JP6379197B2 - アセンブリを変更する装置及びそのための方法 - Google Patents

アセンブリを変更する装置及びそのための方法 Download PDF

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Publication number
JP6379197B2
JP6379197B2 JP2016531930A JP2016531930A JP6379197B2 JP 6379197 B2 JP6379197 B2 JP 6379197B2 JP 2016531930 A JP2016531930 A JP 2016531930A JP 2016531930 A JP2016531930 A JP 2016531930A JP 6379197 B2 JP6379197 B2 JP 6379197B2
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JP
Japan
Prior art keywords
probe
assembly
tool
socket
modification
Prior art date
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Active
Application number
JP2016531930A
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English (en)
Japanese (ja)
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JP2016527517A5 (enExample
JP2016527517A (ja
Inventor
ダーマ，ラジブ
ツィーゲルマン，スヴェトラーナ
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Bruker Nano Inc
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Hysitron Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Hysitron Inc filed Critical Hysitron Inc
Publication of JP2016527517A publication Critical patent/JP2016527517A/ja
Publication of JP2016527517A5 publication Critical patent/JP2016527517A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
    • B23P19/04—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes for assembling or disassembling parts
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/40—Investigating hardness or rebound hardness
    • G01N3/42—Investigating hardness or rebound hardness by performing impressions under a steady load by indentors, e.g. sphere, pyramid
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q60/00—Particular types of SPM [Scanning Probe Microscopy] or microscopes; Essential components thereof
    • G01Q60/24—AFM [Atomic Force Microscopy] or apparatus therefor, e.g. AFM probes
    • G01Q60/36—DC mode
    • G01Q60/366—Nanoindenters, i.e. wherein the indenting force is measured
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01Q—SCANNING-PROBE TECHNIQUES OR APPARATUS; APPLICATIONS OF SCANNING-PROBE TECHNIQUES, e.g. SCANNING PROBE MICROSCOPY [SPM]
    • G01Q70/00—General aspects of SPM probes, their manufacture or their related instrumentation, insofar as they are not specially adapted to a single SPM technique covered by group G01Q60/00
    • G01Q70/02—Probe holders
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
    • B23P19/10—Aligning parts to be fitted together
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01D—MEASURING NOT SPECIALLY ADAPTED FOR A SPECIFIC VARIABLE; ARRANGEMENTS FOR MEASURING TWO OR MORE VARIABLES NOT COVERED IN A SINGLE OTHER SUBCLASS; TARIFF METERING APPARATUS; MEASURING OR TESTING NOT OTHERWISE PROVIDED FOR
    • G01D18/00—Testing or calibrating apparatus or arrangements provided for in groups G01D1/00 - G01D15/00
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/0058—Kind of property studied
    • G01N2203/0076—Hardness, compressibility or resistance to crushing
    • G01N2203/0078—Hardness, compressibility or resistance to crushing using indentation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/0202—Control of the test
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/0202—Control of the test
    • G01N2203/0206—Means for supplying or positioning specimens or exchangeable parts of the machine such as indenters...
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N2203/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N2203/02—Details not specific for a particular testing method
    • G01N2203/026—Specifications of the specimen
    • G01N2203/0286—Miniature specimen; Testing on microregions of a specimen

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Health & Medical Sciences (AREA)
  • General Health & Medical Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Engineering & Computer Science (AREA)
  • Analytical Chemistry (AREA)
  • Pathology (AREA)
  • Immunology (AREA)
  • Biochemistry (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Nanotechnology (AREA)
  • Mechanical Engineering (AREA)
  • Investigating Or Analyzing Materials By The Use Of Ultrasonic Waves (AREA)
  • Measuring Leads Or Probes (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
JP2016531930A 2013-08-01 2014-08-01 アセンブリを変更する装置及びそのための方法 Active JP6379197B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US201361861306P 2013-08-01 2013-08-01
US61/861,306 2013-08-01
PCT/US2014/049379 WO2015017765A2 (en) 2013-08-01 2014-08-01 Instrument changing assembly and methods for the same

Publications (3)

Publication Number Publication Date
JP2016527517A JP2016527517A (ja) 2016-09-08
JP2016527517A5 JP2016527517A5 (enExample) 2017-09-14
JP6379197B2 true JP6379197B2 (ja) 2018-08-22

Family

ID=52432589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2016531930A Active JP6379197B2 (ja) 2013-08-01 2014-08-01 アセンブリを変更する装置及びそのための方法

Country Status (6)

Country Link
US (1) US9902027B2 (enExample)
EP (1) EP3027365B1 (enExample)
JP (1) JP6379197B2 (enExample)
KR (1) KR101712028B1 (enExample)
SG (1) SG11201600737TA (enExample)
WO (1) WO2015017765A2 (enExample)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3027365B1 (en) 2013-08-01 2018-05-23 Hysitron, Inc. Instrument changing assembly and methods for the same
US10883908B2 (en) * 2017-03-13 2021-01-05 King Fahd University Of Petroleum And Minerals Stage for high temperature indentation test
EP3680736A1 (en) * 2019-01-14 2020-07-15 JOT Automation Oy Apparatus and method for testing electronic device
US12270792B2 (en) * 2021-06-12 2025-04-08 University of the District of Columbia Scratch tester for adhesion testing of coatings on surfaces
KR102765238B1 (ko) 2024-03-11 2025-02-07 주식회사 바질바이오텍 과학수사를 위하여 gc-ms와 lc-ms를 이용한 기체 다성분 동시분석 기법

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5595707A (en) * 1990-03-02 1997-01-21 Ventana Medical Systems, Inc. Automated biological reaction apparatus
US5327657A (en) * 1991-07-11 1994-07-12 Renishaw Metrology Ltd. Touch probe
JP3266457B2 (ja) * 1995-05-25 2002-03-18 住友金属工業株式会社 自動ロックウェル硬さ試験機
JP3547143B2 (ja) 1997-07-22 2004-07-28 株式会社日立製作所 試料作製方法
JP3425383B2 (ja) * 1998-12-03 2003-07-14 株式会社島津製作所 走査型プローブ顕微鏡及びプローブホルダ
US7119566B2 (en) * 2002-03-22 2006-10-10 Electro Scientific Industries, Inc. Test probe alignment apparatus
US6756800B2 (en) * 2002-04-16 2004-06-29 Teradyne, Inc. Semiconductor test system with easily changed interface unit
JP2004085387A (ja) * 2002-08-27 2004-03-18 Mitsutoyo Corp 測定装置
WO2008042009A1 (en) 2006-03-13 2008-04-10 Asylum Research Corporation Nanoindenter
EP2237052A1 (en) * 2009-03-31 2010-10-06 Capres A/S Automated multi-point probe manipulation
GB201005252D0 (enExample) * 2010-03-29 2010-05-12 Infinitesima Ltd
KR101535519B1 (ko) * 2011-02-10 2015-07-09 하이지트론, 인코포레이티드 나노기계 테스트 시스템
EP3027365B1 (en) 2013-08-01 2018-05-23 Hysitron, Inc. Instrument changing assembly and methods for the same
CH710648A1 (de) * 2015-01-23 2016-07-29 Erowa Ag Messmaschine zum Vermessen von Werkstücken.

Also Published As

Publication number Publication date
US9902027B2 (en) 2018-02-27
WO2015017765A3 (en) 2015-10-15
EP3027365A2 (en) 2016-06-08
US20160169718A1 (en) 2016-06-16
EP3027365A4 (en) 2017-02-15
SG11201600737TA (en) 2016-02-26
KR20160030335A (ko) 2016-03-16
KR101712028B1 (ko) 2017-03-03
WO2015017765A2 (en) 2015-02-05
EP3027365B1 (en) 2018-05-23
JP2016527517A (ja) 2016-09-08

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