JP6457109B2 - 圧力検出装置 - Google Patents
圧力検出装置 Download PDFInfo
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- JP6457109B2 JP6457109B2 JP2017547700A JP2017547700A JP6457109B2 JP 6457109 B2 JP6457109 B2 JP 6457109B2 JP 2017547700 A JP2017547700 A JP 2017547700A JP 2017547700 A JP2017547700 A JP 2017547700A JP 6457109 B2 JP6457109 B2 JP 6457109B2
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- Prior art keywords
- glass layer
- diaphragm
- bonding
- sensor element
- pressure
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- 238000001514 detection method Methods 0.000 title claims description 41
- 239000011521 glass Substances 0.000 claims description 97
- 239000000463 material Substances 0.000 claims description 31
- 239000006121 base glass Substances 0.000 claims description 29
- 239000002184 metal Substances 0.000 claims description 13
- 229910052751 metal Inorganic materials 0.000 claims description 13
- 238000002844 melting Methods 0.000 claims description 7
- 230000008018 melting Effects 0.000 claims description 7
- CNLWCVNCHLKFHK-UHFFFAOYSA-N aluminum;lithium;dioxido(oxo)silane Chemical group [Li+].[Al+3].[O-][Si]([O-])=O.[O-][Si]([O-])=O CNLWCVNCHLKFHK-UHFFFAOYSA-N 0.000 claims description 3
- 229910001597 celsian Inorganic materials 0.000 claims description 3
- 229910052644 β-spodumene Inorganic materials 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 99
- 238000000034 method Methods 0.000 description 13
- 238000005304 joining Methods 0.000 description 8
- 239000005337 ground glass Substances 0.000 description 5
- 229920001296 polysiloxane Polymers 0.000 description 4
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 239000011368 organic material Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000008646 thermal stress Effects 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 1
- 239000003921 oil Substances 0.000 description 1
- 238000004382 potting Methods 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/84—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by variation of applied mechanical force, e.g. of pressure
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Measuring Fluid Pressure (AREA)
- Pressure Sensors (AREA)
Description
図1は、本発明の実施形態1に係る圧力検出装置100の断面図である。本実施形態の圧力検出装置100は、例えば自動車用のブレーキオイル等の圧力を検出する圧力検出装置であり、特に、歪みを検出するSiチップを実装した圧力検出装置である。本実施形態の圧力検出装置100は、例えば、以下の構成を備えることを特徴としている。
以下、本発明の実施形態2について、図1を援用し、図3を用いて説明する。図3は、本発明の実施形態2に係る圧力検出装置の図2に相当する拡大図である。
1a ダイアフラム
1b 台座面
2 ベース
3 カバー
4 センサ素子
5 ハウジング
6 コネクタターミナル
7 端子台
8 ターミナル
9 シリコーンゲル
10 接合材
10a 接合ガラス層(結晶化ガラス層)
10b 下地ガラス層(結晶化ガラス層)
10c 下地ガラス層
11 ワイヤ
12 接着剤
Claims (5)
- 圧力導入部と該圧力導入部の圧力により変形するダイアフラムとを有する金属筐体と、前記ダイアフラムの歪みを検出するSiチップから成るセンサ素子とを備える圧力検出装置において、
前記ダイアフラムと前記センサ素子とは、該センサ素子に直接接合される接合ガラス層と、該接合ガラス層と前記ダイアフラムとの間に積層された下地ガラス層とを介して接合され、
前記接合ガラス層は、結晶化ガラス層であり、
前記下地ガラス層は、少なくとも一つの結晶化ガラス層と、該結晶化ガラス層を間に挟んで積層された複数のガラス層とで形成される多層構造を有することを特徴とする圧力検出装置。 - 請求項1に記載の圧力検出装置において、前記下地ガラス層に含まれる少なくとも一つの前記結晶化ガラス層の融点は、800℃以上であることを特徴とする圧力検出装置。
- 請求項1に記載の圧力検出装置において、前記下地ガラス層に含まれる少なくとも一つの前記結晶化ガラス層は、セルシアン系ガラスであることを特徴とする圧力検出装置。
- 請求項1に記載の圧力検出装置において、前記下地ガラス層に含まれる少なくとも一つの前記結晶化ガラス層は、βスポジュメン系ガラスであることを特徴とする圧力検出装置。
- 請求項1に記載の圧力検出装置において、前記ダイアフラムの素材は、SUS630であることを特徴とする圧力検出装置。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015211401 | 2015-10-28 | ||
JP2015211401 | 2015-10-28 | ||
PCT/JP2016/079562 WO2017073274A1 (ja) | 2015-10-28 | 2016-10-05 | 圧力検出装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPWO2017073274A1 JPWO2017073274A1 (ja) | 2018-08-09 |
JP6457109B2 true JP6457109B2 (ja) | 2019-01-23 |
Family
ID=58631475
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2017547700A Active JP6457109B2 (ja) | 2015-10-28 | 2016-10-05 | 圧力検出装置 |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP6457109B2 (ja) |
WO (1) | WO2017073274A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017211338A (ja) * | 2016-05-27 | 2017-11-30 | 日立オートモティブシステムズ株式会社 | 物理量測定装置およびその製造方法ならびに物理量測定素子 |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109990942A (zh) * | 2019-04-30 | 2019-07-09 | 芜湖天波光电技术研究院有限公司 | 一种高压共轨压力传感器 |
US11187605B2 (en) * | 2019-08-06 | 2021-11-30 | Vitesco Technologies USA, LLC | Sealing glass geometries for sensitivity enhancement of thick-film piezoresistive pressure sensors |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5440195B2 (ja) * | 1973-09-21 | 1979-12-01 | ||
JPS535981A (en) * | 1976-07-06 | 1978-01-19 | Toyoda Chuo Kenkyusho Kk | Method of producing semiconductor device |
JP3916094B2 (ja) * | 1996-05-14 | 2007-05-16 | 旭テクノグラス株式会社 | 単斜晶セルシアン含有結晶化ガラス及びその製造に好適な組成のガラスと製造方法 |
US7260994B2 (en) * | 2005-11-03 | 2007-08-28 | Honeywell International Inc. | Low cost high-pressure sensor |
JP2015114278A (ja) * | 2013-12-13 | 2015-06-22 | 株式会社デンソー | 圧力センサ |
US10139300B2 (en) * | 2013-12-25 | 2018-11-27 | Hitachi Automotive Systems, Ltd. | High pressure strain detection device with a base made of a first brittle material and a strain detection element bonded to the base via a second brittle material |
-
2016
- 2016-10-05 JP JP2017547700A patent/JP6457109B2/ja active Active
- 2016-10-05 WO PCT/JP2016/079562 patent/WO2017073274A1/ja active Application Filing
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2017211338A (ja) * | 2016-05-27 | 2017-11-30 | 日立オートモティブシステムズ株式会社 | 物理量測定装置およびその製造方法ならびに物理量測定素子 |
Also Published As
Publication number | Publication date |
---|---|
JPWO2017073274A1 (ja) | 2018-08-09 |
WO2017073274A1 (ja) | 2017-05-04 |
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