JP6501117B2 - プリント基板の製造方法 - Google Patents
プリント基板の製造方法 Download PDFInfo
- Publication number
- JP6501117B2 JP6501117B2 JP2015158696A JP2015158696A JP6501117B2 JP 6501117 B2 JP6501117 B2 JP 6501117B2 JP 2015158696 A JP2015158696 A JP 2015158696A JP 2015158696 A JP2015158696 A JP 2015158696A JP 6501117 B2 JP6501117 B2 JP 6501117B2
- Authority
- JP
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- Prior art keywords
- printed circuit
- circuit board
- mask
- mesh
- metal film
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 238000004519 manufacturing process Methods 0.000 title claims description 20
- 239000000758 substrate Substances 0.000 claims description 33
- 239000002184 metal Substances 0.000 claims description 30
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 239000000243 solution Substances 0.000 claims description 25
- 238000000034 method Methods 0.000 claims description 13
- 238000005530 etching Methods 0.000 claims description 8
- 239000007864 aqueous solution Substances 0.000 claims description 5
- 239000004925 Acrylic resin Substances 0.000 claims description 3
- 229920000178 Acrylic resin Polymers 0.000 claims description 3
- 239000010949 copper Substances 0.000 description 9
- 239000010410 layer Substances 0.000 description 7
- 238000000206 photolithography Methods 0.000 description 7
- 239000004372 Polyvinyl alcohol Substances 0.000 description 6
- 229920002451 polyvinyl alcohol Polymers 0.000 description 6
- 239000000463 material Substances 0.000 description 3
- 229910000881 Cu alloy Inorganic materials 0.000 description 2
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000003486 chemical etching Methods 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000005011 phenolic resin Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- LCPVQAHEFVXVKT-UHFFFAOYSA-N 2-(2,4-difluorophenoxy)pyridin-3-amine Chemical compound NC1=CC=CN=C1OC1=CC=C(F)C=C1F LCPVQAHEFVXVKT-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000005401 electroluminescence Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- USHAGKDGDHPEEY-UHFFFAOYSA-L potassium persulfate Chemical compound [K+].[K+].[O-]S(=O)(=O)OOS([O-])(=O)=O USHAGKDGDHPEEY-UHFFFAOYSA-L 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- CHQMHPLRPQMAMX-UHFFFAOYSA-L sodium persulfate Substances [Na+].[Na+].[O-]S(=O)(=O)OOS([O-])(=O)=O CHQMHPLRPQMAMX-UHFFFAOYSA-L 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 238000009941 weaving Methods 0.000 description 1
Images
Landscapes
- Manufacturing Of Printed Circuit Boards (AREA)
Description
10a 基材
10b 金属膜
12 マスク溶液
12’ マスク
20 メッシュ
Claims (5)
- 基板上に形成された金属膜の上にマスクを付与しその露出部を化学的にエッチングしてパターン電極を与えるプリント基板の製造方法であって、
前記金属膜の上に丸断面のワイヤからなるワイヤメッシュを配置しマスク溶液を与えて前記金属膜と前記メッシュとの間に介在させ、前記マスク溶液を硬化させてマスクを付与することを特徴とするプリント基板の製造方法。 - 前記マスク溶液は、PVA水溶液であることを特徴とする請求項1記載のプリント基板の製造方法。
- 前記PVA水溶液は、更にアクリル樹脂を含むことを特徴とする請求項2記載のプリント基板の製造方法。
- 前記ワイヤメッシュは、格子状に編み込んだ線材からなることを特徴とする請求項1乃至3のうちの1つに記載のプリント基板の製造方法。
- 前記金属膜は、Cuからなることを特徴とする請求項1乃至4のうちの1つに記載のプリント基板の製造方法。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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JP2015158696A JP6501117B2 (ja) | 2015-08-11 | 2015-08-11 | プリント基板の製造方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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JP2015158696A JP6501117B2 (ja) | 2015-08-11 | 2015-08-11 | プリント基板の製造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017037975A JP2017037975A (ja) | 2017-02-16 |
JP6501117B2 true JP6501117B2 (ja) | 2019-04-17 |
Family
ID=58049435
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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JP2015158696A Active JP6501117B2 (ja) | 2015-08-11 | 2015-08-11 | プリント基板の製造方法 |
Country Status (1)
Country | Link |
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JP (1) | JP6501117B2 (ja) |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101439715B1 (ko) * | 2010-01-19 | 2014-09-12 | 고쿠리츠 다이가쿠 호진 교토 다이가쿠 | 도전막 및 그의 제조 방법 |
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2015
- 2015-08-11 JP JP2015158696A patent/JP6501117B2/ja active Active
Also Published As
Publication number | Publication date |
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JP2017037975A (ja) | 2017-02-16 |
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