JP6497391B2 - タッチパネル用導電性基板、タッチパネル用導電性基板の製造方法 - Google Patents

タッチパネル用導電性基板、タッチパネル用導電性基板の製造方法 Download PDF

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JP6497391B2
JP6497391B2 JP2016538446A JP2016538446A JP6497391B2 JP 6497391 B2 JP6497391 B2 JP 6497391B2 JP 2016538446 A JP2016538446 A JP 2016538446A JP 2016538446 A JP2016538446 A JP 2016538446A JP 6497391 B2 JP6497391 B2 JP 6497391B2
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copper plating
layer
copper
plating film
conductive substrate
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Japanese (ja)
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JPWO2016017773A1 (ja
Inventor
永田　純一
純一 永田
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Sumitomo Metal Mining Co Ltd
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Sumitomo Metal Mining Co Ltd
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    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
    • B32B7/02—Physical, chemical or physicochemical properties
    • B32B7/023—Optical properties
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
    • G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
    • G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
    • G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
    • G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
    • G06F3/0446—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a grid-like structure of electrodes in at least two directions, e.g. using row and column electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/305—Polyamides or polyesteramides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/14—Non-insulated conductors or conductive bodies characterised by their form comprising conductive layers or films on insulating-supports
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/20—Displays, e.g. liquid crystal displays, plasma displays
    • B32B2457/208—Touch screens
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
    • G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
    • G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices

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  • Engineering & Computer Science (AREA)
  • Theoretical Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
  • Non-Insulated Conductors (AREA)
  • Manufacturing Of Electric Cables (AREA)
JP2016538446A 2014-07-31 2015-07-30 タッチパネル用導電性基板、タッチパネル用導電性基板の製造方法 Active JP6497391B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2014157061 2014-07-31
JP2014157061 2014-07-31
PCT/JP2015/071690 WO2016017773A1 (ja) 2014-07-31 2015-07-30 タッチパネル用導電性基板、タッチパネル用導電性基板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2016017773A1 JPWO2016017773A1 (ja) 2017-05-25
JP6497391B2 true JP6497391B2 (ja) 2019-04-10

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JP2016538446A Active JP6497391B2 (ja) 2014-07-31 2015-07-30 タッチパネル用導電性基板、タッチパネル用導電性基板の製造方法

Country Status (5)

Country Link
JP (1) JP6497391B2 (zh)
KR (1) KR102344716B1 (zh)
CN (1) CN106575172B (zh)
TW (1) TWI671663B (zh)
WO (1) WO2016017773A1 (zh)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2018139018A (ja) * 2015-07-31 2018-09-06 住友金属鉱山株式会社 導電性基板、導電性基板の製造方法
JP6597459B2 (ja) * 2016-04-05 2019-10-30 住友金属鉱山株式会社 導電性基板、導電性基板の製造方法
JP6613995B2 (ja) * 2016-04-05 2019-12-04 住友金属鉱山株式会社 硬化層を備えた基板を有する積層体フィルム
JP6531699B2 (ja) * 2016-04-05 2019-06-19 住友金属鉱山株式会社 導電性基板
JP6597487B2 (ja) * 2016-06-15 2019-10-30 住友金属鉱山株式会社 電極基板フィルム及びその製造方法
JP7049759B2 (ja) * 2016-07-12 2022-04-07 住友金属鉱山株式会社 積層体基板、導電性基板、積層体基板の製造方法、導電性基板の製造方法
JP6848243B2 (ja) * 2016-07-25 2021-03-24 住友金属鉱山株式会社 導電性基板の製造方法
TWI732892B (zh) 2016-07-26 2021-07-11 日商松下知識產權經營股份有限公司 透視型電極用積層板、透視型電極素材、組件及透視型電極用積層板之製造方法
JP7262218B2 (ja) * 2018-12-17 2023-04-21 日東電工株式会社 保護フィルム付き導電性フィルム及び導電性フィルムの製造方法
JP7305342B2 (ja) * 2018-12-17 2023-07-10 日東電工株式会社 導電性フィルム

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4086132B2 (ja) 2001-11-16 2008-05-14 株式会社ブリヂストン 透明導電性フィルムおよびタッチパネル
JP4700332B2 (ja) * 2003-12-05 2011-06-15 イビデン株式会社 多層プリント配線板
TW200731886A (en) * 2005-06-13 2007-08-16 Ibiden Co Ltd Printed wiring board
US8568856B2 (en) * 2005-10-05 2013-10-29 Nippon Mining & Metals Co., Ltd. Two-layer flexible substrate
KR101135332B1 (ko) * 2007-03-15 2012-04-17 닛코킨조쿠 가부시키가이샤 구리전해액 및 그것을 이용하여 얻어진 2층 플렉시블 기판
JP5300156B2 (ja) * 2008-08-07 2013-09-25 Ｊｘ日鉱日石金属株式会社 無電解めっきにより銅薄膜を形成しためっき物
JP5361579B2 (ja) 2009-07-09 2013-12-04 信越ポリマー株式会社 大型ディスプレイ用のセンサパネル及びその製造方法
JP5267403B2 (ja) * 2009-09-29 2013-08-21 大日本印刷株式会社 タッチパネル用電極フィルム、該タッチパネル用電極フィルムの製造方法及びタッチパネル
JP5645581B2 (ja) * 2010-10-05 2014-12-24 富士フイルム株式会社 タッチパネル
JP2013069261A (ja) 2011-09-08 2013-04-18 Dainippon Printing Co Ltd タッチパネル用電極基材、及びタッチパネル、並びに画像表示装置
CN102637637B (zh) * 2012-04-28 2014-03-26 深圳市华星光电技术有限公司 一种薄膜晶体管阵列基板及其制作方法
JP5224203B1 (ja) * 2012-07-11 2013-07-03 大日本印刷株式会社 タッチパネルセンサ、タッチパネル装置および表示装置
CN104584143B (zh) * 2012-08-31 2016-08-17 Lg化学株式会社 导电结构和制造该导电结构的方法
JP5706386B2 (ja) * 2012-10-16 2015-04-22 住友金属鉱山株式会社 ２層フレキシブル基板、並びに２層フレキシブル基板を基材としたプリント配線板

Also Published As

Publication number Publication date
KR102344716B1 (ko) 2021-12-30
TW201629725A (zh) 2016-08-16
CN106575172B (zh) 2022-04-29
CN106575172A (zh) 2017-04-19
WO2016017773A1 (ja) 2016-02-04
KR20170037969A (ko) 2017-04-05
TWI671663B (zh) 2019-09-11
JPWO2016017773A1 (ja) 2017-05-25

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