JP6440260B2 - 格納室を有する伸縮性電子システム - Google Patents

格納室を有する伸縮性電子システム Download PDF

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Publication number
JP6440260B2
JP6440260B2 JP2015557038A JP2015557038A JP6440260B2 JP 6440260 B2 JP6440260 B2 JP 6440260B2 JP 2015557038 A JP2015557038 A JP 2015557038A JP 2015557038 A JP2015557038 A JP 2015557038A JP 6440260 B2 JP6440260 B2 JP 6440260B2
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Prior art keywords
substrate
containment
electronic device
modulus
device component
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Expired - Fee Related
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JP2015557038A
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Japanese (ja)
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JP2016509759A5 (https=
JP2016509759A (ja
Inventor
ジョン エー． ロジャース，
ジョン エー． ロジャース，
シェン シュウ，
シェン シュウ，
ジョナサン エー． ファン，
ジョナサン エー． ファン，
ヨンカン ホァン，
ヨンカン ホァン，
イーフイ チャン，
イーフイ チャン，
リン ジア，
リン ジア，
Original Assignee
ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ
ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ
ノースウェスタン ユニバーシティ
ノースウェスタン ユニバーシティ
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Priority claimed from US13/835,284 external-priority patent/US10497633B2/en
Application filed by ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ, ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ, ノースウェスタン ユニバーシティ, ノースウェスタン ユニバーシティ filed Critical ザ ボード オブ トラスティーズ オブ ザ ユニヴァーシティー オブ イリノイ
Publication of JP2016509759A publication Critical patent/JP2016509759A/ja
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0277—Bendability or stretchability details
    • H05K1/0283—Stretchable printed circuits
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/62—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their interconnections
    • H10W70/65—Shapes or dispositions of interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/688—Flexible insulating substrates
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H10W70/67—Insulating or insulated package substrates; Interposers; Redistribution layers characterised by their insulating layers or insulating parts
    • H10W70/69—Insulating materials thereof
    • H10W70/695—Organic materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09218—Conductive traces
    • H05K2201/09263—Meander
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

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  • Microelectronics & Electronic Packaging (AREA)
  • Engineering & Computer Science (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Secondary Cells (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Structure Of Printed Boards (AREA)
  • Micromachines (AREA)
  • Battery Mounting, Suspending (AREA)
  • Connection Of Batteries Or Terminals (AREA)
  • Thin Film Transistor (AREA)
  • Details Of Aerials (AREA)
  • Casings For Electric Apparatus (AREA)
  • Thermistors And Varistors (AREA)
JP2015557038A 2013-02-06 2014-02-05 格納室を有する伸縮性電子システム Expired - Fee Related JP6440260B2 (ja)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
US201361761412P 2013-02-06 2013-02-06
US61/761,412 2013-02-06
US13/835,284 2013-03-15
US13/835,284 US10497633B2 (en) 2013-02-06 2013-03-15 Stretchable electronic systems with fluid containment
US201461930732P 2014-01-23 2014-01-23
US61/930,732 2014-01-23
PCT/US2014/014944 WO2014124049A2 (en) 2013-02-06 2014-02-05 Stretchable electronic systems with containment chambers

Publications (3)

Publication Number Publication Date
JP2016509759A JP2016509759A (ja) 2016-03-31
JP2016509759A5 JP2016509759A5 (https=) 2017-03-16
JP6440260B2 true JP6440260B2 (ja) 2018-12-19

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Family Applications (2)

Application Number Title Priority Date Filing Date
JP2015557038A Expired - Fee Related JP6440260B2 (ja) 2013-02-06 2014-02-05 格納室を有する伸縮性電子システム
JP2015557036A Pending JP2016520986A (ja) 2013-02-06 2014-02-05 伸縮性エレクトロニクス用の自己相似フラクタルデザイン

Family Applications After (1)

Application Number Title Priority Date Filing Date
JP2015557036A Pending JP2016520986A (ja) 2013-02-06 2014-02-05 伸縮性エレクトロニクス用の自己相似フラクタルデザイン

Country Status (6)

Country Link
EP (2) EP2954762B1 (https=)
JP (2) JP6440260B2 (https=)
KR (2) KR20150125946A (https=)
CN (2) CN105340369A (https=)
CA (2) CA2900583A1 (https=)
WO (2) WO2014124049A2 (https=)

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* Cited by examiner, † Cited by third party
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