JP6399776B2 - 封止方法及びそれに関連するデバイス - Google Patents
封止方法及びそれに関連するデバイス Download PDFInfo
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- JP6399776B2 JP6399776B2 JP2014057935A JP2014057935A JP6399776B2 JP 6399776 B2 JP6399776 B2 JP 6399776B2 JP 2014057935 A JP2014057935 A JP 2014057935A JP 2014057935 A JP2014057935 A JP 2014057935A JP 6399776 B2 JP6399776 B2 JP 6399776B2
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- 238000007789 sealing Methods 0.000 title claims description 80
- 238000000034 method Methods 0.000 title claims description 28
- NRTOMJZYCJJWKI-UHFFFAOYSA-N Titanium nitride Chemical compound [Ti]#N NRTOMJZYCJJWKI-UHFFFAOYSA-N 0.000 claims description 53
- 229910052751 metal Inorganic materials 0.000 claims description 36
- 239000002184 metal Substances 0.000 claims description 36
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 claims description 28
- 238000000231 atomic layer deposition Methods 0.000 claims description 23
- 238000000151 deposition Methods 0.000 claims description 21
- 230000008021 deposition Effects 0.000 claims description 12
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 10
- 238000005240 physical vapour deposition Methods 0.000 claims description 9
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- 229910052804 chromium Inorganic materials 0.000 claims description 7
- 239000011651 chromium Substances 0.000 claims description 7
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 claims description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 5
- 229910052802 copper Inorganic materials 0.000 claims description 5
- 239000010949 copper Substances 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 4
- 239000000956 alloy Substances 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000004377 microelectronic Methods 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 173
- 239000000758 substrate Substances 0.000 description 12
- 238000005229 chemical vapour deposition Methods 0.000 description 5
- 229910016570 AlCu Inorganic materials 0.000 description 4
- 238000005566 electron beam evaporation Methods 0.000 description 4
- 238000001755 magnetron sputter deposition Methods 0.000 description 4
- 230000005693 optoelectronics Effects 0.000 description 4
- 229910000881 Cu alloy Inorganic materials 0.000 description 3
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 3
- 239000002356 single layer Substances 0.000 description 3
- 239000010409 thin film Substances 0.000 description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 239000012707 chemical precursor Substances 0.000 description 2
- 238000004320 controlled atmosphere Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002149 energy-dispersive X-ray emission spectroscopy Methods 0.000 description 2
- 239000012212 insulator Substances 0.000 description 2
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 229910000952 Be alloy Inorganic materials 0.000 description 1
- LTHNHFOGQMKPOV-UHFFFAOYSA-N CCCCC(CC)CN Chemical compound CCCCC(CC)CN LTHNHFOGQMKPOV-UHFFFAOYSA-N 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- WPPDFTBPZNZZRP-UHFFFAOYSA-N aluminum copper Chemical compound [Al].[Cu] WPPDFTBPZNZZRP-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 229910003437 indium oxide Inorganic materials 0.000 description 1
- PJXISJQVUVHSOJ-UHFFFAOYSA-N indium(iii) oxide Chemical compound [O-2].[O-2].[O-2].[In+3].[In+3] PJXISJQVUVHSOJ-UHFFFAOYSA-N 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 229920000620 organic polymer Polymers 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 239000002243 precursor Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- LIVNPJMFVYWSIS-UHFFFAOYSA-N silicon monoxide Chemical compound [Si-]#[O+] LIVNPJMFVYWSIS-UHFFFAOYSA-N 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000004627 transmission electron microscopy Methods 0.000 description 1
- 238000001771 vacuum deposition Methods 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
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- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
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- H01L31/02—Details
- H01L31/0203—Containers; Encapsulations, e.g. encapsulation of photodiodes
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
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- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
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- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
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- H10K59/17—Passive-matrix OLED displays
- H10K59/179—Interconnections, e.g. wiring lines or terminals
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Optics & Photonics (AREA)
- Ceramic Engineering (AREA)
- Electromagnetism (AREA)
- Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
- Electroluminescent Light Sources (AREA)
- Electrodes Of Semiconductors (AREA)
- Physical Vapour Deposition (AREA)
- Chemical Vapour Deposition (AREA)
- Photovoltaic Devices (AREA)
- Contacts (AREA)
- Formation Of Insulating Films (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Description
−前記方法はまた、前記電気接触トラックの少なくとも一部の上に窒化チタン層を堆積する段階を含み、
−前記封止層が前記窒化チタン層を覆うように前記封止層は堆積される。
−少なくとも1つの電子部品、
−前記部品を覆って原子層堆積によって堆積される酸化アルミニウムの封止層及び、
−前記部品に接続され、金属層で構成される少なくとも1つの電気接触トラック、
を備える電子デバイスに関連する。
−金属層101、
−金属層101に堆積される窒化チタン(TiN)層102、及び、
−原子層堆積(ALD)によって窒化チタン層102に堆積される酸化アルミニウム(Al2O3)層103、
を含む。
−電子ビーム蒸着によって堆積された200nmのアルミニウム、
−大気温度でマグネトロンスパッタリングによって堆積された100nmの窒化チタン、
−85℃の温度において、一変形例として250℃においてALDによって堆積された25nmの酸化アルミニウム。
−電子ビーム蒸着によって堆積されたクロム、
−電子ビーム蒸着によって堆積された窒化アルミニウム、
−85℃の温度においてALDによって堆積された25nmの酸化アルミニウム。
−マグネトロンスパッタリングによって5nmの窒化チタンに堆積された200nmのAlCu合金、
−マグネトロンスパッタリングによって堆積された7nmの窒化チタン、
−85℃の温度においてALDによって堆積された25nm又は50nmの酸化アルミニウム。
−電子ビーム蒸着によって堆積された100nmのクロム、
−マグネトロンスパッタリングによって堆積された30nmの窒化チタン、
−85℃の温度においてALDによって堆積された25nmの酸化アルミニウム。
しかしながら、他の温度範囲も考えられる。特に、250℃における堆積が所望の効果を常に与えることが見られ得る。
−支持基板上に構成される有機薄膜トランジスタ(OTFT)、有機太陽電池(OPV)又はOLEDなどの有機デバイス、
−CMOS(Complementary Metal Oxide Semiconductor)回路上に構成される有機ディスプレイ(特にOLED)によって形成されるマイクロディスプレイ、
−例えば酸化亜鉛(ZnO)に基づく無機太陽電池、
−環境に敏感な透明酸化物を用いたトランジスタなどのマイクロエレクトロニクスデバイス(INZO(インジウムガリウム亜鉛酸化物)を含むトランジスタTFT又は“薄膜トランジスタ”)、
−PCB(Printed Circuit Board)。
2 オプトエレクトロニクス部品
3 基板
4 封止層
5 領域
30 金属層
31 金属層
32 絶縁体
41 層
42 封止層
101 金属層
102 窒化チタン層
103 酸化アルミニウム層
105 発電機
Claims (12)
- 原子層堆積によって酸化アルミニウムの封止層(4、42)を堆積する段階を含む、金属層(101)で構成される少なくとも1つの電気接触トラックに接続される少なくとも1つの電子部品(2)の封止方法であって、
前記方法がまた、前記電気接触トラック(101)の少なくとも一部の直上に窒化チタン層(102)を堆積する段階を含み、
前記封止層(4、42)が前記窒化チタン層(102)を直接覆うように前記封止層が堆積され、
前記封止層が、前記電気接触トラック(101)において開いていないことを特徴とする、電子部品(2)の封止方法。 - 前記窒化チタン層(102)が、物理気相堆積によって前記電気接触トラック(101)の少なくとも一部に堆積されることを特徴とする、請求項1に記載の方法。
- 前記窒化チタン層(102)が、前記部品(2)の製造段階中に前記電気接触トラック(101)の少なくとも一部に堆積され、前記部品(2)が、少なくとも1つが窒化チタン層である層の連続堆積によって製造されることを特徴とする、請求項1または2に記載の方法。
- 前記封止層(4、42)に堆積された接点又は接触ワイヤを用いて前記電気接触トラックの少なくとも一部との電気接触を作る段階を特徴とする、請求項1から3の何れか一項に記載の方法。
- 少なくとも1つの電子部品(2)、
前記部品(2)を覆う酸化アルミニウムの封止層(4、42)、及び、
前記部品(2)に接続され、金属層(101)で構成される少なくとも1つの電気接触トラック、
を備え、
前記電気接触トラック(101)の少なくとも一部が、それ自体が前記封止層(4、42)で直接覆われる窒化チタン層(102)で直接覆われ、前記封止層が、前記電気接触トラック(101)において開いていないことを特徴とする、電子デバイス(1)。 - 前記封止層(4、42)が、前記デバイス(1)の外部表面を形成することを特徴とする、請求項5に記載のデバイス(1)。
- 前記金属層(101)が、アルミニウム及び銅の合金層であることを特徴とする、請求項5または6に記載のデバイス(1)。
- 前記金属層(101)が、銅層、又はアルミニウム層、又はクロム層であることを特徴とする、請求項5または6に記載のデバイス(1)。
- 前記封止層(4、42)が、20nmから200nmの厚さであることを特徴とする、請求項5から8の何れか一項に記載のデバイス(1)。
- 前記窒化チタン層(102)が、5nmから250nmの厚さであることを特徴とする、請求項5から9の何れか一項に記載のデバイス(1)。
- 前記部品(2)が、太陽電池、OLED、OPV、又はトランジスタなどのマイクロエレクトニクス部品であることを特徴とする、請求項5から10の何れか一項に記載のデバイス(1)。
- 前記封止層(4、42)にワイヤ接続され、前記電気接触トラック(101)に電流を流すように配置された電気接触要素をさらに含むことを特徴とする、請求項5から11の何れか一項に記載のデバイス(1)。
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1352533A FR3003693B1 (fr) | 2013-03-21 | 2013-03-21 | Procede d'encapsulation et dispositif associe. |
FR1352533 | 2013-03-21 |
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JP2014197677A JP2014197677A (ja) | 2014-10-16 |
JP6399776B2 true JP6399776B2 (ja) | 2018-10-03 |
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Country | Link |
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US (1) | US9224621B2 (ja) |
EP (1) | EP2782156B1 (ja) |
JP (1) | JP6399776B2 (ja) |
KR (1) | KR102164586B1 (ja) |
FR (1) | FR3003693B1 (ja) |
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JPS63269541A (ja) * | 1987-04-27 | 1988-11-07 | Nec Corp | 半導体装置 |
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2013
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2014
- 2014-03-18 US US14/217,670 patent/US9224621B2/en active Active
- 2014-03-18 EP EP14160515.4A patent/EP2782156B1/fr active Active
- 2014-03-20 JP JP2014057935A patent/JP6399776B2/ja active Active
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JP2014197677A (ja) | 2014-10-16 |
FR3003693B1 (fr) | 2017-01-20 |
EP2782156A2 (fr) | 2014-09-24 |
FR3003693A1 (fr) | 2014-09-26 |
EP2782156B1 (fr) | 2019-04-24 |
US20140284807A1 (en) | 2014-09-25 |
KR20140116024A (ko) | 2014-10-01 |
US9224621B2 (en) | 2015-12-29 |
EP2782156A3 (fr) | 2018-01-17 |
KR102164586B1 (ko) | 2020-10-12 |
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