JP6419069B2 - 温度制御統合圧電性共振器 - Google Patents

温度制御統合圧電性共振器 Download PDF

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JP6419069B2
JP6419069B2 JP2015515251A JP2015515251A JP6419069B2 JP 6419069 B2 JP6419069 B2 JP 6419069B2 JP 2015515251 A JP2015515251 A JP 2015515251A JP 2015515251 A JP2015515251 A JP 2015515251A JP 6419069 B2 JP6419069 B2 JP 6419069B2
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layer
resonator
piezoelectric
integrated
temperature
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Japanese (ja)
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JP2015519848A5 (enExample
JP2015519848A (ja
Inventor
エヌ バージェス バイロン
エヌ バージェス バイロン
アール クレニック ウィリアム
アール クレニック ウィリアム
エム ヤコブセン スチュアート
エム ヤコブセン スチュアート
Original Assignee
日本テキサス・インスツルメンツ株式会社
テキサス インスツルメンツ インコーポレイテッド
テキサス インスツルメンツ インコーポレイテッド
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    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/02—Details
    • H03H9/02007—Details of bulk acoustic wave devices
    • H03H9/02086—Means for compensation or elimination of undesirable effects
    • H03H9/02102—Means for compensation or elimination of undesirable effects of temperature influence
    • H—ELECTRICITY
    • H03—ELECTRONIC CIRCUITRY
    • H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
    • H03H9/00—Networks comprising electromechanical or electro-acoustic elements; Electromechanical resonators
    • H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
    • H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
    • H03H9/171—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator implemented with thin-film techniques, i.e. of the film bulk acoustic resonator [FBAR] type
    • H03H9/172—Means for mounting on a substrate, i.e. means constituting the material interface confining the waves to a volume
    • H03H9/175—Acoustic mirrors

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  • Physics & Mathematics (AREA)
  • Acoustics & Sound (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Oscillators With Electromechanical Resonators (AREA)
JP2015515251A 2012-05-31 2013-05-31 温度制御統合圧電性共振器 Active JP6419069B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US13/484,961 2012-05-31
US13/484,961 US9240767B2 (en) 2012-05-31 2012-05-31 Temperature-controlled integrated piezoelectric resonator apparatus
PCT/US2013/043657 WO2013181562A1 (en) 2012-05-31 2013-05-31 Temperature-controlled integrated piezoelectric resonator

Publications (3)

Publication Number Publication Date
JP2015519848A JP2015519848A (ja) 2015-07-09
JP2015519848A5 JP2015519848A5 (enExample) 2016-06-16
JP6419069B2 true JP6419069B2 (ja) 2018-11-07

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Family Applications (1)

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JP2015515251A Active JP6419069B2 (ja) 2012-05-31 2013-05-31 温度制御統合圧電性共振器

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US (1) US9240767B2 (enExample)
JP (1) JP6419069B2 (enExample)
CN (1) CN104321893B (enExample)
WO (1) WO2013181562A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11289246B2 (en) 2019-05-23 2022-03-29 Seiko Epson Corporation Vibrator device, electronic apparatus, and vehicle

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TWI538395B (zh) * 2014-05-07 2016-06-11 國立清華大學 主動式溫度補償共振器結構
WO2015190322A1 (ja) * 2014-06-12 2015-12-17 株式会社村田製作所 圧電デバイス
US10778180B2 (en) * 2015-12-10 2020-09-15 Qorvo Us, Inc. Bulk acoustic wave resonator with a modified outside stack portion
US9965930B1 (en) * 2017-03-16 2018-05-08 Apple Inc. Electronic device including piezoelectric material layer and temperature compensation circuitry and related methods
WO2019056553A1 (zh) * 2017-09-22 2019-03-28 安徽安努奇科技有限公司 压电谐振器的制备方法和压电谐振器
DE102017129160B3 (de) * 2017-12-07 2019-01-31 RF360 Europe GmbH Elektroakustisches Resonatorbauelement und Verfahren zu dessen Herstellung
US11563419B1 (en) * 2018-10-18 2023-01-24 Hrl Laboratories, Llc Piezoelectric resonator with multiple electrode sections
TWI810698B (zh) * 2019-06-12 2023-08-01 美商特拉華公司 電極界定未懸掛之聲波共振器
CN111010115A (zh) * 2019-08-09 2020-04-14 天津大学 体声波谐振器、滤波器和电子设备及控制谐振器温度的方法
CN116263342A (zh) * 2021-12-14 2023-06-16 苏州汉天下电子有限公司 一种体声波传感器及其制造方法

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JPS62245811A (ja) * 1986-04-18 1987-10-27 Nippon Dempa Kogyo Co Ltd 恒温型圧電振動子
US5283458A (en) * 1992-03-30 1994-02-01 Trw Inc. Temperature stable semiconductor bulk acoustic resonator
US5696423A (en) * 1995-06-29 1997-12-09 Motorola, Inc. Temperature compenated resonator and method
US6060692A (en) * 1998-09-02 2000-05-09 Cts Corporation Low power compact heater for piezoelectric device
JP3801083B2 (ja) * 2001-06-06 2006-07-26 株式会社村田製作所 弾性表面波装置
DE10251876B4 (de) * 2002-11-07 2008-08-21 Infineon Technologies Ag BAW-Resonator mit akustischem Reflektor und Filterschaltung
KR100502569B1 (ko) 2003-04-15 2005-07-20 박희대 선택형 블라그 반사층을 이용한 fbar 필터
FR2857785B1 (fr) * 2003-07-17 2005-10-21 Commissariat Energie Atomique Resonateur acoustique de volume a frequence de resonance ajustee et procede de realisation
US7362198B2 (en) 2003-10-30 2008-04-22 Avago Technologies Wireless Ip (Singapore) Pte. Ltd Pass bandwidth control in decoupled stacked bulk acoustic resonator devices
US7332985B2 (en) * 2003-10-30 2008-02-19 Avago Technologies Wireless Ip (Singapore) Pte Ltd. Cavity-less film bulk acoustic resonator (FBAR) devices
DE102005043037B4 (de) 2005-09-09 2009-04-09 Siemens Ag Vorrichtung mit piezoakustischem Resonatorelement, Verfahren zu dessen Herstellung und Verfahren zur Ausgabe eines Signals in Abhängigkeit einer Resonanzfrequenz
DE102005043039B4 (de) * 2005-09-09 2008-10-30 Siemens Ag Vorrichtung mit piezoakustischem Resonatorelement, Verfahren zu dessen Herstellung und Verfahren zur Ausgabe eines Signals in Abhängigkeit einer Resonanzfrequenz
US7463118B2 (en) * 2006-06-09 2008-12-09 Texas Instruments Incorporated Piezoelectric resonator with an efficient all-dielectric Bragg reflector
US7898365B2 (en) * 2006-09-06 2011-03-01 Raytheon Company Integrated saw device heater
US7385334B1 (en) * 2006-11-20 2008-06-10 Sandia Corporation Contour mode resonators with acoustic reflectors
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KR101155989B1 (ko) * 2007-06-21 2012-06-18 삼성전자주식회사 잉크젯 프린트헤드의 제조방법
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11289246B2 (en) 2019-05-23 2022-03-29 Seiko Epson Corporation Vibrator device, electronic apparatus, and vehicle

Also Published As

Publication number Publication date
US20130321101A1 (en) 2013-12-05
CN104321893B (zh) 2017-09-22
CN104321893A (zh) 2015-01-28
US9240767B2 (en) 2016-01-19
JP2015519848A (ja) 2015-07-09
WO2013181562A1 (en) 2013-12-05

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