JP6487321B2 - ステンシルワイパースポットクリーナー組立体および関連する方法 - Google Patents
ステンシルワイパースポットクリーナー組立体および関連する方法 Download PDFInfo
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- JP6487321B2 JP6487321B2 JP2015520345A JP2015520345A JP6487321B2 JP 6487321 B2 JP6487321 B2 JP 6487321B2 JP 2015520345 A JP2015520345 A JP 2015520345A JP 2015520345 A JP2015520345 A JP 2015520345A JP 6487321 B2 JP6487321 B2 JP 6487321B2
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- stencil
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- cleaning head
- spot
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- 238000000034 method Methods 0.000 title claims description 15
- 238000004140 cleaning Methods 0.000 claims description 79
- 229910000679 solder Inorganic materials 0.000 claims description 44
- 239000002904 solvent Substances 0.000 claims description 24
- 230000004907 flux Effects 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 230000007547 defect Effects 0.000 claims description 3
- 230000010355 oscillation Effects 0.000 claims 1
- 238000003384 imaging method Methods 0.000 description 24
- 238000007639 printing Methods 0.000 description 15
- 239000012530 fluid Substances 0.000 description 9
- 230000007246 mechanism Effects 0.000 description 7
- 239000000758 substrate Substances 0.000 description 7
- 238000007689 inspection Methods 0.000 description 5
- 230000000712 assembly Effects 0.000 description 3
- 238000000429 assembly Methods 0.000 description 3
- 230000008878 coupling Effects 0.000 description 3
- 238000010168 coupling process Methods 0.000 description 3
- 238000005859 coupling reaction Methods 0.000 description 3
- 238000009826 distribution Methods 0.000 description 3
- BHELIUBJHYAEDK-OAIUPTLZSA-N Aspoxicillin Chemical compound C1([C@H](C(=O)N[C@@H]2C(N3[C@H](C(C)(C)S[C@@H]32)C(O)=O)=O)NC(=O)[C@H](N)CC(=O)NC)=CC=C(O)C=C1 BHELIUBJHYAEDK-OAIUPTLZSA-N 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004044 response Effects 0.000 description 2
- 238000010276 construction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000010008 shearing Methods 0.000 description 1
- 239000011345 viscous material Substances 0.000 description 1
- 238000009736 wetting Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F35/00—Cleaning arrangements or devices
- B41F35/003—Cleaning arrangements or devices for screen printers or parts thereof
- B41F35/005—Cleaning arrangements or devices for screen printers or parts thereof for flat screens
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
- B08B1/143—Wipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F15/00—Screen printers
- B41F15/08—Machines
- B41F15/0881—Machines for printing on polyhedral articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41F—PRINTING MACHINES OR PRESSES
- B41F35/00—Cleaning arrangements or devices
- B41F35/003—Cleaning arrangements or devices for screen printers or parts thereof
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1216—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by screen printing or stencil printing
- H05K3/1233—Methods or means for supplying the conductive material and for forcing it through the screen or stencil
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2215/00—Screen printing machines
- B41P2215/50—Screen printing machines for particular purposes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
- B41P2235/00—Cleaning
- B41P2235/10—Cleaning characterised by the methods or devices
- B41P2235/20—Wiping devices
- B41P2235/24—Wiping devices using rolls of cleaning cloth
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/16—Inspection; Monitoring; Aligning
- H05K2203/163—Monitoring a manufacturing process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Inking, Control Or Cleaning Of Printing Machines (AREA)
- Screen Printers (AREA)
- Cleaning In General (AREA)
Description
12 フレーム
14 コントローラー
16 ステンシル
18 ステンシル
20 プリントヘッド
22 ガントリ
24 コンベヤーレール
26 コンベヤーレール
28 基板支持組立体
30 撮像システム
32 撮像ガントリ
36 ステンシルワイパー組立体
38 レール
40 レール
41 フレーム
44 給紙ローラー
46 紙ロール
48 紙ガイドローラー
50 ローラー
54 モーター
56 流体送出管
58 ワイパーブレード組立体
60 スポットクリーナー組立体
62 フレーム部材
64 キャリッジ
66 軸駆動装置
68 支持ブラケット
70 モーター
72 スポット清掃ヘッド
74 アクチュエーター
76 下面
78 ハウジング
80 駆動モーター
82 カップリング
84 駆動ベアリング
86 駆動ギア
88 溶剤分配リング
90 真空管
Claims (11)
- 上面および下面を有するステンシルと、
前記ステンシルの前記上面に材料を塗布する材料塗布機と、
前記ステンシルの前記下面をY軸方向に清掃するステンシルワイパー組立体であって、該ステンシルワイパー組立体はワイパーブレード組立体を有し、該ワイパーブレード組立体は、前記ステンシルの前記下面に係合し、該ステンシルワイパー組立体がステンシルワイパーガントリに沿って移動するときに前記ステンシルの前記下面を拭くように構成されている、ステンシルワイパー組立体と、
前記ステンシルワイパー組立体に可動に取り付けられているスポットクリーナー組立体であって、清掃ヘッドを含むと共に、X軸方向に移動し、前記ステンシルの前記下面をスポット清掃するように構成されているスポットクリーナー組立体と、を具備するステンシルプリンターであって、
前記清掃ヘッドは、余剰のはんだペーストおよびフラックスを収集する交換可能な媒体と、前記交換可能な媒体を濡らす溶剤吐出システムと、前記ステンシルを通して該清掃ヘッドの前記交換可能な媒体に空気を引き込む真空システムとを含んでおり、
該ステンシルプリンターは、更に、
前記ステンシルワイパー組立体および前記スポットクリーナー組立体の移動を制御し、前記清掃ヘッドを、スポット清掃作業を行う所望の場所に位置決めするとともに、前記溶剤吐出システムの動作と、前記清掃ヘッドの揺動または回転と、前記真空システムの動作とを制御するように構成されているコントローラーと、を具備するステンシルプリンター。 - 前記スポットクリーナー組立体は、前記ステンシルワイパー組立体のフレームに固定されているフレーム部材を含む請求項1に記載のステンシルプリンター。
- 前記スポットクリーナー組立体は、支持ブラケットにより支持されているキャリッジを更に含み、該キャリッジは、前記フレーム部材に沿って走行するように構成されている請求項2に記載のステンシルプリンター。
- 前記スポットクリーナー組立体は、前記支持ブラケットを移動させるように構成されているX軸駆動装置を更に含む請求項3に記載のステンシルプリンター。
- 前記X軸駆動装置は、モーターにより回転駆動されるボールねじを含む請求項4に記載のステンシルプリンター。
- 前記スポットクリーナー組立体の前記清掃ヘッドは、前記キャリッジにより支持されている請求項3に記載のステンシルプリンター。
- 前記交換可能な媒体は紙ワイパーまたはスポンジ材を含む請求項1に記載のステンシルプリンター。
- 前記清掃ヘッドは、前記揺動または回転によって、前記ステンシルに付着しているはんだペーストおよびフラックスを遊離させるよう構成されている請求項6に記載のステンシルプリンター。
- 前記スポットクリーナー組立体は、前記清掃ヘッドをZ軸方向に移動させるように構成されているアクチュエーターを更に含む請求項6に記載のステンシルプリンター。
- ステンシルプリンターのステンシルを清掃する方法において、
前記ステンシルの下面に係合するワイパーブレード組立体であって、ステンシルワイパー組立体がステンシルワイパーガントリに沿って移動するとき、前記ステンシルの前記下面を拭くように構成されているワイパーブレード組立体を有したステンシルワイパー組立体を移動して、前記ステンシルの下面をY軸方向に清掃することと、
前記ステンシルワイパー組立体に結合され前記ステンシルの前記下面をスポット清掃するスポットクリーナー組立体であって、溶剤吐出システムと真空システムとを含む清掃ヘッドを具備するスポットクリーナー組立体をX軸方向に移動させることと、
前記ステンシルワイパー組立体および前記スポットクリーナー組立体の移動を制御することであって、前記清掃ヘッドを、スポット清掃作業を行う所望の場所に位置決めすることと、
前記清掃ヘッドの交換可能な媒体を濡らす前記溶剤吐出システムの動作と、前記清掃ヘッドの揺動/回転と、前記ステンシルを通して前記清掃ヘッドの前記交換可能な媒体に空気を引き込む前記真空システムの動作とを制御することと、を含む方法。 - 前記ステンシルプリンターにより印刷されたプリント回路基板および前記ステンシルのうちの一方を検査することであって、欠陥を検出することを更に含む請求項10に記載の方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US13/534,641 | 2012-06-27 | ||
US13/534,641 US8746142B2 (en) | 2012-06-27 | 2012-06-27 | Stencil wiper spot cleaner assembly and related method |
PCT/US2013/047214 WO2014004329A1 (en) | 2012-06-27 | 2013-06-23 | Stencil wiper spot cleaner assembly and related method |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2015528758A JP2015528758A (ja) | 2015-10-01 |
JP2015528758A5 JP2015528758A5 (ja) | 2016-08-12 |
JP6487321B2 true JP6487321B2 (ja) | 2019-03-20 |
Family
ID=48748539
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015520345A Active JP6487321B2 (ja) | 2012-06-27 | 2013-06-23 | ステンシルワイパースポットクリーナー組立体および関連する方法 |
Country Status (8)
Country | Link |
---|---|
US (1) | US8746142B2 (ja) |
EP (1) | EP2867025B1 (ja) |
JP (1) | JP6487321B2 (ja) |
KR (1) | KR102108592B1 (ja) |
CN (1) | CN104487252B (ja) |
MY (1) | MY171686A (ja) |
TW (1) | TWI581976B (ja) |
WO (1) | WO2014004329A1 (ja) |
Families Citing this family (14)
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JP5767861B2 (ja) * | 2011-05-31 | 2015-08-19 | ヤマハ発動機株式会社 | 印刷機 |
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US9254641B2 (en) * | 2013-08-05 | 2016-02-09 | Asm Technology Singapore Pte. Ltd. | Screen printer, and method of cleaning a stencil of a screen printer |
US9743527B2 (en) * | 2013-08-09 | 2017-08-22 | CyberOptics Corporaiton | Stencil programming and inspection using solder paste inspection system |
US9370925B1 (en) * | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Stencil printer having stencil shuttle assembly |
US9370924B1 (en) | 2015-03-25 | 2016-06-21 | Illinois Tool Works Inc. | Dual action stencil wiper assembly for stencil printer |
US10703089B2 (en) | 2015-04-07 | 2020-07-07 | Illinois Tool Works Inc. | Edge lock assembly for a stencil printer |
US9370923B1 (en) | 2015-04-07 | 2016-06-21 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
US10723117B2 (en) | 2015-04-07 | 2020-07-28 | Illinois Tool Works Inc. | Lift tool assembly for stencil printer |
CN105478386B (zh) * | 2016-01-15 | 2018-02-27 | 广州达意隆包装机械股份有限公司 | 清洁机台 |
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KR101939116B1 (ko) * | 2017-03-15 | 2019-01-17 | (주)에스에스피 | 플럭스 크리닝 장치 |
CN210148924U (zh) * | 2019-01-04 | 2020-03-17 | 伊利诺斯工具制品有限公司 | 真空擦拭器及具有真空擦拭器的模板印刷机 |
CN113650404B (zh) * | 2021-07-03 | 2022-08-12 | 深圳市南极光电子科技股份有限公司 | 一种用于mini-LED的锡膏印刷设备及mini-LED的制备工艺 |
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US8474377B2 (en) | 2010-12-08 | 2013-07-02 | Illinois Tool Works Inc. | Combination stencil printer and dispenser and related methods |
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-
2012
- 2012-06-27 US US13/534,641 patent/US8746142B2/en active Active
-
2013
- 2013-05-01 TW TW102115620A patent/TWI581976B/zh active
- 2013-06-23 EP EP13734918.9A patent/EP2867025B1/en active Active
- 2013-06-23 KR KR1020157000558A patent/KR102108592B1/ko active IP Right Grant
- 2013-06-23 JP JP2015520345A patent/JP6487321B2/ja active Active
- 2013-06-23 MY MYPI2014703744A patent/MY171686A/en unknown
- 2013-06-23 CN CN201380036209.7A patent/CN104487252B/zh active Active
- 2013-06-23 WO PCT/US2013/047214 patent/WO2014004329A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
TW201400299A (zh) | 2014-01-01 |
JP2015528758A (ja) | 2015-10-01 |
WO2014004329A1 (en) | 2014-01-03 |
US20140000468A1 (en) | 2014-01-02 |
KR20150034167A (ko) | 2015-04-02 |
TWI581976B (zh) | 2017-05-11 |
CN104487252B (zh) | 2016-08-31 |
EP2867025B1 (en) | 2017-11-22 |
EP2867025A1 (en) | 2015-05-06 |
KR102108592B1 (ko) | 2020-05-07 |
MY171686A (en) | 2019-10-23 |
CN104487252A (zh) | 2015-04-01 |
US8746142B2 (en) | 2014-06-10 |
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