JP6380837B2 - 被覆層形成用スパッタリングターゲット材およびその製造方法 - Google Patents

被覆層形成用スパッタリングターゲット材およびその製造方法 Download PDF

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Publication number
JP6380837B2
JP6380837B2 JP2014158424A JP2014158424A JP6380837B2 JP 6380837 B2 JP6380837 B2 JP 6380837B2 JP 2014158424 A JP2014158424 A JP 2014158424A JP 2014158424 A JP2014158424 A JP 2014158424A JP 6380837 B2 JP6380837 B2 JP 6380837B2
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JP
Japan
Prior art keywords
atomic
coating layer
target material
sputtering target
etching
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
JP2014158424A
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English (en)
Japanese (ja)
Other versions
JP2015061933A (ja
Inventor
村田　英夫
英夫 村田
真史 上灘
真史 上灘
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Metals Ltd
Original Assignee
Hitachi Metals Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Metals Ltd filed Critical Hitachi Metals Ltd
Priority to JP2014158424A priority Critical patent/JP6380837B2/ja
Publication of JP2015061933A publication Critical patent/JP2015061933A/ja
Application granted granted Critical
Publication of JP6380837B2 publication Critical patent/JP6380837B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/14—Both compacting and sintering simultaneously
    • B22F3/15—Hot isostatic pressing
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/005—Alloys based on nickel or cobalt with Manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Electrodes Of Semiconductors (AREA)
  • Powder Metallurgy (AREA)
JP2014158424A 2013-08-21 2014-08-04 被覆層形成用スパッタリングターゲット材およびその製造方法 Active JP6380837B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2014158424A JP6380837B2 (ja) 2013-08-21 2014-08-04 被覆層形成用スパッタリングターゲット材およびその製造方法

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2013171072 2013-08-21
JP2013171072 2013-08-21
JP2014158424A JP6380837B2 (ja) 2013-08-21 2014-08-04 被覆層形成用スパッタリングターゲット材およびその製造方法

Publications (2)

Publication Number Publication Date
JP2015061933A JP2015061933A (ja) 2015-04-02
JP6380837B2 true JP6380837B2 (ja) 2018-08-29

Family

ID=52821353

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2014158424A Active JP6380837B2 (ja) 2013-08-21 2014-08-04 被覆層形成用スパッタリングターゲット材およびその製造方法

Country Status (4)

Country Link
JP (1) JP6380837B2 (zh)
KR (1) KR20150021891A (zh)
CN (1) CN104419903B (zh)
TW (1) TWI539010B (zh)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6823799B2 (ja) * 2015-10-01 2021-02-03 日立金属株式会社 電子部品用積層配線膜および被覆層形成用スパッタリングターゲット材
JP2019108571A (ja) * 2017-12-15 2019-07-04 三菱マテリアル株式会社 ＣｕＮｉ合金スパッタリングターゲットおよびＣｕＮｉ合金粉末
CN115637412A (zh) * 2022-09-27 2023-01-24 芜湖映日科技股份有限公司 一种钼合金靶材及其制作工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4655281B2 (ja) * 2005-03-29 2011-03-23 日立金属株式会社 薄膜配線層
WO2010013636A1 (ja) * 2008-07-29 2010-02-04 株式会社アルバック 配線膜、薄膜トランジスタ、ターゲット、配線膜の形成方法
JP5203908B2 (ja) * 2008-12-04 2013-06-05 新日鉄住金マテリアルズ株式会社 Ｎｉ−Ｍｏ系合金スパッタリングターゲット板
JP2011014654A (ja) * 2009-06-30 2011-01-20 Jx Nippon Mining & Metals Corp プリント配線板用銅箔
JP5532767B2 (ja) * 2009-09-04 2014-06-25 大同特殊鋼株式会社 Ｃｕ電極保護膜用ＮｉＣｕ合金ターゲット材
JP2012222166A (ja) * 2011-04-08 2012-11-12 Ulvac Japan Ltd 配線膜、薄膜トランジスタ、ターゲット、配線膜の形成方法

Also Published As

Publication number Publication date
KR20150021891A (ko) 2015-03-03
CN104419903B (zh) 2017-09-19
CN104419903A (zh) 2015-03-18
TW201510231A (zh) 2015-03-16
JP2015061933A (ja) 2015-04-02
TWI539010B (zh) 2016-06-21

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