JP6441704B2 - Cutting equipment - Google Patents
Cutting equipment Download PDFInfo
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- JP6441704B2 JP6441704B2 JP2015024392A JP2015024392A JP6441704B2 JP 6441704 B2 JP6441704 B2 JP 6441704B2 JP 2015024392 A JP2015024392 A JP 2015024392A JP 2015024392 A JP2015024392 A JP 2015024392A JP 6441704 B2 JP6441704 B2 JP 6441704B2
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- 238000005520 cutting process Methods 0.000 title claims description 283
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 221
- 238000003860 storage Methods 0.000 claims description 29
- 238000001914 filtration Methods 0.000 claims description 5
- 239000004065 semiconductor Substances 0.000 description 35
- 239000002699 waste material Substances 0.000 description 26
- 238000003384 imaging method Methods 0.000 description 5
- NWUYHJFMYQTDRP-UHFFFAOYSA-N 1,2-bis(ethenyl)benzene;1-ethenyl-2-ethylbenzene;styrene Chemical compound C=CC1=CC=CC=C1.CCC1=CC=CC=C1C=C.C=CC1=CC=CC=C1C=C NWUYHJFMYQTDRP-UHFFFAOYSA-N 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 230000009931 harmful effect Effects 0.000 description 3
- 239000003456 ion exchange resin Substances 0.000 description 3
- 229920003303 ion-exchange polymer Polymers 0.000 description 3
- 238000003754 machining Methods 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000006061 abrasive grain Substances 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/023—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with a cutting blade mounted on a carriage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Dicing (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Auxiliary Devices For Machine Tools (AREA)
- Grinding-Machine Dressing And Accessory Apparatuses (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Description
本発明は、半導体ウエーハ等の被加工物に切削加工を施すための切削装置に関する。 The present invention relates to a cutting apparatus for cutting a workpiece such as a semiconductor wafer.
半導体デバイス製造工程においては、略円板形状である半導体ウエーハの表面に格子状に形成された分割予定ラインによって複数の領域が区画され、この区画された領域にIC、LSI等のデバイスを形成する。このように複数のデバイスが形成された半導体ウエーハを分割予定ラインに沿って切断することによりデバイスが形成された領域を分割して個々の半導体デバイスを製造している。 In the semiconductor device manufacturing process, a plurality of areas are defined by division lines formed in a lattice pattern on the surface of a semiconductor wafer having a substantially disk shape, and devices such as ICs and LSIs are formed in the partitioned areas. . The semiconductor wafer in which a plurality of devices are formed in this manner is cut along a predetermined division line to divide the region in which the devices are formed to manufacture individual semiconductor devices.
半導体ウエーハを分割予定ラインに沿って切断する切削装置は、被加工物を保持する被加工物保持手段と、該被加工物保持手段に保持された被加工物を切削する回転可能に構成された切削ブレードを備えた切削手段と、該切削手段の切削ブレードによる切削加工部に切削水を供給する切削水供給手段と、被加工物保持手段と切削手段とを加工送り方向に相対的に加工送りする加工送り手段と、を具備している(例えば、特許文献1参照)。 A cutting apparatus for cutting a semiconductor wafer along a planned dividing line is configured to be capable of rotating a workpiece holding means for holding a workpiece and the workpiece held by the workpiece holding means. A cutting means provided with a cutting blade, a cutting water supply means for supplying cutting water to a cutting portion by the cutting blade of the cutting means, a workpiece holding means, and a cutting means are processed relative to each other in the processing feed direction. Processing feed means to perform (see, for example, Patent Document 1).
而して、切削手段の切削ブレードによる切削加工部に供給される切削水は純水が使用されており、コストが高く生産性が悪いという問題がある。 Thus, the pure water is used as the cutting water supplied to the cutting part by the cutting blade of the cutting means, and there is a problem that the cost is high and the productivity is poor.
本発明は上記事実に鑑みてなされたものであり、その主たる技術的課題は、切削手段の切削ブレードによる切削加工部に供給される切削水を回収して被加工物に対して害を及ぼさない水に再生して使用することができる切削装置を提供することである。 The present invention has been made in view of the above facts, and the main technical problem thereof is to collect cutting water supplied to a cutting portion by a cutting blade of a cutting means so as not to harm a workpiece. It is providing the cutting device which can be regenerated and used for water.
上記主たる技術的課題を解決するため、本発明によれば、被加工物を保持する被加工物保持手段と、該被加工物保持手段に保持された被加工物を切削する回転可能に構成された切削ブレードを備えた切削手段と、該切削手段の切削ブレードによる切削加工部に切削水を供給する切削水供給機構と、を具備する切削装置であって、該切削手段の該切削ブレードによる切削加工部に供給された切削水を受け止める切削水受け止め手段と、該切削水受け止め手段によって受け止められた切削水に混入されている屑を、切削水を渦状に回転させ遠心力によって屑と水とを分離する遠心分離機により除去する屑除去手段と、該遠心分離機により除去される屑よりも微細な屑を含む切削水を濾過し純水に生成する純水生成手段と、該屑除去手段によって比較的大きな屑を除去した後、該屑除去手段によって除去された屑よりも微細な切削屑が残存する切削水の流れを、該純水生成手段を経由せずに切削水貯留タンクに向けて流す経路又は該純水生成手段を介して切削水貯留タンクに向けて流す経路に切り換える切り替え手段と、該屑除去手段によって屑が除去された切削水を該切削水供給機構に送るポンプと、を備えている、
ことを特徴とする切削装置が提供される。
In order to solve the above-mentioned main technical problem, according to the present invention, a workpiece holding means for holding a workpiece, and a rotatable structure for cutting the workpiece held by the workpiece holding means. A cutting apparatus comprising: a cutting means provided with a cutting blade; and a cutting water supply mechanism that supplies cutting water to a cutting portion of the cutting means by the cutting blade, wherein the cutting means uses the cutting blade to cut. Cutting water receiving means for receiving the cutting water supplied to the machining section, and debris mixed in the cutting water received by the cutting water receiving means , the cutting water is rotated in a spiral shape, and the debris and water are separated by centrifugal force. By debris removing means to be removed by a centrifugal separator to be separated, pure water generating means for filtering and generating cutting water containing finer waste than scrap removed by the centrifugal separator , and the debris removing means ratio After removing large debris, a flow of cutting water in which finer cutting debris than the debris removed by the debris removal means flows toward the cutting water storage tank without passing through the pure water generating means comprising a switching means for switching a path to flow toward the cutting water storage tank via the path or the pure water generating means, a pump for sending the cutting water debris was removed by該屑removing means to the cutting water supply mechanism, the ing,
A cutting device is provided.
本発明による切削装置は、被加工物を保持する被加工物保持手段と、該被加工物保持手段に保持された被加工物を切削する回転可能に構成された切削ブレードを備えた切削手段と、該切削手段の切削ブレードによる切削加工部に切削水を供給する切削水供給機構と、を具備し、切削手段の切削ブレードによる切削加工部に供給された切削水を受け止める切削水受け止め手段と、該切削水受け止め手段によって受け止められた切削水に混入されている屑を、切削水を渦状に回転させ遠心力によって屑と水とを分離する遠心分離機により除去する屑除去手段と、該遠心分離機により除去される屑よりも微細な屑を含む切削水を濾過し純水に生成する純水生成手段と、該屑除去手段によって比較的大きな屑を除去した後、該屑除去手段によって除去された屑よりも微細な切削屑が残存する切削水の流れを、該純水生成手段を経由せずに切削水貯留タンクに向けて流す経路又は該純水生成手段を介して切削水貯留タンクに向けて流す経路に切り換える切り替え手段と、該屑除去手段によって屑が除去された切削水を切削水供給機構に送るポンプと、を備えているので、切削ブレードによる切削加工部に供給された切削水は切削水受け止め手段によって受け止められ屑除去手段に導入される。そして、屑除去手段において導入された切削水に混入されている屑を分離し、屑が除去され半導体ウエーハ等の被加工物に対して害のない水を切削水として循環するので、純水の供給を抑制でき、切削水のコストを下げて生産性の向上を図ることができ、さらに、屑除去手段は切削水を渦状に回転させ遠心力によって屑と水とを分離するので、切削水に混入されている比較的大きい屑を除去することができるものの微細な屑が切削水に残存することになるが、半導体ウエーハ等の被加工物を構成する素材が混入しているので弊害を与えることはない。 A cutting apparatus according to the present invention includes a workpiece holding means for holding a workpiece, and a cutting means including a cutting blade configured to be rotatable for cutting the workpiece held by the workpiece holding means. A cutting water supply mechanism for supplying cutting water to a cutting portion by the cutting blade of the cutting means, and a cutting water receiving means for receiving the cutting water supplied to the cutting portion by the cutting blade of the cutting means; The debris removing means for removing the debris mixed in the cutting water received by the cutting water receiving means with a centrifuge for rotating the cutting water in a vortex and separating the debris and water by centrifugal force, and the centrifugal separation After removing cutting water containing finer scrap than the scrap removed by the machine to produce pure water and pure water, relatively large scrap is removed by the scrap removing means, and then removed by the scrap removing means. A flow of cutting water in which finer cutting waste than the generated waste remains flows toward the cutting water storage tank without passing through the pure water generating means or the cutting water storage tank via the pure water generating means and switching means for switching a path to flow towards the pump sending the cutting water debris was removed by該屑removing means cutting water supply mechanism is provided with the cutting supplied to cutting unit by the cutting blade Water is received by the cutting water receiving means and introduced into the debris removing means. And, the waste mixed in the cutting water introduced in the waste removal means is separated, and the waste is removed and water harmless to the workpiece such as a semiconductor wafer is circulated as the cutting water. Supply can be reduced, cutting water costs can be reduced, and productivity can be improved.Furthermore , the waste removal means rotates the cutting water in a vortex and separates the waste and water by centrifugal force. Although relatively large waste can be removed, fine waste remains in the cutting water. However, since the material constituting the workpiece, such as a semiconductor wafer, is mixed in, it is harmful. There is no.
以下、本発明に従って構成された切削装置の好適な実施形態について、添付図面を参照して、更に詳細に説明する。 Hereinafter, a preferred embodiment of a cutting device configured according to the present invention will be described in more detail with reference to the accompanying drawings.
図1には、本発明に従って構成された切削装置の斜視図が示されている。図1に示す切削装置は、略直方体状の装置ハウジング2を具備している。この装置ハウジング2内には、被加工物を保持する被加工物保持手段としてのチャックテーブル3が切削送り方向である矢印Xで示す方向(X軸方向)に移動可能に配設されている。チャックテーブル3は、吸着チャック支持台31と、該吸着チャック支持台31上に配設された吸着チャック32を具備しており、該吸着チャック32の上面である保持面上に被加工物を図示しない吸引手段を作動することによって吸引保持するようになっている。また、チャックテーブル3は、図示しない回転機構によって回転可能に構成されている。なお、チャックテーブル3には、被加工物として後述するウエーハをダイシングテープを介して支持する環状のフレームを固定するためのクランプ33が配設されている。このように構成されたチャックテーブル3は、図示しない切削送り手段によって、矢印Xで示す加工送り方向(X軸方向)に移動せしめられるようになっている。 FIG. 1 shows a perspective view of a cutting device constructed in accordance with the present invention. The cutting device shown in FIG. 1 includes a device housing 2 having a substantially rectangular parallelepiped shape. In the apparatus housing 2, a chuck table 3 as a work holding means for holding a work is disposed so as to be movable in a direction (X-axis direction) indicated by an arrow X which is a cutting feed direction. The chuck table 3 includes a suction chuck support 31 and a suction chuck 32 disposed on the suction chuck support 31. A workpiece is illustrated on a holding surface which is the upper surface of the suction chuck 32. Suction holding is performed by operating a suction means that does not. The chuck table 3 is configured to be rotatable by a rotation mechanism (not shown). The chuck table 3 is provided with a clamp 33 for fixing an annular frame that supports a wafer, which will be described later, as a work piece via a dicing tape. The chuck table 3 configured as described above can be moved in a machining feed direction (X-axis direction) indicated by an arrow X by a cutting feed means (not shown).
図1に示す切削装置は、切削手段としてのスピンドルユニット4を具備している。スピンドルユニット4は、加工送り方向(X軸方向)と直交する矢印Yで示す割り出し送り方向(Y軸方向)に沿って配設されている。スピンドルユニット4は、図示しない割り出し送り手段によって割り出し送り方向(Y軸方向)に移動せしめられるとともに、図示しない切り込み送り手段によって図1において矢印Zで示す切り込み送り方向(Z軸方向)に移動せしめられるようになっている。このスピンドルユニット4は、図示しない移動基台に装着され割り出し方向(Y軸方向)および切り込み方向(Z軸方向)に移動調整されるスピンドルハウジング41と、該スピンドルハウジング41に回転自在に支持された回転スピンドル42と、該回転スピンドル42の前端部に装着された切削ブレード43とを具備している。回転スピンドル42は、図示しないサーボモータによって回転せしめられるように構成されている。上記切削ブレード43は、例えば図2に示すようにアルミニウムによって形成された円盤状の基台431と、該基台431の外周部側面にダイヤモンド砥粒をニッケルメッキで固めて厚さが例えば50μmに形成された環状の切刃432からなっている。 The cutting apparatus shown in FIG. 1 includes a spindle unit 4 as cutting means. The spindle unit 4 is disposed along an indexing feed direction (Y-axis direction) indicated by an arrow Y orthogonal to the machining feed direction (X-axis direction). The spindle unit 4 is moved in the index feed direction (Y-axis direction) by an index feed means (not shown), and is moved in the cut feed direction (Z-axis direction) indicated by an arrow Z in FIG. 1 by a not-shown cut feed means. It is like that. The spindle unit 4 is mounted on a moving base (not shown) and is adjusted to move in an indexing direction (Y-axis direction) and a cutting direction (Z-axis direction), and is rotatably supported by the spindle housing 41. A rotary spindle 42 and a cutting blade 43 attached to the front end of the rotary spindle 42 are provided. The rotary spindle 42 is configured to be rotated by a servo motor (not shown). The cutting blade 43 has a disk-shaped base 431 formed of aluminum, for example, as shown in FIG. 2, and diamond abrasive grains hardened by nickel plating on the outer peripheral side surface of the base 431 to a thickness of, for example, 50 μm. An annular cutting edge 432 is formed.
上記スピンドルハウジング41の前端部には、切削ブレード43の上半部を覆うブレードカバー44が取り付けられている。ブレードカバー44は、図示の実施形態においてはスピンドルハウジング41に装着された第1のカバー部材441と、該第1のカバー部材441に装着される第2のカバー部材442とからなっている。第1のカバー部材441は、一端部が切削ブレード43側に突出して形成された前カバー部441aを備えている。また、第1のカバー部材441の側面には雌ネジ穴441bと2個の位置決めピン441cが設けられており、第2のカバー部材442には上記雌ネジ穴441bと対応する位置に挿通穴442aが設けられている。また、第2のカバー部材442の第1のカバー部材441と対向する面には、上記2個の位置決めピン441cが嵌合する図示しない2個の凹部が形成されている。このように構成された第1のカバー部材441と第2のカバー部材442は、第2のカバー部材442に形成された図示しない2個の凹部を第1のカバー部材441に設けられた2個の位置決めピン441cに嵌合することによって位置決めする。そして、締結ボルト443を第2のカバー部材442の挿通穴442aに挿通し、第1のカバー部材441に設けられた雌ネジ穴441bと螺合することにより、第2のカバー部材442を第1のカバー部材441に装着する。 A blade cover 44 that covers the upper half of the cutting blade 43 is attached to the front end of the spindle housing 41. The blade cover 44 includes a first cover member 441 mounted on the spindle housing 41 and a second cover member 442 mounted on the first cover member 441 in the illustrated embodiment. The first cover member 441 includes a front cover portion 441a formed with one end portion protruding toward the cutting blade 43 side. Further, a female screw hole 441b and two positioning pins 441c are provided on the side surface of the first cover member 441. The second cover member 442 has an insertion hole 442a at a position corresponding to the female screw hole 441b. Is provided. Further, on the surface of the second cover member 442 facing the first cover member 441, two recesses (not shown) into which the two positioning pins 441c are fitted are formed. The first cover member 441 and the second cover member 442 configured in this way are provided with two recesses (not shown) formed in the second cover member 442 provided in the first cover member 441. Positioning is performed by fitting to the positioning pin 441c. Then, the fastening bolt 443 is inserted into the insertion hole 442a of the second cover member 442, and is screwed into the female screw hole 441b provided in the first cover member 441, whereby the second cover member 442 is engaged with the first cover member 442. The cover member 441 is attached.
図2を参照して説明を続けると、図示の実施形態における切削装置は、上記切削ブレード43の環状の切刃432による切削加工部に切削水を供給する切削水供給機構5を具備している。この切削水供給機構5は、上記ブレードカバー44を構成する第1のカバー部材441および第2のカバー部材442に配設された第1の切削水供給管511および第2の切削水供給管512と、該第1の切削水供給管511および第2の切削水供給管512に切削水を送給する切削水送給手段52と、上記第1の切削水供給管511および第2の切削水供給管512にそれぞれ接続された第1の切削水供給ノズル513および第2の切削水供給ノズル514を具備している。 Continuing the description with reference to FIG. 2, the cutting apparatus in the illustrated embodiment includes a cutting water supply mechanism 5 that supplies cutting water to a cutting portion by the annular cutting edge 432 of the cutting blade 43. . The cutting water supply mechanism 5 includes a first cutting water supply pipe 511 and a second cutting water supply pipe 512 disposed on the first cover member 441 and the second cover member 442 constituting the blade cover 44. A cutting water supply means 52 for supplying cutting water to the first cutting water supply pipe 511 and the second cutting water supply pipe 512, and the first cutting water supply pipe 511 and the second cutting water. A first cutting water supply nozzle 513 and a second cutting water supply nozzle 514 connected to the supply pipe 512 are provided.
第1の切削水供給管511および第2の切削水供給管512は、それぞれ上記ブレードカバー44を構成する第1のカバー部材441および第2のカバー部材442に配設されており、その上端が切削水送給手段52に接続され、その下端にはそれぞれ第1の切削水供給ノズル513および第2の切削水供給ノズル514が接続される。 The first cutting water supply pipe 511 and the second cutting water supply pipe 512 are respectively disposed on the first cover member 441 and the second cover member 442 constituting the blade cover 44, and the upper ends thereof are arranged. The first cutting water supply nozzle 513 and the second cutting water supply nozzle 514 are connected to the lower ends of the cutting water supply means 52, respectively.
上記切削水送給手段52は、切削水を貯留する切削水貯留タンク521と、該切削水貯留タンク521と上記第1の切削水供給管511および第2の切削水供給管512とを接続する配管に配設された切削水送給ポンプ522とからなっている。また、図示の切削水供給機構5は、上記第1の切削水供給管511および第2の切削水供給管512に純水を供給する純水供給手段53を備えている。この純水供給手段53は、純水を貯留する純水貯留タンク531と、該純水貯留タンク531と上記第1の切削水供給管511および第2の切削水供給管512とを接続する配管に配設された純水送給ポンプ532とからなっている。 The cutting water supply means 52 connects the cutting water storage tank 521 for storing cutting water, and the cutting water storage tank 521 to the first cutting water supply pipe 511 and the second cutting water supply pipe 512. It consists of a cutting water feed pump 522 disposed in the pipe. The illustrated cutting water supply mechanism 5 includes pure water supply means 53 that supplies pure water to the first cutting water supply pipe 511 and the second cutting water supply pipe 512. The pure water supply means 53 includes a pure water storage tank 531 that stores pure water, and a pipe that connects the pure water storage tank 531 to the first cutting water supply pipe 511 and the second cutting water supply pipe 512. And a pure water feed pump 532 disposed in
図2を参照して説明を続けると、図示の実施形態における切削装置は、上記第1の切削水供給ノズル513および第2の切削水供給ノズル514から噴出され上記切削ブレード43の切刃432による切削領域に供給された切削水を受ける切削水受け止め手段54と、該切削水受け止め手段54に受け入れられた切削水を送り出す第1の循環ポンプ55と、該第1の循環ポンプ55によって送られた切削水に混入されている屑を除去する屑除去手段56と、屑除去手段56によって屑が除去された切削水を上記切削水供給機構5に送る第2の循環ポンプ57を具備している。切削水受け止め手段54は切削水受け容器からなり、排水口541を備えている。この切削水受け止め手段54に受け入れられた切削水は、第1の循環ポンプ55によって屑除去手段56に送られる。 Continuing the description with reference to FIG. 2, the cutting device in the illustrated embodiment is ejected from the first cutting water supply nozzle 513 and the second cutting water supply nozzle 514 by the cutting edge 432 of the cutting blade 43. The cutting water receiving means 54 for receiving the cutting water supplied to the cutting area, the first circulation pump 55 for sending the cutting water received by the cutting water receiving means 54, and the first circulation pump 55. A scrap removing unit 56 that removes scraps mixed in the cutting water, and a second circulation pump 57 that sends the cutting water from which scraps have been removed by the scrap removing unit 56 to the cutting water supply mechanism 5 are provided. The cutting water receiving means 54 includes a cutting water receiving container and includes a drain port 541. The cutting water received by the cutting water receiving means 54 is sent to the debris removing means 56 by the first circulation pump 55.
屑除去手段56は、図示の実施形態においては切削水を渦状に回転させ遠心力によって屑と水とを分離する遠心分離機で構成されている。即ち、屑除去手段56は、円錐形状のハウジング561と、該ハウジング561内に配設された三角形状の回転羽562と、該回転羽562を回転せしめる電動モーター563を備えている。ハウジング561の下部には上記第1の循環ポンプ55によって送られた切削水を導入する導入口561aが設けられ、ハウジング561の上端には送出口561bが設けられている。また、ハウジング561の下端部には屑収容室561cが設けられている。この屑収容室561cには排水管564が接続されており、該排水管564に電磁開閉弁565が配設されている。このように構成された屑除去手段56は、電動モーター563を作動して回転羽562を回転することにより導入口561aからハウジング561内に導入された切削水に渦状の回転を与える。この結果、切削水には遠心力が与えられるので、切削水に混入されている重量が重い屑がハウジング561の内周面側に移動して、ハウジング561の下端部に設けられた屑収容室561cに落下せしめられる。このようにして屑が分離された切削水は、ハウジング561の上端に形成された送出口561bから切削水循環経路570に配設された第2の循環ポンプ57によって上記切削水供給機構5に循環せしめられる。一方、屑収容室561cに収容された屑は、定期的に電磁開閉弁565を開路することにより切削水とともに排出される。 In the illustrated embodiment, the scrap removing means 56 is constituted by a centrifuge that rotates cutting water in a vortex and separates scraps and water by centrifugal force. That is, the dust removing means 56 includes a conical housing 561, a triangular rotating blade 562 disposed in the housing 561, and an electric motor 563 that rotates the rotating blade 562. An introduction port 561a for introducing the cutting water sent by the first circulation pump 55 is provided at the lower part of the housing 561, and a delivery port 561b is provided at the upper end of the housing 561. In addition, a waste storage chamber 561c is provided at the lower end of the housing 561. A drain pipe 564 is connected to the waste storage chamber 561c, and an electromagnetic on-off valve 565 is disposed in the drain pipe 564. The debris removing means 56 configured as described above causes the cutting water introduced into the housing 561 from the introduction port 561a to rotate spirally by operating the electric motor 563 and rotating the rotary blade 562. As a result, since centrifugal force is applied to the cutting water, the heavy waste mixed in the cutting water moves to the inner peripheral surface side of the housing 561, and the waste storage chamber provided at the lower end of the housing 561. It is dropped to 561c. The cutting water from which the debris has been separated in this manner is circulated to the cutting water supply mechanism 5 from the delivery port 561b formed at the upper end of the housing 561 by the second circulation pump 57 disposed in the cutting water circulation path 570. It is done. On the other hand, the waste stored in the waste storage chamber 561c is discharged together with the cutting water by periodically opening the electromagnetic on-off valve 565.
図2を参照して説明を続けると、図示の実施形態における切削装置は、上記切削水循環経路570に循環された切削水を純水に生成する純水生成手段58と、切削水循環経路570に循環された切削水を上記切削水供給機構5の切削水貯留タンク521と純水生成手段58に向けて切り替える切り替え手段59を具備している。純水生成手段58は、濾過フィルター581と紫外線照射器582およびイオン交換樹脂583とからなっており、切削水循環経路570に循環された切削水を純水に生成して切削水貯留タンク521に送る。上記切り替え手段59は、図示の実施形態においては通常は切削水循環経路570に循環された切削水を切削水供給機構5の切削水貯留タンク521に向けて流し、必要に応じて純水生成手段58に向けて流すように構成されている。 Continuing the description with reference to FIG. 2, the cutting apparatus in the illustrated embodiment circulates in the cutting water circulation path 570 and pure water generating means 58 for generating the cutting water circulated in the cutting water circulation path 570 into pure water. Switching means 59 is provided for switching the cut water to the cutting water storage tank 521 and the pure water generating means 58 of the cutting water supply mechanism 5. The pure water generation means 58 includes a filtration filter 581, an ultraviolet irradiator 582, and an ion exchange resin 583. The pure water generation means 58 generates cutting water circulated through the cutting water circulation path 570 into pure water and sends it to the cutting water storage tank 521. . In the illustrated embodiment, the switching means 59 normally causes the cutting water circulated through the cutting water circulation path 570 to flow toward the cutting water storage tank 521 of the cutting water supply mechanism 5 and, if necessary, pure water generation means 58. It is comprised so that it may flow toward.
図1に戻って説明を続けると、図示の実施形態における切削装置は、上記チャックテーブル3上に保持された被加工物の表面を撮像し、上記切削ブレード43によって切削すべき領域を検出するための撮像手段7を具備している。この撮像手段7は、顕微鏡やCCDカメラ等の光学手段からなっている。また、切削装置は、撮像手段7によって撮像された画像を表示する表示手段8を具備している。 Referring back to FIG. 1, the description of the cutting apparatus in the illustrated embodiment is for imaging the surface of the workpiece held on the chuck table 3 and detecting a region to be cut by the cutting blade 43. The imaging means 7 is provided. The imaging means 7 is composed of optical means such as a microscope and a CCD camera. In addition, the cutting apparatus includes a display unit 8 that displays an image captured by the imaging unit 7.
上記装置ハウジング2におけるカセット載置領域9aには、被加工物を収容するカセットを載置するカセット載置テーブル9が配設されている。このカセット載置テーブル9は、図示しない昇降手段によって上下方向に移動可能に構成されている。カセット載置テーブル9上には、被加工物としての半導体ウエーハWを収容するカセット11が載置される。カセット11に収容される半導体ウエーハWは、表面に格子状の分割予定ラインが形成されており、この格子状の分割予定ラインによって区画された複数の矩形領域にIC、LSI等のデバイスが形成されている。このように形成された半導体ウエーハWは、環状のフレームFに装着されたダイシングテープTの表面に塗布された粘着層に裏面が貼着された状態でカセット11に収容される。 In the cassette mounting area 9a of the apparatus housing 2, a cassette mounting table 9 for mounting a cassette for storing a workpiece is disposed. This cassette mounting table 9 is configured to be movable in the vertical direction by a lifting means (not shown). On the cassette mounting table 9, a cassette 11 for storing a semiconductor wafer W as a workpiece is placed. The semiconductor wafer W accommodated in the cassette 11 has a grid-like division planned line formed on the surface, and devices such as IC and LSI are formed in a plurality of rectangular areas partitioned by the grid-like division planned line. ing. The semiconductor wafer W thus formed is accommodated in the cassette 11 with the back surface adhered to the adhesive layer applied to the surface of the dicing tape T mounted on the annular frame F.
また、図示の実施形態における切削装置は、カセット載置テーブル9上に載置されたカセット11に収容されている半導体ウエーハWを仮置きテーブル12に搬出する搬出するするとともに切削加工され仮置きテーブル12に搬送された半導体ウエーハWをカセット11に搬入する搬出・搬入手段13と、仮置きテーブル12に搬出された半導体ウエーハWを上記チャックテーブル3上に搬送するするとともに切削加工された半導体ウエーハWを仮置きテーブル12に搬送する第1の搬送手段14と、チャックテーブル3上で切削加工された半導体ウエーハWを洗浄する洗浄手段15と、チャックテーブル3上で切削加工された半導体ウエーハWを洗浄手段15へ搬送する第2の搬送手段16を具備している。 Further, the cutting apparatus in the illustrated embodiment carries out the semiconductor wafer W accommodated in the cassette 11 placed on the cassette placement table 9 to the temporary placement table 12 and carries out the cutting and the temporary placement table. The semiconductor wafer W transported to the unloading / loading means 13 for transporting the semiconductor wafer W to the cassette 11 and the semiconductor wafer W transported to the temporary table 12 to the chuck table 3 and cut and processed. The first transfer means 14 for transferring the semiconductor wafer W to the temporary placement table 12, the cleaning means 15 for cleaning the semiconductor wafer W cut on the chuck table 3, and the semiconductor wafer W cut on the chuck table 3. Second transport means 16 for transporting to the means 15 is provided.
図示の実施形態における切削装置は以上のように構成されており、以下その作用について主に図1を参照して説明する。
カセット載置テーブル9上に載置されたカセット11の所定位置に収容されている半導体ウエーハW(環状のフレームFにダイシングテープTを介して支持されている状態)は、図示しない昇降手段によってカセット載置テーブル9が上下動することにより搬出位置に位置付けられる。次に、搬出・搬入手段13が進退作動して搬出位置に位置付けられた半導体ウエーハWを仮置きテーブル12上に搬出する。仮置きテーブル12に搬出された半導体ウエーハWは、第1の搬送手段14の旋回動作によって上記チャックテーブル3上に搬送される。
The cutting apparatus in the illustrated embodiment is configured as described above, and the operation thereof will be described mainly with reference to FIG.
The semiconductor wafer W (supported by the annular frame F via the dicing tape T) accommodated in a predetermined position of the cassette 11 placed on the cassette placing table 9 is moved by the lifting means (not shown). The mounting table 9 is positioned at the carry-out position by moving up and down. Next, the carry-out / carry-in means 13 moves forward and backward to carry the semiconductor wafer W positioned at the carry-out position onto the temporary placement table 12. The semiconductor wafer W carried out to the temporary placement table 12 is transferred onto the chuck table 3 by the turning operation of the first transfer means 14.
チャックテーブル3上に半導体ウエーハWが載置されたならば、図示しない吸引手段が作動して半導体ウエーハWをチャックテーブル3上に吸引保持する。また、半導体ウエーハWをダイシングテープTを介して支持する環状のフレームFは、上記クランプ33によって固定される。このようにして半導体ウエーハWを吸引保持したチャックテーブル3は、撮像手段7の直下まで移動せしめられる。チャックテーブル3が撮像手段7の直下に位置付けられると、撮像手段7によって半導体ウエーハWに形成されている分割予定ラインを検出するとともに、スピンドルユニット4を割り出し方向である矢印Y方向に移動調整して分割予定ラインと切削ブレード43との精密位置合わせ作業を実施する(アライメント工程)。 When the semiconductor wafer W is placed on the chuck table 3, suction means (not shown) is operated to suck and hold the semiconductor wafer W on the chuck table 3. An annular frame F that supports the semiconductor wafer W via the dicing tape T is fixed by the clamp 33. The chuck table 3 that sucks and holds the semiconductor wafer W in this way is moved to a position immediately below the image pickup means 7. When the chuck table 3 is positioned immediately below the image pickup means 7, the image pickup means 7 detects the planned division line formed on the semiconductor wafer W, and moves and adjusts the spindle unit 4 in the arrow Y direction as the indexing direction. A precise alignment operation between the division line and the cutting blade 43 is performed (alignment process).
その後、切削ブレード43を矢印Zで示す方向に所定量切り込み送りし所定の方向に回転させつつ、半導体ウエーハWを保持したチャックテーブル3を切削送り方向である矢印Xで示す方向(切削ブレード43の回転軸と直交する方向)に所定の切削送り速度で移動することにより、チャックテーブル3に保持された半導体ウエーハWは切削ブレード43により所定の分割予定ラインに沿って切断される(切削工程)。この切削工程においては、上記切削水供給機構5が作動して切削ブレード43の環状の切刃432による切削加工部に切削水を供給する。なお、切削ブレード43の環状の切刃432による切削加工部への切削水の供給については、後で詳細に説明する。このようにして、半導体ウエーハWを所定の分割予定ラインに沿って切断したら、チャックテーブル3を矢印Yで示す方向に分割予定ラインの間隔だけ割り出し送りし、上記切削工程を実施する。そして、半導体ウエーハWの所定方向に延在する全ての分割予定ラインに沿って切削工程を実施したならば、チャックテーブル3を90度回転させて、半導体ウエーハWの所定方向と直交する方向に延在する分割予定ラインに沿って切削工程を実行することにより、半導体ウエーハWに格子状に形成された全ての分割予定ラインが切削されて個々のデバイスに分割される。なお、分割された個々のデバイスは、ダイシングテープTの作用によってバラバラにはならず、環状のフレームFに支持されたウエーハの状態が維持されている。 Thereafter, while the cutting blade 43 is cut and fed by a predetermined amount in the direction indicated by the arrow Z and rotated in the predetermined direction, the chuck table 3 holding the semiconductor wafer W is moved in the direction indicated by the arrow X that is the cutting feed direction (of the cutting blade 43 The semiconductor wafer W held on the chuck table 3 is cut along a predetermined division line by a cutting blade 43 by moving in a direction orthogonal to the rotation axis at a predetermined cutting feed rate (cutting process). In this cutting process, the cutting water supply mechanism 5 operates to supply cutting water to a cutting portion by the annular cutting edge 432 of the cutting blade 43. The supply of cutting water to the cutting portion by the annular cutting edge 432 of the cutting blade 43 will be described in detail later. When the semiconductor wafer W is cut along a predetermined division line in this way, the chuck table 3 is indexed and fed in the direction indicated by the arrow Y by the interval of the division line, and the above-described cutting process is performed. When the cutting process is performed along all the division lines extending in the predetermined direction of the semiconductor wafer W, the chuck table 3 is rotated by 90 degrees to extend in the direction orthogonal to the predetermined direction of the semiconductor wafer W. By executing the cutting process along the existing division lines, all the division lines formed in a lattice pattern on the semiconductor wafer W are cut and divided into individual devices. The divided individual devices are not separated by the action of the dicing tape T, and the state of the wafer supported by the annular frame F is maintained.
次に、上記切削工程における切削ブレード43の環状の切刃432による切削加工部への切削水の供給について、図2を参照して説明する。
上記切削工程を最初に実施する際には、切削水供給機構5の切削水貯留タンク521には切削水が貯留されていないので、純水供給手段53の純水送給ポンプ532を作動して純水貯留タンク531に貯留されている純水を切削水として切削ブレード43の環状の切刃432による切削加工部に供給する。このようにして切削ブレード43の環状の切刃432による切削加工部に供給された切削水は、切削水受け止め手段54によって受け止められる。切削水受け止め手段54によって受け止められた切削水は、第1の循環ポンプ55の作動により屑除去手段56に導入される。屑除去手段56に導入された切削水は、電動モーター563を作動して回転羽562を回転することにより上述したように混入されている屑が遠心分離され屑収容室561cに収容される。このようにして屑が分離され除去された切削水は、第2の循環ポンプ57の作動により切り替え手段59を介して切削水貯留タンク521に送られる。そして、切削水貯留タンク521に送られた切削水の貯水量が循環可能な量に達したら、純水供給手段53の純水送給ポンプ532の作動を停止する。このようにして、切削水貯留タンク521の貯水量が循環可能な量に達し純水供給手段53の純水送給ポンプ532の作動を停止したならば、切削水送給手段52の切削水送給ポンプ522を作動して切削水貯留タンク521に貯留された切削水を切削水として切削ブレード43の環状の切刃432による切削加工部に供給する。なお、必要に応じて例えば循環する切削水の汚れが増した場合、切り替え手段59を切り替えて第2の循環ポンプ57によって送られる切削水を純水生成手段58に送る。純水生成手段58に送られた切削水は、濾過フィルター581と紫外線照射器582およびイオン交換樹脂583を通ることにより純水に生成されて切削水貯留タンク521に送られる。また、定期的に屑除去手段56の電磁開閉弁565を開路することにより、屑収容室561cに収容された屑を切削水とともに排出する。
そして、蒸発等によって循環する切削水が減少した場合は、純水供給手段53の純水送給ポンプ532を作動して純水貯留タンク531に貯留されている純水を切削水循環経路570に導入する。
Next, the supply of the cutting water to the cutting part by the annular cutting edge 432 of the cutting blade 43 in the cutting step will be described with reference to FIG.
When the cutting process is first performed, since the cutting water is not stored in the cutting water storage tank 521 of the cutting water supply mechanism 5, the pure water feed pump 532 of the pure water supply means 53 is operated. The pure water stored in the pure water storage tank 531 is supplied as a cutting water to the cutting portion by the annular cutting blade 432 of the cutting blade 43. Thus, the cutting water supplied to the cutting portion by the annular cutting edge 432 of the cutting blade 43 is received by the cutting water receiving means 54. The cutting water received by the cutting water receiving means 54 is introduced into the debris removing means 56 by the operation of the first circulation pump 55. The cutting water introduced into the waste removing means 56 is operated to rotate the rotating blade 562 by operating the electric motor 563, so that the waste mixed therein is centrifuged and stored in the waste storage chamber 561c. The cutting water from which the debris has been separated and removed in this manner is sent to the cutting water storage tank 521 through the switching means 59 by the operation of the second circulation pump 57. When the amount of stored cutting water sent to the cutting water storage tank 521 reaches a circulatable amount, the operation of the pure water feed pump 532 of the pure water supply means 53 is stopped. In this way, when the amount of water stored in the cutting water storage tank 521 reaches a circulatable amount and the operation of the pure water supply pump 532 of the pure water supply means 53 is stopped, the cutting water supply of the cutting water supply means 52 is performed. The feed pump 522 is operated to supply the cutting water stored in the cutting water storage tank 521 to the cutting portion by the annular cutting edge 432 of the cutting blade 43 as cutting water. For example, when the dirt of the circulating cutting water increases as necessary, the switching means 59 is switched and the cutting water sent by the second circulation pump 57 is sent to the pure water generating means 58. The cutting water sent to the pure water generating means 58 is generated into pure water by passing through the filtration filter 581, the ultraviolet irradiator 582 and the ion exchange resin 583, and sent to the cutting water storage tank 521. Further, by periodically opening the electromagnetic on-off valve 565 of the waste removal means 56, the waste stored in the waste storage chamber 561c is discharged together with the cutting water.
When the cutting water circulating due to evaporation or the like decreases, the pure water feed pump 532 of the pure water supply means 53 is operated to introduce the pure water stored in the pure water storage tank 531 into the cutting water circulation path 570. To do.
以上のように図示の実施形態における切削水供給機構5は、切削ブレード43の環状の切刃432による切削加工部に供給された切削水を切削水受け止め手段54によって受け止め、切削水受け止め手段54によって受け止められた切削水を屑除去手段56に導入する。そして、屑除去手段56において導入された切削水に混入されている屑を分離し、屑が除去され半導体ウエーハ等の被加工物に対して害のない水を切削水として循環するので、純水の供給を抑制でき、切削水のコストを下げて生産性の向上を図ることができる。なお、屑除去手段56は切削水を渦状に回転させ遠心力によって屑と水とを分離するので、切削水に混入されている比較的大きい屑を除去することができるものの微細な屑が切削水に残存することになるが、半導体ウエーハ等の被加工物を構成する素材が混入しているので弊害を与えることはない。また、実施形態における切削水供給機構5は、屑除去手段56によって屑を除去した切削水の一部を純水生成手段58に送り純水を生成して切削水に混入するようにしているので、純水生成手段58を構成する濾過フィルター581やイオン交換樹脂583の寿命を延ばすことができる。 As described above, the cutting water supply mechanism 5 in the illustrated embodiment receives the cutting water supplied to the cutting portion by the annular cutting edge 432 of the cutting blade 43 by the cutting water receiving means 54 and uses the cutting water receiving means 54. The received cutting water is introduced into the debris removal means 56. And the waste mixed in the cutting water introduced in the waste removal means 56 is separated, and the waste is removed and water that is not harmful to the workpiece such as a semiconductor wafer is circulated as the cutting water. Therefore, it is possible to reduce the cost of cutting water and improve productivity. The scrap removing means 56 rotates the cutting water in a vortex and separates the scrap and water by centrifugal force. Therefore, although the relatively large scrap mixed in the cutting water can be removed, the fine scrap is the cutting water. However, since a material constituting the workpiece such as a semiconductor wafer is mixed, no harmful effect is caused. Further, the cutting water supply mechanism 5 in the embodiment sends a part of the cutting water from which the debris has been removed by the debris removing means 56 to the pure water generating means 58 to generate pure water and mix it with the cutting water. In addition, the service life of the filtration filter 581 and the ion exchange resin 583 constituting the pure water generating means 58 can be extended.
2:装置ハウジング
3:チャックテーブル+
4:スピンドルユニット
43:切削ブレード
44:ブレードカバー
5:切削水供給機構
52:切削水送給手段
521:切削水貯留タンク
522:切削水送給ポンプ
53:純水供給手段
531:純水貯留タンク
532:純水送給ポンプ
54:切削水受け止め手段
55:第1の循環ポンプ
56:屑除去手段
57:第2の循環ポンプ
58:純水生成手段
59:切り替え手段
7:撮像手段
11:カセット
12:仮置きテーブル
13:搬出・搬入手段
14:第1の搬送手段
15:洗浄手段
16:第2の搬送手段
W:半導体ウエーハ
F:環状のフレーム
T:ダイシングテープ
2: Device housing 3: Chuck table +
4: Spindle unit 43: Cutting blade 44: Blade cover 5: Cutting water supply mechanism 52: Cutting water supply means 521: Cutting water storage tank 522: Cutting water supply pump 53: Pure water supply means 531: Pure water storage tank 532: Pure water feed pump 54: Cutting water receiving means 55: First circulation pump 56: Waste removal means 57: Second circulation pump 58: Pure water generating means 59: Switching means 7: Imaging means 11: Cassette 12 : Temporary placement table 13: Unloading / carrying means 14: First conveying means 15: Cleaning means 16: Second conveying means
W: Semiconductor wafer
F: Ring frame
T: Dicing tape
Claims (1)
該切削手段の該切削ブレードによる切削加工部に供給された切削水を受け止める切削水受け止め手段と、該切削水受け止め手段によって受け止められた切削水に混入されている屑を、切削水を渦状に回転させ遠心力によって屑と水とを分離する遠心分離機により除去する屑除去手段と、該遠心分離機により除去される屑よりも微細な屑を含む切削水を濾過し純水に生成する純水生成手段と、該屑除去手段によって比較的大きな屑を除去した後、該屑除去手段によって除去された屑よりも微細な切削屑が残存する切削水の流れを、該純水生成手段を経由せずに切削水貯留タンクに向けて流す経路又は該純水生成手段を介して切削水貯留タンクに向けて流す経路に切り換える切り替え手段と、該屑除去手段によって屑が除去された切削水を該切削水供給機構に送るポンプと、を備えていることを特徴とする切削装置。 A workpiece holding means for holding a workpiece, a cutting means having a cutting blade configured to be rotatable for cutting a workpiece held by the workpiece holding means, and a cutting blade of the cutting means A cutting water supply mechanism for supplying cutting water to the cutting part by the cutting device,
The cutting water receiving means for receiving the cutting water supplied to the cutting portion of the cutting means by the cutting blade, and the scrap mixed in the cutting water received by the cutting water receiving means to rotate the cutting water in a spiral shape Debris removing means for removing by a centrifuge that separates debris and water by centrifugal force, and pure water that is produced by filtering the cutting water containing finer debris than the debris removed by the centrifuge After removing relatively large debris by the generation means and the debris removal means, the flow of cutting water in which finer cutting debris than the debris removed by the debris removal means passes through the pure water generation means. the cutting to a switching means for switching a path to flow toward the cutting water storage tank via the path or the pure water producing unit flows toward the cutting water storage tank, cutting water debris was removed by該屑removing means not Cutting apparatus characterized by comprising a pump for sending to the feed mechanism.
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