KR20150021891A - 피복층 형성용 스퍼터링 타깃재 및 그 제조 방법 - Google Patents

피복층 형성용 스퍼터링 타깃재 및 그 제조 방법 Download PDF

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Publication number
KR20150021891A
KR20150021891A KR20140106876A KR20140106876A KR20150021891A KR 20150021891 A KR20150021891 A KR 20150021891A KR 20140106876 A KR20140106876 A KR 20140106876A KR 20140106876 A KR20140106876 A KR 20140106876A KR 20150021891 A KR20150021891 A KR 20150021891A
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KR
South Korea
Prior art keywords
atomic
coating layer
sputtering target
target material
forming
Prior art date
Application number
KR20140106876A
Other languages
English (en)
Korean (ko)
Inventor
히데오 무라타
마사시 가미나다
Original Assignee
히타치 긴조쿠 가부시키가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 히타치 긴조쿠 가부시키가이샤 filed Critical 히타치 긴조쿠 가부시키가이샤
Publication of KR20150021891A publication Critical patent/KR20150021891A/ko

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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/14—Both compacting and sintering simultaneously
    • B22F3/15—Hot isostatic pressing
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/005—Alloys based on nickel or cobalt with Manganese as the next major constituent
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel

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  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Physical Vapour Deposition (AREA)
  • Powder Metallurgy (AREA)
  • Electrodes Of Semiconductors (AREA)
KR20140106876A 2013-08-21 2014-08-18 피복층 형성용 스퍼터링 타깃재 및 그 제조 방법 KR20150021891A (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013171072 2013-08-21
JPJP-P-2013-171072 2013-08-21

Publications (1)

Publication Number Publication Date
KR20150021891A true KR20150021891A (ko) 2015-03-03

Family

ID=52821353

Family Applications (1)

Application Number Title Priority Date Filing Date
KR20140106876A KR20150021891A (ko) 2013-08-21 2014-08-18 피복층 형성용 스퍼터링 타깃재 및 그 제조 방법

Country Status (4)

Country Link
JP (1) JP6380837B2 (zh)
KR (1) KR20150021891A (zh)
CN (1) CN104419903B (zh)
TW (1) TWI539010B (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190010701A (ko) * 2015-10-01 2019-01-30 히타치 긴조쿠 가부시키가이샤 전자 부품용 적층 배선막 및 피복층 형성용 스퍼터링 타깃재

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2019108571A (ja) * 2017-12-15 2019-07-04 三菱マテリアル株式会社 ＣｕＮｉ合金スパッタリングターゲットおよびＣｕＮｉ合金粉末
CN115637412A (zh) * 2022-09-27 2023-01-24 芜湖映日科技股份有限公司 一种钼合金靶材及其制作工艺

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4655281B2 (ja) * 2005-03-29 2011-03-23 日立金属株式会社 薄膜配線層
WO2010013636A1 (ja) * 2008-07-29 2010-02-04 株式会社アルバック 配線膜、薄膜トランジスタ、ターゲット、配線膜の形成方法
JP5203908B2 (ja) * 2008-12-04 2013-06-05 新日鉄住金マテリアルズ株式会社 Ｎｉ−Ｍｏ系合金スパッタリングターゲット板
JP2011014654A (ja) * 2009-06-30 2011-01-20 Jx Nippon Mining & Metals Corp プリント配線板用銅箔
JP5532767B2 (ja) * 2009-09-04 2014-06-25 大同特殊鋼株式会社 Ｃｕ電極保護膜用ＮｉＣｕ合金ターゲット材
JP2012222166A (ja) * 2011-04-08 2012-11-12 Ulvac Japan Ltd 配線膜、薄膜トランジスタ、ターゲット、配線膜の形成方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20190010701A (ko) * 2015-10-01 2019-01-30 히타치 긴조쿠 가부시키가이샤 전자 부품용 적층 배선막 및 피복층 형성용 스퍼터링 타깃재

Also Published As

Publication number Publication date
TW201510231A (zh) 2015-03-16
JP2015061933A (ja) 2015-04-02
CN104419903A (zh) 2015-03-18
CN104419903B (zh) 2017-09-19
TWI539010B (zh) 2016-06-21
JP6380837B2 (ja) 2018-08-29

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