JP6442462B2 - 超音波洗浄システムおよび方法 - Google Patents
超音波洗浄システムおよび方法 Download PDFInfo
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- JP6442462B2 JP6442462B2 JP2016214741A JP2016214741A JP6442462B2 JP 6442462 B2 JP6442462 B2 JP 6442462B2 JP 2016214741 A JP2016214741 A JP 2016214741A JP 2016214741 A JP2016214741 A JP 2016214741A JP 6442462 B2 JP6442462 B2 JP 6442462B2
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Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F02—COMBUSTION ENGINES; HOT-GAS OR COMBUSTION-PRODUCT ENGINE PLANTS
- F02B—INTERNAL-COMBUSTION PISTON ENGINES; COMBUSTION ENGINES IN GENERAL
- F02B77/00—Component parts, details or accessories, not otherwise provided for
- F02B77/04—Cleaning of, preventing corrosion or erosion in, or preventing unwanted deposits in, combustion engines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
- B08B3/12—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration by sonic or ultrasonic vibrations
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
- B08B7/026—Using sound waves
- B08B7/028—Using ultrasounds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B9/00—Cleaning hollow articles by methods or apparatus specially adapted thereto
- B08B9/02—Cleaning pipes or tubes or systems of pipes or tubes
- B08B9/027—Cleaning the internal surfaces; Removal of blockages
- B08B9/032—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing
- B08B9/0321—Cleaning the internal surfaces; Removal of blockages by the mechanical action of a moving fluid, e.g. by flushing using pressurised, pulsating or purging fluid
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F01—MACHINES OR ENGINES IN GENERAL; ENGINE PLANTS IN GENERAL; STEAM ENGINES
- F01D—NON-POSITIVE DISPLACEMENT MACHINES OR ENGINES, e.g. STEAM TURBINES
- F01D25/00—Component parts, details, or accessories, not provided for in, or of interest apart from, other groups
- F01D25/002—Cleaning of turbomachines
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/044—Cleaning involving contact with liquid using agitated containers in which the liquid and articles or material are placed
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/08—Cleaning involving contact with liquid the liquid having chemical or dissolving effect
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/04—Cleaning involving contact with liquid
- B08B3/10—Cleaning involving contact with liquid with additional treatment of the liquid or of the object being cleaned, e.g. by heat, by electricity or by vibration
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/02041—Cleaning
- H01L21/02076—Cleaning after the substrates have been singulated
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67057—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing with the semiconductor substrates being dipped in baths or vessels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02T—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO TRANSPORTATION
- Y02T50/00—Aeronautics or air transport
- Y02T50/60—Efficient propulsion technologies, e.g. for aircraft
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Cleaning By Liquid Or Steam (AREA)
- Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
Description
102 機器
104 タービンシステム
106 プローブ
108 結合機構
110 接触媒質
112 コネクタ
114 光学センサ
116 電源
118 制御装置
120 メモリ
122 入力デバイス
124 出力デバイス
126 外面
128 供給源
130 ノズル
132 走査機構
200 構成要素
202 堆積物
302 外側金属層
304 遮熱コーティング
Claims (18)
- エンジン(102)に入り、超音波パルスを放出するように構成された超音波プローブ(106)と、
前記超音波プローブ(106)と前記エンジン(102)の1つまたは複数の構成要素との間に超音波接触媒質(110)を提供するように構成された結合機構(108)と、
前記エンジン(102)の前記1つまたは複数の構成要素の表面に前記接触媒質(110)を通して前記超音波パルスを送達するように前記超音波プローブ(106)を駆動するように構成された制御装置(118)と、
を備えるシステム(100)であって、
前記超音波プローブ(106)が、前記エンジン(102)の前記1つまたは複数の構成要素(200)から堆積物(202)を除去するために前記超音波パルスを送達するように構成され、
前記超音波プローブ(106)が、前記エンジン(102)の前記1つまたは複数の構成要素(200)の遮熱コーティング(304)の除去を防止しながら、前記堆積物(202)を除去するために、前記堆積物(202)に前記超音波パルスを集束させ、かつ、前記遮熱コーティング(304)には集束させないように構成される、
システム(100)。 - 前記結合機構(108)が、前記超音波プローブ(106)と前記エンジン(102)の1つまたは複数のブレード、ノズル、燃焼器ライナ、または圧縮機ブレードとの間に前記接触媒質(110)を提供するように構成される請求項1に記載のシステム(100)。
- 前記エンジン(102)の前記1つまたは複数の構成要素(200)の前記表面が外面(126)であり、前記超音波プローブ(106)が、前記エンジン(102)の前記1つまたは複数の構成要素(200)の前記外面(126)の前記堆積物(202)に向けて前記超音波パルスを集束させるように構成された集束超音波プローブ(106)である、請求項1または2に記載のシステム(100)。
- 前記結合機構(108)がダイヤフラムを含み、前記ダイヤフラムが、前記超音波接触媒質(110)を少なくとも一部充填され、前記超音波プローブ(106)と前記1つまたは複数の構成要素(200)との間に前記エンジン(102)の前記1つまたは複数の構成要素(200)を係合するように構成される、請求項1から3のいずれかに記載のシステム(100)。
- 前記超音波プローブ(106)による前記堆積物(202)の除去中に、前記エンジン(102)の前記1つまたは複数の構成要素(200)を表す光学データを発生するように構成された光学センサをさらに備える、請求項1から4のいずれかに記載のシステム(100)。
- 前記エンジン(102)の前記1つまたは複数の構成要素(200)の前記表面が外面(126)であり、前記1つまたは複数の構成要素(200)が逆側の内面を含み、前記結合機構(108)が、前記超音波プローブ(106)から前記外面(126)に前記接触媒質(110)を提供するように構成され、前記制御装置(118)が、前記内面から前記堆積物(202)を除去するために、前記エンジン(102)の前記1つまたは複数の構成要素(200)の前記外面(126)を通して前記内面の前記堆積物(202)に前記超音波パルスを集束させるように前記超音波プローブ(106)を指向するように構成される請求項1または2に記載のシステム(100)。
- 前記接触媒質(110)がガリウムインジウム合金を含む、請求項1から6のいずれかに記載のシステム(100)。
- 超音波プローブ(106)をエンジン(102)に挿入するステップと、
前記超音波プローブ(106)と前記エンジン(102)の1つまたは複数の構成要素(200)との間に超音波接触媒質(110)を送達するステップと、
前記超音波プローブ(106)から前記接触媒質(110)を通して前記エンジン(102)の前記1つまたは複数の構成要素(200)の表面に超音波パルスを放出するステップと、
を含む方法であって、
前記超音波パルスが、前記エンジン(102)の前記1つまたは複数の構成要素(200)から堆積物(202)を除去し、
前記超音波パルスが、前記エンジン(102)の前記1つまたは複数の構成要素(200)の遮熱コーティング(304)の除去を防止しながら、前記堆積物(202)を除去するように、前記超音波パルスが前記堆積物(202)に集束され、かつ、前記遮熱コーティング(304)には集束されない、
方法。 - 前記超音波接触媒質(110)を送達するステップが、前記エンジン(102)の前記1つまたは複数の構成要素(200)上に前記接触媒質(110)を噴霧するステップを含む、請求項8に記載の方法。
- 前記超音波接触媒質(110)を送達するステップが、前記エンジン(102)の前記1つまたは複数の構成要素(200)の前記表面を、前記超音波接触媒質(110)で少なくとも一部充填されたダイヤフラムと係合するステップを含む、請求項8に記載の方法。
- 前記超音波プローブ(106)による前記堆積物(202)の除去中に、光学センサから前記エンジン(102)の前記1つまたは複数の構成要素(200)を表す光学データを得るステップをさらに含む、請求項8から10のいずれかに記載の方法。
- 前記エンジン(102)の前記1つまたは複数の構成要素(200)の前記表面が外面(126)であり、前記1つまたは複数の構成要素(200)が逆側の内面を含み、前記接触媒質(110)が、前記外面(126)上に送達され、前記超音波パルスを放出するステップが、前記内面から堆積物(202)を除去するために、前記エンジン(102)の前記1つまたは複数の構成要素(200)の前記外面(126)を通して前記内面の前記堆積物(202)に前記超音波パルスを集束させるステップを含む、請求項8から11のいずれかに記載の方法。
- 前記1つまたは複数の構成要素(200)が、前記内面によって少なくとも一部境界を画された内部空洞を含み、方法がさらに、超音波接触媒質(110)または別の流体を内部空洞に少なくとも一部充填するステップを含む、請求項12に記載の方法。
- 前記超音波パルスを放出するステップが、前記内面から前記堆積物(202)を除去するために、前記内部空洞に向けて前記超音波パルスを指向するステップと、前記内部空洞の周りでの音響効果を生成するステップと、を含む、請求項13に記載の方法。
- 前記内面と前記外面(126)の間の前記1つまたは複数の構成要素(200)の厚さに基づいて、前記超音波プローブ(106)によって送達される前記超音波パルスの周波数を変えるステップをさらに含む、請求項12から14のいずれかに記載の方法。
- 機器に入り、超音波パルスを放出するように構成された超音波プローブ(106)と、
前記機器の前記1つまたは複数の構成要素(200)の表面に前記超音波パルスを送達するように前記超音波プローブ(106)を駆動するように構成された制御装置(118)と、
を備えるシステム(100)であって、
前記超音波プローブ(106)が、前記機器の前記1つまたは複数の構成要素(200)から堆積物(202)を除去するために前記超音波パルスを送達するように構成され、
前記超音波プローブ(106)が、前記機器の前記1つまたは複数の構成要素(200)の遮熱コーティング(304)の除去を防止しながら、前記堆積物(202)を除去するために、前記堆積物(202)に前記超音波パルスを集束させ、かつ、前記遮熱コーティング(304)には集束させないように構成される、
システム(100)。 - 前記超音波プローブ(106)と前記機器の1つまたは複数の構成要素(200)との間に超音波接触媒質(110)を提供するように構成された結合機構(108)をさらに含む、請求項16に記載のシステム(100)。
- 前記機器の前記1つまたは複数の構成要素(200)の前記表面が外面(126)であり、前記1つまたは複数の構成要素(200)が逆側の内面を含み、前記制御装置(118)が、前記機器の前記1つまたは複数の構成要素(200)の前記外面(126)を通して前記内面の前記堆積物(202)に前記超音波パルスを集束させて、前記内面から堆積物(202)を除去するように構成される、請求項16または17に記載のシステム(100)。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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US14/938,590 | 2015-11-11 | ||
US14/938,590 US10018113B2 (en) | 2015-11-11 | 2015-11-11 | Ultrasonic cleaning system and method |
Publications (2)
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JP2017087205A JP2017087205A (ja) | 2017-05-25 |
JP6442462B2 true JP6442462B2 (ja) | 2018-12-19 |
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JP2016214741A Expired - Fee Related JP6442462B2 (ja) | 2015-11-11 | 2016-11-02 | 超音波洗浄システムおよび方法 |
Country Status (7)
Country | Link |
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US (2) | US10018113B2 (ja) |
EP (2) | EP3167966B1 (ja) |
JP (1) | JP6442462B2 (ja) |
CN (1) | CN106890827B (ja) |
BR (1) | BR102016026311A2 (ja) |
CA (1) | CA2946567C (ja) |
TW (1) | TWI634048B (ja) |
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-
2015
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2016
- 2016-10-27 CA CA2946567A patent/CA2946567C/en not_active Expired - Fee Related
- 2016-11-01 EP EP16196738.5A patent/EP3167966B1/en active Active
- 2016-11-01 EP EP22150263.6A patent/EP3998122A1/en active Pending
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- 2016-11-11 CN CN201610993374.7A patent/CN106890827B/zh active Active
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EP3167966A3 (en) | 2017-08-02 |
CA2946567A1 (en) | 2017-05-11 |
EP3167966A2 (en) | 2017-05-17 |
CN106890827B (zh) | 2021-03-05 |
US11286849B2 (en) | 2022-03-29 |
EP3998122A1 (en) | 2022-05-18 |
US10018113B2 (en) | 2018-07-10 |
BR102016026311A2 (pt) | 2017-10-10 |
US20170130649A1 (en) | 2017-05-11 |
CA2946567C (en) | 2019-01-08 |
EP3167966B1 (en) | 2022-02-16 |
JP2017087205A (ja) | 2017-05-25 |
TWI634048B (zh) | 2018-09-01 |
TW201728505A (zh) | 2017-08-16 |
US20180291803A1 (en) | 2018-10-11 |
CN106890827A (zh) | 2017-06-27 |
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