SG11201700622VA - Laser packaging system and method - Google Patents

Laser packaging system and method

Info

Publication number
SG11201700622VA
SG11201700622VA SG11201700622VA SG11201700622VA SG11201700622VA SG 11201700622V A SG11201700622V A SG 11201700622VA SG 11201700622V A SG11201700622V A SG 11201700622VA SG 11201700622V A SG11201700622V A SG 11201700622VA SG 11201700622V A SG11201700622V A SG 11201700622VA
Authority
SG
Singapore
Prior art keywords
packaging system
laser packaging
laser
packaging
Prior art date
Application number
SG11201700622VA
Inventor
Yuanhao Huang
Shucun Zhu
Wen Luo
Leili Cheng
Original Assignee
Shanghai Microelectronics Equi
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shanghai Microelectronics Equi filed Critical Shanghai Microelectronics Equi
Publication of SG11201700622VA publication Critical patent/SG11201700622VA/en

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
    • H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
    • H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/87—Passivation; Containers; Encapsulations

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Laser Beam Processing (AREA)
  • Electroluminescent Light Sources (AREA)
  • Joining Of Glass To Other Materials (AREA)
SG11201700622VA 2014-07-29 2015-05-27 Laser packaging system and method SG11201700622VA (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CN201410367513.6A CN105336877B (en) 2014-07-29 2014-07-29 The system and method for laser scanning seal glass packaging body
PCT/CN2015/079918 WO2016015515A1 (en) 2014-07-29 2015-05-27 Laser packaging system and method

Publications (1)

Publication Number Publication Date
SG11201700622VA true SG11201700622VA (en) 2017-03-30

Family

ID=55216738

Family Applications (1)

Application Number Title Priority Date Filing Date
SG11201700622VA SG11201700622VA (en) 2014-07-29 2015-05-27 Laser packaging system and method

Country Status (6)

Country Link
JP (1) JP6374093B2 (en)
KR (1) KR101920286B1 (en)
CN (1) CN105336877B (en)
SG (1) SG11201700622VA (en)
TW (1) TWI629915B (en)
WO (1) WO2016015515A1 (en)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107331590B (en) * 2016-04-29 2019-06-25 上海微电子装备（集团）股份有限公司 Plesiochronous laser package system and method
CN107665826B (en) * 2016-07-29 2019-11-26 上海微电子装备（集团）股份有限公司 Laser package method and laser package device
CN106206985B (en) * 2016-08-19 2017-11-07 京东方科技集团股份有限公司 Encapsulating structure and preparation method, display panel and display device
CN106425088B (en) * 2016-10-25 2019-09-17 昆山国显光电有限公司 The method and package sealing with laser system of package sealing with laser frit
CN109093251B (en) * 2017-06-20 2020-08-04 上海微电子装备（集团）股份有限公司 Laser packaging device and packaging method
CN109422449B (en) * 2017-09-01 2021-03-09 上海微电子装备（集团）股份有限公司 Laser scanning packaging system and method
CN109542449A (en) * 2018-10-29 2019-03-29 大族激光科技产业集团股份有限公司 A kind of non-linear laser power control NC programmed method and laser power control system
CN110018668A (en) * 2019-04-11 2019-07-16 湖北三江航天红峰控制有限公司 A kind of laser power follow-up control method
CN110031327A (en) * 2019-04-19 2019-07-19 西北核技术研究所 Composite material mechanical behavior under high temperature-rate of temperature rise relevance parameter test macro and method
CN111138076B (en) * 2019-12-30 2022-04-19 武汉华工激光工程有限责任公司 Laser glass welding control system and method
CN112171056B (en) * 2020-08-14 2023-04-07 大族激光科技产业集团股份有限公司 OLED laser packaging device
CN115890009B (en) * 2023-03-03 2023-05-12 北京金橙子科技股份有限公司 Laser and galvanometer data processing system, method and medium based on function upgrading

Family Cites Families (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006205216A (en) * 2005-01-28 2006-08-10 Pioneer Electronic Corp Laser welding equipment and laser welding method
US7537504B2 (en) * 2005-12-06 2009-05-26 Corning Incorporated Method of encapsulating a display element with frit wall and laser beam
CN101512709B (en) * 2005-12-06 2011-03-23 康宁股份有限公司 Hermetically sealed glass package and method of manufacture
TWI327757B (en) * 2005-12-06 2010-07-21 Corning Inc System and method for frit sealing glass packages
CN201002157Y (en) * 2006-12-08 2008-01-09 华南理工大学 Selective laser micro-braze-welding system based on vibration mirror scanning
US8247730B2 (en) * 2007-09-28 2012-08-21 Corning Incorporated Method and apparatus for frit sealing with a variable laser beam
KR101117732B1 (en) * 2010-01-19 2012-02-24 삼성모바일디스플레이주식회사 Laser beam irradiation apparatus for substrate sealing and manufacturing method of organic light emitting display device using the same
CN102248304A (en) * 2011-01-13 2011-11-23 苏州德龙激光有限公司 CO2 laser high-speed slotting device and method for backlight source processing
CN102690045A (en) * 2011-03-21 2012-09-26 上海微电子装备有限公司 Packaging device and packaging method
CN102694132B (en) * 2011-03-21 2016-04-20 上海微电子装备有限公司 A kind of packaging system and method for packing
JP2013125718A (en) * 2011-12-16 2013-06-24 Sharp Corp Display device and manufacturing method thereof
JP6116170B2 (en) * 2012-09-24 2017-04-19 株式会社半導体エネルギー研究所 Manufacturing method of sealing body
CN102945054A (en) * 2012-10-12 2013-02-27 上海大学 Photoelectric device encapsulation and laser bonding temperature collection and control system and method
CN103482857A (en) * 2013-09-30 2014-01-01 上海大学 Laser quasi-synchronous scanning method and system
CN103474587B (en) * 2013-09-30 2015-12-02 上海大学 OLED packaging system
CN103553312A (en) * 2013-10-18 2014-02-05 昆山思拓机器有限公司 Temperature control device and method for laser welding OLED (organic light-emitting diode) glass

Also Published As

Publication number Publication date
JP2017524538A (en) 2017-08-31
TW201605285A (en) 2016-02-01
CN105336877A (en) 2016-02-17
KR20170041779A (en) 2017-04-17
KR101920286B1 (en) 2018-11-20
JP6374093B2 (en) 2018-08-15
WO2016015515A1 (en) 2016-02-04
TWI629915B (en) 2018-07-11
CN105336877B (en) 2018-01-26

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