WO2013058004A1 - Waste working fluid recirculation apparatus - Google Patents

Waste working fluid recirculation apparatus Download PDF

Info

Publication number
WO2013058004A1
WO2013058004A1 PCT/JP2012/069805 JP2012069805W WO2013058004A1 WO 2013058004 A1 WO2013058004 A1 WO 2013058004A1 JP 2012069805 W JP2012069805 W JP 2012069805W WO 2013058004 A1 WO2013058004 A1 WO 2013058004A1
Authority
WO
WIPO (PCT)
Prior art keywords
processing
supply
fluid
working fluid
machining
Prior art date
Application number
PCT/JP2012/069805
Other languages
French (fr)
Japanese (ja)
Inventor
努 吉田
Original Assignee
株式会社村田製作所
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 株式会社村田製作所 filed Critical 株式会社村田製作所
Publication of WO2013058004A1 publication Critical patent/WO2013058004A1/en

Links

Images

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B57/00—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents
    • B24B57/04—Devices for feeding, applying, grading or recovering grinding, polishing or lapping agents for feeding of solid grinding, polishing or lapping agents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/007—Use, recovery or regeneration of abrasive mediums
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working

Definitions

  • the present invention relates to a processing waste liquid circulating device that is regenerated as the processing waste liquid circulates in the apparatus and reused as the processing liquid.
  • devices such as ICs and LSIs are formed in a plurality of regions on the surface of a substantially disk-shaped semiconductor wafer divided in a grid pattern by division lines.
  • Each semiconductor device is manufactured by cutting the semiconductor wafer with a dicer or the like along the planned dividing line.
  • a cutting fluid pump that supplies cutting fluid (machining fluid), a pump motor that drives the cutting fluid pump, and a pump motor control unit that controls the operation of the pump motor are provided.
  • a cutting fluid amount control device that controls the amount of cutting fluid supplied according to a cutting object. In the case of a material that requires a small amount of cutting, the rotational speed of the pump motor is controlled to be low, and a small amount of cutting fluid is supplied.
  • Patent Document 2 a machining fluid circulation path is separately provided, and even when the flow rate of the machining fluid is smaller than the minimum allowable flow rate value of the pump, the pump can ensure a flow rate corresponding to the minimum allowable flow rate value.
  • a working fluid supply apparatus is disclosed.
  • Patent Document 1 the amount of cutting fluid supplied is controlled in accordance with the object to be cut.
  • the pump motor since the pump motor is started from the stopped state at the start of cutting, a considerable time is required until the pump motor reaches the target rotational speed. For this reason, there is a problem in that the supply amount may not be able to catch up when the object to be cut changes frequently.
  • Patent Document 2 since the pump is started from a stopped state at the start of cutting, there is a problem that it takes a considerable time for the amount of machining fluid to reach the target flow rate and stabilize. .
  • the present invention has been made in view of the above circumstances, and provides a processing waste liquid circulating apparatus that can circulate a processing liquid without supplying it to the processing apparatus and can achieve homogenization of the quality and temperature of the processing liquid.
  • the purpose is to provide.
  • a processing waste liquid circulation apparatus is a processing waste liquid circulation apparatus that supplies a processing liquid to a processing apparatus, regenerates the used processing liquid, and supplies the processed liquid again to the processing apparatus.
  • a return pipe for returning the machining liquid to the tank from the middle, and the supply amount of the machining liquid of the supply pump can be changed by inverter control.
  • the return pipe is And a control means for guiding the processing liquid to the tank.
  • the amount of machining fluid supplied from the supply pump can be changed by inverter control. When the amount of machining fluid supplied is less than the specified amount, the machining fluid is guided to the tank via the return pipe. It is possible to circulate without supplying, and it is not necessary to stop the supply pump even when the processing apparatus is stopped.
  • the working fluid is returned to the tank by the return pipe, there is no temperature difference between the circulating working fluid and the working fluid stored in the tank, and the inside of the tank can be stirred. It is also possible to homogenize the quality and temperature of the working fluid.
  • the processing waste liquid circulation device is provided with an electromagnetic on-off valve that opens and closes a path to the return pipe, and the control means is configured to switch the electromagnetic on-off valve when the amount of processing liquid supplied is less than a predetermined amount. Is preferably opened.
  • an electromagnetic on-off valve that opens and closes the path to the return pipe is provided, and the electromagnetic on-off valve opens when the amount of machining fluid supplied is less than a predetermined amount.
  • the supply pump is not stopped, the machining liquid can be stably supplied with the start of the operation of the machining apparatus.
  • control unit receives a processing liquid supply request from the processing apparatus, and varies the processing liquid supply amount according to the received supply request.
  • the machining fluid supply amount can be adjusted according to the number of processing devices operating. it can.
  • the processing waste liquid circulation apparatus is provided with a pressure gauge and a flow meter in front of the return pipe, and the control means is configured to control the processing liquid based on the measured values of the pressure gauge and the flow meter. It is preferable to vary the supply amount.
  • a pressure gauge and a flow meter are provided in front of the return pipe, and the supply amount of the machining fluid is varied based on the measured values of the pressure gauge and the flow meter. Therefore, it is possible to appropriately adjust the supply amount of the machining fluid according to the number of operating units.
  • the supply amount of the machining fluid of the supply pump can be changed by the inverter control, and when the supply amount of the machining fluid is less than a predetermined amount, the machining fluid is guided to the tank via the return pipe.
  • the machining liquid can be circulated without being supplied to the machining apparatus, and even if the machining apparatus is stopped, there is no need to stop the supply pump.
  • the working fluid is returned to the tank by the return pipe, there is no temperature difference between the circulating working fluid and the working fluid stored in the tank, and the inside of the tank can be stirred. It is also possible to homogenize the quality and temperature of the working fluid.
  • FIG. 7 is a schematic diagram showing the configuration of a conventional processing waste liquid circulation device.
  • the conventional processing waste liquid circulation device includes a supply path 11 and a supply pump 12 for supplying a processing liquid to a plurality of dicing devices (processing devices) 1.
  • the working fluid is not particularly limited as long as the amount of heat generated during dicing, friction, and the like can be reduced.
  • a solution obtained by adding an aliphatic polyhydric alcohol as a solvent to pure water may be used.
  • the semiconductor wafer is cut by a dicer or the like.
  • the used machining fluid containing cutting waste and the like is stored in the raw water tank 14 through the discharge path 13.
  • the used processing liquid stored in the raw water tank 14 may be discarded as it is, and the processing liquid may be newly supplied from the supply tank 15 to the dicing apparatus (processing apparatus) 1 or may be circulated and reused. .
  • the used machining fluid stored in the raw water tank 14 is pumped up by the raw water pump 16 and sent to the filter device 17.
  • a filter such as a hollow fiber membrane as the filter device 17
  • impurities such as cutting waste contained in the used machining fluid can be eliminated.
  • the used processing liquid from which impurities are removed by the filter device 17 is stored in the buffer tank 19.
  • the buffer tank 19 is internally provided with a conductivity meter (not shown) for measuring the conductivity of the used machining fluid, and an ion exchange device 18 is connected to adjust the conductivity to a predetermined range.
  • the ion exchange device 18 is connected to the buffer tank 19 via an electromagnetic open / close valve 52, and the control device 30 opens and closes the electromagnetic open / close valve 52 according to the conductivity measured by the conductivity meter.
  • the pump 51 for supplying the machining fluid to the ion exchange device 18 is driven / stopped.
  • the used working fluid adjusted so that the electric conductivity is within a predetermined range is guided to the mixing tank 21.
  • a pH meter (not shown) that measures the pH value of the stored machining liquid is provided, and the pH value of the stored machining liquid is measured as needed.
  • the control device 30 acquires a measurement value obtained by the pH meter as a detection signal, and determines whether or not the pH value of the used processing liquid is within a predetermined range. When the control device 30 determines that the pH value of the used machining liquid is outside the predetermined range, the machining that is stored in the mixing tank 21 by opening the electromagnetic on-off valve 24 to adjust the pH value.
  • the neutralizing agent is supplied from the neutralizing agent tank 23 to the liquid.
  • the neutralizing agent is preferably an aqueous solution containing inorganic phosphoric acid.
  • the neutralizing agent By supplying the neutralizing agent, the pH value of the processing liquid stored in the mixing tank 21 is adjusted, and the pH value can be brought close to the neutral value “7”. Specifically, by supplying the neutralizing agent, the ratio of the neutralizing agent in the solvent of the processing liquid increases, so the degree of the influence of the acidic component or alkaline component eluted in the processing liquid on the entire solvent is reduced. The pH value approaches the neutral value.
  • the used processing liquid whose conductivity and pH value are adjusted is temporarily stored in the mixing tank 21 and supplied to the supply tank 15 according to the remaining amount of the processing liquid in the supply tank 15.
  • the machining liquid stored in the supply tank 15 is supplied again to the dicing apparatus 1 by the supply pump 12.
  • each dicing device 1 is provided with a valve 111.
  • the valve 111 is closed from the dicing device 1 side to supply the processing liquid. Therefore, there was no means other than stopping the supply pump 12. Therefore, the number of stopped dicing apparatuses 1 cannot be grasped by the control apparatus 30, and the supply amount of the machining fluid cannot be adjusted appropriately according to the number of operating dicing apparatuses 1. Therefore, in the present invention, even if any of the dicing apparatuses 1 is stopped, the number of operating dicing apparatuses 1 is estimated without stopping the supply pump 12, and the amount required according to the estimated operating number. Supply the machining fluid.
  • FIG. 1 is a schematic diagram showing a configuration of a processing waste liquid circulation apparatus according to Embodiment 1 of the present invention.
  • the processing waste liquid circulation apparatus according to the first embodiment includes a supply path 11 and a supply pump 12 for supplying a processing liquid to a plurality of dicing apparatuses (processing apparatuses) 1.
  • the working fluid is not particularly limited as long as the amount of heat generated during dicing, friction, and the like can be reduced.
  • a solution obtained by adding an aliphatic polyhydric alcohol as a solvent to pure water may be used.
  • the semiconductor wafer is cut by a dicer or the like.
  • the used machining fluid containing cutting waste and the like is stored in the raw water tank 14 through the discharge path 13.
  • the used processing liquid stored in the raw water tank 14 may be discarded as it is, and the processing liquid may be newly supplied from the supply tank (tank) 15 to the dicing apparatus (processing apparatus) 1 or may be circulated and reused. May be.
  • the used machining fluid stored in the raw water tank 14 is pumped up by the raw water pump 16 and sent to the filter device 17.
  • a filter such as a hollow fiber membrane as the filter device 17
  • impurities such as cutting waste contained in the used machining fluid can be eliminated.
  • the used processing liquid from which impurities are removed by the filter device 17 is stored in the buffer tank 19.
  • the buffer tank 19 is internally provided with a conductivity meter (not shown) for measuring the conductivity of the used machining fluid, and an ion exchange device 18 is connected to adjust the conductivity to a predetermined range.
  • the ion exchange device 18 is connected to the buffer tank 19 via an electromagnetic open / close valve 52, and the control device 30 opens and closes the electromagnetic open / close valve 52 according to the conductivity measured by the conductivity meter.
  • the pump 51 for supplying the machining fluid to the ion exchange device 18 is driven / stopped.
  • the used working fluid adjusted so that the electric conductivity is within a predetermined range is guided to the mixing tank 21.
  • a pH meter (not shown) that measures the pH value of the stored machining liquid is provided, and the pH value of the stored machining liquid is measured as needed.
  • a conductivity meter may be provided in the mixing tank 21. This is because when the neutralizing agent is added to the working fluid stored in the mixing tank 21, the conductivity of the working fluid mixed with the neutralizing agent can be measured.
  • the control device 30 acquires a measurement value obtained by the pH meter as a detection signal, and determines whether or not the pH value of the used processing liquid is within a predetermined range. When the control device 30 determines that the pH value of the used machining liquid is outside the predetermined range, the machining that is stored in the mixing tank 21 by opening the electromagnetic on-off valve 24 to adjust the pH value.
  • the neutralizing agent is supplied from the neutralizing agent tank 23 to the liquid.
  • the neutralizing agent is preferably an aqueous solution containing inorganic phosphoric acid.
  • the neutralizing agent By supplying the neutralizing agent, the pH value of the processing liquid stored in the mixing tank 21 is adjusted, and the pH value can be brought close to the neutral value “7”. Specifically, by supplying the neutralizing agent, the ratio of the neutralizing agent in the solvent of the processing liquid increases, so the degree of the influence of the acidic component or alkaline component eluted in the processing liquid on the entire solvent is reduced. The pH value approaches the neutral value.
  • the used processing liquid with adjusted conductivity and pH value is temporarily stored in the mixing tank 21 and supplied to the supply tank 15 according to the remaining amount of the processing liquid in the supply tank (tank) 15.
  • the regenerated processing fluid stored in the supply tank 15 is supplied again to the dicing apparatus 1 by the supply pump 12.
  • the valve 111 for supplying the machining liquid provided for each dicing apparatus 1 is opened, and a supply request signal for the machining liquid is transmitted from the dicing apparatus 1 to the control device. 30.
  • the control device 30 that has received the supply request signal transmits an instruction signal to the inverter 40 in accordance with the number of operating dicing devices 1 and the like, and controls the operation of the supply pump 12 by inverter.
  • the valve 111 is closed and the machining liquid supply request signal is not transmitted from the dicing apparatus 1 to the control apparatus 30.
  • the return piping 41 which returns a process liquid to the supply tank 15 without supplying a process liquid from the supply path 11 to the dicing apparatus 1 is provided in the middle of the supply path 11.
  • FIG. 1 In front of the return pipe 41, an electromagnetic on-off valve 44 for opening and closing the path to the return pipe 41 is provided, and the electromagnetic on-off valve 44 is open when the supply pump 12 is driven.
  • the conventional processing waste liquid circulation apparatus has no means other than stopping the supply pump 12 in order to stop the supply of the processing liquid. Since the supply pump 12 is started from a stopped state, a considerable time is required from the start of operation of the dicing apparatus 1 until the machining liquid can be stably supplied.
  • the return pipe 41 since the return pipe 41 is provided, the machining fluid can be circulated without passing through the dicing apparatus 1, so there is no need to stop the supply pump 12. Therefore, it becomes possible to supply the machining liquid stably with the start of operation of the dicing apparatus 1.
  • FIG. 2 is a block diagram showing the configuration of the control device 30 of the processing waste liquid circulation device according to Embodiment 1 of the present invention.
  • the control device 30 is configured by a computer, and includes at least a CPU 31 that performs arithmetic processing according to a control program, a memory 32 that stores a control program, a storage device 33, an input interface 34, and an output interface 35. ing.
  • the input interface 34 receives a detection signal from a not-shown conductivity meter, pH meter, etc., an input signal from the input device 36, and a supply request signal from the dicing device 1. From the output interface 35, the supply pump 12, the raw water pump 16, the pump 51 that supplies the working fluid to the ion exchange device 18, the electromagnetic on-off valve 52 that opens and closes the path to the ion exchange device 18, and the neutralizing agent to the mixing tank 21. In addition to the electromagnetic on-off valve 24 that opens and closes the supply path, a control signal is output to the inverter 40 that controls the operation of the supply pump 12 and the electromagnetic on-off valve 44 that opens and closes the path to the return pipe 41.
  • FIG. 3 is a flowchart showing a processing procedure of the CPU 31 of the control device 30 of the processing waste liquid circulation device according to the first embodiment of the present invention.
  • the CPU 31 of the control device 30 resets the counter to 0 (step S301), selects one dicing device 1 (step S302), and has received a supply request signal from the selected dicing device 1 or not. Is determined (step S303).
  • step S303: YES When the CPU 31 determines that the supply request signal has been received (step S303: YES), the CPU 31 increments the counter by “1” (step S304). When the CPU 31 determines that the supply request signal has not been received (step S303: NO), the CPU 31 determines whether there is an unselected dicing apparatus 1 (step S305).
  • step S305: YES When the CPU 31 determines that there is an unselected dicing device 1 (step S305: YES), the CPU 31 selects the next dicing device 1 (step S306), returns the processing to step S303, and performs the above-described processing. repeat.
  • step S305: NO When the CPU 31 determines that all the dicing apparatuses 1 have been selected (step S305: NO), the CPU 31 determines whether or not the counter is 0 (step S307).
  • step S307 NO
  • the CPU 31 determines that at least one dicing apparatus 1 is in operation, and supplies the necessary amount of machining liquid according to the counter. Calculation is performed (step S308), and an instruction signal for driving the supply pump 12 is transmitted to the inverter 40 (step S309). As a result, the supply pump 12 is driven at a rotational speed corresponding to the number of operating dicing apparatuses 1.
  • step S307: YES the CPU 31 determines that the counter is 0 (step S307: YES) and drives the supply pump 12 at the set minimum rotational speed. Then, the working fluid is guided to the supply tank 15 through the return pipe 41. As a result, the machining liquid can be circulated between the supply tank 15 and the supply pump 12 without going through the dicing apparatus 1, and the supply pump 12 is stopped even when the dicing apparatus 1 is stopped. There is no need to let them.
  • CPU31 judges whether processing in all the dicing devices 1 was completed (Step S310), and when CPU31 judges that there is dicing device 1 which has not finished processing yet (Step S310: NO), CPU31 returns a process to step S302, and repeats the process mentioned above.
  • CPU31 judges that the process in all the dicing apparatuses 1 was complete
  • the supply amount of the machining fluid of the supply pump 12 can be changed by the inverter control, and when the number of operating dicing apparatuses 1 is small, that is, the necessary supply amount of the machining fluid. Is less than a predetermined amount, the machining liquid is guided to the supply tank 15 via the return pipe 41, so that the machining liquid can be circulated without being supplied to the dicing apparatus 1, and the dicing apparatus 1 is stopped. Even in this case, it is not necessary to stop the supply pump 12. Further, since the machining fluid is returned to the supply tank 15 by the return pipe 41, there is no temperature difference between the circulating machining fluid and the machining fluid stored in the supply tank 15, and the inside of the supply tank 15 is maintained. Since the agitation can be performed, the quality and temperature of the working fluid can be homogenized.
  • FIG. 4 is a schematic diagram showing a configuration of a processing waste liquid circulation apparatus according to Embodiment 2 of the present invention.
  • the processing waste liquid circulation apparatus according to the second embodiment includes a supply path 11 and a supply pump 12 for supplying a processing liquid to a plurality of dicing apparatuses (processing apparatuses) 1.
  • the working fluid is not particularly limited as long as the amount of heat generated during dicing, friction, and the like can be reduced.
  • a solution obtained by adding an aliphatic polyhydric alcohol as a solvent to pure water may be used.
  • the semiconductor wafer is cut by a dicer or the like.
  • the used machining fluid containing cutting waste and the like is stored in the raw water tank 14 through the discharge path 13.
  • the used processing liquid stored in the raw water tank 14 may be discarded as it is, and the processing liquid may be newly supplied from the supply tank (tank) 15 to the dicing apparatus (processing apparatus) 1 or may be circulated and reused. May be.
  • the used machining fluid stored in the raw water tank 14 is pumped up by the raw water pump 16 and sent to the filter device 17.
  • a filter such as a hollow fiber membrane as the filter device 17
  • impurities such as cutting waste contained in the used machining fluid can be eliminated.
  • the used processing liquid from which impurities are removed by the filter device 17 is stored in the buffer tank 19.
  • the buffer tank 19 is internally provided with a conductivity meter (not shown) for measuring the conductivity of the used machining fluid, and an ion exchange device 18 is connected to adjust the conductivity to a predetermined range.
  • the ion exchange device 18 is connected to the buffer tank 19 via an electromagnetic open / close valve 52, and the control device 30 opens and closes the electromagnetic open / close valve 52 according to the conductivity measured by the conductivity meter.
  • the pump 51 for supplying the machining fluid to the ion exchange device 18 is driven / stopped.
  • the used working fluid adjusted so that the electric conductivity is within a predetermined range is guided to the mixing tank 21.
  • a pH meter (not shown) that measures the pH value of the stored machining liquid is provided, and the pH value of the stored machining liquid is measured as needed.
  • a conductivity meter may be provided in the mixing tank 21. This is because when the neutralizing agent is added to the working fluid stored in the mixing tank 21, the conductivity of the working fluid mixed with the neutralizing agent can be measured.
  • the control device 30 acquires a measurement value obtained by the pH meter as a detection signal, and determines whether or not the pH value of the used processing liquid is within a predetermined range. When the control device 30 determines that the pH value of the used machining liquid is outside the predetermined range, the machining that is stored in the mixing tank 21 by opening the electromagnetic on-off valve 24 to adjust the pH value.
  • the neutralizing agent is supplied from the neutralizing agent tank 23 to the liquid.
  • the used processing liquid with adjusted conductivity and pH value is temporarily stored in the mixing tank 21 and supplied to the supply tank 15 according to the remaining amount of the processing liquid in the supply tank (tank) 15.
  • the regenerated processing fluid stored in the supply tank 15 is supplied again to the dicing apparatus 1 by the supply pump 12.
  • a return pipe 41 for returning the processing liquid to the supply tank 15 is provided in the middle of the supply path 11.
  • a pressure gauge 42 and a flow meter 43 for measuring the pressure and flow rate of the working fluid circulating between the supply tank 15 and the supply pump 12 via the return pipe 41 are provided in front of the return pipe 41.
  • the number of operating dicing apparatuses 1 can be estimated from the relationship between the number of operating dicing apparatuses 1 and the pressure or flow rate of the working fluid, which have been grasped in advance, and the measured pressure and flow rate of the working liquid.
  • control device 30 acquires pressure and flow measurement values from the pressure gauge 42 and the flow meter 43, estimates the number of operating dicing devices 1 based on the acquired measurement values, and inverters according to the estimated operation number An instruction signal is transmitted to 40 to control the operation of the supply pump 12.
  • FIG. 5 is a block diagram showing the configuration of the control device 30 of the processing waste liquid circulation device according to the second embodiment of the present invention.
  • the control device 30 is configured by a computer, and includes at least a CPU 31 that performs arithmetic processing according to a control program, a memory 32 that stores a control program, a storage device 33, an input interface 34, and an output interface 35. ing.
  • the detection signal from the conductivity meter, pH meter, etc., the input signal from the input device 36, the detection signal from the pressure gauge 42 and the flow meter 43 are input to the input interface 34. From the output interface 35, the supply pump 12, the raw water pump 16, the pump 51 that supplies the working fluid to the ion exchange device 18, the electromagnetic on-off valve 52 that opens and closes the path to the ion exchange device 18, and the neutralizing agent to the mixing tank 21. In addition to the electromagnetic on-off valve 24 that opens and closes the supply path, a control signal is output to the inverter 40 that controls the operation of the supply pump 12.
  • FIG. 6 is a flowchart showing a processing procedure of the CPU 31 of the control device 30 of the processing waste liquid circulation device according to Embodiment 2 of the present invention.
  • the CPU 31 of the control device 30 acquires pressure and flow measurement values from the pressure gauge 42 and the flow meter 43 (step S ⁇ b> 601), and knows in advance the number of operating dicing devices 1 and the machining fluid.
  • the number of operating dicing apparatuses 1 is estimated on the basis of the relationship between the pressure and the flow rate and the measured values of the acquired pressure and flow rate (step S602). If the machining fluid is supplied to the dicing device 1, the flow rate of the machining fluid circulating through the return pipe 41 is reduced and the pressure is lowered. Therefore, the number of dicing devices 1 that are operated can be easily determined by the measured pressure and flow rate of the machining fluid. Can be estimated.
  • step S603 judges whether the estimated operation number is 0 (step S603).
  • step S603: NO the CPU 31 determines that at least one dicing apparatus 1 is operating, and is necessary depending on the estimated operating number.
  • a supply amount of the machining fluid is calculated (step S604), and an instruction signal for driving the supply pump 12 is transmitted to the inverter 40 (step S605). As a result, the supply pump 12 is driven at a rotational speed corresponding to the number of operating dicing apparatuses 1.
  • step S603 When the CPU 31 determines that the estimated number of operating units is 0 (step S603: YES), the CPU 31 determines that no dicing device 1 is operating, and the supply pump 12 is set to the minimum rotation. The machining liquid is guided to the supply tank 15 through the return pipe 41.
  • the CPU 31 determines whether or not the processing in all the dicing apparatuses 1 has been completed (step S606), and when the CPU 31 determines that there is a dicing apparatus 1 that has not yet completed processing (step S606: NO), CPU31 returns a process to step S601, and repeats the process mentioned above.
  • CPU31 judges that the process in all the dicing apparatuses 1 was complete
  • the amount of the processing fluid supplied from the supply pump 12 can be varied by inverter control, and is circulated between the supply tank 15 and the supply pump 12 via the return pipe 41. Since the number of operating dicing devices 1 is estimated based on the measured values of the pressure and flow rate of the working fluid to be calculated, and the required amount of working fluid is calculated, the supply pump regardless of whether the dicing device 1 is operating 12 can continue to move, and a required amount of machining fluid can be supplied to the dicing apparatus 1 according to the estimated number of operating units.
  • the machining fluid is returned to the supply tank 15 by the return pipe 41, there is no temperature difference between the circulating machining fluid and the machining fluid stored in the supply tank 15, and the inside of the supply tank 15 is maintained. Since the agitation can be performed, the quality and temperature of the working fluid can be homogenized.
  • the processing apparatus is not limited to a dicing apparatus, and can be applied to a grinder that thins a wafer or the like, or a machine tool such as a milling machine, a lathe, a surface grinding machine, or a lapping machine.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Auxiliary Devices For Machine Tools (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)

Abstract

Provided is a waste working fluid recirculation apparatus that is capable of circulating working fluid without supplying the working fluid to a processing apparatus, and capable of making the quality and temperature of working fluid more uniform. Working fluid is supplied to a dicing device (1), and then the used working fluid is recycled and resupplied to the dicing device (1). The waste working fluid recirculation apparatus is provided with: a supply tank (15) for storing recycled working fluid; a supply pump (12) for resupplying the recycled working fluid to the dicing device (1); a supply channel (11) for supplying the working fluid to a processing apparatus; and a return pipe (41) for returning the working fluid to the supply tank (15) from partway along the supply channel (11). Inverter control makes it possible to adjust the amount of working fluid supplied by the supply pump (12). When the amount of working fluid supplied is less than a prescribed amount, working fluid is guided to the supply tank (15) through the return pipe (41).

Description

加工廃液循環装置Processing waste liquid circulation device
　本発明は、加工廃液が装置内を循環する途上で再生され、加工液として再利用される加工廃液循環装置に関する。 The present invention relates to a processing waste liquid circulating device that is regenerated as the processing waste liquid circulates in the apparatus and reused as the processing liquid.
　半導体デバイスを製造する場合、分割予定ラインで格子状に区分けされた略円盤形状の半導体ウエハの表面の複数の領域に、ＩＣ、ＬＳＩ等のデバイスを形成する。そして、分割予定ラインに沿って、ダイサー等により半導体ウエハを切削加工することにより、個々の半導体デバイスを製造している。 When manufacturing semiconductor devices, devices such as ICs and LSIs are formed in a plurality of regions on the surface of a substantially disk-shaped semiconductor wafer divided in a grid pattern by division lines. Each semiconductor device is manufactured by cutting the semiconductor wafer with a dicer or the like along the planned dividing line.
　ダイシング装置を用いて、分割予定ラインに沿って切削加工する場合、加工用のブレードに加工液を供給する。例えば特許文献１では、ＮＣ工作機械において、切削液（加工液）を供給する切削液ポンプと、該切削液ポンプを駆動するポンプモータと、該ポンプモータの動作を制御するポンプモータ制御部とを備え、切削対象物に応じて切削液の供給量を制御する切削液量制御装置が開示されている。切削量が少なくて済む材質である場合には、ポンプモータの回転数が低くなるよう制御され、少量の切削液が供給される。 場合 When cutting along the division line using a dicing machine, supply the machining fluid to the blade for machining. For example, in Patent Document 1, in an NC machine tool, a cutting fluid pump that supplies cutting fluid (machining fluid), a pump motor that drives the cutting fluid pump, and a pump motor control unit that controls the operation of the pump motor are provided. There is disclosed a cutting fluid amount control device that controls the amount of cutting fluid supplied according to a cutting object. In the case of a material that requires a small amount of cutting, the rotational speed of the pump motor is controlled to be low, and a small amount of cutting fluid is supplied.
　また、特許文献２では、加工液の循環経路を別途備えており、加工液の流量がポンプの最低許容流量値より少ない場合でも、ポンプが最低許容流量値に相当する流量を確保することができる加工液供給装置が開示されている。 Further, in Patent Document 2, a machining fluid circulation path is separately provided, and even when the flow rate of the machining fluid is smaller than the minimum allowable flow rate value of the pump, the pump can ensure a flow rate corresponding to the minimum allowable flow rate value. A working fluid supply apparatus is disclosed.
特開平０７－２６６１８５号公報JP 07-266185 A 特開２００２－２２４９３１号公報JP 2002-224931 A
　特許文献１では、切削対象物に応じて切削液の供給量を制御している。しかし、切削加工の開始時には、ポンプモータを停止状態から始動するため、ポンプモータが目標回転数に到達するまでに相当の時間を要する。そのため、切削対象物が頻繁に変わる場合等には、供給量の制御が追いつかないおそれがあるという問題点があった。 In Patent Document 1, the amount of cutting fluid supplied is controlled in accordance with the object to be cut. However, since the pump motor is started from the stopped state at the start of cutting, a considerable time is required until the pump motor reaches the target rotational speed. For this reason, there is a problem in that the supply amount may not be able to catch up when the object to be cut changes frequently.
　また、特許文献２においても、切削加工の開始時には、ポンプを停止状態から始動するため、加工液の供給量が目標流量に到達して安定するまでに相当の時間を要するという問題点があった。 Also in Patent Document 2, since the pump is started from a stopped state at the start of cutting, there is a problem that it takes a considerable time for the amount of machining fluid to reach the target flow rate and stabilize. .
　もちろん、加工液の循環経路を別途備えておき、切削加工の停止中であってもポンプを継続して駆動させておくことで、加工液の供給量が安定するまでに要する時間を短縮することもできる。しかし、循環している加工液はポンプの直前へ戻され、また循環している加工液の量も少量であるため、ポンプの発熱により比較的短時間で加工液の温度が上昇する。温度の上昇が加工液の品質劣化につながるとともに、循環している加工液とタンクに貯留されている加工液との温度差が大きくなるので、加工対象物の品質に影響を与えるおそれも生じるという問題点があった。 Of course, it is possible to reduce the time required for the supply of the machining fluid to stabilize by providing a separate circulation path for the machining fluid and keeping the pump driven even when cutting is stopped. You can also. However, since the circulating machining fluid is returned immediately before the pump and the amount of the circulating machining fluid is small, the temperature of the machining fluid rises in a relatively short time due to heat generated by the pump. The rise in temperature leads to degradation of the quality of the machining fluid, and the temperature difference between the circulating machining fluid and the machining fluid stored in the tank increases, which may affect the quality of the workpiece. There was a problem.
　本発明は、上記事情に鑑みてなされたものであり、加工液を加工装置へ供給することなく循環させることができ、加工液の品質及び温度の均質化を図ることができる加工廃液循環装置を提供することを目的とする。 The present invention has been made in view of the above circumstances, and provides a processing waste liquid circulating apparatus that can circulate a processing liquid without supplying it to the processing apparatus and can achieve homogenization of the quality and temperature of the processing liquid. The purpose is to provide.
　上記目的を達成するために本発明に係る加工廃液循環装置は、加工装置へ加工液を供給し、使用済みの加工液を再生処理して前記加工装置へ再度供給する加工廃液循環装置であって、再生処理された加工液を貯留するタンクと、再生処理された加工液を、再度、前記加工装置へ供給する供給ポンプと、前記加工装置へ加工液を供給する供給経路と、該供給経路の中途から前記タンクへ加工液を戻す戻り配管とを備え、インバータ制御により前記供給ポンプの加工液の供給量を変動させることができ、加工液の供給量が所定量より少ない場合、前記戻り配管を介して前記タンクへ加工液を誘導させる制御手段を有することを特徴とする。 In order to achieve the above object, a processing waste liquid circulation apparatus according to the present invention is a processing waste liquid circulation apparatus that supplies a processing liquid to a processing apparatus, regenerates the used processing liquid, and supplies the processed liquid again to the processing apparatus. A tank for storing the reprocessed processing liquid, a supply pump for supplying the reprocessed processing liquid to the processing apparatus again, a supply path for supplying the processing liquid to the processing apparatus, and the supply path A return pipe for returning the machining liquid to the tank from the middle, and the supply amount of the machining liquid of the supply pump can be changed by inverter control. When the supply quantity of the machining liquid is less than a predetermined amount, the return pipe is And a control means for guiding the processing liquid to the tank.
　上記構成では、再生処理された加工液を貯留するタンクと、再生処理された加工液を、再度、加工装置へ供給する供給ポンプと、加工装置へ加工液を供給する供給経路と、該供給経路の中途からタンクへ加工液を戻す戻り配管とを備える。インバータ制御により供給ポンプの加工液の供給量を変動させることができ、加工液の供給量が所定量より少ない場合、戻り配管を介してタンクへ加工液を誘導するので、加工液を加工装置へ供給することなく循環させることができ、加工装置が停止している場合であっても供給ポンプを停止させる必要がない。また、戻り配管によりタンクへ加工液を戻しているので、循環している加工液とタンクに貯留されている加工液との温度差が生じることがなく、タンク内を撹拌することができるので、加工液の品質及び温度の均質化を図ることも可能となる。 In the above configuration, the tank that stores the regenerated processing fluid, the supply pump that supplies the reprocessed processing fluid to the processing apparatus again, the supply path that supplies the processing liquid to the processing apparatus, and the supply path And a return pipe for returning the machining fluid from the middle to the tank. The amount of machining fluid supplied from the supply pump can be changed by inverter control. When the amount of machining fluid supplied is less than the specified amount, the machining fluid is guided to the tank via the return pipe. It is possible to circulate without supplying, and it is not necessary to stop the supply pump even when the processing apparatus is stopped. In addition, since the working fluid is returned to the tank by the return pipe, there is no temperature difference between the circulating working fluid and the working fluid stored in the tank, and the inside of the tank can be stirred. It is also possible to homogenize the quality and temperature of the working fluid.
　また、本発明に係る加工廃液循環装置は、前記戻り配管への経路を開閉する電磁開閉弁を設けてあり、前記制御手段は、加工液の供給量が所定量より少ない場合、前記電磁開閉弁を開かせることが好ましい。 Further, the processing waste liquid circulation device according to the present invention is provided with an electromagnetic on-off valve that opens and closes a path to the return pipe, and the control means is configured to switch the electromagnetic on-off valve when the amount of processing liquid supplied is less than a predetermined amount. Is preferably opened.
　上記構成では、戻り配管への経路を開閉する電磁開閉弁を設けてあり、加工液の供給量が所定量より少ない場合に電磁開閉弁が開くので、加工装置が停止している場合であっても供給ポンプが停止していないので、加工装置の運転開始とともに安定して加工液を供給することが可能となる。 In the above configuration, an electromagnetic on-off valve that opens and closes the path to the return pipe is provided, and the electromagnetic on-off valve opens when the amount of machining fluid supplied is less than a predetermined amount. However, since the supply pump is not stopped, the machining liquid can be stably supplied with the start of the operation of the machining apparatus.
　また、本発明に係る加工廃液循環装置は、前記制御手段は、前記加工装置から加工液の供給要求を受け付け、受け付けた供給要求に応じて加工液の供給量を変動させることが好ましい。 Further, in the processing waste liquid circulation apparatus according to the present invention, it is preferable that the control unit receives a processing liquid supply request from the processing apparatus, and varies the processing liquid supply amount according to the received supply request.
　上記構成では、加工装置から加工液の供給要求を受け付け、受け付けた供給要求に応じて加工液の供給量を変動させるので、加工装置の稼働台数に応じて加工液の供給量を調整することができる。 In the above configuration, since the machining fluid supply request is received from the machining device and the machining fluid supply amount is changed according to the received supply request, the machining fluid supply amount can be adjusted according to the number of processing devices operating. it can.
　また、本発明に係る加工廃液循環装置は、前記戻り配管の手前に圧力計及び流量計を設けてあり、前記制御手段は、前記圧力計及び前記流量計の計測値に基づいて、加工液の供給量を変動させることが好ましい。 Further, the processing waste liquid circulation apparatus according to the present invention is provided with a pressure gauge and a flow meter in front of the return pipe, and the control means is configured to control the processing liquid based on the measured values of the pressure gauge and the flow meter. It is preferable to vary the supply amount.
　上記構成では、戻り配管の手前に圧力計及び流量計を設けてあり、圧力計及び流量計の計測値に基づいて、加工液の供給量を変動させるので、加工装置の稼働台数を容易に推定することができ、稼働台数に応じて加工液の供給量を適切に調整することが可能となる。 In the above configuration, a pressure gauge and a flow meter are provided in front of the return pipe, and the supply amount of the machining fluid is varied based on the measured values of the pressure gauge and the flow meter. Therefore, it is possible to appropriately adjust the supply amount of the machining fluid according to the number of operating units.
　上記構成によれば、インバータ制御により供給ポンプの加工液の供給量を変動させることができ、加工液の供給量が所定量より少ない場合、戻り配管を介してタンクへ加工液を誘導するので、加工液を加工装置へ供給することなく循環させることができ、加工装置が停止している場合であっても供給ポンプを停止させる必要がない。また、戻り配管によりタンクへ加工液を戻しているので、循環している加工液とタンクに貯留されている加工液との温度差が生じることがなく、タンク内を撹拌することができるので、加工液の品質及び温度の均質化を図ることも可能となる。 According to the above configuration, the supply amount of the machining fluid of the supply pump can be changed by the inverter control, and when the supply amount of the machining fluid is less than a predetermined amount, the machining fluid is guided to the tank via the return pipe. The machining liquid can be circulated without being supplied to the machining apparatus, and even if the machining apparatus is stopped, there is no need to stop the supply pump. In addition, since the working fluid is returned to the tank by the return pipe, there is no temperature difference between the circulating working fluid and the working fluid stored in the tank, and the inside of the tank can be stirred. It is also possible to homogenize the quality and temperature of the working fluid.
本発明の実施の形態１に係る加工廃液循環装置の構成を示す模式図である。It is a schematic diagram which shows the structure of the processing waste liquid circulation apparatus which concerns on Embodiment 1 of this invention. 本発明の実施の形態１に係る加工廃液循環装置の制御装置の構成を示すブロック図である。It is a block diagram which shows the structure of the control apparatus of the processing waste liquid circulation apparatus which concerns on Embodiment 1 of this invention. 本発明の実施の形態１に係る加工廃液循環装置の制御装置のＣＰＵの処理手順を示すフローチャートである。It is a flowchart which shows the process sequence of CPU of the control apparatus of the processing waste liquid circulation apparatus which concerns on Embodiment 1 of this invention. 本発明の実施の形態２に係る加工廃液循環装置の構成を示す模式図である。It is a schematic diagram which shows the structure of the processing waste liquid circulation apparatus which concerns on Embodiment 2 of this invention. 本発明の実施の形態２に係る加工廃液循環装置の制御装置の構成を示すブロック図である。It is a block diagram which shows the structure of the control apparatus of the processing waste liquid circulation apparatus which concerns on Embodiment 2 of this invention. 本発明の実施の形態２に係る加工廃液循環装置の制御装置のＣＰＵの処理手順を示すフローチャートである。It is a flowchart which shows the process sequence of CPU of the control apparatus of the processing waste liquid circulation apparatus which concerns on Embodiment 2 of this invention. 従来の加工廃液循環装置の構成を示す模式図である。It is a schematic diagram which shows the structure of the conventional process waste liquid circulation apparatus.
　以下、本発明の実施の形態における加工廃液循環装置について、図面を用いて具体的に説明する。以下の実施の形態は、特許請求の範囲に記載された発明を限定するものではなく、実施の形態の中で説明されている特徴的事項の組み合わせの全てが解決手段の必須事項であるとは限らないことは言うまでもない。 Hereinafter, the processing waste liquid circulation device in the embodiment of the present invention will be specifically described with reference to the drawings. The following embodiments do not limit the invention described in the claims, and all combinations of characteristic items described in the embodiments are essential to the solution. It goes without saying that it is not limited.
　図７は、従来の加工廃液循環装置の構成を示す模式図である。図７に示すように、従来の加工廃液循環装置は、複数のダイシング装置（加工装置）１に加工液を供給する供給経路１１及び供給ポンプ１２を備えている。なお、加工液は、ダイシング時に発生する熱量、摩擦等を低減することができれば特に限定されるものではないが、例えば純水に溶媒として脂肪族多価アルコールを添加したものを用いれば良い。 FIG. 7 is a schematic diagram showing the configuration of a conventional processing waste liquid circulation device. As shown in FIG. 7, the conventional processing waste liquid circulation device includes a supply path 11 and a supply pump 12 for supplying a processing liquid to a plurality of dicing devices (processing devices) 1. The working fluid is not particularly limited as long as the amount of heat generated during dicing, friction, and the like can be reduced. For example, a solution obtained by adding an aliphatic polyhydric alcohol as a solvent to pure water may be used.
　ダイシング装置１では、ダイサー等により半導体ウエハを切削加工する。切削屑等が含まれた使用済み加工液は、排出経路１３を通って原水槽１４に貯留される。原水槽１４に貯留された使用済み加工液はそのまま廃棄して、供給タンク１５からダイシング装置（加工装置）１へ新たに加工液を供給しても良いし、循環させて再利用しても良い。 In the dicing apparatus 1, the semiconductor wafer is cut by a dicer or the like. The used machining fluid containing cutting waste and the like is stored in the raw water tank 14 through the discharge path 13. The used processing liquid stored in the raw water tank 14 may be discarded as it is, and the processing liquid may be newly supplied from the supply tank 15 to the dicing apparatus (processing apparatus) 1 or may be circulated and reused. .
　使用済み加工液を再利用する場合、原水槽１４に貯留された使用済み加工液を原水ポンプ１６で汲み上げてフィルタ装置１７へ送出する。フィルタ装置１７として、例えば中空糸膜等のフィルタを用いることで、使用済み加工液に含まれる切削屑等の不純物を排除することができる。 When reusing the used machining fluid, the used machining fluid stored in the raw water tank 14 is pumped up by the raw water pump 16 and sent to the filter device 17. By using a filter such as a hollow fiber membrane as the filter device 17, impurities such as cutting waste contained in the used machining fluid can be eliminated.
　フィルタ装置１７で不純物を排除した使用済み加工液は、バッファタンク１９に貯留される。バッファタンク１９には、使用済み加工液の導電率を計測する導電率計（図示せず）を内部に備えてあり、導電率が所定の範囲になるよう調整するためにイオン交換装置１８が接続されている。イオン交換装置１８は、バッファタンク１９と電磁開閉弁５２を介して接続されており、制御装置３０は、導電率計で計測された導電率に応じて、電磁開閉弁５２を開閉し、使用済み加工液をイオン交換装置１８へ供給するポンプ５１を駆動／停止させる。 The used processing liquid from which impurities are removed by the filter device 17 is stored in the buffer tank 19. The buffer tank 19 is internally provided with a conductivity meter (not shown) for measuring the conductivity of the used machining fluid, and an ion exchange device 18 is connected to adjust the conductivity to a predetermined range. Has been. The ion exchange device 18 is connected to the buffer tank 19 via an electromagnetic open / close valve 52, and the control device 30 opens and closes the electromagnetic open / close valve 52 according to the conductivity measured by the conductivity meter. The pump 51 for supplying the machining fluid to the ion exchange device 18 is driven / stopped.
　導電率が所定の範囲内になるよう調整された使用済み加工液は、混合タンク２１へ誘導される。バッファタンク１９内及び混合タンク２１内には、貯留されている加工液のｐＨ値を計測する図示しないｐＨ計を備えてあり、貯留されている加工液のｐＨ値を随時計測する。 The used working fluid adjusted so that the electric conductivity is within a predetermined range is guided to the mixing tank 21. In the buffer tank 19 and the mixing tank 21, a pH meter (not shown) that measures the pH value of the stored machining liquid is provided, and the pH value of the stored machining liquid is measured as needed.
　制御装置３０は、ｐＨ計での計測値を検出信号として取得して、使用済み加工液のｐＨ値が所定の範囲内であるか否かを判断する。制御装置３０は、使用済み加工液のｐＨ値が所定の範囲外であると判断した場合には、ｐＨ値を調整するべく、電磁開閉弁２４を開いて混合タンク２１内に貯留されている加工液に中和剤タンク２３から中和剤を供給する。 The control device 30 acquires a measurement value obtained by the pH meter as a detection signal, and determines whether or not the pH value of the used processing liquid is within a predetermined range. When the control device 30 determines that the pH value of the used machining liquid is outside the predetermined range, the machining that is stored in the mixing tank 21 by opening the electromagnetic on-off valve 24 to adjust the pH value. The neutralizing agent is supplied from the neutralizing agent tank 23 to the liquid.
　中和剤は、無機リン酸を含む水溶液であることが好ましい。中和剤を供給することにより、混合タンク２１内に貯留されている加工液のｐＨ値が調整され、ｐＨ値を中性値‘７’に近づけることができる。具体的には、中和剤を供給することにより、加工液の溶媒中の中和剤比率が上昇するので、加工液に溶出した酸性成分又はアルカリ性成分の溶媒全体に及ぼす影響の度合が低減し、ｐＨ値が中性値へと近づく。 The neutralizing agent is preferably an aqueous solution containing inorganic phosphoric acid. By supplying the neutralizing agent, the pH value of the processing liquid stored in the mixing tank 21 is adjusted, and the pH value can be brought close to the neutral value “7”. Specifically, by supplying the neutralizing agent, the ratio of the neutralizing agent in the solvent of the processing liquid increases, so the degree of the influence of the acidic component or alkaline component eluted in the processing liquid on the entire solvent is reduced. The pH value approaches the neutral value.
　導電率及びｐＨ値が調整された使用済み加工液は、混合タンク２１に一旦貯留され、供給タンク１５内の加工液の残量に応じて供給タンク１５へと供給される。供給タンク１５に貯留されている加工液は、供給ポンプ１２により、再度ダイシング装置１へ供給される。 The used processing liquid whose conductivity and pH value are adjusted is temporarily stored in the mixing tank 21 and supplied to the supply tank 15 according to the remaining amount of the processing liquid in the supply tank 15. The machining liquid stored in the supply tank 15 is supplied again to the dicing apparatus 1 by the supply pump 12.
　上述した従来の加工廃液循環装置では、ダイシング装置１ごとにバルブ１１１を備えており、いずれかのダイシング装置１が停止した場合、ダイシング装置１側からバルブ１１１が閉鎖され、加工液を供給することができなくなるので、供給ポンプ１２を停止させる以外の手段がなかった。したがって、停止しているダイシング装置１の台数を制御装置３０で把握することができず、ダイシング装置１の稼働台数に応じて加工液の供給量を適切に調整することはできない。そこで、本発明では、いずれかのダイシング装置１が停止した場合であっても供給ポンプ１２を停止することなく、ダイシング装置１の稼働台数を推定して、推定した稼働台数に応じて必要な量の加工液を供給する。 In the above-described conventional processing waste liquid circulation device, each dicing device 1 is provided with a valve 111. When any of the dicing devices 1 is stopped, the valve 111 is closed from the dicing device 1 side to supply the processing liquid. Therefore, there was no means other than stopping the supply pump 12. Therefore, the number of stopped dicing apparatuses 1 cannot be grasped by the control apparatus 30, and the supply amount of the machining fluid cannot be adjusted appropriately according to the number of operating dicing apparatuses 1. Therefore, in the present invention, even if any of the dicing apparatuses 1 is stopped, the number of operating dicing apparatuses 1 is estimated without stopping the supply pump 12, and the amount required according to the estimated operating number. Supply the machining fluid.
　（実施の形態１）
　図１は、本発明の実施の形態１に係る加工廃液循環装置の構成を示す模式図である。図１に示すように、本実施の形態１に係る加工廃液循環装置は、複数のダイシング装置（加工装置）１に加工液を供給する供給経路１１及び供給ポンプ１２を備えている。なお、加工液は、ダイシング時に発生する熱量、摩擦等を低減することができれば特に限定されるものではないが、例えば純水に溶媒として脂肪族多価アルコールを添加したものを用いれば良い。 (Embodiment 1)
FIG. 1 is a schematic diagram showing a configuration of a processing waste liquid circulation apparatus according to Embodiment 1 of the present invention. As shown in FIG. 1, the processing waste liquid circulation apparatus according to the first embodiment includes a supply path 11 and a supply pump 12 for supplying a processing liquid to a plurality of dicing apparatuses (processing apparatuses) 1. The working fluid is not particularly limited as long as the amount of heat generated during dicing, friction, and the like can be reduced. For example, a solution obtained by adding an aliphatic polyhydric alcohol as a solvent to pure water may be used.
　ダイシング装置１では、ダイサー等により半導体ウエハを切削加工する。切削屑等が含まれた使用済み加工液は、排出経路１３を通って原水槽１４に貯留される。原水槽１４に貯留された使用済み加工液はそのまま廃棄して、供給タンク（タンク）１５からダイシング装置（加工装置）１へ新たに加工液を供給しても良いし、循環させて再利用しても良い。 In the dicing apparatus 1, the semiconductor wafer is cut by a dicer or the like. The used machining fluid containing cutting waste and the like is stored in the raw water tank 14 through the discharge path 13. The used processing liquid stored in the raw water tank 14 may be discarded as it is, and the processing liquid may be newly supplied from the supply tank (tank) 15 to the dicing apparatus (processing apparatus) 1 or may be circulated and reused. May be.
　使用済み加工液を再利用する場合、原水槽１４に貯留された使用済み加工液を原水ポンプ１６で汲み上げてフィルタ装置１７へ送出する。フィルタ装置１７として、例えば中空糸膜等のフィルタを用いることで、使用済み加工液に含まれる切削屑等の不純物を排除することができる。 When reusing the used machining fluid, the used machining fluid stored in the raw water tank 14 is pumped up by the raw water pump 16 and sent to the filter device 17. By using a filter such as a hollow fiber membrane as the filter device 17, impurities such as cutting waste contained in the used machining fluid can be eliminated.
　フィルタ装置１７で不純物を排除した使用済み加工液は、バッファタンク１９に貯留される。バッファタンク１９には、使用済み加工液の導電率を計測する導電率計（図示せず）を内部に備えてあり、導電率が所定の範囲になるよう調整するためにイオン交換装置１８が接続されている。イオン交換装置１８は、バッファタンク１９と電磁開閉弁５２を介して接続されており、制御装置３０は、導電率計で計測された導電率に応じて、電磁開閉弁５２を開閉し、使用済み加工液をイオン交換装置１８へ供給するポンプ５１を駆動／停止させる。 The used processing liquid from which impurities are removed by the filter device 17 is stored in the buffer tank 19. The buffer tank 19 is internally provided with a conductivity meter (not shown) for measuring the conductivity of the used machining fluid, and an ion exchange device 18 is connected to adjust the conductivity to a predetermined range. Has been. The ion exchange device 18 is connected to the buffer tank 19 via an electromagnetic open / close valve 52, and the control device 30 opens and closes the electromagnetic open / close valve 52 according to the conductivity measured by the conductivity meter. The pump 51 for supplying the machining fluid to the ion exchange device 18 is driven / stopped.
　導電率が所定の範囲内になるよう調整された使用済み加工液は、混合タンク２１へ誘導される。バッファタンク１９内及び混合タンク２１内には、貯留されている加工液のｐＨ値を計測する図示しないｐＨ計を備えてあり、貯留されている加工液のｐＨ値を随時計測する。なお、混合タンク２１内に導電率計を備えていても良い。混合タンク２１内に貯留されている加工液に中和剤を添加した場合に、中和剤と混合した加工液の導電率を計測することができるからである。 The used working fluid adjusted so that the electric conductivity is within a predetermined range is guided to the mixing tank 21. In the buffer tank 19 and the mixing tank 21, a pH meter (not shown) that measures the pH value of the stored machining liquid is provided, and the pH value of the stored machining liquid is measured as needed. Note that a conductivity meter may be provided in the mixing tank 21. This is because when the neutralizing agent is added to the working fluid stored in the mixing tank 21, the conductivity of the working fluid mixed with the neutralizing agent can be measured.
　制御装置３０は、ｐＨ計での計測値を検出信号として取得して、使用済み加工液のｐＨ値が所定の範囲内であるか否かを判断する。制御装置３０は、使用済み加工液のｐＨ値が所定の範囲外であると判断した場合には、ｐＨ値を調整するべく、電磁開閉弁２４を開いて混合タンク２１内に貯留されている加工液に中和剤タンク２３から中和剤を供給する。 The control device 30 acquires a measurement value obtained by the pH meter as a detection signal, and determines whether or not the pH value of the used processing liquid is within a predetermined range. When the control device 30 determines that the pH value of the used machining liquid is outside the predetermined range, the machining that is stored in the mixing tank 21 by opening the electromagnetic on-off valve 24 to adjust the pH value. The neutralizing agent is supplied from the neutralizing agent tank 23 to the liquid.
　中和剤は、無機リン酸を含む水溶液であることが好ましい。中和剤を供給することにより、混合タンク２１内に貯留されている加工液のｐＨ値が調整され、ｐＨ値を中性値‘７’に近づけることができる。具体的には、中和剤を供給することにより、加工液の溶媒中の中和剤比率が上昇するので、加工液に溶出した酸性成分又はアルカリ性成分の溶媒全体に及ぼす影響の度合が低減し、ｐＨ値が中性値へと近づく。 The neutralizing agent is preferably an aqueous solution containing inorganic phosphoric acid. By supplying the neutralizing agent, the pH value of the processing liquid stored in the mixing tank 21 is adjusted, and the pH value can be brought close to the neutral value “7”. Specifically, by supplying the neutralizing agent, the ratio of the neutralizing agent in the solvent of the processing liquid increases, so the degree of the influence of the acidic component or alkaline component eluted in the processing liquid on the entire solvent is reduced. The pH value approaches the neutral value.
　導電率及びｐＨ値が調整された使用済み加工液は、混合タンク２１に一旦貯留され、供給タンク（タンク）１５内の加工液の残量に応じて供給タンク１５へと供給される。供給タンク１５に貯留されている再生処理された加工液は、供給ポンプ１２により、再度ダイシング装置１へ供給される。 The used processing liquid with adjusted conductivity and pH value is temporarily stored in the mixing tank 21 and supplied to the supply tank 15 according to the remaining amount of the processing liquid in the supply tank (tank) 15. The regenerated processing fluid stored in the supply tank 15 is supplied again to the dicing apparatus 1 by the supply pump 12.
　本実施の形態１では、ダイシング装置１が運転を開始する場合、ダイシング装置１ごとに設けられた加工液を供給するためのバルブ１１１が開き、ダイシング装置１から加工液の供給要求信号が制御装置３０に送信される。供給要求信号を受信した制御装置３０は、ダイシング装置１の稼働台数等に応じてインバータ４０へ指示信号を送信し、供給ポンプ１２の動作をインバータ制御する。ダイシング装置１が停止した場合、バルブ１１１が閉じ、ダイシング装置１から加工液の供給要求信号が制御装置３０に送信されない。 In the first embodiment, when the dicing apparatus 1 starts operation, the valve 111 for supplying the machining liquid provided for each dicing apparatus 1 is opened, and a supply request signal for the machining liquid is transmitted from the dicing apparatus 1 to the control device. 30. The control device 30 that has received the supply request signal transmits an instruction signal to the inverter 40 in accordance with the number of operating dicing devices 1 and the like, and controls the operation of the supply pump 12 by inverter. When the dicing apparatus 1 is stopped, the valve 111 is closed and the machining liquid supply request signal is not transmitted from the dicing apparatus 1 to the control apparatus 30.
　そして、本実施の形態１では、供給経路１１からダイシング装置１へ加工液を供給せずに、供給タンク１５に加工液を戻す戻り配管４１を供給経路１１の中途に備えている。戻り配管４１の手前には、戻り配管４１への経路を開閉する電磁開閉弁４４を設けてあり、電磁開閉弁４４は供給ポンプ１２の駆動時は開いている。 And in this Embodiment 1, the return piping 41 which returns a process liquid to the supply tank 15 without supplying a process liquid from the supply path 11 to the dicing apparatus 1 is provided in the middle of the supply path 11. FIG. In front of the return pipe 41, an electromagnetic on-off valve 44 for opening and closing the path to the return pipe 41 is provided, and the electromagnetic on-off valve 44 is open when the supply pump 12 is driven.
　ダイシング装置１が１台も稼働していない場合、従来の加工廃液循環装置では加工液の供給を止めるためには供給ポンプ１２を停止させる以外手段がなかった。供給ポンプ１２を停止状態から始動するため、ダイシング装置１の運転開始から安定して加工液を供給することができるまでに相当の時間を要する。 When no dicing apparatus 1 is operating, the conventional processing waste liquid circulation apparatus has no means other than stopping the supply pump 12 in order to stop the supply of the processing liquid. Since the supply pump 12 is started from a stopped state, a considerable time is required from the start of operation of the dicing apparatus 1 until the machining liquid can be stably supplied.
　しかし、戻り配管４１を備えることにより、加工液をダイシング装置１を介することなく循環させることができるので、供給ポンプ１２を停止させる必要がない。したがって、ダイシング装置１の運転開始とともに安定して加工液を供給することが可能となる。 However, since the return pipe 41 is provided, the machining fluid can be circulated without passing through the dicing apparatus 1, so there is no need to stop the supply pump 12. Therefore, it becomes possible to supply the machining liquid stably with the start of operation of the dicing apparatus 1.
　図２は、本発明の実施の形態１に係る加工廃液循環装置の制御装置３０の構成を示すブロック図である。図２に示すように、制御装置３０はコンピュータによって構成されており、少なくとも制御プログラムに従って演算処理するＣＰＵ３１、制御プログラム等を記憶するメモリ３２、記憶装置３３、入力インタフェース３４、及び出力インタフェース３５を備えている。 FIG. 2 is a block diagram showing the configuration of the control device 30 of the processing waste liquid circulation device according to Embodiment 1 of the present invention. As shown in FIG. 2, the control device 30 is configured by a computer, and includes at least a CPU 31 that performs arithmetic processing according to a control program, a memory 32 that stores a control program, a storage device 33, an input interface 34, and an output interface 35. ing.
　入力インタフェース３４には、図示しない導電率計、ｐＨ計等からの検出信号、入力装置３６からの入力信号、ダイシング装置１からの供給要求信号が入力される。出力インタフェース３５からは、供給ポンプ１２、原水ポンプ１６、加工液をイオン交換装置１８へ供給するポンプ５１、イオン交換装置１８への経路を開閉する電磁開閉弁５２、混合タンク２１へ中和剤を供給する経路を開閉する電磁開閉弁２４の他、供給ポンプ１２の動作を制御するインバータ４０、戻り配管４１への経路を開閉する電磁開閉弁４４へ制御信号を出力する。 The input interface 34 receives a detection signal from a not-shown conductivity meter, pH meter, etc., an input signal from the input device 36, and a supply request signal from the dicing device 1. From the output interface 35, the supply pump 12, the raw water pump 16, the pump 51 that supplies the working fluid to the ion exchange device 18, the electromagnetic on-off valve 52 that opens and closes the path to the ion exchange device 18, and the neutralizing agent to the mixing tank 21. In addition to the electromagnetic on-off valve 24 that opens and closes the supply path, a control signal is output to the inverter 40 that controls the operation of the supply pump 12 and the electromagnetic on-off valve 44 that opens and closes the path to the return pipe 41.
　図３は、本発明の実施の形態１に係る加工廃液循環装置の制御装置３０のＣＰＵ３１の処理手順を示すフローチャートである。図３において、制御装置３０のＣＰＵ３１は、カウンタを０にリセットし（ステップＳ３０１）、一のダイシング装置１を選択して（ステップＳ３０２）、選択したダイシング装置１から供給要求信号を受信したか否かを判断する（ステップＳ３０３）。 FIG. 3 is a flowchart showing a processing procedure of the CPU 31 of the control device 30 of the processing waste liquid circulation device according to the first embodiment of the present invention. 3, the CPU 31 of the control device 30 resets the counter to 0 (step S301), selects one dicing device 1 (step S302), and has received a supply request signal from the selected dicing device 1 or not. Is determined (step S303).
　ＣＰＵ３１が、供給要求信号を受信したと判断した場合（ステップＳ３０３：ＹＥＳ）、ＣＰＵ３１は、カウンタを‘１’インクリメントする（ステップＳ３０４）。ＣＰＵ３１が、供給要求信号を受信していないと判断した場合（ステップＳ３０３：ＮＯ）、ＣＰＵ３１は、未選択のダイシング装置１が存在するか否かを判断する（ステップＳ３０５）。 When the CPU 31 determines that the supply request signal has been received (step S303: YES), the CPU 31 increments the counter by “1” (step S304). When the CPU 31 determines that the supply request signal has not been received (step S303: NO), the CPU 31 determines whether there is an unselected dicing apparatus 1 (step S305).
　ＣＰＵ３１が、未選択のダイシング装置１が存在すると判断した場合（ステップＳ３０５：ＹＥＳ）、ＣＰＵ３１は、次のダイシング装置１を選択して（ステップＳ３０６）、処理をステップＳ３０３へ戻して上述した処理を繰り返す。ＣＰＵ３１が、すべてのダイシング装置１が選択されたと判断した場合（ステップＳ３０５：ＮＯ）、ＣＰＵ３１は、カウンタが０であるか否かを判断する（ステップＳ３０７）。 When the CPU 31 determines that there is an unselected dicing device 1 (step S305: YES), the CPU 31 selects the next dicing device 1 (step S306), returns the processing to step S303, and performs the above-described processing. repeat. When the CPU 31 determines that all the dicing apparatuses 1 have been selected (step S305: NO), the CPU 31 determines whether or not the counter is 0 (step S307).
　ＣＰＵ３１が、カウンタが０ではないと判断した場合（ステップＳ３０７：ＮＯ）、ＣＰＵ３１は、少なくとも１台のダイシング装置１は稼働していると判断し、カウンタに応じて必要な加工液の供給量を算出して（ステップＳ３０８）、インバータ４０へ供給ポンプ１２を駆動する指示信号を送信する（ステップＳ３０９）。これにより、供給ポンプ１２がダイシング装置１の稼働台数に応じた回転数で駆動する。 When the CPU 31 determines that the counter is not 0 (step S307: NO), the CPU 31 determines that at least one dicing apparatus 1 is in operation, and supplies the necessary amount of machining liquid according to the counter. Calculation is performed (step S308), and an instruction signal for driving the supply pump 12 is transmitted to the inverter 40 (step S309). As a result, the supply pump 12 is driven at a rotational speed corresponding to the number of operating dicing apparatuses 1.
　ＣＰＵ３１が、カウンタが０であると判断した場合（ステップＳ３０７：ＹＥＳ）、ＣＰＵ３１は、１台もダイシング装置１が稼働していないと判断して、供給ポンプ１２を設定された最小回転数で駆動させ、戻り配管４１を介して供給タンク１５へ加工液を誘導させる。これにより、加工液を、ダイシング装置１を介することなく、供給タンク１５と供給ポンプ１２との間で循環させることができ、ダイシング装置１が停止している場合であっても供給ポンプ１２を停止させる必要がない。 When the CPU 31 determines that the counter is 0 (step S307: YES), the CPU 31 determines that no dicing device 1 is operating and drives the supply pump 12 at the set minimum rotational speed. Then, the working fluid is guided to the supply tank 15 through the return pipe 41. As a result, the machining liquid can be circulated between the supply tank 15 and the supply pump 12 without going through the dicing apparatus 1, and the supply pump 12 is stopped even when the dicing apparatus 1 is stopped. There is no need to let them.
　ＣＰＵ３１は、すべてのダイシング装置１における加工を終了したか否かを判断し（ステップＳ３１０）、ＣＰＵ３１が、まだ加工を終了していないダイシング装置１が存在すると判断した場合（ステップＳ３１０：ＮＯ）、ＣＰＵ３１は、処理をステップＳ３０２へ戻し、上述した処理を繰り返す。ＣＰＵ３１が、すべてのダイシング装置１における加工を終了したと判断した場合（ステップＳ３１０：ＹＥＳ）、ＣＰＵ３１は、処理を終了する。 CPU31 judges whether processing in all the dicing devices 1 was completed (Step S310), and when CPU31 judges that there is dicing device 1 which has not finished processing yet (Step S310: NO), CPU31 returns a process to step S302, and repeats the process mentioned above. When CPU31 judges that the process in all the dicing apparatuses 1 was complete | finished (step S310: YES), CPU31 complete | finishes a process.
　以上のように本実施の形態１によれば、インバータ制御により供給ポンプ１２の加工液の供給量を変動させることができ、ダイシング装置１の稼働台数が少ない場合、すなわち必要な加工液の供給量が所定量より少ない場合に、戻り配管４１を介して供給タンク１５へ加工液を誘導するので、加工液をダイシング装置１へ供給することなく循環させることができ、ダイシング装置１が停止している場合であっても供給ポンプ１２を停止させる必要がない。また、戻り配管４１により供給タンク１５へ加工液を戻しているので、循環している加工液と供給タンク１５に貯留されている加工液との温度差が生じることがなく、供給タンク１５内を撹拌することができるので、加工液の品質及び温度の均質化を図ることも可能となる。 As described above, according to the first embodiment, the supply amount of the machining fluid of the supply pump 12 can be changed by the inverter control, and when the number of operating dicing apparatuses 1 is small, that is, the necessary supply amount of the machining fluid. Is less than a predetermined amount, the machining liquid is guided to the supply tank 15 via the return pipe 41, so that the machining liquid can be circulated without being supplied to the dicing apparatus 1, and the dicing apparatus 1 is stopped. Even in this case, it is not necessary to stop the supply pump 12. Further, since the machining fluid is returned to the supply tank 15 by the return pipe 41, there is no temperature difference between the circulating machining fluid and the machining fluid stored in the supply tank 15, and the inside of the supply tank 15 is maintained. Since the agitation can be performed, the quality and temperature of the working fluid can be homogenized.
　（実施の形態２）
　図４は、本発明の実施の形態２に係る加工廃液循環装置の構成を示す模式図である。図４に示すように、本実施の形態２に係る加工廃液循環装置は、複数のダイシング装置（加工装置）１に加工液を供給する供給経路１１及び供給ポンプ１２を備えている。なお、加工液は、ダイシング時に発生する熱量、摩擦等を低減することができれば特に限定されるものではないが、例えば純水に溶媒として脂肪族多価アルコールを添加したものを用いれば良い。 (Embodiment 2)
FIG. 4 is a schematic diagram showing a configuration of a processing waste liquid circulation apparatus according to Embodiment 2 of the present invention. As shown in FIG. 4, the processing waste liquid circulation apparatus according to the second embodiment includes a supply path 11 and a supply pump 12 for supplying a processing liquid to a plurality of dicing apparatuses (processing apparatuses) 1. The working fluid is not particularly limited as long as the amount of heat generated during dicing, friction, and the like can be reduced. For example, a solution obtained by adding an aliphatic polyhydric alcohol as a solvent to pure water may be used.
　ダイシング装置１では、ダイサー等により半導体ウエハを切削加工する。切削屑等が含まれた使用済み加工液は、排出経路１３を通って原水槽１４に貯留される。原水槽１４に貯留された使用済み加工液はそのまま廃棄して、供給タンク（タンク）１５からダイシング装置（加工装置）１へ新たに加工液を供給しても良いし、循環させて再利用しても良い。 In the dicing apparatus 1, the semiconductor wafer is cut by a dicer or the like. The used machining fluid containing cutting waste and the like is stored in the raw water tank 14 through the discharge path 13. The used processing liquid stored in the raw water tank 14 may be discarded as it is, and the processing liquid may be newly supplied from the supply tank (tank) 15 to the dicing apparatus (processing apparatus) 1 or may be circulated and reused. May be.
　また、使用済み加工液を再利用する場合、原水槽１４に貯留された使用済み加工液を原水ポンプ１６で汲み上げてフィルタ装置１７へ送出する。フィルタ装置１７として、例えば中空糸膜等のフィルタを用いることで、使用済み加工液に含まれる切削屑等の不純物を排除することができる。 Further, when the used machining fluid is reused, the used machining fluid stored in the raw water tank 14 is pumped up by the raw water pump 16 and sent to the filter device 17. By using a filter such as a hollow fiber membrane as the filter device 17, impurities such as cutting waste contained in the used machining fluid can be eliminated.
　フィルタ装置１７で不純物を排除した使用済み加工液は、バッファタンク１９に貯留される。バッファタンク１９には、使用済み加工液の導電率を計測する導電率計（図示せず）を内部に備えてあり、導電率が所定の範囲になるよう調整するためにイオン交換装置１８が接続されている。イオン交換装置１８は、バッファタンク１９と電磁開閉弁５２を介して接続されており、制御装置３０は、導電率計で計測された導電率に応じて、電磁開閉弁５２を開閉し、使用済み加工液をイオン交換装置１８へ供給するポンプ５１を駆動／停止させる。 The used processing liquid from which impurities are removed by the filter device 17 is stored in the buffer tank 19. The buffer tank 19 is internally provided with a conductivity meter (not shown) for measuring the conductivity of the used machining fluid, and an ion exchange device 18 is connected to adjust the conductivity to a predetermined range. Has been. The ion exchange device 18 is connected to the buffer tank 19 via an electromagnetic open / close valve 52, and the control device 30 opens and closes the electromagnetic open / close valve 52 according to the conductivity measured by the conductivity meter. The pump 51 for supplying the machining fluid to the ion exchange device 18 is driven / stopped.
　導電率が所定の範囲内になるよう調整された使用済み加工液は、混合タンク２１へ誘導される。バッファタンク１９内及び混合タンク２１内には、貯留されている加工液のｐＨ値を計測する図示しないｐＨ計を備えてあり、貯留されている加工液のｐＨ値を随時計測する。なお、混合タンク２１内に導電率計を備えていても良い。混合タンク２１内に貯留されている加工液に中和剤を添加した場合に、中和剤と混合した加工液の導電率を計測することができるからである。 The used working fluid adjusted so that the electric conductivity is within a predetermined range is guided to the mixing tank 21. In the buffer tank 19 and the mixing tank 21, a pH meter (not shown) that measures the pH value of the stored machining liquid is provided, and the pH value of the stored machining liquid is measured as needed. Note that a conductivity meter may be provided in the mixing tank 21. This is because when the neutralizing agent is added to the working fluid stored in the mixing tank 21, the conductivity of the working fluid mixed with the neutralizing agent can be measured.
　制御装置３０は、ｐＨ計での計測値を検出信号として取得して、使用済み加工液のｐＨ値が所定の範囲内であるか否かを判断する。制御装置３０は、使用済み加工液のｐＨ値が所定の範囲外であると判断した場合には、ｐＨ値を調整するべく、電磁開閉弁２４を開いて混合タンク２１内に貯留されている加工液に中和剤タンク２３から中和剤を供給する。 The control device 30 acquires a measurement value obtained by the pH meter as a detection signal, and determines whether or not the pH value of the used processing liquid is within a predetermined range. When the control device 30 determines that the pH value of the used machining liquid is outside the predetermined range, the machining that is stored in the mixing tank 21 by opening the electromagnetic on-off valve 24 to adjust the pH value. The neutralizing agent is supplied from the neutralizing agent tank 23 to the liquid.
　導電率及びｐＨ値が調整された使用済み加工液は、混合タンク２１に一旦貯留され、供給タンク（タンク）１５内の加工液の残量に応じて供給タンク１５へと供給される。供給タンク１５に貯留されている再生処理された加工液は、供給ポンプ１２により、再度ダイシング装置１へ供給される。 The used processing liquid with adjusted conductivity and pH value is temporarily stored in the mixing tank 21 and supplied to the supply tank 15 according to the remaining amount of the processing liquid in the supply tank (tank) 15. The regenerated processing fluid stored in the supply tank 15 is supplied again to the dicing apparatus 1 by the supply pump 12.
　本実施の形態２では、実施の形態１と同様、供給タンク１５に加工液を戻す戻り配管４１を供給経路１１の中途に備えている。戻り配管４１の手前には、戻り配管４１を介して供給タンク１５と供給ポンプ１２との間を循環する加工液の圧力及び流量を計測する圧力計４２及び流量計４３を設けてある。事前に把握しておいたダイシング装置１の稼働台数と加工液の圧力又は流量との関係と、計測した加工液の圧力及び流量とにより、ダイシング装置１の稼働台数を推定することができる。すなわち、制御装置３０は、圧力計４２及び流量計４３から圧力及び流量の計測値を取得し、取得した計測値に基づいてダイシング装置１の稼働台数を推定し、推定した稼働台数に応じてインバータ４０へ指示信号を送信し、供給ポンプ１２の動作を制御する。 In the second embodiment, as in the first embodiment, a return pipe 41 for returning the processing liquid to the supply tank 15 is provided in the middle of the supply path 11. A pressure gauge 42 and a flow meter 43 for measuring the pressure and flow rate of the working fluid circulating between the supply tank 15 and the supply pump 12 via the return pipe 41 are provided in front of the return pipe 41. The number of operating dicing apparatuses 1 can be estimated from the relationship between the number of operating dicing apparatuses 1 and the pressure or flow rate of the working fluid, which have been grasped in advance, and the measured pressure and flow rate of the working liquid. That is, the control device 30 acquires pressure and flow measurement values from the pressure gauge 42 and the flow meter 43, estimates the number of operating dicing devices 1 based on the acquired measurement values, and inverters according to the estimated operation number An instruction signal is transmitted to 40 to control the operation of the supply pump 12.
　図５は、本発明の実施の形態２に係る加工廃液循環装置の制御装置３０の構成を示すブロック図である。図５に示すように、制御装置３０はコンピュータによって構成されており、少なくとも制御プログラムに従って演算処理するＣＰＵ３１、制御プログラム等を記憶するメモリ３２、記憶装置３３、入力インタフェース３４、及び出力インタフェース３５を備えている。 FIG. 5 is a block diagram showing the configuration of the control device 30 of the processing waste liquid circulation device according to the second embodiment of the present invention. As shown in FIG. 5, the control device 30 is configured by a computer, and includes at least a CPU 31 that performs arithmetic processing according to a control program, a memory 32 that stores a control program, a storage device 33, an input interface 34, and an output interface 35. ing.
　入力インタフェース３４には、導電率計、ｐＨ計等からの検出信号、入力装置３６からの入力信号、圧力計４２及び流量計４３からの検出信号が入力される。出力インタフェース３５からは、供給ポンプ１２、原水ポンプ１６、加工液をイオン交換装置１８へ供給するポンプ５１、イオン交換装置１８への経路を開閉する電磁開閉弁５２、混合タンク２１へ中和剤を供給する経路を開閉する電磁開閉弁２４の他、供給ポンプ１２の動作を制御するインバータ４０へ制御信号を出力する。 The detection signal from the conductivity meter, pH meter, etc., the input signal from the input device 36, the detection signal from the pressure gauge 42 and the flow meter 43 are input to the input interface 34. From the output interface 35, the supply pump 12, the raw water pump 16, the pump 51 that supplies the working fluid to the ion exchange device 18, the electromagnetic on-off valve 52 that opens and closes the path to the ion exchange device 18, and the neutralizing agent to the mixing tank 21. In addition to the electromagnetic on-off valve 24 that opens and closes the supply path, a control signal is output to the inverter 40 that controls the operation of the supply pump 12.
　図６は、本発明の実施の形態２に係る加工廃液循環装置の制御装置３０のＣＰＵ３１の処理手順を示すフローチャートである。図６において、制御装置３０のＣＰＵ３１は、圧力計４２及び流量計４３から圧力及び流量の計測値を取得して（ステップＳ６０１）、事前に把握しておいたダイシング装置１の稼働台数と加工液の圧力又は流量との関係と、取得した圧力及び流量の計測値に基づいて、ダイシング装置１の稼働台数を推定する（ステップＳ６０２）。ダイシング装置１へ加工液を供給していれば、戻り配管４１を循環する加工液の流量が減少し、圧力が低下するので、計測した加工液の圧力及び流量によりダイシング装置１の稼働台数を容易に推定することができる。 FIG. 6 is a flowchart showing a processing procedure of the CPU 31 of the control device 30 of the processing waste liquid circulation device according to Embodiment 2 of the present invention. In FIG. 6, the CPU 31 of the control device 30 acquires pressure and flow measurement values from the pressure gauge 42 and the flow meter 43 (step S <b> 601), and knows in advance the number of operating dicing devices 1 and the machining fluid. The number of operating dicing apparatuses 1 is estimated on the basis of the relationship between the pressure and the flow rate and the measured values of the acquired pressure and flow rate (step S602). If the machining fluid is supplied to the dicing device 1, the flow rate of the machining fluid circulating through the return pipe 41 is reduced and the pressure is lowered. Therefore, the number of dicing devices 1 that are operated can be easily determined by the measured pressure and flow rate of the machining fluid. Can be estimated.
　ＣＰＵ３１は、推定した稼働台数が０であるか否かを判断する（ステップＳ６０３）。ＣＰＵ３１が、推定した稼働台数が０ではないと判断した場合（ステップＳ６０３：ＮＯ）、ＣＰＵ３１は、少なくとも１台のダイシング装置１は稼働していると判断し、推定した稼働台数に応じて必要な加工液の供給量を算出して（ステップＳ６０４）、インバータ４０へ供給ポンプ１２を駆動する指示信号を送信する（ステップＳ６０５）。これにより、供給ポンプ１２がダイシング装置１の稼働台数に応じた回転数で駆動する。 CPU31 judges whether the estimated operation number is 0 (step S603). When the CPU 31 determines that the estimated operating number is not 0 (step S603: NO), the CPU 31 determines that at least one dicing apparatus 1 is operating, and is necessary depending on the estimated operating number. A supply amount of the machining fluid is calculated (step S604), and an instruction signal for driving the supply pump 12 is transmitted to the inverter 40 (step S605). As a result, the supply pump 12 is driven at a rotational speed corresponding to the number of operating dicing apparatuses 1.
　ＣＰＵ３１が、推定した稼働台数が０であると判断した場合（ステップＳ６０３：ＹＥＳ）、ＣＰＵ３１は、１台もダイシング装置１が稼働していないと判断して、供給ポンプ１２を設定された最小回転数で駆動させ、戻り配管４１を介して供給タンク１５へ加工液を誘導させる。ＣＰＵ３１は、すべてのダイシング装置１における加工を終了したか否かを判断し（ステップＳ６０６）、ＣＰＵ３１が、まだ加工を終了していないダイシング装置１が存在すると判断した場合（ステップＳ６０６：ＮＯ）、ＣＰＵ３１は、処理をステップＳ６０１へ戻し、上述した処理を繰り返す。ＣＰＵ３１が、すべてのダイシング装置１における加工を終了したと判断した場合（ステップＳ６０６：ＹＥＳ）、ＣＰＵ３１は、処理を終了する。 When the CPU 31 determines that the estimated number of operating units is 0 (step S603: YES), the CPU 31 determines that no dicing device 1 is operating, and the supply pump 12 is set to the minimum rotation. The machining liquid is guided to the supply tank 15 through the return pipe 41. The CPU 31 determines whether or not the processing in all the dicing apparatuses 1 has been completed (step S606), and when the CPU 31 determines that there is a dicing apparatus 1 that has not yet completed processing (step S606: NO), CPU31 returns a process to step S601, and repeats the process mentioned above. When CPU31 judges that the process in all the dicing apparatuses 1 was complete | finished (step S606: YES), CPU31 complete | finishes a process.
　以上のように本実施の形態２によれば、インバータ制御により供給ポンプ１２の加工液の供給量を変動させることができ、戻り配管４１を介して供給タンク１５と供給ポンプ１２との間を循環する加工液の圧力及び流量の計測値に基づいてダイシング装置１の稼働台数を推定し、必要な加工液の供給量を算出するので、ダイシング装置１が稼働しているか否かに関係なく供給ポンプ１２を動かし続けることができるとともに、推定した稼働台数に応じて必要な量の加工液をダイシング装置１へ供給することができる。また、戻り配管４１により供給タンク１５へ加工液を戻しているので、循環している加工液と供給タンク１５に貯留されている加工液との温度差が生じることがなく、供給タンク１５内を撹拌することができるので、加工液の品質及び温度の均質化を図ることも可能となる。 As described above, according to the second embodiment, the amount of the processing fluid supplied from the supply pump 12 can be varied by inverter control, and is circulated between the supply tank 15 and the supply pump 12 via the return pipe 41. Since the number of operating dicing devices 1 is estimated based on the measured values of the pressure and flow rate of the working fluid to be calculated, and the required amount of working fluid is calculated, the supply pump regardless of whether the dicing device 1 is operating 12 can continue to move, and a required amount of machining fluid can be supplied to the dicing apparatus 1 according to the estimated number of operating units. Further, since the machining fluid is returned to the supply tank 15 by the return pipe 41, there is no temperature difference between the circulating machining fluid and the machining fluid stored in the supply tank 15, and the inside of the supply tank 15 is maintained. Since the agitation can be performed, the quality and temperature of the working fluid can be homogenized.
　その他、本発明は上記実施例に限定されるものではなく、本発明の趣旨の範囲内であれば多種の変形、置換等が可能であることは言うまでもない。例えば加工装置は、ダイシング装置に限定するものではなく、ウエハ等を薄くするグラインダ、あるいはフライス、旋盤、平面研削盤、ラップ等の工作機械に適用することも可能である。 In addition, the present invention is not limited to the above-described embodiments, and it goes without saying that various modifications and substitutions are possible within the scope of the present invention. For example, the processing apparatus is not limited to a dicing apparatus, and can be applied to a grinder that thins a wafer or the like, or a machine tool such as a milling machine, a lathe, a surface grinding machine, or a lapping machine.
　１　ダイシング装置（加工装置）
　１５　供給タンク（タンク）
　３０　制御装置（制御手段）
　４０　インバータ
　４１　戻り配管
　４２　圧力計
　４３　流量計
　４４　電磁開閉弁 1 Dicing equipment (processing equipment)
15 Supply tank (tank)
30 Control device (control means)
40 Inverter 41 Return piping 42 Pressure gauge 43 Flow meter 44 Electromagnetic on-off valve

Claims (4)

  1. 　加工装置へ加工液を供給し、使用済みの加工液を再生処理して前記加工装置へ再度供給する加工廃液循環装置であって、
    　再生処理された加工液を貯留するタンクと、
    　再生処理された加工液を、再度、前記加工装置へ供給する供給ポンプと、
    　前記加工装置へ加工液を供給する供給経路と、
    　該供給経路の中途から前記タンクへ加工液を戻す戻り配管と
    　を備え、
    　インバータ制御により前記供給ポンプの加工液の供給量を変動させることができ、加工液の供給量が所定量より少ない場合、前記戻り配管を介して前記タンクへ加工液を誘導させる制御手段を有することを特徴とする加工廃液循環装置。     A processing waste liquid circulation device that supplies a processing fluid to a processing device, regenerates a used processing fluid, and supplies the processing fluid again to the processing device,
    A tank for storing the regenerated processing fluid;
    A supply pump for supplying the reprocessed processing liquid to the processing apparatus again;
    A supply path for supplying a processing liquid to the processing apparatus;
    A return pipe for returning the machining fluid to the tank from the middle of the supply path,
    It is possible to vary the supply amount of the machining fluid of the supply pump by inverter control, and when the supply amount of the machining fluid is less than a predetermined amount, control means for guiding the machining fluid to the tank via the return pipe is provided. Processing waste liquid circulation device characterized by.
  2. 　前記戻り配管への経路を開閉する電磁開閉弁を設けてあり、前記制御手段は、加工液の供給量が所定量より少ない場合、前記電磁開閉弁を開かせることを特徴とする請求項１記載の加工廃液循環装置。 2. An electromagnetic on-off valve that opens and closes a path to the return pipe is provided, and the control means opens the electromagnetic on-off valve when the amount of machining fluid supplied is less than a predetermined amount. Processing waste liquid circulation device.
  3. 　前記制御手段は、前記加工装置から加工液の供給要求を受け付け、
    　受け付けた供給要求に応じて加工液の供給量を変動させることを特徴とする請求項１又は２に記載の加工廃液循環装置。     The control means receives a supply request for a machining fluid from the machining apparatus,
    The processing waste fluid circulation device according to claim 1, wherein the supply amount of the processing fluid is varied in accordance with the received supply request.
  4. 　前記戻り配管の手前に圧力計及び流量計を設けてあり、
    　前記制御手段は、前記圧力計及び前記流量計の計測値に基づいて、加工液の供給量を変動させることを特徴とする請求項１又は２に記載の加工廃液循環装置。     A pressure gauge and a flow meter are provided in front of the return pipe,
    The processing waste fluid circulation apparatus according to claim 1, wherein the control unit varies a supply amount of the processing fluid based on measurement values of the pressure gauge and the flow meter.
PCT/JP2012/069805 2011-10-20 2012-08-03 Waste working fluid recirculation apparatus WO2013058004A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2011-230845 2011-10-20
JP2011230845 2011-10-20

Publications (1)

Publication Number Publication Date
WO2013058004A1 true WO2013058004A1 (en) 2013-04-25

Family

ID=48140661

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2012/069805 WO2013058004A1 (en) 2011-10-20 2012-08-03 Waste working fluid recirculation apparatus

Country Status (1)

Country Link
WO (1) WO2013058004A1 (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015077673A (en) * 2013-10-18 2015-04-23 株式会社ノリタケカンパニーリミテド Coolant circulation device
JP2016149403A (en) * 2015-02-10 2016-08-18 株式会社ディスコ Cutting device
CN111805775A (en) * 2020-06-09 2020-10-23 徐州鑫晶半导体科技有限公司 Mortar supply method, mortar supply equipment and crystal bar cutting system
WO2022004538A1 (en) * 2020-06-30 2022-01-06 ファナック株式会社 Machine tool
JP7052126B1 (en) * 2021-06-29 2022-04-11 Dmg森精機株式会社 Machine tool coolant preheating device and machine tool coolant preheating method

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07127565A (en) * 1993-10-29 1995-05-16 Toyooki Kogyo Co Ltd Pumping device for coolant
JPH105512A (en) * 1996-06-20 1998-01-13 Nisshin Koki Kk Filter and filtration system
JPH11138051A (en) * 1997-11-11 1999-05-25 Nikuni:Kk Liquid treatment apparatus
JPH11254266A (en) * 1998-03-05 1999-09-21 Fanuc Ltd Machine tool provided with through-spindle oil feeder
JP2002224931A (en) * 2001-01-29 2002-08-13 Disco Abrasive Syst Ltd Machining fluid supplying system
US20060053026A1 (en) * 2004-09-07 2006-03-09 Unist, Inc. Machine lubricant and coolant distribution system
JP2011031342A (en) * 2009-08-03 2011-02-17 Honda Motor Co Ltd Coolant feeder

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07127565A (en) * 1993-10-29 1995-05-16 Toyooki Kogyo Co Ltd Pumping device for coolant
JPH105512A (en) * 1996-06-20 1998-01-13 Nisshin Koki Kk Filter and filtration system
JPH11138051A (en) * 1997-11-11 1999-05-25 Nikuni:Kk Liquid treatment apparatus
JPH11254266A (en) * 1998-03-05 1999-09-21 Fanuc Ltd Machine tool provided with through-spindle oil feeder
JP2002224931A (en) * 2001-01-29 2002-08-13 Disco Abrasive Syst Ltd Machining fluid supplying system
US20060053026A1 (en) * 2004-09-07 2006-03-09 Unist, Inc. Machine lubricant and coolant distribution system
JP2011031342A (en) * 2009-08-03 2011-02-17 Honda Motor Co Ltd Coolant feeder

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2015077673A (en) * 2013-10-18 2015-04-23 株式会社ノリタケカンパニーリミテド Coolant circulation device
JP2016149403A (en) * 2015-02-10 2016-08-18 株式会社ディスコ Cutting device
CN111805775A (en) * 2020-06-09 2020-10-23 徐州鑫晶半导体科技有限公司 Mortar supply method, mortar supply equipment and crystal bar cutting system
WO2022004538A1 (en) * 2020-06-30 2022-01-06 ファナック株式会社 Machine tool
JP7381754B2 (en) 2020-06-30 2023-11-15 ファナック株式会社 Machine Tools
JP7052126B1 (en) * 2021-06-29 2022-04-11 Dmg森精機株式会社 Machine tool coolant preheating device and machine tool coolant preheating method
WO2023276859A1 (en) * 2021-06-29 2023-01-05 Dmg森精機株式会社 Coolant preheating device for machine tool and coolant preheating method for machine tool

Similar Documents

Publication Publication Date Title
WO2013058004A1 (en) Waste working fluid recirculation apparatus
JP7440183B2 (en) Advanced fluid handling methods and systems
US6183352B1 (en) Slurry recycling apparatus and slurry recycling method for chemical-mechanical polishing technique
WO2013164942A1 (en) Etching method, etching device and storage medium
US20030104959A1 (en) Chemical solution feeding apparatus and method for preparing slurry
JP2021169083A5 (en)
JP6290762B2 (en) Flow rate adjusting mechanism, diluted chemical supply mechanism, liquid processing apparatus, and operation method thereof
KR100639710B1 (en) Method for liquid mixing supply
WO2013054576A1 (en) Waste machining fluid treatment device and waste machining fluid treatment method
US20160233106A1 (en) Etching method, etching apparatus, and storage medium
CN105629887A (en) Controller for controlling machine tool having cutting condition change function
KR101263537B1 (en) Point-of-use process control blender systems and corresponding methods
JP2013175592A (en) Liquid processing device, liquid processing method, and storage medium storing computer program for performing liquid processing method
JP6318074B2 (en) Coolant liquid replenishment method and apparatus
US20240009803A1 (en) Slurry dispersion system with real time control
WO2018163908A1 (en) Cooling water supply system for laser processing head and method for supplying cooling water to laser processing head
WO2013054577A1 (en) Waste machining fluid circulation device and waste machining fluid circulation method
WO2013057992A1 (en) Waste working fluid recirculation apparatus
CN109571227B (en) Polishing solution supply system, method and polishing system
JP2012192512A (en) Electric discharge machine
JP2005313266A (en) Slurry feeding device, and feeding method
CN111696889A (en) Mixing device, mixing method, and substrate processing system
JP2020087985A (en) Substrate processing apparatus and substrate processing method
JP6121349B2 (en) Diluted chemical liquid supply apparatus, substrate liquid processing apparatus, and flow rate control method
JP6545841B2 (en) Flow rate adjustment mechanism, diluted chemical solution supply mechanism, liquid processing apparatus and operation method thereof

Legal Events

Date Code Title Description
121 Ep: the epo has been informed by wipo that ep was designated in this application

Ref document number: 12842074

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: DE

122 Ep: pct application non-entry in european phase

Ref document number: 12842074

Country of ref document: EP

Kind code of ref document: A1

NENP Non-entry into the national phase

Ref country code: JP