JP6433159B2 - 情報処理装置、方法及びプログラム - Google Patents

情報処理装置、方法及びプログラム Download PDF

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Publication number
JP6433159B2
JP6433159B2 JP2014112746A JP2014112746A JP6433159B2 JP 6433159 B2 JP6433159 B2 JP 6433159B2 JP 2014112746 A JP2014112746 A JP 2014112746A JP 2014112746 A JP2014112746 A JP 2014112746A JP 6433159 B2 JP6433159 B2 JP 6433159B2
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power supply
die
information
package
specified
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JP2014112746A
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Japanese (ja)
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JP2015228078A5 (enExample
JP2015228078A (ja
Inventor
俊孝 野島
俊孝 野島
俊智 定松
俊智 定松
伸一 濱
伸一 濱
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Canon Inc
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Canon Inc
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Priority to JP2014112746A priority Critical patent/JP6433159B2/ja
Priority to US14/722,549 priority patent/US10339257B2/en
Publication of JP2015228078A publication Critical patent/JP2015228078A/ja
Publication of JP2015228078A5 publication Critical patent/JP2015228078A5/ja
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    • G—PHYSICS
    • G06—COMPUTING OR CALCULATING; COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F30/00—Computer-aided design [CAD]
    • G06F30/30—Circuit design
    • G06F30/39—Circuit design at the physical level
    • G06F30/398—Design verification or optimisation, e.g. using design rule check [DRC], layout versus schematics [LVS] or finite element methods [FEM]

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Evolutionary Computation (AREA)
  • Geometry (AREA)
  • General Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
JP2014112746A 2014-05-30 2014-05-30 情報処理装置、方法及びプログラム Active JP6433159B2 (ja)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP2014112746A JP6433159B2 (ja) 2014-05-30 2014-05-30 情報処理装置、方法及びプログラム
US14/722,549 US10339257B2 (en) 2014-05-30 2015-05-27 Information processing apparatus, method, and storage medium

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2014112746A JP6433159B2 (ja) 2014-05-30 2014-05-30 情報処理装置、方法及びプログラム

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JP2015228078A JP2015228078A (ja) 2015-12-17
JP2015228078A5 JP2015228078A5 (enExample) 2017-06-29
JP6433159B2 true JP6433159B2 (ja) 2018-12-05

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JP2014112746A Active JP6433159B2 (ja) 2014-05-30 2014-05-30 情報処理装置、方法及びプログラム

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US (1) US10339257B2 (enExample)
JP (1) JP6433159B2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6645114B2 (ja) * 2015-10-16 2020-02-12 富士通株式会社 設計支援プログラム、情報処理装置、および設計支援方法
KR102116038B1 (ko) * 2017-02-02 2020-05-27 주식회사 엘지화학 접지 커패시터 선정 장치 및 방법
US10783307B1 (en) * 2018-12-12 2020-09-22 Cadence Design Systems, Inc. System and method for power-grid aware simulation of an IC-package schematic
WO2023188051A1 (ja) 2022-03-30 2023-10-05 三菱電機株式会社 プリント基板の設計支援システム、設計支援方法、プログラム、及び記録媒体
CN119895423A (zh) * 2023-03-20 2025-04-25 株式会社村田制作所 基板设计辅助装置、基板设计辅助系统以及与电路信息相关的数据结构

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3183340B2 (ja) * 1998-09-29 2001-07-09 日本電気株式会社 パスコンの有効性チェック方法および装置
US6405357B1 (en) * 2000-05-02 2002-06-11 Advanced Semiconductor Engineering, Inc. Method for positioning bond pads in a semiconductor die
JP2002016337A (ja) 2000-06-29 2002-01-18 Sony Corp プリント基板の配線構造チェックシステム
WO2004111890A1 (ja) * 2003-06-16 2004-12-23 Nec Corporation プリント回路配線基板設計支援装置及びプリント回路基板設計方法並びにそのプログラム
US7464348B1 (en) * 2005-09-30 2008-12-09 Cadence Design Systems, Inc. Method and system for mapping source elements to destination elements as interconnect routing assignments
JP5253244B2 (ja) * 2009-03-12 2013-07-31 キヤノン株式会社 プリント基板設計支援プログラム、方法及び装置

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US20150347668A1 (en) 2015-12-03
US10339257B2 (en) 2019-07-02
JP2015228078A (ja) 2015-12-17

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