JP6442821B2 - 超音波デバイス及び電子機器 - Google Patents

超音波デバイス及び電子機器 Download PDF

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Publication number
JP6442821B2
JP6442821B2 JP2013203476A JP2013203476A JP6442821B2 JP 6442821 B2 JP6442821 B2 JP 6442821B2 JP 2013203476 A JP2013203476 A JP 2013203476A JP 2013203476 A JP2013203476 A JP 2013203476A JP 6442821 B2 JP6442821 B2 JP 6442821B2
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Japan
Prior art keywords
film
ultrasonic
ultrasonic device
conductive film
partition wall
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JP2013203476A
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English (en)
Japanese (ja)
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JP2015066202A5 (enExample
JP2015066202A (ja
Inventor
清瀬　摂内
摂内 清瀬
鈴木　博則
博則 鈴木
洋史 松田
洋史 松田
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Seiko Epson Corp
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Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2013203476A priority Critical patent/JP6442821B2/ja
Priority to CN201410499407.3A priority patent/CN104510497B/zh
Priority to US14/499,841 priority patent/US10524764B2/en
Publication of JP2015066202A publication Critical patent/JP2015066202A/ja
Publication of JP2015066202A5 publication Critical patent/JP2015066202A5/ja
Application granted granted Critical
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    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4483—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer
    • A61B8/4488—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device characterised by features of the ultrasound transducer the transducer being a phased array
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/13—Tomography
    • A61B8/14—Echo-tomography
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B06—GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL
    • B06B—METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY, e.g. FOR PERFORMING MECHANICAL WORK IN GENERAL
    • B06B1/00—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency
    • B06B1/02—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy
    • B06B1/06—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction
    • B06B1/0607—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements
    • B06B1/0622—Methods or apparatus for generating mechanical vibrations of infrasonic, sonic, or ultrasonic frequency making use of electrical energy operating with piezoelectric effect or with electrostriction using multiple elements on one surface
    • B06B1/0629—Square array
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/01—Manufacture or treatment
    • H10N30/08—Shaping or machining of piezoelectric or electrostrictive bodies
    • H10N30/082—Shaping or machining of piezoelectric or electrostrictive bodies by etching, e.g. lithography
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N30/00—Piezoelectric or electrostrictive devices
    • H10N30/704—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings
    • H10N30/706—Piezoelectric or electrostrictive devices based on piezoelectric or electrostrictive films or coatings characterised by the underlying bases, e.g. substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N—ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10N39/00—Integrated devices, or assemblies of multiple devices, comprising at least one piezoelectric, electrostrictive or magnetostrictive element covered by groups H10N30/00 – H10N35/00
    • A—HUMAN NECESSITIES
    • A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
    • A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
    • A61B8/44—Constructional features of the ultrasonic, sonic or infrasonic diagnostic device
    • A61B8/4427—Device being portable or laptop-like

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  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Medical Informatics (AREA)
  • Surgery (AREA)
  • Pathology (AREA)
  • Radiology & Medical Imaging (AREA)
  • Biophysics (AREA)
  • Biomedical Technology (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Physics & Mathematics (AREA)
  • Molecular Biology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Public Health (AREA)
  • Veterinary Medicine (AREA)
  • Gynecology & Obstetrics (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Transducers For Ultrasonic Waves (AREA)
  • Ultra Sonic Daignosis Equipment (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
JP2013203476A 2013-09-30 2013-09-30 超音波デバイス及び電子機器 Active JP6442821B2 (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP2013203476A JP6442821B2 (ja) 2013-09-30 2013-09-30 超音波デバイス及び電子機器
CN201410499407.3A CN104510497B (zh) 2013-09-30 2014-09-25 超声波装置、探测器、电子设备以及超声波图像装置
US14/499,841 US10524764B2 (en) 2013-09-30 2014-09-29 Ultrasonic device, ultrasonic probe, electronic equipment, and ultrasonic image device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2013203476A JP6442821B2 (ja) 2013-09-30 2013-09-30 超音波デバイス及び電子機器

Publications (3)

Publication Number Publication Date
JP2015066202A JP2015066202A (ja) 2015-04-13
JP2015066202A5 JP2015066202A5 (enExample) 2016-10-13
JP6442821B2 true JP6442821B2 (ja) 2018-12-26

Family

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Family Applications (1)

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JP2013203476A Active JP6442821B2 (ja) 2013-09-30 2013-09-30 超音波デバイス及び電子機器

Country Status (3)

Country Link
US (1) US10524764B2 (enExample)
JP (1) JP6442821B2 (enExample)
CN (1) CN104510497B (enExample)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6011235B2 (ja) 2012-10-17 2016-10-19 セイコーエプソン株式会社 超音波測定装置、プローブヘッド、超音波プローブ、電子機器及び超音波診断装置
JP6442821B2 (ja) * 2013-09-30 2018-12-26 セイコーエプソン株式会社 超音波デバイス及び電子機器
JP6468426B2 (ja) * 2014-03-10 2019-02-13 セイコーエプソン株式会社 超音波センサー
US10130339B2 (en) * 2014-06-30 2018-11-20 Seiko Epson Corporation Ultrasound sensor and method of manufacturing thereof
WO2016194591A1 (ja) * 2015-05-29 2016-12-08 株式会社日立製作所 超音波トランスデューサおよび超音波検査装置
JP6597026B2 (ja) * 2015-07-30 2019-10-30 セイコーエプソン株式会社 超音波デバイス及び超音波モジュール
JP2017103267A (ja) * 2015-11-30 2017-06-08 セイコーエプソン株式会社 圧電素子、圧電素子の形成方法および超音波装置
JP6610883B2 (ja) * 2015-12-17 2019-11-27 セイコーエプソン株式会社 超音波センサー用の圧電デバイス
JP6724502B2 (ja) * 2016-04-06 2020-07-15 セイコーエプソン株式会社 超音波装置
JP6809094B2 (ja) 2016-09-29 2021-01-06 セイコーエプソン株式会社 圧電素子、圧電アクチュエーター、超音波探触子、超音波装置、電子機器、液体噴射ヘッド、及び液体噴射装置
JP6874463B2 (ja) 2017-03-27 2021-05-19 セイコーエプソン株式会社 圧電素子、圧電アクチュエーター、超音波探触子、超音波装置、電子機器、液体噴射ヘッド、及び液体噴射装置
JP6922651B2 (ja) 2017-10-26 2021-08-18 セイコーエプソン株式会社 超音波デバイス、及び超音波測定装置
JP7127510B2 (ja) * 2018-11-22 2022-08-30 セイコーエプソン株式会社 超音波素子、及び超音波装置
CN109622346B (zh) * 2018-12-20 2020-08-18 张隆弟 一种超声换能器的新型阵列结构
JP6776481B1 (ja) * 2020-01-30 2020-10-28 サンコール株式会社 超音波トランスデューサー及びその製造方法
CN111944670B (zh) * 2020-03-19 2021-11-30 珠海艾博罗生物技术股份有限公司 超声处理器
KR102802030B1 (ko) * 2020-04-22 2025-05-02 삼성메디슨 주식회사 초음파 프로브
JP2022094478A (ja) * 2020-12-15 2022-06-27 セイコーエプソン株式会社 超音波素子および超音波装置
WO2023197290A1 (zh) * 2022-04-15 2023-10-19 深圳市韶音科技有限公司 驱动装置及包含该驱动装置的声学输出装置
CN117563929A (zh) * 2022-08-08 2024-02-20 华为技术有限公司 具有振膜的器件、电子设备

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JP3545269B2 (ja) * 1998-09-04 2004-07-21 日本碍子株式会社 質量センサ及び質量検出方法
US6515402B2 (en) * 2001-01-24 2003-02-04 Koninklijke Philips Electronics N.V. Array of ultrasound transducers
US7023036B2 (en) * 2001-10-02 2006-04-04 Matsushita Electric Industrial Co., Ltd. Ferroelectric element and actuator using the same, and ink jet head and ink jet recording device
KR100646135B1 (ko) * 2003-07-21 2006-11-23 쌍신전자통신주식회사 실리콘 체적탄성파 소자 및 그 제조방법
JP2005051688A (ja) 2003-07-31 2005-02-24 Matsushita Electric Works Ltd 超音波アレイセンサおよびその製造方法
JP4513596B2 (ja) * 2004-08-25 2010-07-28 株式会社デンソー 超音波センサ
US7489593B2 (en) * 2004-11-30 2009-02-10 Vermon Electrostatic membranes for sensors, ultrasonic transducers incorporating such membranes, and manufacturing methods therefor
WO2007046180A1 (ja) * 2005-10-18 2007-04-26 Hitachi, Ltd. 超音波トランスデューサ、超音波探触子および超音波撮像装置
JP4787630B2 (ja) 2006-03-03 2011-10-05 日立アロカメディカル株式会社 超音波探触子
KR20100057596A (ko) * 2007-07-03 2010-05-31 코닌클리즈케 필립스 일렉트로닉스 엔.브이. 존재 검출을 위한 박막 검출기
JP4533934B2 (ja) * 2008-01-15 2010-09-01 エプソントヨコム株式会社 振動片及び振動子の製造方法
JP2011082624A (ja) * 2009-10-02 2011-04-21 Asahi Kasei Electronics Co Ltd 近接超音波センサ
EP2598255A2 (en) * 2010-07-30 2013-06-05 Koninklijke Philips Electronics N.V. Thin film ultrasound transducer
WO2012144370A1 (ja) * 2011-04-19 2012-10-26 京セラ株式会社 電子部品および弾性波装置
JP5990930B2 (ja) * 2012-02-24 2016-09-14 セイコーエプソン株式会社 超音波トランスデューサー素子チップおよびプローブ並びに電子機器および超音波診断装置
JP5900107B2 (ja) 2012-03-30 2016-04-06 セイコーエプソン株式会社 超音波トランスデューサー素子チップおよびプローブ並びに電子機器および超音波診断装置
JP6078994B2 (ja) 2012-06-13 2017-02-15 セイコーエプソン株式会社 超音波トランスデューサー素子ユニットおよびプローブおよびプローブヘッド並びに電子機器および超音波診断装置
JP6442821B2 (ja) * 2013-09-30 2018-12-26 セイコーエプソン株式会社 超音波デバイス及び電子機器

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Publication number Publication date
CN104510497B (zh) 2019-01-15
US10524764B2 (en) 2020-01-07
CN104510497A (zh) 2015-04-15
JP2015066202A (ja) 2015-04-13
US20150094590A1 (en) 2015-04-02

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