JP6376601B2 - ペリクル支持手段及びこれを用いたペリクル支持装置とペリクル装着方法 - Google Patents

ペリクル支持手段及びこれを用いたペリクル支持装置とペリクル装着方法 Download PDF

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JP6376601B2
JP6376601B2 JP2015100677A JP2015100677A JP6376601B2 JP 6376601 B2 JP6376601 B2 JP 6376601B2 JP 2015100677 A JP2015100677 A JP 2015100677A JP 2015100677 A JP2015100677 A JP 2015100677A JP 6376601 B2 JP6376601 B2 JP 6376601B2
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Japan
Prior art keywords
pellicle
support means
frame
support
adhesive layer
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JP2015100677A
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English (en)
Japanese (ja)
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JP2016218162A (ja
Inventor
一敏 関原
一敏 関原
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Shin Etsu Chemical Co Ltd
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Shin Etsu Chemical Co Ltd
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Priority to JP2015100677A priority Critical patent/JP6376601B2/ja
Priority to TW105114794A priority patent/TWI624859B/zh
Priority to CN201610323191.4A priority patent/CN106168735B/zh
Priority to KR1020160060003A priority patent/KR102666696B1/ko
Publication of JP2016218162A publication Critical patent/JP2016218162A/ja
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G03F1/64—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof characterised by the frames, e.g. structure or material, including bonding means therefor
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/62—Pellicles, e.g. pellicle assemblies, e.g. having membrane on support frame; Preparation thereof
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
    • G03F1/66—Containers specially adapted for masks, mask blanks or pellicles; Preparation thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/033—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers
    • H01L21/0334—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane
    • H01L21/0337—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising inorganic layers characterised by their size, orientation, disposition, behaviour, shape, in horizontal or vertical plane characterised by the process involved to create the mask, e.g. lift-off masks, sidewalls, or to modify the mask, e.g. pre-treatment, post-treatment

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  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical & Material Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Preparing Plates And Mask In Photomechanical Process (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
JP2015100677A 2015-05-18 2015-05-18 ペリクル支持手段及びこれを用いたペリクル支持装置とペリクル装着方法 Active JP6376601B2 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2015100677A JP6376601B2 (ja) 2015-05-18 2015-05-18 ペリクル支持手段及びこれを用いたペリクル支持装置とペリクル装着方法
TW105114794A TWI624859B (zh) 2015-05-18 2016-05-13 防塵薄膜組件以及其安裝方法
CN201610323191.4A CN106168735B (zh) 2015-05-18 2016-05-16 防尘薄膜组件以及其安装方法
KR1020160060003A KR102666696B1 (ko) 2015-05-18 2016-05-17 펠리클 및 그 장착 방법

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2015100677A JP6376601B2 (ja) 2015-05-18 2015-05-18 ペリクル支持手段及びこれを用いたペリクル支持装置とペリクル装着方法

Publications (2)

Publication Number Publication Date
JP2016218162A JP2016218162A (ja) 2016-12-22
JP6376601B2 true JP6376601B2 (ja) 2018-08-22

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JP2015100677A Active JP6376601B2 (ja) 2015-05-18 2015-05-18 ペリクル支持手段及びこれを用いたペリクル支持装置とペリクル装着方法

Country Status (4)

Country Link
JP (1) JP6376601B2 (zh)
KR (1) KR102666696B1 (zh)
CN (1) CN106168735B (zh)
TW (1) TWI624859B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6706575B2 (ja) * 2016-12-22 2020-06-10 信越化学工業株式会社 ペリクルフレーム及びこれを用いたペリクル
JP2018180252A (ja) * 2017-04-12 2018-11-15 日本特殊陶業株式会社 ペリクル枠及びその製造方法
JP6921412B2 (ja) * 2018-01-25 2021-08-18 株式会社ブイ・テクノロジー ペリクルフレーム把持装置及びペリクルフレーム把持方法
JP7061288B2 (ja) * 2018-08-28 2022-04-28 日本軽金属株式会社 フラットパネルディスプレイ用ペリクル枠体及びその製造方法
JP7040427B2 (ja) * 2018-12-03 2022-03-23 信越化学工業株式会社 ペリクル、ペリクル付露光原版、露光方法及び半導体の製造方法
WO2021117817A1 (ja) * 2019-12-13 2021-06-17 三井化学株式会社 ペリクルのデマウント方法、及び、ペリクルのデマウント装置
JP7375210B2 (ja) * 2020-08-20 2023-11-07 三井化学株式会社 アライメントユニット用の防塵構造体
JP7063962B2 (ja) * 2020-09-23 2022-05-09 信越化学工業株式会社 ペリクルフレーム及びペリクル

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6736386B1 (en) * 2001-04-10 2004-05-18 Dupont Photomasks, Inc. Covered photomask holder and method of using the same
US7316869B2 (en) * 2003-08-26 2008-01-08 Intel Corporation Mounting a pellicle to a frame
JP4478558B2 (ja) * 2004-12-08 2010-06-09 大日本印刷株式会社 大型ペリクルの搬送方法、搬送用治具及びペリクルケース
JP4478557B2 (ja) * 2004-12-08 2010-06-09 大日本印刷株式会社 大型ペリクル、ペリクル搬送方法、ペリクルケース及びペリクル移載装置
JP4677632B2 (ja) * 2005-07-08 2011-04-27 レーザーテック株式会社 ペリクルライナー又はペリクルの剥離装置、剥離方法及びパターン基板の製造方法
WO2009008294A1 (ja) * 2007-07-06 2009-01-15 Asahi Kasei E-Materials Corporation 大型ペリクルの枠体及び該枠体の把持方法
JP4879308B2 (ja) * 2009-10-29 2012-02-22 信越化学工業株式会社 ペリクル剥離用冶具および剥離方法
JP5202557B2 (ja) * 2010-03-05 2013-06-05 信越化学工業株式会社 ペリクルハンドリング治具
JP5528190B2 (ja) * 2010-04-23 2014-06-25 信越化学工業株式会社 ペリクル収納容器
JP2012103638A (ja) * 2010-11-15 2012-05-31 Shin Etsu Chem Co Ltd ペリクルハンドリング治具
JP5854511B2 (ja) * 2012-10-16 2016-02-09 信越化学工業株式会社 ペリクルおよびペリクルの貼付け方法
JP5984187B2 (ja) 2013-04-22 2016-09-06 信越化学工業株式会社 ペリクルとフォトマスクのアセンブリ
JP6004582B2 (ja) * 2013-04-30 2016-10-12 信越化学工業株式会社 ペリクル
JP6261004B2 (ja) * 2014-01-20 2018-01-17 信越化学工業株式会社 Ｅｕｖ用ペリクルとこれを用いたｅｕｖ用アセンブリーおよびその組立方法

Also Published As

Publication number Publication date
JP2016218162A (ja) 2016-12-22
CN106168735A (zh) 2016-11-30
KR102666696B1 (ko) 2024-05-20
TWI624859B (zh) 2018-05-21
CN106168735B (zh) 2020-01-03
TW201705210A (zh) 2017-02-01
KR20160135665A (ko) 2016-11-28

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