CN101339146B - Automatic optical detector - Google Patents
Automatic optical detector Download PDFInfo
- Publication number
- CN101339146B CN101339146B CN2007101274051A CN200710127405A CN101339146B CN 101339146 B CN101339146 B CN 101339146B CN 2007101274051 A CN2007101274051 A CN 2007101274051A CN 200710127405 A CN200710127405 A CN 200710127405A CN 101339146 B CN101339146 B CN 101339146B
- Authority
- CN
- China
- Prior art keywords
- integrated circuit
- casket
- automatic optical
- dish
- optical detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Abstract
The invention relates to an automatic optical inspection device which is used for detecting surface defects of an integrated circuit. The automatic optical inspection device comprises a box disc conveyor which is used for conveying and bearing the box disc of at least one integrated circuit and provided with at least one holding part, a clamping mechanism which is used for clamping the holding part so that the box disc can be fixed on the box disc conveyor, and an image capturing device which is used for capturing an image of the surface of the integrated circuit; wherein, the image can be analyzed to detect the surface defects of the integrated circuit, wherein the box disc conveyor includes a pick-up head for classifying the integrated circuit, the pick-up head picks up the integrated circuit which does not pass the test from the box disc and places in a box disc which does not pass the test, and the pick-up head picks up the integrated circuit which does not pass the test from the next box disc and places in the box disc, thereby filling the box disc which carries the integrated circuit which does not pass the test.
Description
Technical field
The present invention relates to a kind of automatic optical detection device, particularly relevant for a kind of automatic optical detection device that is applied to detect the integrated circuit surface defective.
Background technology
Semiconductor element test mostly uses Auto-Test System (Automatic TestEquipment at present, ATE) test, the wafer that has detected is through being cut into crystal grain (die), utilize crystal granules sorted machine (dice sorter) that crystal grain is positioned on the casket dish (tray) again, deliver to the successive process board.
Before carrying out successive process, for confirming the quality status of crystal grain, must be inspected by random samples the crystal grain on the casket dish by the sight check personnel, common grain surface defective comprises scratch (scratch), dust (particle) and projection and weighs (bump touch detect) etc. wounded.Yet with the sight check personnel crystal grain on the casket dish being inspected by random samples regular meeting has the instability quality situation to take place; for example differ for the criterion of defective because of different personnel; cause crystal grain quality instability by check; or because personnel's checkability deficiency; can't examine entirely, cause the bad crystal grain of quality still can enter the successive process board.
In view of above-mentioned existing in prior technology shortcoming, be necessary to propose a kind of automatic optical detection device, not only can be applied to detect the surface imperfection of crystal grain, also can be applied to detect the surface imperfection of general integrated circuit, with improvement personnel sight check instability quality problem, and improve the efficient that detects simultaneously.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art and defective, a kind of automatic optical detection device is proposed, not only can be applied to detect the surface imperfection of crystal grain, also can be applied to detect the surface imperfection of general integrated circuit, with improvement personnel sight check instability quality problem, and improve the efficient that detects simultaneously.
According to above-mentioned purpose, the invention provides a kind of automatic optical detection device, be applied to detect the surface imperfection of integrated circuit, this automatic optical detection device comprises: a casket disk transfer device, in order to transmit the casket dish of at least one integrated circuit of carrying, this casket dish has at least one clamping part; One pressure holding mechanism in order to this clamping part of clamping, makes this casket dish be fixed in this casket disk transfer device; An and image capture unit, in order to capture an image of this integrated circuit surface, wherein by analyzing this image, can detect the surface imperfection of this integrated circuit, wherein, this casket disk transfer device has a pick-up head, this pick-up head is in order to this integrated circuit of classifying, this pick-up head will not taken out and be positioned over one not by detecting the casket dish by this integrated circuit that detects by this casket dish, and this pick-up head will be taken out by next this casket dish by this integrated circuit that detects and be positioned over this casket dish, thereby this casket dish that will carry this integrated circuit that passes through detection is mended full.
Useful technique effect of the present invention is, utilize automatic optical detection device of the present invention, be applied to detect the surface imperfection of integrated circuit, can avoid personnel's sight check instability quality problem, and because detection efficiency is higher, can examine entirely, the integrated circuit of avoiding having surface imperfection enters the successive process board.
Description of drawings
Figure 1A shows the schematic top plan view according to the automatic optical detection device of a preferred embodiment of the present invention;
Figure 1B shows the schematic top plan view of the automatic optical detection device of another preferred embodiment according to the present invention;
The side schematic view of automatic optical detection device in Fig. 2 displayed map 1.
Symbol description among the figure
20 automatic optical detection devices
21 image capture units
22 casket dishes
23 integrated circuit
24 pressure holding mechanisms
25 casket disk transfer devices
26 classification districts
27 pick-up heads
28 charging casket dish stack devices
29 buffer zones
30 detection zones
31 classification buffer zones
33 by detecting casket dish stack device
34 by not detecting casket dish stack device
35 casket dish stack devices
221 clamping parts
222 holes
The L1 hole lengths
L2 integrated circuit length
Embodiment
Some embodiments of the present invention will be described in detail as follows.Yet except following description, the present invention can also be widely implements at other embodiment, and scope of the present invention is not subjected to the qualification of embodiment, and its scope with claims is as the criterion.Moreover for clearer description being provided and being more readily understood the present invention, each several part is not drawn according to its relative size in the accompanying drawing, and some size is compared with other scale dependent and exaggerated; Incoherent detail section is not drawn fully yet, in the hope of graphic succinct.
Figure 1A shows the schematic top plan view according to the automatic optical detection device of a preferred embodiment of the present invention.This automatic optical detection device 20 is applied to detect the surface imperfection of integrated circuit 23, and this automatic optical detection device 20 comprises: a casket disk transfer device 25, a pressure holding mechanism 24 and an image capture unit 21.
Casket disk transfer device 25, in order to transmit a casket dish 22, these casket dish 22 at least one integrated circuit 23 of carrying and this casket dish 22 have at least one clamping part 221; This casket disk transfer device 25 still comprises a buffer zone 29, a detection zone 30, a classification buffer zone 31 and a classification district 26; In addition, this casket disk transfer device 25 further is provided with a charging casket dish stack device 28, a casket dish stack device 35, passes through to detect casket dish stack device 33 and by detecting casket dish stack device 34.
Analyze this image by a computing machine (figure does not indicate), can detect the surface imperfection of this integrated circuit 23, and will have the position of the integrated circuit 23 of surface imperfection, be embedded in this computing machine., do not give unnecessary details to judge whether the application principle of surface imperfection as for the Computer Analysis image at this.In the present embodiment, the minimum dimension that can detect surface imperfection is about 5um, can detect common surface imperfection, and for example scratch (scratch), dust (particle) and projection weigh (bumptouch detect) etc. wounded.
Charging casket dish stack device 28 is in order to deposit the casket dish 22 of carrying to-be-measured integrated circuit 23.Buffer zone 29 is arranged between this charging casket dish stack device 28 and this detection zone 30, and integrated circuit 23 waits in this buffer zone 29 and detects, to reduce the delivery time of casket dish 22.Detection zone 30 has above-mentioned pressure holding mechanism 24 and image capture unit 21, by pressure holding mechanism 24 casket dish 22 is fixed in this casket disk transfer device 25, and the integrated circuit 23 that is carried on the casket dish 22 by 21 pairs of image capture units detects again.Classification buffer zone 31 is arranged between detection zone 30 and the casket dish stack device 35, and this integrated circuit 23 of finishing detection waits in classification buffer zone 31 classifies, to reduce the delivery time of casket dish 22.Casket dish stack device 35 is in order to provide the casket dish to the classification district.
According to present embodiment, control by aforementioned computing machine, this pick-up head 27 can will not move to the casket dish 22 that the integrated circuit 23 of detection is passed through in carrying by the integrated circuit 23 that detects, this pick-up head 27 can will pass through the integrated circuit 23 of detection by next casket dish 22 simultaneously, move to the casket dish 22 of carrying by the integrated circuit 23 of detection, full with casket dish 22 benefits that will carry the integrated circuit 23 that passes through detection, use in order to follow-up processing procedure, but not as limit.
Figure 1B shows the schematic top plan view of the automatic optical detection device of another preferred embodiment according to the present invention.According to present embodiment, control by aforementioned computing machine, this pick-up head 27 can will move to the casket dish 22 of carrying by the integrated circuit 23 of detection by the integrated circuit 23 that detects, mend full with the casket dish 22 that will carry the integrated circuit 23 that passes through detection, use in order to follow-up processing procedure, but not as limit.
Fig. 2 shows the side schematic view according to the automatic optical detection device of a preferred embodiment of the present invention.Integrated circuit 23 is placed in the hole 222 on the casket dish 22, if the excesssive gap between integrated circuit 23 and the hole 222, then automatic optical detection device 20 is when analyzing surface image, be easy to generate erroneous judgement, in the present embodiment, for avoiding the excesssive gap between integrated circuit 23 and the hole 222, the minimum value of hole 222 length L 1 is greater than the about 0.05mm of maximal value of these integrated circuit 23 length L 2, and the flatness of casket dish is less than 0.05mm in addition.
Utilize automatic optical detection device of the present invention, be applied to detect the surface imperfection of integrated circuit, can avoid personnel's sight check instability quality problem, and because detection efficiency is higher, can examine entirely, the integrated circuit of avoiding having surface imperfection enters the successive process board.
The foregoing description only is explanation technological thought of the present invention and characteristics, its purpose makes those skilled in the art can understand content of the present invention and is implementing according to this, when can not with qualification claim of the present invention, be that all other do not break away from various equivalences that disclosed spirit finishes and change or modify and all be encompassed in the disclosed scope of the present invention, all should be included in the scope of claims.
Claims (10)
1. automatic optical detection device is applied to detect the surface imperfection of integrated circuit, it is characterized in that this automatic optical detection device comprises:
One casket disk transfer device, in order to transmit the casket dish of at least one integrated circuit of carrying, this casket dish has at least one clamping part;
One pressure holding mechanism in order to this clamping part of clamping, makes this casket dish be fixed in this casket disk transfer device; And
One image capture unit, in order to capture an image of this integrated circuit surface, wherein by analyzing this image, can detect the surface imperfection of this integrated circuit, wherein, this casket disk transfer device has a pick-up head, this pick-up head is in order to this integrated circuit of classifying, this pick-up head will not taken out and be positioned over one not by detecting the casket dish by this integrated circuit that detects by this casket dish, and this pick-up head will be taken out by next this casket dish by this integrated circuit that detects and be positioned over this casket dish, thereby this casket dish that will carry this integrated circuit that passes through detection is mended full.
2. automatic optical detection device as claimed in claim 1, wherein, above-mentioned casket dish has a flatness, and this flatness is less than 0.05mm.
3. automatic optical detection device as claimed in claim 1, wherein, above-mentioned casket dish has a plurality of holes, and in order to ccontaining this integrated circuit, the minimum length of this hole is greater than this integrated circuit maximum length 0.05mm.
4. automatic optical detection device as claimed in claim 1, wherein, above-mentioned image capture unit is CCD.
5. automatic optical detection device as claimed in claim 1, wherein, above-mentioned casket disk transfer device comprises a detection zone, and this integrated circuit is detected by this image capture unit in this detection zone.
6. automatic optical detection device as claimed in claim 5 wherein, more comprises a charging casket dish stack device, in order to deposit this casket dish.
7. automatic optical detection device as claimed in claim 6, wherein, above-mentioned casket disk transfer device more comprises a buffer zone, and this buffer zone is arranged between this charging casket dish stack device and this detection zone, and this integrated circuit waits in this buffer zone and detects.
8. automatic optical detection device as claimed in claim 5 wherein, more comprises a casket dish stack device, in order to provide this casket dish to this casket disk transfer device.
9. automatic optical detection device as claimed in claim 8, wherein, above-mentioned casket disk transfer device more comprises a classification buffer zone, and this classification buffer zone is arranged between this detection zone and the straight-through casket dish stack device, and this integrated circuit of finishing detection waits in the classification buffer zone classifies.
10. automatic optical detection device as claimed in claim 9, wherein, above-mentioned casket disk transfer device more comprises a classification district, and this classification district has this pick-up head, this pick-up head can be mended full by this casket dish of this integrated circuit of detection carrying by the control of a computing machine.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007101274051A CN101339146B (en) | 2007-07-05 | 2007-07-05 | Automatic optical detector |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2007101274051A CN101339146B (en) | 2007-07-05 | 2007-07-05 | Automatic optical detector |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101339146A CN101339146A (en) | 2009-01-07 |
CN101339146B true CN101339146B (en) | 2011-07-20 |
Family
ID=40213268
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007101274051A Active CN101339146B (en) | 2007-07-05 | 2007-07-05 | Automatic optical detector |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN101339146B (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102148132B (en) * | 2010-11-19 | 2013-02-27 | 上海微曦自动控制技术有限公司 | Optical detection device |
CN102707168A (en) * | 2012-05-21 | 2012-10-03 | 上海华力微电子有限公司 | Defect monitoring method based on equipment maintenance risk control |
TWI657229B (en) * | 2017-12-25 | 2019-04-21 | 由田新技股份有限公司 | An optical inspection apparatus and a workpiece lifting device |
CN110412041A (en) * | 2019-08-12 | 2019-11-05 | 南京杰科丰智慧电气自动化有限公司 | A kind of wisdom factory personnel flow detector and its detection method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1152754A (en) * | 1995-03-23 | 1997-06-25 | 株式会社爱德万测试 | Device conveyer and rechecking method for IC processing apparatus |
US20060231778A1 (en) * | 2005-03-30 | 2006-10-19 | Delta Design, Inc. | Machine vision based scanner using line scan camera |
CN1873940A (en) * | 2005-05-30 | 2006-12-06 | 京元电子股份有限公司 | Device for picking up and sorting crystal grains |
CN1925124A (en) * | 2005-09-02 | 2007-03-07 | 由田新技股份有限公司 | Tray conveying system |
-
2007
- 2007-07-05 CN CN2007101274051A patent/CN101339146B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1152754A (en) * | 1995-03-23 | 1997-06-25 | 株式会社爱德万测试 | Device conveyer and rechecking method for IC processing apparatus |
US20060231778A1 (en) * | 2005-03-30 | 2006-10-19 | Delta Design, Inc. | Machine vision based scanner using line scan camera |
CN1873940A (en) * | 2005-05-30 | 2006-12-06 | 京元电子股份有限公司 | Device for picking up and sorting crystal grains |
CN1925124A (en) * | 2005-09-02 | 2007-03-07 | 由田新技股份有限公司 | Tray conveying system |
Also Published As
Publication number | Publication date |
---|---|
CN101339146A (en) | 2009-01-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5790247A (en) | Technique for determining defect positions in three dimensions in a transparent structure | |
CN101327483B (en) | Device and method for classifying chips | |
US8019040B2 (en) | X-ray inspection device and production system | |
JPH0821803A (en) | Defect type judging device and process control system | |
CN101339146B (en) | Automatic optical detector | |
JP3938227B2 (en) | Foreign object inspection method and apparatus | |
EP1277042B1 (en) | Directional lighting and method to distinguish three dimensional information | |
EP0119681B1 (en) | Inspection apparatus for inspecting articles moving on a conveyor | |
KR100629921B1 (en) | Test handler and method for test of semiconductor package | |
JP4789630B2 (en) | Semiconductor manufacturing apparatus, semiconductor appearance inspection apparatus, and appearance inspection method | |
KR101772849B1 (en) | Tray defect inspection device and method for inspection | |
JP2011117866A (en) | Visual inspection apparatus | |
CN201266177Y (en) | Combined automatic optical detection equipment | |
TWI507677B (en) | Assembly and method for testing and classifying led wafers | |
JPH01257250A (en) | Discriminating method for sort of defect in disk surface inspecting apparatus | |
CN208721000U (en) | Product size on-line measuring device | |
TW201033600A (en) | System and processing of a substrate | |
TW200848722A (en) | Automatic optical inspection device | |
JP4408902B2 (en) | Foreign object inspection method and apparatus | |
CN102914551A (en) | Glass substrate inspection system and manufacturing method of glass substrate | |
JP2001050907A (en) | Method for inspecting substrate | |
JP2009025004A (en) | Inspection device and method for plane substrate | |
US20070165940A1 (en) | Semiconductor surface inspection apparatus, surface inspection method, and semiconductor manufacturing apparatus | |
JP2008170222A (en) | Inspection method, inspection system and inspection device | |
KR100740251B1 (en) | System for vision inspection of semiconductor device |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |