JP6490328B2 - 発光装置及びその製造方法 - Google Patents

発光装置及びその製造方法 Download PDF

Info

Publication number
JP6490328B2
JP6490328B2 JP2012139155A JP2012139155A JP6490328B2 JP 6490328 B2 JP6490328 B2 JP 6490328B2 JP 2012139155 A JP2012139155 A JP 2012139155A JP 2012139155 A JP2012139155 A JP 2012139155A JP 6490328 B2 JP6490328 B2 JP 6490328B2
Authority
JP
Japan
Prior art keywords
solder
light emitting
light
emitting element
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2012139155A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014003242A (ja
JP2014003242A5 (enExample
Inventor
忠明 宮田
忠明 宮田
大湯　孝寛
孝寛 大湯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nichia Corp
Original Assignee
Nichia Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nichia Corp filed Critical Nichia Corp
Priority to JP2012139155A priority Critical patent/JP6490328B2/ja
Publication of JP2014003242A publication Critical patent/JP2014003242A/ja
Publication of JP2014003242A5 publication Critical patent/JP2014003242A5/ja
Application granted granted Critical
Publication of JP6490328B2 publication Critical patent/JP6490328B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector

Landscapes

  • Led Device Packages (AREA)
JP2012139155A 2012-06-20 2012-06-20 発光装置及びその製造方法 Active JP6490328B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2012139155A JP6490328B2 (ja) 2012-06-20 2012-06-20 発光装置及びその製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2012139155A JP6490328B2 (ja) 2012-06-20 2012-06-20 発光装置及びその製造方法

Publications (3)

Publication Number Publication Date
JP2014003242A JP2014003242A (ja) 2014-01-09
JP2014003242A5 JP2014003242A5 (enExample) 2015-05-14
JP6490328B2 true JP6490328B2 (ja) 2019-03-27

Family

ID=50036117

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2012139155A Active JP6490328B2 (ja) 2012-06-20 2012-06-20 発光装置及びその製造方法

Country Status (1)

Country Link
JP (1) JP6490328B2 (enExample)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015153981A (ja) * 2014-02-18 2015-08-24 日亜化学工業株式会社 発光装置
US9812625B2 (en) 2014-02-18 2017-11-07 Nichia Corporation Light-emitting device having resin member with conductive particles
JP7428916B2 (ja) * 2021-12-27 2024-02-07 日亜化学工業株式会社 発光装置の製造方法および発光装置
CN116169231B (zh) * 2023-04-21 2023-07-18 惠科股份有限公司 发光装置、显示装置以及发光装置的制备方法

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4591399B2 (ja) * 2006-04-03 2010-12-01 パナソニック株式会社 部品接合方法ならびに部品接合構造
JP4107349B2 (ja) * 2007-06-20 2008-06-25 ソニー株式会社 光源装置、表示装置
JP5716281B2 (ja) * 2010-03-01 2015-05-13 日亜化学工業株式会社 発光装置及びその製造方法
JP5402804B2 (ja) * 2010-04-12 2014-01-29 デクセリアルズ株式会社 発光装置の製造方法
JP5710915B2 (ja) * 2010-09-09 2015-04-30 シチズンホールディングス株式会社 半導体発光装置

Also Published As

Publication number Publication date
JP2014003242A (ja) 2014-01-09

Similar Documents

Publication Publication Date Title
TWI230105B (en) Solder
TWI233684B (en) Electronic device
JP3558063B2 (ja) はんだ
JP3736452B2 (ja) はんだ箔
CN100578778C (zh) 电子器件
CN101740709B (zh) 光半导体装置及其制造方法
KR101528030B1 (ko) 스터드 범프 구조물 및 그 제조 방법
JP2004174522A (ja) 複合はんだ、その製造方法および電子機器
US20090096100A1 (en) Semiconductor apparatus, manufacturing method of semiconductor apparatus, and joint material
CN104139249B (zh) 焊膏
JP6176910B2 (ja) 接続構造体の製造方法
JP4096992B2 (ja) 半導体モジュールの製造方法
US20070183920A1 (en) Nanoscale metal paste for interconnect and method of use
KR20210043655A (ko) 접속체의 제조 방법, 이방성 접합 필름, 접속체
JP2002305213A (ja) はんだ箔および半導体装置および電子装置
JP6490328B2 (ja) 発光装置及びその製造方法
WO2007119571A1 (ja) 半田層及びそれを用いたデバイス接合用基板並びに該デバイス接合用基板の製造方法
CN101194359A (zh) 副安装座及其制造方法
JP2008238233A (ja) 非鉛系の合金接合材、接合方法および接合体
US7750484B2 (en) Semiconductor device with flip-chip connection that uses gallium or indium as bonding material
JP4432541B2 (ja) 電子機器
JP6398499B2 (ja) 電子装置及び電子装置の製造方法
CN104183689A (zh) 一种用于led倒装固晶的基板及利用其固晶制备led的方法
WO2018207177A1 (en) Method and kit for attaching metallic surfaces
JP2006278463A (ja) サブマウント

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20150327

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20150327

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20160126

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20160127

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160324

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20160830

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20161122

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20161130

A912 Re-examination (zenchi) completed and case transferred to appeal board

Free format text: JAPANESE INTERMEDIATE CODE: A912

Effective date: 20170303

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180308

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20180608

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20181129

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20190227

R150 Certificate of patent or registration of utility model

Ref document number: 6490328

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250