CN101342531B - Memory body IC detecting and sorting machine - Google Patents
Memory body IC detecting and sorting machine Download PDFInfo
- Publication number
- CN101342531B CN101342531B CN200710136307A CN200710136307A CN101342531B CN 101342531 B CN101342531 B CN 101342531B CN 200710136307 A CN200710136307 A CN 200710136307A CN 200710136307 A CN200710136307 A CN 200710136307A CN 101342531 B CN101342531 B CN 101342531B
- Authority
- CN
- China
- Prior art keywords
- memory body
- seat
- detecting
- board
- sorting machine
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000012360 testing method Methods 0.000 claims abstract description 106
- 239000000463 material Substances 0.000 claims abstract description 35
- 238000012546 transfer Methods 0.000 claims abstract description 17
- 239000002184 metal Substances 0.000 claims description 9
- 238000012545 processing Methods 0.000 claims description 6
- 238000006073 displacement reaction Methods 0.000 claims description 4
- 230000010354 integration Effects 0.000 claims description 2
- 230000011218 segmentation Effects 0.000 claims 1
- 230000008901 benefit Effects 0.000 abstract description 2
- 238000001514 detection method Methods 0.000 description 12
- 230000009471 action Effects 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 238000007906 compression Methods 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
Images
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to a memory IC testing and classifying device, comprising a feeding box which is arranged on a machine platform to support the memory IC to be tested; a receiving box which is arranged on the machine platform to support the tested memory IC; a testing device which is arranged on the machine platform, and provided with a plurality of testing sheath seats in parallel; a material moving device which is arranged on the machine platform, and provided with a jack jig and a plurality of taking and placing heads to transfer a plurality of memory ICs tested or to be tested among the feeding box, the testing device and the receiving box; a central processor which is used to control and integrate the movement of each device to execute automatic operation. Thereby, a plurality of memory ICs can be transferred and tested synchronously, the stand-by time is effectively shortened, the testing efficiency of the memory IC is largely improved, and the service efficiency and the use benefits of the efficiency are achieved and improved.
Description
Technical field
The present invention relates to a kind of IC and detect classifier, be meant a kind of memory body IC detecting and sorting machine especially.
Background technology
Now, it is dissimilar that the IC of semiconductor element generally is divided into logic IC, memory body IC, analogy IC and microcomponent IC etc., is example with logic IC, is the central processing unit that is applied on the motherboard; Change or transmit with the signal of being responsible for central processing unit and other peripheral elements, and the computing operation, it is functional comparatively complicated; Memory body IC then is used for merely storing data, and is installed in the modular circuit plate, and described modular circuit plate refills and fits on the motherboard; It is functional comparatively simple, though the IC of right any kind, after completing; Must detect operation through one, eliminating out defective products, and guarantee product quality.
Yet, because the central processing unit of logic IC collocation is directly to be installed in motherboard, and functional comparatively complicated and diversified; The dealer can detect under actual environment for making logic IC, promote to detect the accuracy of operation, satisfies the solid plate (being motherboard) used with logic IC practical set in the future as testing circuit board; Make logic IC on solid plate, detect operation, the detection operation of logic-based IC is comparatively complicated and diversified, supplies execution unity logic IC to detect operation so described solid plate often only is provided with a test suite seat; Seeing also the 1st, 2 figure, is in the streets to be applied in the IC that detects logic IC to detect classifier, and the front end that is included in board is provided with feed casket 11, a plurality of rewinding casket 12 and first moves materials device 13; Described feed casket 11 is bearable logic IC to be measured for getting material, and each rewinding casket 12 is that logic IC that bearable completion detects is used for rewinding, and first to move materials device 13 be that to be used for transfer to be measured or accomplish the logic IC that detects; The rear end of board then is provided with a plurality of testing arrangements 14 and second and moves materials device 15, and each testing arrangement 14 is the solid plate 141 that are provided with the single test suite seat 142 of tool, and the compression joint mechanism 143 that is used for pressing down logic IC to be measured; Wherein, described test suite seat 142 can supply to insert single logic IC17 to be measured, and second moves materials device 15 then is used for the logic IC that transfer is to be measured or accomplish to detect; Other is provided with one can be at the transporter 16 of board front and back ends shift reciprocately, and described transporter 16 is to be used for carrying to be measured or to accomplish the logic IC that detects, and then described first moves materials device 13 and can take out logic IC17 to be measured at feed casket 11 places; And be seated on the transporter 16; Be carried to the rear end of board by transporter 16, second moves materials device 15 is about to logic IC17 to be measured on the transporter 16 and takes out, and transfers load to testing arrangement 14 places; And insert in the test suite seat 142 of its solid plate 141; Detect operation to carry out, after detection finished, described second moved the logic IC17 taking-up that materials device 15 is near completion and detects; And be seated on the transporter 16; Be carried to the front end of board by transporter 16, first moves 13 of materials devices takes out the logic IC17 that accomplish on the transporter 16 to detect, and transfers load to rewinding casket 12; And classifying according to testing result places, with detection, the sorting operations of completion logic IC17.
, memory body IC is owing to be to be used for purely storing data, and it is functional comparatively simple, therefore generally is to test with a plurality of memory body ICs simultaneously; When if the dealer carries out the detection operation of memory body IC with above-mentioned logic IC detection classifier; It is transfer simultaneously and a plurality of memory body ICs to be measured of test also; And once only carry single memory body IC to be measured via transporter; With making whole overlong time of moving the material standby, if the large-scale memory body IC machines of a plurality of testing arrangements of tool, then the start and the stand-by period of each device will be more loaded down with trivial details and consuming time; Also significantly reduce the detection efficiency of memory body IC, so an IC detects the inapplicable detection operation at the execution memory body IC of classifier.
Therefore, detect fast under service efficiency and the demand that promotes efficient stressing, how to design and a kind ofly be useful in the detection memory body IC, and significantly promote the memory body IC detecting and sorting machine of detection efficiency, be the target of dealer's design.
Summary of the invention
Deficiency to prior art the objective of the invention is to: a kind of memory body IC detecting and sorting machine is provided, to shorten the start time of each device, increases the detection speed of memory body IC.
For realizing above-mentioned purpose, the technical scheme that the present invention adopts is:
A kind of memory body IC detecting and sorting machine is characterized in that, it is to include: the feed casket: be provided in a side of on the board, be used for bearing memory body IC to be measured; Rewinding casket: be provided in a side of on the board, be used for the memory body IC that bearing accomplish to detect; Testing arrangement: be provided in a side of on the board, it also is provided with a plurality of test suite seats; Move materials device: be provided in a side of on the board, it also is provided with the roof pressure tool and a plurality of head that picks and places, and is used for a plurality of to be measured or memory body ICs that accomplish to detect of a transfer between feed casket, testing arrangement and rewinding casket; Central processing unit: be to be used for controlling with integration respectively installing start, to carry out automated job.
Compared with prior art, the beneficial effect that has of the present invention is:
1. the present invention comprises feed casket and at least one the rewinding casket that is located at the board front end, is located at least one testing arrangement and the positioner of board rear end, and is located at the materials device that moves between confession, rewinding casket and testing arrangement; Described confession, rewinding casket are to be used for the memory body IC that bearing is to be measured or completion detects respectively; Each testing arrangement then is provided with the testing circuit board of a plurality of test suite seats of tool; Moving materials device is to have a plurality of heads that pick and place, and can be at a plurality of memory body ICs of feed casket transfer simultaneously to testing arrangement to carry out test jobs; So, can effectively shorten the start time of each device, and significantly increase the amount detection of memory body IC, promote service efficiency.
2. the present invention is provided with a location device in addition in the board rear end, for moving materials device a plurality of memory body ICs of feed casket transfer is located, and after accomplishing the location, can accurately memory body IC be inserted in the test suite seat, to carry out test jobs, promotes the degree of accuracy.
3. testing arrangement of the present invention is the testing circuit board that is provided with a plurality of test suite seats of tool; Each test suite seat is that normally closed jacket seat in addition is provided with a plurality of roof pressure tools moving on the materials device; And above each test suite seat of a plurality of memory body ICs of transfer to testing arrangement the time; Roof pressure tool capable of using presses down opens the test suite seat, for pick and place head with memory body IC insert each test suite seat in, rise when closing the test suite seat at the roof pressure tool; Memory body IC can be fixed in the test suite seat to carry out test jobs, the lifting utilization benefit.
Description of drawings
Fig. 1: existing IC detects the allocation plan of classifier;
Fig. 2: existing IC detects the testing arrangement sketch map of classifier;
Fig. 3: the configuration schematic diagram of memory body IC detecting and sorting machine of the present invention;
Fig. 4: the decomposing schematic representation of test suite seat of the present invention;
Fig. 5: the combination sketch map of test suite seat of the present invention;
Fig. 6: the sketch map of testing arrangement of the present invention;
Fig. 7: the sketch map of positioner of the present invention;
Fig. 8: the present invention moves the schematic appearance of materials device;
Fig. 9: the present invention moves the side view of materials device;
Figure 10: memory body IC of the present invention is inserted the action sketch map () at the test suite seat;
Figure 11: memory body IC of the present invention is inserted the action sketch map (two) at the test suite seat;
Figure 12: memory body IC of the present invention is inserted the action sketch map at the test suite seat;
Figure 13: memory body IC of the present invention is inserted the action sketch map (four) at the test suite seat;
Figure 14: the present invention is at the action sketch map of accomplishing after detecting ();
Figure 15: the present invention is at the action sketch map of accomplishing after detecting (two).
Description of reference numerals: 11-feed casket; 12-rewinding casket; 13-first moves materials device; The 14-testing arrangement; The 141-solid plate; 142-test suite seat; The 143-compression joint mechanism; 15-second moves materials device; The 16-transporter; 17-IC; The 20-board; 21-feed casket; 22A-rewinding casket; 22B-rewinding casket; 22C-rewinding casket; The 23-testing arrangement; 231-test suite seat; The 2311-base; The 2312-inserting hole; The 2313-metal intermediate plate 2314-seat of honour; The 2315-spring; The 2316-slide plate; The 2317-guide seat; The 2318-guiding incline; The 232-testing circuit board; The 24-testing arrangement; 241-test suite seat; The 242-testing circuit board; The 25-positioner; The 251-locating slot; 26-moves materials device; 261-frame slide rail; The 262-slide; The 263-slide rail set; The upright saddle of 264-; 265 first cylinder pressures; 266-roof pressure tool; 267-second cylinder pressure; 268-picks and places head.
The specific embodiment
See also Fig. 3; Memory body IC detecting and sorting machine of the present invention is that the front end at board 20 is provided with feed casket 21, a plurality of rewinding casket 22A, 22B, 22C; Be located at board 20 rear ends testing arrangement 23,24, be located at the positioner 25 of 23,24 of two testing arrangements, and move and move materials device 26 23,24 of confession, rewinding casket 21,22A, 22B, 22C and testing arrangements; Described feed casket 21 is to be used for bearing memory body IC to be measured, and a plurality of rewinding casket 22A, 22B, 22C can segment different brackets, is used for storing accomplishing the different brackets memory body IC that detects; 23,24 of testing arrangements are provided with the testing circuit board 232,242 of a plurality of test suite seats 231,241 of tool (Open Top Socket); Testing circuit board 232,242 also is linked to the test machine (drawing does not show) of board 20 belows; Test machine also will test signal and link to transfer to and be used for control and respectively install start with integrating, with the central processing unit of execution automated job; One to move materials device 26 be to have a plurality of roof pressure tools 266 and pick and place 268; And can position at a plurality of memory body ICs of feed casket 21 transfers to positioner 25; And after accomplishing the location, memory body IC is transferred load to above each test suite seat 231,241 of testing arrangement 23,24; Press down with roof pressure tool 266 again and open test suite seat 231,241; For pick and place 268 with memory body IC insert each test suite seat 231,241 in, roof pressure tool 266 was closed the test suite seat at 231,241 o'clock in rising, memory body IC can be fixed in the test suite seat 231,241 to carry out test jobs.
See also Fig. 3, Fig. 4, Fig. 5, Fig. 6, testing arrangement the 23, the 24th of the present invention is installed 4 * 8 test suite seats 231,241, with test suite seat 231 on testing circuit board 232,242; It is closed type test suite seat (Open Top Socket), and described test suite seat 231 mainly includes base 2311, the seat of honour 2314 and guide seat 2317, and base 2311 is provided with several inserting holes 2312 that can supply the IC pin to plug; And in the required inserting hole that uses 2312, be provided with metal intermediate plate 2313; When the IC pin inserts, to press the folder location, the seat of honour 2314 is the tops that are erected at base 2311, and it is supported on base 2311 top up-down starts with spring 2315 and slide plate 2316; And when pressing down, can make outside the metal intermediate plate 2313 of base 2311 and opening; Insert for the IC pin, the seat of honour 2314 then makes metal intermediate plate 2313 clamping IC pins when rising, and decides IC to press clamping; Guide seat 2317 is provided in a side of in the framework at the base 2311 and the seat of honour 2314; Guide the location when inserting for confession IC and use, guiding slipped into when its guiding incline 2318 can supply IC to insert, and then made in the inserting hole 2312 of IC pin contraposition insertion base 2311 correspondences.
See also Fig. 3, Fig. 7; The positioner 25 that the present invention is located at 23,24 of two testing arrangements is to be installed on the board 20; Described positioner 25 offers several locating slots 251, for bearing location memory body IC, when taking out in feed casket 21 owing to memory body IC; Its angle is very inaccurate; Therefore before built-in test cover seat 231,241, must insert earlier in the locating slot 251 of positioner 25,, could accurately the memory body IC built-in test be overlapped in the seat 231,241 and carry out test jobs with described memory body IC location.
See also Fig. 3, Fig. 8, Fig. 9, the materials device 26 that moves of the present invention is on board 20, to do X-Y-Z three axial moving, and board 20 is provided with the axial frame slide rail 261 of Y; The described materials device 26 that moves is on the axial frame slide rail 261 of Y, to set up slide 262; On slide 262, set up a plurality of upright saddles 264 with slide rail set 263 respectively again, each upright saddle 264 upper end links one first cylinder pressure 265, and the lower end then is equiped with roof pressure tool 266; Utilize the start of first cylinder pressure 265; Can make upright saddle 264 drive roof pressure tools 266 and do the axial up-down displacement of Z, in addition on grillage above the roof pressure tool 266, link with second cylinder pressure 267 and to pick and place 268; And make a described start of 268 second cylinder pressures 267 capable of using that picks and places, up-down displacement in roof pressure tool 266.
See also Fig. 3, Fig. 9, the present invention moves materials device 26 a plurality of memory body ICs of feed casket 21 transfers to positioner 25 and testing arrangement at 23,24 o'clock, all is to utilize second cylinder pressure 267 to drive to pick and place 268 a up-down start, to pick and place memory body IC.See also Figure 10, when moving a plurality of memory body ICs of materials device 26 transfers to testing arrangement 23, a memory body IC that respectively picks and places on 268 is to be positioned at roof pressure tool 266, and each roof pressure tool 266 correspondence is in each test suite seat 231 position.See also Figure 11; Each first cylinder pressure 265 that then moves on the materials device 26 drives 266 declines of roof pressure tool; The seat of honour 2314 that roof pressure tool 266 will compress test suite seat 231 descends, and makes metal intermediate plate 2313 outer the opening of base 2311, for the pin insertion of memory body IC.See also Figure 12,268 meeting that respectively pick and place that then move materials device 26 drive decline by second cylinder pressure 267, memory body IC is placed on each test suite seat 231, and the pin of memory body IC is inserted in the metal intermediate plate 2313 of base 2311.See also Figure 13; Then move materials device 26 respectively pick and place 268 by second cylinder pressure 267 drive rise after; Roof pressure tool 266 is also driven by first cylinder pressure 265 immediately and rises; This moment promptly rises and resets in test suite seat 231 the seat of honour 2314, and makes metal intermediate plate 2313 pressure clampings decide memory body IC, and carries out test jobs.
See also Figure 14, after the memory body IC in the testing arrangement 23,24 is accomplished test, move materials device 26 identical meetings and move to test suite seat 231 tops, and press down unlatching test suite seat 231, accomplish the memory body IC that detects for taking out.See also Figure 15, then moving materials device 26 can split in rewinding casket 22A, 22B, 22C accomplishing the memory body IC that detects, and accomplish sorting operations according to test result.
In view of the above, the present invention's transfer simultaneously and a plurality of memory body ICs of test with effective shortening stand-by time, and significantly increase the detection efficiency of memory body IC.
More than explanation is just illustrative for the purpose of the present invention; And it is nonrestrictive; Those of ordinary skills understand; Under the situation of spirit that does not break away from claim and limited and scope, can make many modifications, variation or equivalence, but but all will fall within the claim restricted portion of the present invention.
Claims (8)
1. a memory body IC detecting and sorting machine is characterized in that, it is to include:
Feed casket: be provided in a side of on the board, be used for bearing memory body IC to be measured;
Rewinding casket: be provided in a side of on the board, be used for the memory body IC that bearing accomplish to detect;
Testing arrangement: be provided in a side of on the board; It also is provided with a plurality of closed type test suite seats, and this closed type test suite seat includes base, the seat of honour and guide seat, and the seat of honour is set up in the top of base with spring and slide plate; Guide seat then is located in the framework at the base and the seat of honour, with guiding location IC;
Move materials device: be provided in a side of on the board, it also is provided with the roof pressure tool and a plurality of head that picks and places, and is used for a plurality of to be measured or memory body ICs that accomplish to detect of a transfer between feed casket, testing arrangement and rewinding casket;
Central processing unit: be to be used for controlling with integration respectively installing start, to carry out automated job.
2. memory body IC detecting and sorting machine according to claim 1 is characterized in that: described rewinding casket is the rewinding casket of segmentation different brackets, is used for the different brackets memory body IC that bearing accomplish to detect.
3. memory body IC detecting and sorting machine according to claim 1 is characterized in that: the test suite seat of described testing arrangement is to be installed on the testing circuit board, and described testing circuit board is linked to test machine.
4. memory body IC detecting and sorting machine according to claim 1; It is characterized in that: the base of described closed type test suite seat is provided with several inserting holes; But and in inserting hole, be provided with the metal intermediate plate of folding, the seat of honour can make when pressing down outside the metal intermediate plate of base opens, to press the pin of folder IC.
5. memory body IC detecting and sorting machine according to claim 1 is characterized in that: more be included in described board and be provided with positioner, for the memory body IC to be measured location from the transfer of feed casket.
6. memory body IC detecting and sorting machine according to claim 5 is characterized in that: described positioner offers several locating slots, for the location memory body IC.
7. memory body IC detecting and sorting machine according to claim 1; It is characterized in that: board is provided with the axial frame slide rail of Y; The described materials device that moves is on the frame slide rail, to set up slide, on slide, sets up a plurality of upright saddles again, and each upright saddle upper end links one first cylinder pressure; The lower end then is equiped with the roof pressure tool, and drives roof pressure tool up-down displacement with first cylinder pressure.
8. memory body IC detecting and sorting machine according to claim 1 is characterized in that: the described materials device that moves links with second cylinder pressure and to pick and place head on grillage above the roof pressure tool, picks and places the head displacement of in the roof pressure tool, going up and down and drive with second cylinder pressure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710136307A CN101342531B (en) | 2007-07-13 | 2007-07-13 | Memory body IC detecting and sorting machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710136307A CN101342531B (en) | 2007-07-13 | 2007-07-13 | Memory body IC detecting and sorting machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101342531A CN101342531A (en) | 2009-01-14 |
| CN101342531B true CN101342531B (en) | 2012-09-05 |
Family
ID=40244721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710136307A Expired - Fee Related CN101342531B (en) | 2007-07-13 | 2007-07-13 | Memory body IC detecting and sorting machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101342531B (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101901634B (en) * | 2009-05-26 | 2013-01-02 | 鸿劲科技股份有限公司 | USB memory testing sorter |
| CN102081120B (en) * | 2009-11-27 | 2013-10-09 | 鸿富锦精密工业（深圳）有限公司 | Testing system |
| WO2012061970A1 (en) * | 2010-11-08 | 2012-05-18 | Abb Technology Ab | Batteries testing and sorting system and the method thereof |
| CN103575937B (en) * | 2012-07-31 | 2016-03-02 | 鸿劲科技股份有限公司 | The testing apparatus of vapour-pressure type proving installation and application thereof |
| CN104614666B (en) * | 2015-02-05 | 2017-07-07 | 深圳创维－Rgb电子有限公司 | Automatic tester for circuitboard |
| TWI589881B (en) * | 2015-11-20 | 2017-07-01 | Hon Tech Inc | Carrier locating mechanism of electronic components operating device and operating equipment for its application |
| CN106226676A (en) * | 2016-07-05 | 2016-12-14 | 南通富士通微电子股份有限公司 | A kind of chip parameter test system |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5150797A (en) * | 1990-07-18 | 1992-09-29 | Tokyo Electron Limited | IC sorting and receiving apparatus and method |
| CN2664799Y (en) * | 2003-11-12 | 2004-12-22 | 梁大明 | Grading machine testing gripper mechanism |
| TW200600805A (en) * | 2004-06-18 | 2006-01-01 | Hon Tech Inc | An IC tester suitable for different IC carrier |
| TW200613752A (en) * | 2004-10-19 | 2006-05-01 | Hon Tech Inc | Visual inspection machine for electronic component |
-
2007
- 2007-07-13 CN CN200710136307A patent/CN101342531B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5150797A (en) * | 1990-07-18 | 1992-09-29 | Tokyo Electron Limited | IC sorting and receiving apparatus and method |
| CN2664799Y (en) * | 2003-11-12 | 2004-12-22 | 梁大明 | Grading machine testing gripper mechanism |
| TW200600805A (en) * | 2004-06-18 | 2006-01-01 | Hon Tech Inc | An IC tester suitable for different IC carrier |
| TW200613752A (en) * | 2004-10-19 | 2006-05-01 | Hon Tech Inc | Visual inspection machine for electronic component |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101342531A (en) | 2009-01-14 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101342531B (en) | Memory body IC detecting and sorting machine | |
| CN101342532B (en) | Memory body IC detecting and sorting machine | |
| CN101241869B (en) | Chip testing classifier | |
| US7642799B2 (en) | Test chip socket and method for testing a chip | |
| CN202861725U (en) | Lantern ring machine for milling cutter and drill bit at end of printed circuit board | |
| CN101308707A (en) | Sorting machine for memory IC detection | |
| CN106425468A (en) | Automatic spring insert plate assembling machine and operating method thereof | |
| JPH0526957A (en) | Electronic part contact assembly and connecting method thereof | |
| CN101322971B (en) | Memory body IC testing and sorting machine | |
| KR100671397B1 (en) | Apparatus for contacting devices to test sockets in semiconductor test handler | |
| CN206505116U (en) | voltage testing system | |
| TWI525329B (en) | Tray stacker of handler for testing semiconductor | |
| CN101901634B (en) | USB memory testing sorter | |
| CN106269581B (en) | Identification of fingerprint electronic component apparatus for work and its testing classification equipment of application | |
| CN105894055A (en) | Automatic reading-writing system of main board tag information of mobile phone | |
| CN208068427U (en) | Automatic punch machine | |
| CN206490730U (en) | The detection tool of cell phone mainboard download function | |
| JP6742501B2 (en) | Load measuring system | |
| CN110216172A (en) | A kind of bending robot sliding induction catch pawl | |
| TW201930845A (en) | Gland module, test device having gland module, and test classification apparatus using the same capable of reducing the transfer stroke and easily adding test modules thereby improving test quality and production efficiency | |
| TWI337360B (en) | Testing and classifying machine for use in memory ics | |
| CN108353536A (en) | To substrate operation machine and insertion method | |
| CN107943010A (en) | FCT test devices based on motor simulation | |
| CN2774078Y (en) | Double-station dynamic positioner of resonator lead wire strip | |
| KR101173373B1 (en) | Customer tray stacker |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120905 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |