JP6473920B2 - 電子機器 - Google Patents

電子機器 Download PDF

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Publication number
JP6473920B2
JP6473920B2 JP2014192910A JP2014192910A JP6473920B2 JP 6473920 B2 JP6473920 B2 JP 6473920B2 JP 2014192910 A JP2014192910 A JP 2014192910A JP 2014192910 A JP2014192910 A JP 2014192910A JP 6473920 B2 JP6473920 B2 JP 6473920B2
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Japan
Prior art keywords
heat
heat pipe
conductor
housing
metal
Prior art date
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Application number
JP2014192910A
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English (en)
Japanese (ja)
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JP2016066119A (ja
JP2016066119A5 (enExample
Inventor
孝宣 淺井
孝宣 淺井
和弘 白神
和弘 白神
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Intellectual Property Management Co Ltd
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Panasonic Intellectual Property Management Co Ltd
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Priority to JP2014192910A priority Critical patent/JP6473920B2/ja
Publication of JP2016066119A publication Critical patent/JP2016066119A/ja
Publication of JP2016066119A5 publication Critical patent/JP2016066119A5/ja
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Publication of JP6473920B2 publication Critical patent/JP6473920B2/ja
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  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP2014192910A 2014-09-22 2014-09-22 電子機器 Active JP6473920B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014192910A JP6473920B2 (ja) 2014-09-22 2014-09-22 電子機器

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014192910A JP6473920B2 (ja) 2014-09-22 2014-09-22 電子機器

Publications (3)

Publication Number Publication Date
JP2016066119A JP2016066119A (ja) 2016-04-28
JP2016066119A5 JP2016066119A5 (enExample) 2017-06-15
JP6473920B2 true JP6473920B2 (ja) 2019-02-27

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ID=55805464

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014192910A Active JP6473920B2 (ja) 2014-09-22 2014-09-22 電子機器

Country Status (1)

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JP (1) JP6473920B2 (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2022094020A (ja) * 2020-12-14 2022-06-24 レノボ・シンガポール・プライベート・リミテッド 電子機器及び冷却モジュール
JP7240470B1 (ja) 2021-10-18 2023-03-15 レノボ・シンガポール・プライベート・リミテッド 電子機器及び冷却モジュール
CN119054423A (zh) * 2022-04-11 2024-11-29 索尼互动娱乐股份有限公司 电子设备

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5712762A (en) * 1996-03-01 1998-01-27 Compaq Computer Corporation Computer having a heat sink structure incorporated therein
US6535386B2 (en) * 2000-12-05 2003-03-18 Intel Corporation Electronic assembly having a heat pipe that conducts heat from a semiconductor die
US7057895B2 (en) * 2003-06-30 2006-06-06 Intel Corporation Thermal standoff for close proximity thermal management
JP4869419B2 (ja) * 2010-03-18 2012-02-08 株式会社東芝 電子機器

Also Published As

Publication number Publication date
JP2016066119A (ja) 2016-04-28

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