JP6442618B2 - 光塩基発生剤を含有する光イメージ化可能な組成物 - Google Patents

光塩基発生剤を含有する光イメージ化可能な組成物 Download PDF

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JP6442618B2
JP6442618B2 JP2017542867A JP2017542867A JP6442618B2 JP 6442618 B2 JP6442618 B2 JP 6442618B2 JP 2017542867 A JP2017542867 A JP 2017542867A JP 2017542867 A JP2017542867 A JP 2017542867A JP 6442618 B2 JP6442618 B2 JP 6442618B2
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bicyclo
composition
polymer
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JP2018511819A5 (https=
JP2018511819A (ja
Inventor
ヘンドラ イング,
ヘンドラ イング,
ウェイ チャン,
ウェイ チャン,
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プロメラス, エルエルシー
プロメラス, エルエルシー
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    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0045Photosensitive materials with organic non-macromolecular light-sensitive compounds not otherwise provided for, e.g. dissolution inhibitors
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/0046Photosensitive materials with perfluoro compounds, e.g. for dry lithography
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/038Macromolecular compounds which are rendered insoluble or differentially wettable
    • G03F7/0382Macromolecular compounds which are rendered insoluble or differentially wettable the macromolecular compound being present in a chemically amplified negative photoresist composition
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0751Silicon-containing compounds used as adhesion-promoting additives or as means to improve adhesion

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Materials For Photolithography (AREA)
  • Epoxy Resins (AREA)
  • Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
JP2017542867A 2015-02-18 2016-02-12 光塩基発生剤を含有する光イメージ化可能な組成物 Active JP6442618B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201562117769P 2015-02-18 2015-02-18
US62/117,769 2015-02-18
PCT/US2016/017654 WO2016133794A1 (en) 2015-02-18 2016-02-12 Photoimageable compositions containing photobase generators

Publications (3)

Publication Number Publication Date
JP2018511819A JP2018511819A (ja) 2018-04-26
JP2018511819A5 JP2018511819A5 (https=) 2018-11-15
JP6442618B2 true JP6442618B2 (ja) 2018-12-19

Family

ID=55699781

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2017542867A Active JP6442618B2 (ja) 2015-02-18 2016-02-12 光塩基発生剤を含有する光イメージ化可能な組成物

Country Status (5)

Country Link
US (1) US9823565B2 (https=)
JP (1) JP6442618B2 (https=)
KR (1) KR20170117103A (https=)
TW (1) TWI649620B (https=)
WO (1) WO2016133794A1 (https=)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI649620B (zh) * 2015-02-18 2019-02-01 日商住友電木股份有限公司 含有光產鹼劑的光可成像組成物
CN111788246B (zh) * 2018-03-16 2022-06-10 3M创新有限公司 组合物、粘结方法和粘结组件

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6849377B2 (en) * 1998-09-23 2005-02-01 E. I. Du Pont De Nemours And Company Photoresists, polymers and processes for microlithography
EP1246013A3 (en) 2001-03-30 2003-11-19 E.I. Du Pont De Nemours And Company Photoresists, polymers and processes for microlithography
US6737215B2 (en) 2001-05-11 2004-05-18 Clariant Finance (Bvi) Ltd Photoresist composition for deep ultraviolet lithography
US20060020068A1 (en) * 2004-07-07 2006-01-26 Edmund Elce Photosensitive compositions based on polycyclic polymers for low stress, high temperature films
US8030425B2 (en) 2002-07-03 2011-10-04 Promerus Llc Photosensitive compositions based on polycyclic polymers for low stress, high temperature films
WO2006008251A2 (en) * 2004-07-21 2006-01-26 Ciba Specialty Chemicals Holding Inc. Process for the photoactivation and use of a catalyst by an inverted two-stage procedure
JP5521999B2 (ja) * 2009-11-26 2014-06-18 住友化学株式会社 化学増幅型フォトレジスト組成物及びレジストパターンの製造方法
JPWO2012053052A1 (ja) * 2010-10-19 2014-02-24 住友ベークライト株式会社 感光性樹脂組成物および半導体装置
CN104221176B (zh) * 2012-01-16 2017-03-01 住友电木株式会社 用于微电子和光电子器件及其组件的热氧化稳定的、侧链聚醚官能化的聚降冰片烯
KR101572049B1 (ko) * 2012-09-25 2015-11-26 프로메러스, 엘엘씨 사이클로올레핀성 중합체를 함유하는 말레이미드 및 그의 용도
TWI649620B (zh) * 2015-02-18 2019-02-01 日商住友電木股份有限公司 含有光產鹼劑的光可成像組成物

Also Published As

Publication number Publication date
WO2016133794A1 (en) 2016-08-25
US20160238931A1 (en) 2016-08-18
US9823565B2 (en) 2017-11-21
KR20170117103A (ko) 2017-10-20
TWI649620B (zh) 2019-02-01
JP2018511819A (ja) 2018-04-26
TW201636734A (zh) 2016-10-16

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