JP6456884B2 - 表示装置及びその製造方法 - Google Patents

表示装置及びその製造方法 Download PDF

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Publication number
JP6456884B2
JP6456884B2 JP2016155628A JP2016155628A JP6456884B2 JP 6456884 B2 JP6456884 B2 JP 6456884B2 JP 2016155628 A JP2016155628 A JP 2016155628A JP 2016155628 A JP2016155628 A JP 2016155628A JP 6456884 B2 JP6456884 B2 JP 6456884B2
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Japan
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layer
rib
display device
glass substrate
manufacturing
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JP2016155628A
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English (en)
Japanese (ja)
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JP2017037308A5 (enExample
JP2017037308A (ja
Inventor
一史 渡部
一史 渡部
寛 川中子
寛 川中子
山下　学
学 山下
秀明 石毛
秀明 石毛
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Japan Display Inc
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Japan Display Inc
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/131—Interconnections, e.g. wiring lines or terminals
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/805—Electrodes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/84—Passivation; Containers; Encapsulations
    • H10K50/844—Encapsulations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/50—Forming devices by joining two substrates together, e.g. lamination techniques
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/80—Manufacture or treatment specially adapted for the organic devices covered by this subclass using temporary substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/851—Division of substrate
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K2102/00—Constructional details relating to the organic devices covered by this subclass
    • H10K2102/301—Details of OLEDs
    • H10K2102/351—Thickness
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/10—OLED displays
    • H10K59/12—Active-matrix OLED [AMOLED] displays
    • H10K59/1201—Manufacture or treatment

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)
  • Devices For Indicating Variable Information By Combining Individual Elements (AREA)
  • Liquid Crystal (AREA)
  • Optical Filters (AREA)
JP2016155628A 2015-08-07 2016-08-08 表示装置及びその製造方法 Active JP6456884B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015157534 2015-08-07
JP2015157534 2015-08-07

Publications (3)

Publication Number Publication Date
JP2017037308A JP2017037308A (ja) 2017-02-16
JP2017037308A5 JP2017037308A5 (enExample) 2017-08-10
JP6456884B2 true JP6456884B2 (ja) 2019-01-23

Family

ID=58049588

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016155628A Active JP6456884B2 (ja) 2015-08-07 2016-08-08 表示装置及びその製造方法

Country Status (5)

Country Link
US (1) US9978989B2 (enExample)
JP (1) JP6456884B2 (enExample)
KR (1) KR101865469B1 (enExample)
CN (1) CN106449697B (enExample)
TW (1) TWI615952B (enExample)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6474337B2 (ja) * 2015-08-27 2019-02-27 株式会社ジャパンディスプレイ 表示装置及びその製造方法
CN206003842U (zh) * 2016-09-22 2017-03-08 合肥鑫晟光电科技有限公司 显示装置及封装盖板
KR102867300B1 (ko) * 2016-10-31 2025-10-01 엘지디스플레이 주식회사 유기 발광 표시 장치
CN110462718B (zh) * 2017-03-29 2022-03-04 夏普株式会社 显示设备、显示设备的制造方法及制造装置、成膜装置
KR102376502B1 (ko) * 2017-04-19 2022-03-22 삼성디스플레이 주식회사 터치 센서, 이를 포함하는 표시 장치, 및 터치 센서의 제조 방법
JP7084386B2 (ja) * 2017-05-18 2022-06-14 株式会社半導体エネルギー研究所 表示装置の作製方法
KR102326221B1 (ko) * 2017-07-31 2021-11-12 엘지디스플레이 주식회사 디스플레이 장치 및 그 제조 방법
KR102504133B1 (ko) * 2018-02-20 2023-02-28 삼성디스플레이 주식회사 디스플레이 장치와, 이의 제조 방법
CN112154712B (zh) * 2018-03-02 2024-02-09 夏普株式会社 显示装置的制造方法
US11101258B2 (en) * 2018-05-09 2021-08-24 Sakai Display Products Corporation Method and apparatus for manufacturing flexible light-emitting device
CN110943066A (zh) * 2018-09-21 2020-03-31 联华电子股份有限公司 具有高电阻晶片的半导体结构及高电阻晶片的接合方法
JP7083736B2 (ja) * 2018-10-26 2022-06-13 株式会社ジャパンディスプレイ 表示装置
US11943958B2 (en) * 2019-01-09 2024-03-26 Joled Inc. Display panel and display apparatus
JP2020113494A (ja) * 2019-01-16 2020-07-27 セイコーエプソン株式会社 有機エレクトロルミネッセンス装置の製造方法
EP3785897B1 (en) 2019-08-29 2021-12-29 SHPP Global Technologies B.V. Transparent, flexible, impact resistant, multilayer film comprising polycarbonate copolymers
JP7465652B2 (ja) * 2019-12-05 2024-04-11 ＪＤＩ Ｄｅｓｉｇｎ ａｎｄ Ｄｅｖｅｌｏｐｍｅｎｔ 合同会社 自発光表示パネルおよびその製造方法
JP7427969B2 (ja) * 2020-01-22 2024-02-06 セイコーエプソン株式会社 電気光学装置および電子機器

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
IL145317A0 (en) * 1999-04-28 2002-06-30 Du Pont Flexible organic electronic device with improved resistance to oxygen and moisture degradation
JP4094863B2 (ja) * 2002-02-12 2008-06-04 三星エスディアイ株式会社 有機ｅｌ表示装置
JP2006185679A (ja) 2004-12-27 2006-07-13 Asahi Glass Co Ltd 有機ｅｌパネル及び有機ｅｌ発光装置、並びに有機ｅｌパネルの製造方法
JP2010272270A (ja) * 2009-05-20 2010-12-02 Hitachi Displays Ltd 有機ｅｌ表示装置
JP5493791B2 (ja) * 2009-12-09 2014-05-14 セイコーエプソン株式会社 電気光学装置の製造方法
JP2011227369A (ja) * 2010-04-22 2011-11-10 Hitachi Displays Ltd 画像表示装置及びその製造方法
JP2012022065A (ja) * 2010-07-13 2012-02-02 Bridgestone Corp 情報表示用パネルの製造方法
JP5355618B2 (ja) * 2011-03-10 2013-11-27 三星ディスプレイ株式會社 可撓性表示装置及びこの製造方法
JP5887245B2 (ja) * 2012-10-03 2016-03-16 株式会社ジャパンディスプレイ 表示装置の製造方法

Also Published As

Publication number Publication date
CN106449697A (zh) 2017-02-22
US20170040569A1 (en) 2017-02-09
KR20170017770A (ko) 2017-02-15
KR101865469B1 (ko) 2018-06-07
JP2017037308A (ja) 2017-02-16
TWI615952B (zh) 2018-02-21
TW201707196A (zh) 2017-02-16
CN106449697B (zh) 2019-12-13
US9978989B2 (en) 2018-05-22

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