JP6374093B2 - レーザーパッケージングシステム及び方法 - Google Patents

レーザーパッケージングシステム及び方法 Download PDF

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JP6374093B2
JP6374093B2 JP2017504388A JP2017504388A JP6374093B2 JP 6374093 B2 JP6374093 B2 JP 6374093B2 JP 2017504388 A JP2017504388 A JP 2017504388A JP 2017504388 A JP2017504388 A JP 2017504388A JP 6374093 B2 JP6374093 B2 JP 6374093B2
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laser
module
glass frit
predetermined
output
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JP2017524538A (ja
Inventor
ファン，ユェンハウ
ジュ，シュツン
ルオ，ウェン
チェン，レイリ
Original Assignee
シャンハイ マイクロ エレクトロニクス イクイプメント（グループ）カンパニー リミティド
シャンハイ マイクロ エレクトロニクス イクイプメント（グループ）カンパニー リミティド
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations

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  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Electroluminescent Light Sources (AREA)
  • Joining Of Glass To Other Materials (AREA)
JP2017504388A 2014-07-29 2015-05-27 レーザーパッケージングシステム及び方法 Active JP6374093B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN201410367513.6A CN105336877B (zh) 2014-07-29 2014-07-29 激光扫描密封玻璃封装体的系统和方法
CN201410367513.6 2014-07-29
PCT/CN2015/079918 WO2016015515A1 (zh) 2014-07-29 2015-05-27 激光封装系统和方法

Publications (2)

Publication Number Publication Date
JP2017524538A JP2017524538A (ja) 2017-08-31
JP6374093B2 true JP6374093B2 (ja) 2018-08-15

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JP2017504388A Active JP6374093B2 (ja) 2014-07-29 2015-05-27 レーザーパッケージングシステム及び方法

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JP (1) JP6374093B2 (zh)
KR (1) KR101920286B1 (zh)
CN (1) CN105336877B (zh)
SG (1) SG11201700622VA (zh)
TW (1) TWI629915B (zh)
WO (1) WO2016015515A1 (zh)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107331590B (zh) * 2016-04-29 2019-06-25 上海微电子装备（集团）股份有限公司 准同步激光封装系统及方法
CN107665826B (zh) * 2016-07-29 2019-11-26 上海微电子装备（集团）股份有限公司 激光封装方法及激光封装装置
CN106206985B (zh) * 2016-08-19 2017-11-07 京东方科技集团股份有限公司 封装结构及制作方法、显示面板及显示装置
CN106425088B (zh) * 2016-10-25 2019-09-17 昆山国显光电有限公司 激光密封玻璃料的方法及激光密封系统
CN109093251B (zh) * 2017-06-20 2020-08-04 上海微电子装备（集团）股份有限公司 一种激光封装装置及封装方法
CN109422449B (zh) * 2017-09-01 2021-03-09 上海微电子装备（集团）股份有限公司 一种激光扫描封装系统及方法
CN109542449A (zh) * 2018-10-29 2019-03-29 大族激光科技产业集团股份有限公司 一种非线性激光功率控制nc编程方法及激光功率控制系统
CN110018668A (zh) * 2019-04-11 2019-07-16 湖北三江航天红峰控制有限公司 一种激光功率跟随控制方法
CN110031327A (zh) * 2019-04-19 2019-07-19 西北核技术研究所 复合材料高温力学性能-升温率相关性参数测试系统及方法
CN111138076B (zh) * 2019-12-30 2022-04-19 武汉华工激光工程有限责任公司 一种激光玻璃焊接控制系统及方法
CN112171056B (zh) * 2020-08-14 2023-04-07 大族激光科技产业集团股份有限公司 一种oled激光封装装置
CN115890009B (zh) * 2023-03-03 2023-05-12 北京金橙子科技股份有限公司 基于功能升级的激光器和振镜数据处理系统、方法和介质

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006205216A (ja) * 2005-01-28 2006-08-10 Pioneer Electronic Corp レーザ溶接装置、及びレーザ溶接方法
KR100885563B1 (ko) * 2005-12-06 2009-02-24 코닝 인코포레이티드 글래스 패키지 제조방법 및 그 밀봉장치
US7537504B2 (en) * 2005-12-06 2009-05-26 Corning Incorporated Method of encapsulating a display element with frit wall and laser beam
CN101512709B (zh) * 2005-12-06 2011-03-23 康宁股份有限公司 气密式密封玻璃封装及其制造方法
CN201002157Y (zh) * 2006-12-08 2008-01-09 华南理工大学 基于振镜扫描的选择性激光微钎焊系统
US8247730B2 (en) * 2007-09-28 2012-08-21 Corning Incorporated Method and apparatus for frit sealing with a variable laser beam
KR101117732B1 (ko) * 2010-01-19 2012-02-24 삼성모바일디스플레이주식회사 기판 밀봉에 사용되는 레이저 빔 조사 장치 및 이를 이용한 유기 발광 디스플레이 장치의 제조 방법
CN102248304A (zh) * 2011-01-13 2011-11-23 苏州德龙激光有限公司 用于背光源加工的co2激光高速划槽装置及其方法
CN102690045A (zh) * 2011-03-21 2012-09-26 上海微电子装备有限公司 封装装置及封装方法
CN102694132B (zh) * 2011-03-21 2016-04-20 上海微电子装备有限公司 一种封装装置及封装方法
JP2013125718A (ja) * 2011-12-16 2013-06-24 Sharp Corp 表示装置及びその製造方法
JP6116170B2 (ja) * 2012-09-24 2017-04-19 株式会社半導体エネルギー研究所 封止体の作製方法
CN102945054A (zh) * 2012-10-12 2013-02-27 上海大学 光电器件封装、激光键合温度采集与控制系统和方法
CN103474587B (zh) * 2013-09-30 2015-12-02 上海大学 Oled封装装置
CN103482857A (zh) * 2013-09-30 2014-01-01 上海大学 激光准同步扫描方法和系统
CN103553312A (zh) * 2013-10-18 2014-02-05 昆山思拓机器有限公司 用于激光焊接oled玻璃的温控装置和方法

Also Published As

Publication number Publication date
TW201605285A (zh) 2016-02-01
CN105336877B (zh) 2018-01-26
WO2016015515A1 (zh) 2016-02-04
TWI629915B (zh) 2018-07-11
KR20170041779A (ko) 2017-04-17
SG11201700622VA (en) 2017-03-30
CN105336877A (zh) 2016-02-17
JP2017524538A (ja) 2017-08-31
KR101920286B1 (ko) 2018-11-20

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