TWI337360B - Testing and classifying machine for use in memory ics - Google Patents
Testing and classifying machine for use in memory ics Download PDFInfo
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- TWI337360B TWI337360B TW96122789A TW96122789A TWI337360B TW I337360 B TWI337360 B TW I337360B TW 96122789 A TW96122789 A TW 96122789A TW 96122789 A TW96122789 A TW 96122789A TW I337360 B TWI337360 B TW I337360B
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Description
1337360 九、發明說明: 卯年10月29日修正替換頁 【發明所屬之技術領域】 本發明係提供一種可同時移載及測試複數個記憶體I C,以 有效縮短待機時間,而大幅增加記憶體I c檢測產能之記憶體 IC檢測分類機。 【先前技術】1337360 IX. Description of the invention: Revision of the replacement page on October 29 of the following year [Technical field of the invention] The present invention provides a memory IC that can simultaneously transfer and test a plurality of memory ICs to effectively shorten the standby time and substantially increase the memory I c detects the capacity of the memory IC detection classifier. [Prior Art]
在現令,半導體元件之I c概分為邏輯I c、記憶體I C、 類比I C及微元件I c等不同類型,以邏輯I c為例,係應用於 主機板上之中央處理器,俾以負責中央處理器與其他周邊元件之 訊號轉,或傳遞,以及作業’其舰性較為獅,而記憶體 I ^則單純用以儲存資料,並裝設於模組電路板,該模組電路板 再裝,於域板上,其魏錄為單純,然不論任何類型之I c 保Ιΐΐί成後,均須經過一檢測作業,以淘汰出不良品,而確 輯1⑽配之中央處理11係直接裝絲主機板,且 k為複雜及錄化’絲為使邏輯〗c可於實 使用之實f4確性’逐以日後邏輯I C實際裝配 ,請參邏輯I C靖 分類機,包含於機台之===邏輯1 C之I C檢測 及第一移料裝f , 有供枓匣1 1、複數個收料匣1 2 供取料,各收料E i 2 1 1係可承置制之邏輯I C以 -移料裝置TS以:=IC用以收料,而第 則設有複數個測試裝置&寺/第 1之C,而機台之後端 14係設有具單―測試套 實^〗15,各測試裝置 壓待測邏輯I c之壓接機構} 乂之2板1 4 1 ’以及用以下 供置入單-待測之邏輯33 2中’該測試套座14 2可 科Cl7 ’而第二移料裝置15則用以移 5 !337360 99年10月29曰修正替拖 栽待/完測之邏輯I C,另設有一可於機台前、一_換頁 轉運裝置i 6 ’ ^置,6係用以栽送待/完測之 ,進而該第-移料裝置1 3可於供料!處取出待 I C17,並置放於轉運裝置16上,由轉運裝置16恭ι輯 台之後端’第二移料裝置15即將轉運裝置丄6 I C 1 7取出,赠載至測試裝置1 4處,且置入二 1 4 1之測試套座1 4 2中,以執行檢測作業,於檢測板 該第二移料裝置15即將完測之邏輯Ic丄7取出,並4 ’ 運裝置16上,由轉運裝置16載送至機台之前端,苐 置13則將轉運裝置16上完測之邏輯Ic 2 7取出,並恭裝 收料匣12,且依檢測結果而分類收置,以完成邏輯T c丄^至 檢測、分類作業。 < 反觀,記憶體I C由於係純粹用以儲存資料,其功能性 單純,因此一般係同時以多個記憶體I C進行測試;若業者以^ 述邏輯IC檢測分類機來執行記憶體IC之檢測作業時Ϊ其並無 法同時移載及測試多個待測之記憶體I C,且經由轉運裝 僅載送單一待測之記憶體IC,將使整個移料待機的時間過長^ 右為具複數個測试裝置之大型§己憶體I C檢測機,則各裝置之作 動,等待時間將更為繁瑣及耗時,亦大幅降低記憶體I^之檢測 產能,故此一 I C檢測分類機不適用於執行記憶體丨(^之檢測作 業。 因此,在講求快速之檢測使用效率及提升產能之需求下,如 種適用於檢測記憶體IC,而大幅提升檢測產能之記憶 r 檢測分類機,即為業者設計之標的。 【發明内容】 其包务明之主要目的係提供一種記憶體1C檢測分類機, 之二於機台前端之供料g及至少一個收料n,設於機台後端 置間挪試裴置及定位裝置,以及設於供、收料匣及測試裝 3 料I置;該供、收料匣係分別用以承置待/完測之記憶 1337360 99年10月29曰修正替換頁 料夺有具複數個測試套座之 、,係,、有複數個取放頭’而可於供料匿同時移裁 之檢測數量,達鳴提升使At present, the I c of the semiconductor component is divided into different types such as the logic I c , the memory IC, the analog IC, and the micro IC I c , and the logic I c is taken as an example, and is applied to the central processing unit on the motherboard, 俾Responsible for the signal conversion, transmission, and operation of the central processing unit and other peripheral components. The memory is more lion-like, and the memory I ^ is simply used to store data and is installed on the module circuit board. The board is reloaded, on the domain board, its Wei recorded as simple, but no matter what type of I c is guaranteed, it must go through a test operation to eliminate the defective products, and the 1 (10) is equipped with the central processing 11 series. Directly load the main board, and k is complex and recorded 'wire for the logic〗 c can be used in the real f4 authenticity' to the actual assembly of the logic IC in the future, please refer to the logic IC classification machine, included in the machine === Logic 1 C IC detection and the first transfer material f, there is a supply 枓匣 1 1 , a plurality of receipt 匣 1 2 for reclaiming, each receipt E i 2 1 1 can be placed logic The IC uses - the transfer device TS to: = IC for receiving, and the first with multiple test devices & Temple / 1st C And the rear end 14 of the machine is provided with a single-test sleeve real ^ 15, each test device presses the crimping mechanism of the logic I c to be tested} 2 of the board 1 4 1 ' and the following is used to place the order - In the logic 33 2 to be tested, 'the test socket 14 2 can be Cl7' and the second transfer device 15 is used to move 5!337360 October 29, 1999 to correct the logic IC for the planting/finishing, Another one can be placed in front of the machine, a _ page transfer device i 6 ' ^, 6 series for planting to be completed / completed, and the first - transfer device 13 can be taken at the feeding! C17, placed side by side on the transfer device 16, after the transfer device 16 congratulates the stage, the second transfer device 15 takes the transfer device IC6 IC 1 7 out, and carries it to the test device 14 and puts it into the second In the test suite 1 4 2 of 1 4, in order to perform the inspection operation, the logic Ic丄7 of the second transfer device 15 to be tested is taken out on the detection board, and is carried by the transfer device 16 on the 4' transport device 16. Sended to the front end of the machine, the device 13 takes out the logic Ic 2 7 on the transfer device 16 and assembles the receipt 匣12, and sorts and collects according to the detection result to complete the logic T c ^ To detect, classify jobs. < In contrast, memory IC is purely used for storing data, and its functionality is simple. Therefore, it is generally tested with multiple memory ICs at the same time; if the operator uses the logic IC detection classifier to perform memory IC detection During operation, it is not possible to simultaneously transfer and test multiple memory ICs to be tested, and only carry a single memory IC to be tested via the transfer device, which will make the entire shift standby time too long ^ Right for multiple The large § 体 体 IC tester of the test device, the operation of each device, the waiting time will be more cumbersome and time consuming, and the detection capacity of the memory I ^ is greatly reduced, so the IC detection classifier is not applicable to Execution of memory 丨 (^ detection operation. Therefore, in the demand for rapid detection of use efficiency and increased productivity, such as the memory detection IC, and greatly improve the detection capacity of the memory r detection classifier, that is, the operator The main purpose of the package is to provide a memory 1C detection sorting machine, and the second is to supply the feed g and at least one receiving material n at the front end of the machine, and set it on the machine. The end-to-end misplacement test and positioning device, and the supply and receiving devices and the test device 3 are placed; the supply and receiving devices are respectively used to hold the memory to be/completed. 1337360 October, 1999 29曰Revised replacement page material has a number of test sets, a system, and a plurality of pick and place heads, and the number of detections that can be moved at the same time as the feed is blocked.
載之複數做,_丨供_多 於測試套座内’以進行測試作業,達到有效提以JDo the plural, _ 丨 _ more than in the test socket </ /> to carry out the test operation, to achieve effective J
二:,“it 置 試套座為常閉型套座(Qpen Top socket),另於樹mg :复數個頂壓治具,而於移載複數個記憶體丨c至測試裝 試套座上方時,可利用頂壓治具下壓開啟測試套 頭 套座時,記憶體I c即可固定於測試套座内以進;; 而達到提升使用效益之目的。 呆 ^ 【實施方式】 為使貴審查委員對本發明作更進一步之瞭解,茲舉一 實施例並配合圖式,詳述如后: 請參閱第3圖,本發明之記憶體j c檢測分類機係於機台 2 0之前端設有供料匣21、複數個收料匣2 2a、2 2 B、 2 2 C ’設於機台2 〇後端之測試裝置2 3、2 4、設於兩測試 裝置2 3、2 4間之定位裝置2 5,以及移動於供、收料g2丄、 22A、22B、22 C及測試裝置2 3、2 4間之移料裝置 2 6 ;該供料H 21係用以承置待測之記憶體! c,而複數個收 料E 22A、22B、22 C係可細分不同等級,用以儲放完測 之不同等級記憶體I C ;測試裝置2 3、2 4則設有具複數個測 7 1337360 99年I〇月29日修正替換頁 試套座2 2 4 2 ’測試電路板2 (3 測試電路板2 3 2、 試機(圖面未示),測 f 2並連、.,Q至機台2 〇下方之測 合各裝置作動,物;自輸至用以控制及整 2 6係具有複數個頂壓;中央處理器,·-移料裝置 =1移載複數個記憶二、c至2工而可於供料 ^疋位後將記憶體I g 位’並於完 2 3 1、2 4 η 士 = 裝置2 3、2 4之各測試套座 2 3 1、2 4 1,以供:二頂 =具2 6 6下壓開啟測試套座 試套座2 3 1、2 4 ί、& 5厂、6 8將記憶體1 C置入於之各測 2 3 1、2 4 1時%二„具2 6 6於上升關_試套座 24 以進行測卩可固定於測試套座2 3 1、 係於二^ 2 之測試裝置2 3、2 4 、2 4 1,以測气衣广0 2 4 2上裝叹4 * 8個測試套座2 31Two:, "it test socket is a normally closed type of socket (Qpen Top socket), another tree mg: a plurality of top pressure fixtures, and transfer a plurality of memory 丨c to the test test socket When the test sleeve sleeve can be opened by pressing the top pressure fixture, the memory I c can be fixed in the test sleeve to enter; and achieve the purpose of improving the use efficiency. Staying ^ [embodiment] The reviewer will further understand the present invention, and an embodiment will be described in detail with reference to the following figures. Referring to FIG. 3, the memory jc detection sorting machine of the present invention is provided at the front end of the machine 20. Feeding 匣21, a plurality of receiving 匣2 2a, 2 2 B, 2 2 C 'the test device 2 3, 2 4 disposed at the rear end of the machine 2, is disposed between the two test devices 2 3, 2 4 a positioning device 25, and a moving device 2 6 moving between the supply and receiving units g2丄, 22A, 22B, 22C and the testing devices 2 3 and 24; the feeding H 21 is for holding the test to be tested Memory! c, and a plurality of receipts E 22A, 22B, 22 C can be subdivided into different levels for storing and testing different levels of memory IC; test devices 2 3, 2 4 There are a number of tests 7 1337360 99 I am the 29th day to replace the replacement page test socket 2 2 4 2 'test circuit board 2 (3 test circuit board 2 3 2, test machine (not shown), test f 2 parallel, ., Q to machine 2 below the measuring device, the device; from the input to control and the whole 26 series has a plurality of top pressure; central processor, ·- Transfer a plurality of memories 2, c to 2 work and the memory I g position after the feeding ^疋 position and complete the test suites of 2 3 1 , 2 4 η 士 = device 2 3, 2 4 2 3 1, 2 4 1, for: two top = with 2 6 6 press open test socket test set 2 3 1, 2 4 ί, & 5 factory, 6 8 put memory 1 C into Each test 2 3 1 , 2 4 1 hour % 2 „ 2 6 6 in ascending off _ test socket 24 for testing can be fixed to the test socket 2 3 1 , tied to the test device 2 2 2 , 2 4 , 2 4 1, to measure the air coat wide 0 2 4 2 on the sigh 4 * 8 test sets 2 31
Top Socket) (〇pen 1=;=22 33 ;27,= =上設有數個· 上座2 3 1 4係ί接腳插人時予以壓夫定位, 可令=並於下壓時 壓夾ί定Λ ί升時則使金屬爽片2 313爽合1c接腳,以 2導引座2 317係設於底座2 311及上座 2 ’為供1 c置入時導引定位使用,其導斜面 座Μ 1 C置入時導引滑人,進而使1 c接腳對位插入底 座1對應之插置孔2312内。 定位7圖’本發明設於兩測試裝置2 3、2 4間之 裝置2 5係固設於機台2 0上,該定位裝置2 5開設有數個 99年10月29日修正替換頁 料匣2曰1内i出二供2C己憶體1 C,由於記憶體1 C於供 2 3 1 ^ ο a ^1八角度並不十分準確,因此於置入測試套座 内,以將該4心?1予以置入定位裝置2 5之定位槽2 51 座2仏‘峨準確將記憶體I C置入測試套 2 οϋϋΐ8、9圖’本發明之移料裝置2 6斜於機台 架滑轨2 6 γ上該移料裝置2 6係於Υ車由向之機 組2 β ^加讯ΐ架6又⑺座2 6 2,再於滑座2 6 2上分別以滑軌 結一第直立導架2 6 4 ’各直立導架2 6 4上端連 軸向之tit動’可使直立導架2 6 4帶動頂壓治具2 6 6作Z f另於種治具2 6 6之上方«上,以第二廢 缸2 6 7 放頭2 6 8 ’而使該取放頭2 6 8可綱第二壓 2=動,於頂壓治具2 6 6内升降位移。 複數^記恃體^ c 移料裝置2 6於供料匿21移载 係利用第it二5f則試裝置2 3、2 4時’均 體! c。技iti 動取放頭2 6 8升降作動,以取放記憶 1 c至測“ϋ1 f圖’當移料裝置2 6移載複數個記憶體 頂壓治且^ 3時,各取放頭268上之記憶體〗C係位於 2 3 1你、番 内,且各頂壓治具2 6 6對應於各測試套座 試套座2 h ^ 降M壓轉2 6 6將會壓抵測 片2 3 1 f 23 1 4下降,並使底座2 3 Η之金屬央 接著移料己憶體1 C之接腳插人。請參閱第1 2圖, 降,將:mi取放頭2 6 8會由第二壓缸2 6 7驅動下Top Socket) (〇pen 1=;=22 33 ;27,= = There are several on the upper seat. 2 3 1 4 Series ί When the pin is inserted, the position is pressed, so that = and press the clamp when pressing down ί When the 升 Λ 升 升 升 升 升 升 升 升 升 升 升 升 升 升 升 升 升 升 升 升 升 升 升 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 When the seat 1 C is placed, the slider is guided, and the 1 c pin is inserted into the corresponding insertion hole 2312 of the base 1. Positioning 7 Figure 'The device of the present invention is provided between the two test devices 2 3 and 24 The 2 5 series is fixed on the machine 20, and the positioning device 25 is provided with a plurality of corrections on October 29, 1999. The replacement page is 匣2曰1, and the second is for the 2C replied body 1 C, due to the memory 1 C is not very accurate for 2 3 1 ^ ο a ^1 eight angles, so it is placed in the test socket to place the 4 cores 1 into the positioning groove 2 of the positioning device 2 51 51 2'峨 Accurately place the memory IC into the test sleeve 2 οϋϋΐ8, 9Fig. 'The moving device of the present invention 2 6 oblique to the machine frame slide 2 6 γ on the moving device 2 6 is attached to the brake unit 2 β ^ 加 ΐ 6 6 (7) seat 2 6 2, then on the slide 2 6 2 The slide rails are connected to a vertical guide frame 2 6 4 'the upright guides 2 6 4 and the upper end of the axial joints move 'to make the upright guides 2 6 4 drive the top press fixtures 2 6 6 for Z f Above the fixture 2 6 6 «上, with the second waste cylinder 2 6 7 head 2 6 8 ', the pick-and-place head 2 6 8 can be the second pressure 2 = move, press the fixture 2 6 6 Internal lifting and lowering displacement. Complex number ^ 恃 ^ ^ c 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移 移2 6 8 Lifting and lowering to pick up and store memory 1 c to measure “ϋ1 f map” When the loading device 2 6 transfers a plurality of memory top pressures and ^ 3, the memory on each pick-up head 268 is C The system is located in 2 3 1 You, Fan, and each of the top pressure fixtures 2 6 6 corresponds to each test socket test socket 2 h ^ drop M pressure turn 2 6 6 will be pressed against the test piece 2 3 1 f 23 1 4 Drop, and make the base of the base 2 3 Η and then the pin of the moving material 1 C. Please refer to Figure 1 2, drop, will: mi take the head 2 6 8 will be the second cylinder 2 6 7 drive
接腳插入==2 if料測3座231,並使記憶體1C之 , 2 3 1 1之金屬央片231 3内。% & 1 Q 圖’接著移料裝置26之各取放頭268由第二心2參= 13J/360 99年10月29曰修正替換頁 ϋ後’碰治具2 “概即由第—齡2 6 51SI?7^ 二座2 31之上座2 3 14即上升復位,並使金屬失片 2 313壓夾固定記憶體i C,而進行測試作業。 =參閱第14圖,當測試裝置2 3、2 4内之記憶體! c完 成測,後’移料裝置2 6相_會移驗測試套座2 3 i上方, 並下壓開啟測試套座2 31,以供取出完測之記憶體丨c灸 閱第15圖,接著移料裝置2 6會依據測試結果,將完測之ς ^ c分置於收料s22A、22B、22C内,而完成分类^ 呆0 據此,本發明可同時移載及測試複數個記憶體丨C,以 縮短待機時間,而大幅增加記憶體r C之檢測產能,實為一 ^ 實用性及進步性之設計’絲見有相同之產品及刊物公開: 允符發明專利申請要件,爰依法提出申請。 而 【圖式簡單說明】 第1圖:習式I C檢測分類機之配置圖。 第2圖 第3圖 第4圖 第5圖 第6圖 第7圖 第8圖 第9圖 習式IC檢測分類機之測試裝置示意圖。 本發明記憶體Ic檢測分類機之配置示意圖。 本發明測試套座之分解示意圖。 本發明測試套座之組合示意圖。 本發明測試裝置之示意圖。 本發明定位裝置之示意圖。 本發明移料裝置之外觀示意圖。 本發明移料裝置之側視圖。 第1 0圖:本發明記憶體I c置入於測試套座 第1 1圖:本發曰月記憶體ί C置入於測試套座之動S3 一)。 第1 2圖:本發明記憶體ί C置入於測試套座之動rJ。 第1 3圖.本發明記憶體I c置入於測試套座之 ϋ( — )。 第1 4圖:本發明於完測後之動作示意圖(―(四)。 第1 5圖:本發明於完測後之動作示意圖(二)。 10 1337360 99年10月29日修正替換頁 【主要元件符號說明】Pin insertion == 2 If the material is tested 3 231, and the memory 1C, 2 3 1 1 metal film 231 3 inside. % & 1 Q Figure 'The pick-and-place head 268 of the transfer device 26 is replaced by the second heart 2 = 13J/360 October 29, 1999. After the replacement page, the 'touch fixture 2' is called the first Age 2 6 51SI? 7^ Two seats 2 31 Upper seat 2 3 14 is the ascending reset, and the metal loss piece 2 313 is clamped to fix the memory i C, and the test operation is performed. = Refer to Figure 14 when the test device 2 3, 2 4 memory! c completed the test, after the 'transfer device 2 6 phase _ will test the test suite 2 3 i above, and press the test socket 2 31 to open the memory for the test The body c c- moxibustion read the 15th picture, and then the transfer device 26 will place the measured ς ^ c in the receiving materials s22A, 22B, 22C according to the test result, and complete the classification ^ stay 0 according to this, the present invention It is possible to simultaneously transfer and test a plurality of memory ports C to shorten the standby time and greatly increase the detection capacity of the memory r C. It is a practical and progressive design. : The requirements for the invention patent application are allowed, and the application is filed according to law. [Simplified description of the drawing] Figure 1: Configuration diagram of the conventional IC detection classifier. Figure 2 Figure 4 Figure 5 Figure 6 Figure 7 Figure 8 Figure 9 Schematic diagram of the test device of the IC detection classifier. The memory Ic detection classifier configuration diagram of the present invention. Schematic diagram of the test suite of the present invention. Schematic diagram of the test apparatus of the present invention. Schematic diagram of the positioning apparatus of the present invention. Schematic diagram of the appearance of the material transfer apparatus of the present invention. Side view of the material transfer apparatus of the present invention. The body I c is placed in the test socket. Figure 1: The memory of the present month ί C is placed in the test socket S3 a). Figure 12: Memory ί C of the present invention is placed in the test sleeve The movement of the seat rJ. Figure 1 3 shows the memory I c of the present invention placed in the test socket (-). Figure 14: Schematic diagram of the operation of the present invention after completion of the test (― (4). Figure 5: Schematic diagram of the action of the present invention after completion of the test (2) 10 1337360 October 29, 1999 revised replacement page [main component symbol description]
12:收料匣 14 2 :測試套座 16:轉運裝置 2 2 B :收料匣 2 312 :插置孔 2 315 :彈簧 2 318 :導斜面 2 41 ·測試套座 2 51 :定位槽 2 6 2 :滑座 2 6 5第一壓缸 2 6 8 :取放頭 習式部份: 11:供料匣 1 4 :測試裝置 141:實體板 15:第二移料裝置 本發明部分: 2 0 :機台 21:供料匣 2 2A :收料匣 2 3 :測試裝置 2 31 :測試套座 2 31 1 :底座 2 314 :上座 2 317 :導引座 2 3 2 :測試電路板 2 4 :測試裴置 2 5 :定位裝置 2 6 :移料裝置 2 61 :機架滑軌 2 6 4 :直立導架 2 6 7 :第二壓紅 13:第一移料裝置 14 3 .壓接機構12: Receiving cassette 14 2 : Test socket 16: Transfer device 2 2 B : Receiving cassette 2 312 : Inserting hole 2 315 : Spring 2 318 : Leading bevel 2 41 · Test housing 2 51 : Positioning groove 2 6 2: slide 2 6 5 first cylinder 2 6 8 : pick-up head part: 11: feed 匣 1 4 : test device 141: solid plate 15: second transfer device part of the invention: 2 0 : Machine 21: Feed 匣 2 2A : Receiver 匣 2 3 : Test set 2 31 : Test set 2 31 1 : Base 2 314 : Upper seat 2 317 : Guide 2 2 2 : Test board 2 4 : Test device 2 5 : Positioning device 2 6 : Transfer device 2 61 : Rack slide 2 6 4 : Upright guide 2 6 7 : Second pressure red 13: First transfer device 14 3 . Crimping mechanism
1 7 : I C 2 2 C :收料匣 2 3 1 3 :金屬夾片 2 316 :滑片 2 4 2 :测試電路板 2 6 3 :滑執組 2 6 6 :頂壓治具1 7 : I C 2 2 C : receiving 匣 2 3 1 3 : metal clip 2 316 : sliding piece 2 4 2 : test circuit board 2 6 3 : slippery group 2 6 6 : top press fixture
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