JP6448365B2 - 発光装置および投射装置 - Google Patents

発光装置および投射装置 Download PDF

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Publication number
JP6448365B2
JP6448365B2 JP2014266772A JP2014266772A JP6448365B2 JP 6448365 B2 JP6448365 B2 JP 6448365B2 JP 2014266772 A JP2014266772 A JP 2014266772A JP 2014266772 A JP2014266772 A JP 2014266772A JP 6448365 B2 JP6448365 B2 JP 6448365B2
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JP
Japan
Prior art keywords
light emitting
light
mounting substrate
emitting device
phosphor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014266772A
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English (en)
Japanese (ja)
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JP2016127145A5 (enExample
JP2016127145A (ja
Inventor
原　博昭
博昭 原
紀彦 小林
紀彦 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Citizen Electronics Co Ltd
Citizen Watch Co Ltd
Original Assignee
Citizen Electronics Co Ltd
Citizen Watch Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Citizen Electronics Co Ltd, Citizen Watch Co Ltd filed Critical Citizen Electronics Co Ltd
Priority to JP2014266772A priority Critical patent/JP6448365B2/ja
Publication of JP2016127145A publication Critical patent/JP2016127145A/ja
Publication of JP2016127145A5 publication Critical patent/JP2016127145A5/ja
Application granted granted Critical
Publication of JP6448365B2 publication Critical patent/JP6448365B2/ja
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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Projection Apparatus (AREA)
  • Fastening Of Light Sources Or Lamp Holders (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Liquid Crystal (AREA)
JP2014266772A 2014-12-26 2014-12-26 発光装置および投射装置 Active JP6448365B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014266772A JP6448365B2 (ja) 2014-12-26 2014-12-26 発光装置および投射装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014266772A JP6448365B2 (ja) 2014-12-26 2014-12-26 発光装置および投射装置

Publications (3)

Publication Number Publication Date
JP2016127145A JP2016127145A (ja) 2016-07-11
JP2016127145A5 JP2016127145A5 (enExample) 2017-08-03
JP6448365B2 true JP6448365B2 (ja) 2019-01-09

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ID=56359646

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014266772A Active JP6448365B2 (ja) 2014-12-26 2014-12-26 発光装置および投射装置

Country Status (1)

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JP (1) JP6448365B2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7029882B2 (ja) 2016-09-01 2022-03-04 エルジー ディスプレイ カンパニー リミテッド 光源装置および表示装置
WO2018142440A1 (ja) * 2017-01-31 2018-08-09 サンケン電気株式会社 発光装置
JP6888381B2 (ja) 2017-04-06 2021-06-16 セイコーエプソン株式会社 光源装置及びプロジェクター
US10770632B2 (en) * 2018-03-09 2020-09-08 Nichia Corporation Light source device
JP7132502B2 (ja) * 2018-03-09 2022-09-07 日亜化学工業株式会社 光源装置
KR102666946B1 (ko) * 2018-10-26 2024-05-17 엘지이노텍 주식회사 노광기용 조명 장치
JP6940776B2 (ja) 2018-11-05 2021-09-29 日亜化学工業株式会社 発光装置及びその製造方法
CN111830773A (zh) * 2019-04-19 2020-10-27 中强光电股份有限公司 波长转换模块以及投影装置
JP7185157B2 (ja) * 2020-12-25 2022-12-07 日亜化学工業株式会社 発光モジュール及び発光モジュールの製造方法
US12477870B2 (en) * 2022-04-07 2025-11-18 DOMINANT Opto Technologies Sdn Bhd. Surface mountable optoelectronic device with side walls including slots filled with a laminated encapsulant material
JP7626947B2 (ja) * 2022-06-24 2025-02-05 日亜化学工業株式会社 発光モジュール

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2005347312A (ja) * 2004-05-31 2005-12-15 Ngk Spark Plug Co Ltd 発光素子用パッケージ
US7540616B2 (en) * 2005-12-23 2009-06-02 3M Innovative Properties Company Polarized, multicolor LED-based illumination source
US7663152B2 (en) * 2006-08-09 2010-02-16 Philips Lumileds Lighting Company, Llc Illumination device including wavelength converting element side holding heat sink
DE102008003971A1 (de) * 2008-01-11 2009-07-16 Ledon Lighting Jennersdorf Gmbh Leuchtdiodenanordnung mit Schutzrahmen
CN106568002A (zh) * 2009-05-28 2017-04-19 皇家飞利浦电子股份有限公司 具有封闭光源的罩的照明设备
US7855394B2 (en) * 2009-06-18 2010-12-21 Bridgelux, Inc. LED array package covered with a highly thermal conductive plate
JP2011014769A (ja) * 2009-07-03 2011-01-20 Pearl Lighting Co Ltd 発光ダイオード
JP5340879B2 (ja) * 2009-10-13 2013-11-13 スタンレー電気株式会社 発光装置
JP2011222626A (ja) * 2010-04-06 2011-11-04 Stanley Electric Co Ltd 半導体発光装置および発光素子パッケージ
JP2013074274A (ja) * 2011-09-29 2013-04-22 Ccs Inc Ｌｅｄパッケージ
US9115868B2 (en) * 2011-10-13 2015-08-25 Intematix Corporation Wavelength conversion component with improved protective characteristics for remote wavelength conversion

Also Published As

Publication number Publication date
JP2016127145A (ja) 2016-07-11

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