described above, in addition to determining the separation speed of the squeegee 31, the timing of adjusting the separation speed of the squeegee 31 is also determined based on the remaining amount of the solder Sp on the mask M. The controller 6 is configured as follows. Thereby, the separation speed can be adjusted at an appropriate timing according to the remaining amount of the solder Sp on the mask M. As a result, even when the printing operation is performed and the remaining amount of the solder Sp on the mask M changes, the separation speed of the squeegee 31 can be maintained at an appropriate separation speed.

  Moreover, in the present embodiment, as described above, the supply amount of the solder Sp supplied on the mask M, the adhesion amount of the solder Sp on the squeegee 31 separated, and the solder Sp by the mask M on one substrate P. The control unit 6 is configured to acquire the remaining amount of the solder Sp on the mask M based on the printing amount of and the number of printed substrates P. Thus, the residual amount of the solder Sp on the mask M can be acquired without providing a dedicated measuring device for acquiring the residual amount of the solder Sp on the mask M. It is possible to suppress the complication of the device configuration for acquiring the remaining amount.

  Further, in the present embodiment, as described above, the load cell 36 for measuring the load of the squeegee 31 on the mask M is provided in the printing apparatus 100. Then, based on the measurement result by the load cell 36, the control unit 6 is configured to acquire the adhesion amount of the solder Sp to the separated squeegee 31. As a result, the load (imprinting pressure) of the squeegee 31 on the mask M and the adhesion amount of the solder Sp on the separated squeegee 31 can be acquired using the common load cell 36, so the adhesion amount of the solder Sp is acquired. It is possible to suppress the complication of the device configuration for

[Modification]
It should be understood that the embodiments disclosed herein are illustrative and non-restrictive in every respect. The scope of the present invention is indicated not by the above description of the embodiment but by the scope of the claims, and further includes all modifications (variations) within the meaning and scope equivalent to the scope of the claims.

  For example, although the above-mentioned embodiment showed the example to which the present invention was applied to the printing device which reciprocates one squeegee and performs printing of going-forward path and printing of return path, the present invention is not limited to this. The present invention may be applied to a printing apparatus that includes two squeegees and performs printing on the forward pass and printing on the return pass using different squeegees.

  Moreover, in the said embodiment, although the squeegee showed the example spaced apart upwards from the solder (viscous material), this invention is not limited to this. In the present invention, the squeegee may be separated from the viscous material in a direction other than the upward direction. For example, the squeegee may be spaced rearward from the viscous material (in the Y direction away from the viscous material).

  Moreover, although the example using solder as a viscous material was shown in the said embodiment, this invention is not limited to this. In the present invention, a viscous material other than solder may be used. For example, a conductive paste such as silver paste may be used as the viscous material.

  Moreover, although the example in which the metal mask made of metal was used as a mask for printing of a solder (viscous material) was shown in the said embodiment, this invention is not limited to this. In the present invention, a mask other than metal may be used as the mask for printing the viscous material. For example, a resin mask may be used.

  In the above embodiment, the control unit of the printing apparatus determines the separation speed, but the present invention is not limited to this. In the present invention, the control device other than the control unit of the printing apparatus may determine the separation speed. For example, in a component mounting system including a component mounting device, a printing device, an inspection device, a reflow device, and a control device (host computer) that controls these devices, the control device (host computer) determines the separation speed of the squeegee in the printing device. May be determined.

  In the above embodiment, an example is shown in which the separation speed of the squeegee is determined based on both the physical property value information of the solder (viscous material) and the adhesion amount of the solder (viscous material) to the squeegee. The invention is not limited to this. In the present invention, the separation speed of the squeegee may be determined based on at least one of physical property value information of the viscous material or the adhesion amount of the viscous material to the squeegee separated. For example, only the initial value of the separation speed of the squeegee may be determined based on the physical property value information of the viscous material. In addition, the initial value of the separation speed of the squeegee is input by the user, and the initial value of the separation speed of the squeegee input by the user is adjusted based on the adhesion amount of the viscous material to the separated squeegee. Good.

  In the above embodiment, an example is shown in which information on the viscosity of the solder (viscous material) and information on the thixotropy index of the solder (viscous material) are used as physical property value information of the solder (viscous material). The invention is not limited to this. In the present invention, information other than the information on the viscosity of the viscous material and the information on the thixotropy index of the viscous material may be used as physical property value information of the viscous material.

  Moreover, although the example which the separation speed of the squeegee was adjusted and determined based on the residual amount of the solder (viscosity material) on a mask was shown in the said embodiment, this invention is not limited to this. In the present invention, if the separation speed of the squeegee is determined based on at least one of physical property value information of the viscous material or the adhesion amount of the viscous material to the squeegee separated, based on the remaining amount of the viscous material, The separation speed of the squeegee may not be adjusted and determined.

  Moreover, although the example which the remaining amount of the solder (viscous material) on a mask calculated and acquired by calculation formulas like Formula (3) was shown in the said embodiment, this invention is not limited to this. In the present invention, the remaining amount of the viscous material on the mask may be measured by a dedicated measuring device.

  Further, in the above embodiment, an example is shown in which the separation speed of the squeegee is adjusted and determined at the timing (adjustment timing) determined based on the remaining amount of the solder (viscous material) on the mask at the time of production. The present invention is not limited to this. In the present invention, the separation speed of the squeegee may be adjusted and determined at a timing other than the timing determined based on the remaining amount of the viscous material on the mask. For example, the separation speed of the squeegee may be adjusted and determined at a timing determined based on the number of printed sheets after the viscous material is supplied onto the mask.

  Further, in the above-described embodiment, the threshold value of the adhesion amount shown in FIG. 7 is changed to become smaller as the remaining amount of solder (remaining amount of the viscous material) on the mask becomes smaller. Although the example in which the separation speed is adjusted so that the value decreases as the remaining amount of solder (remaining amount of viscous material) decreases, the present invention is not limited to this. In the present invention, if the separation speed is adjusted so that the value decreases as the remaining amount of the viscous material on the mask decreases, the adhesion amount threshold value shown in FIG. 7 changes so as to decrease. You do not have to do it.

  In the above embodiment, for convenience of explanation, the processing operation of the control unit has been described using a flow driven flow chart in which processing is sequentially performed along the processing flow, but the present invention is not limited to this. In the present invention, the processing operation of the control unit may be performed by event-driven (event-driven) processing that executes processing on an event-by-event basis. In this case, the operation may be completely event driven, or the combination of event driving and flow driving may be performed.

6 Control Unit 31 Squeegee 36 Load Cell (Load Measurement Unit)
100 printing device M mask P substrate Sp solder (viscous material)

Claims (11)

A squeegee (31) for printing the viscous material (Sp) on the mask on the substrate (P) by being moved in the printing direction on the mask (M) having a printing pattern;
A control unit (6) for performing an operation of separating the squeegee from the viscous material after the printing operation of the viscous material on the substrate;
A printing apparatus configured to determine a separation speed of the squeegee in an operation of separating the squeegee from the viscous material based on the adhesion amount of the viscous material to the squeegee separated.   The printing apparatus according to claim 1, wherein the initial value of the separation speed is determined based on physical property value information of a viscous material.   The initial value of the separation speed determined based on the physical property value information of the viscous material is adjusted based on the adhesion amount of the viscous material to the separated squeegee to determine the separation speed of the squeegee. The printing device according to claim 2 configured.   The printing device according to claim 2, wherein the physical property value information of the viscous material includes at least one of information on the viscosity of the viscous material and information on a thixotropy index of the viscous material.   The separation speed of the squeegee is adjusted and determined according to the difference between the adhesion amount of the viscous material to the squeegee and the threshold value of the adhesion amount which are separated from each other. The printing device according to any one of the items. A plurality of the squeegees having different widths in a direction substantially orthogonal to the printing direction are configured to be usable,
The printing apparatus according to claim 5, wherein the threshold value of the adhesion amount is provided according to a width in a direction substantially orthogonal to the printing direction of the squeegee.   The separation speed of the squeegee is determined on the basis of the remaining amount of the viscous material on the mask in addition to the adhesion amount of the viscous material to the squeegee spaced apart. The printing device according to any one of 6.   In addition to determining the separation speed of the squeegee, timing of adjusting the separation speed of the squeegee is also determined based on the remaining amount of the viscous material on the mask. The printing device described in.   The amount of supply of the viscous material supplied onto the mask, the amount of adhesion of the viscous material to the separated squeegee, the amount of printing of the viscous material by the mask onto one substrate, and the printing of the substrate The printing apparatus according to claim 7, wherein the printing apparatus is configured to acquire the remaining amount of the viscous material on the mask based on the number of sheets. It further comprises a load measuring unit (36) for measuring the load of the squeegee on the mask,
The printing apparatus according to any one of claims 1 to 9, wherein an amount of adhesion of the viscous material to the separated squeegee is acquired based on a measurement result by the load measurement unit. The viscous material (Sp) on the mask is printed on the substrate (P) by moving the squeegee (31) on the mask (M) having a print pattern,
Separating the squeegee from the viscous material after printing of the viscous material onto the substrate;
The printing method, wherein the separation speed of the squeegee in the operation of separating the squeegee from the viscous material is determined based on the adhesion amount of the viscous material to the separated squeegee.

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