JP6396001B2 - 回路基板およびサーマルプリントヘッド - Google Patents
回路基板およびサーマルプリントヘッド Download PDFInfo
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- JP6396001B2 JP6396001B2 JP2013080516A JP2013080516A JP6396001B2 JP 6396001 B2 JP6396001 B2 JP 6396001B2 JP 2013080516 A JP2013080516 A JP 2013080516A JP 2013080516 A JP2013080516 A JP 2013080516A JP 6396001 B2 JP6396001 B2 JP 6396001B2
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- silver
- circuit board
- palladium
- particles
- paste
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Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013080516A JP6396001B2 (ja) | 2013-04-08 | 2013-04-08 | 回路基板およびサーマルプリントヘッド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2013080516A JP6396001B2 (ja) | 2013-04-08 | 2013-04-08 | 回路基板およびサーマルプリントヘッド |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2014201029A JP2014201029A (ja) | 2014-10-27 |
| JP2014201029A5 JP2014201029A5 (enExample) | 2015-10-15 |
| JP6396001B2 true JP6396001B2 (ja) | 2018-09-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2013080516A Active JP6396001B2 (ja) | 2013-04-08 | 2013-04-08 | 回路基板およびサーマルプリントヘッド |
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| Country | Link |
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| JP (1) | JP6396001B2 (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP6754335B2 (ja) * | 2017-08-08 | 2020-09-09 | アオイ電子株式会社 | サーマルヘッド |
| JP7093226B2 (ja) * | 2018-05-22 | 2022-06-29 | ローム株式会社 | サーマルプリントヘッド |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62222601A (ja) * | 1986-03-25 | 1987-09-30 | 株式会社デンソー | 正特性磁器半導体 |
| JPH0796681B2 (ja) * | 1988-02-04 | 1995-10-18 | 住友金属鉱山株式会社 | パラジウム被覆銀粉の製造方法 |
| JP2508923B2 (ja) * | 1991-01-18 | 1996-06-19 | ローム株式会社 | 厚膜サ―マルヘッド |
| JP3178615B2 (ja) * | 1991-12-10 | 2001-06-25 | トヨタ自動車株式会社 | 導電性電極材料 |
| JPH05201048A (ja) * | 1992-01-30 | 1993-08-10 | Rohm Co Ltd | 厚膜型サーマルヘッド及びその製造方法 |
| JPH06103816A (ja) * | 1992-09-18 | 1994-04-15 | Mitsubishi Materials Corp | Pd被覆金属粉末からなる導電性フィラー |
| JP2002067366A (ja) * | 2000-09-01 | 2002-03-05 | Rohm Co Ltd | サーマルプリントヘッドの発熱抵抗体、サーマルプリントヘッドおよびサーマルプリントヘッドの発熱抵抗体の製造方法 |
| JP4515858B2 (ja) * | 2004-08-18 | 2010-08-04 | ローム株式会社 | サーマルプリントヘッドの製造方法 |
| JP2012209148A (ja) * | 2011-03-30 | 2012-10-25 | Sony Corp | 導電性粒子、導電性ペースト、及び、回路基板 |
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2013
- 2013-04-08 JP JP2013080516A patent/JP6396001B2/ja active Active
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| Publication number | Publication date |
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| JP2014201029A (ja) | 2014-10-27 |
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