JP6384879B2 - 撮像装置、および内視鏡 - Google Patents
撮像装置、および内視鏡 Download PDFInfo
- Publication number
- JP6384879B2 JP6384879B2 JP2016570458A JP2016570458A JP6384879B2 JP 6384879 B2 JP6384879 B2 JP 6384879B2 JP 2016570458 A JP2016570458 A JP 2016570458A JP 2016570458 A JP2016570458 A JP 2016570458A JP 6384879 B2 JP6384879 B2 JP 6384879B2
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- Japan
- Prior art keywords
- protective film
- wiring board
- solder
- imaging device
- solder bump
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- CLZWAWBPWVRRGI-UHFFFAOYSA-N tert-butyl 2-[2-[2-[2-[bis[2-[(2-methylpropan-2-yl)oxy]-2-oxoethyl]amino]-5-bromophenoxy]ethoxy]-4-methyl-n-[2-[(2-methylpropan-2-yl)oxy]-2-oxoethyl]anilino]acetate Chemical compound CC1=CC=C(N(CC(=O)OC(C)(C)C)CC(=O)OC(C)(C)C)C(OCCOC=2C(=CC=C(Br)C=2)N(CC(=O)OC(C)(C)C)CC(=O)OC(C)(C)C)=C1 CLZWAWBPWVRRGI-UHFFFAOYSA-N 0.000 description 1
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- Transforming Light Signals Into Electric Signals (AREA)
Description
前記第1の主面の前記第1の端部を覆う、前記複数の第1の半田バンプを取り囲んでいる、前記第1のバンプの高さよりも厚い、第1の保護膜と、前記第1の主面の前記第2の端部を覆う、前記複数の第2の半田バンプを取り囲んでいる、前記第1の保護膜の厚さおよび前記第2の半田バンプの高さよりも厚い、第2の保護膜と、を前記配線板が有する。
前記第1の主面の前記第1の端部を覆う、前記複数の第1の半田バンプを取り囲んでいる、前記第1のバンプの高さよりも厚い、第1の保護膜と、前記第1の主面の前記第2の端部を覆う、前記複数の第2の半田バンプを取り囲んでいる、前記第1の保護膜の厚さおよび前記第2の半田バンプの高さよりも厚い、第2の保護膜と、を前記配線板が有する撮像装置を、挿入部の先端部に具備する。
次に撮像装置1の製造方法を説明する。なお、カバーガラス30が接着された撮像素子10は、接合ウエハの切断により作製されるが、以下は個々の撮像素子として説明する。
次に第2実施形態の撮像装置1Aおよび第2実施形態の変形例の撮像装置1Bについて説明する。なお、撮像装置1A、1Bは、撮像装置1と類似しているため、同じ機能の構成要素には同じ符号を付し説明は省略する。
また撮像装置1Bは、第1の保護膜42Aが第1の端部40S1を除いて第2の保護膜43Bで覆われているため、配線板40が大きく変形しても、ひび割れ等が発生しやすい第1の保護膜42Aが可撓性の厚い第2の保護膜43Bで覆われているため、撮像装置1Aよりも更に信頼性が高い。
次に第3実施形態の撮像装置1Cについて説明する。なお、撮像装置1Cは、撮像装置1、1A、1Bと類似しており、同様の効果を有するため、同じ機能の構成要素には同じ符号を付し説明は省略する。
次に第3実施形態の内視鏡2について説明する。なお、内視鏡2は、すでに説明した撮像装置1、1A〜1Cを挿入部3の先端部3Aに具備する。このため、撮像装置1等の説明は省略する。
2…内視鏡
9…内視鏡システム
10…撮像素子
10T…溝
11…受光部
12…外部電極
13…電極パッド
19…エッチングマスク
20…接着層
23…接合部材
30…カバーガラス
40…配線板
41…基体
42…第1の保護膜
43…第2の保護膜
44…第1の接合電極
45…第3の接合電極
46…第2の接合電極
50…信号ケーブル
51…導線
54…第1の半田バンプ
55…第3の半田バンプ
56…第2の半田バンプ
56…バンプ
60…電子部品
Claims (10)
- 受光面に受光部が形成されており、前記受光面に対して傾斜している傾斜面に前記受光部と接続されている複数の電極パッドが列設されている、撮像素子と、
前記受光面を覆うように接着層を介して接着されている透明部材と、
第1の主面の第1の端部に、前記撮像素子の前記複数の電極パッドのそれぞれと第1の半田バンプを介して接合されている複数の第1の接合電極が列設されており、前記第1の端部と対向している第2の端部に複数の第2の接合電極が列設されている配線板と、
前記配線板の前記複数の第2の接合電極のそれぞれと、前記第1の半田バンプよりも高さの高い第2の半田バンプを介して接合されている複数の導線を有する信号ケーブルと、を具備する撮像装置であって、
前記第1の主面の前記第1の端部を覆う、前記複数の第1の半田バンプを取り囲んでいる、厚さが前記第1のバンプの高さよりも小さい、第1の保護膜と、
前記第1の主面の前記第2の端部を覆う、前記複数の第2の半田バンプを取り囲んでいる、厚さが、前記第1の保護膜の厚さよりも大きく、かつ、前記第2の半田バンプの高さよりも小さい、第2の保護膜と、を前記配線板が有することを特徴とする撮像装置。 - 前記第1の保護膜が、撥半田材料からなり
前記第2の保護膜が、ソルダレジストからなることを特徴とする請求項1に記載の撮像装置。 - 前記第1の保護膜が、酸化シリコン、または窒化シリコンからなることを特徴とする請求項2に記載の撮像装置。
- 前記第1の保護膜が、スパッタ法、蒸着法またはCVD法により成膜されており、
前記第2の保護膜が印刷法により成膜されていることを特徴とする請求項3に記載の撮像装置。 - 前記第1の保護膜の厚さが、0.1μm以上3μm以下であることを特徴とする請求項4に記載の撮像装置。
- 前記第1の保護膜が、前記第1の主面を覆っており、前記複数の第2の接合電極を取り囲んでいることを特徴とする請求項4に記載の撮像装置。
- 前記配線板が可撓性であることを特徴とする請求項6に記載の撮像装置。
- 前記複数の電極パッドと前記複数の第1の接合電極との接合部が、封止用樹脂で封止されていることを特徴とする請求項7に記載の撮像装置。
- 前記配線板の前記第1の主面に複数の第3の接合電極が配設されており、
前記第1の保護膜および前記第2の保護膜が前記複数の第3の接合電極を取り囲んでおり、
電子部品が、前記複数の第3の接合電極のそれぞれと、第3の半田バンプを介して接合されていることを特徴とする請求項8に記載の撮像装置。 - 請求項1から請求項9のいずれか1項に記載の撮像装置を具備することを特徴とする内視鏡。
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