CN109093251B - Laser packaging device and packaging method - Google Patents
Laser packaging device and packaging method Download PDFInfo
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- CN109093251B CN109093251B CN201710470990.9A CN201710470990A CN109093251B CN 109093251 B CN109093251 B CN 109093251B CN 201710470990 A CN201710470990 A CN 201710470990A CN 109093251 B CN109093251 B CN 109093251B
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- 230000003247 decreasing effect Effects 0.000 claims description 8
- 230000003287 optical effect Effects 0.000 claims description 6
- 238000005538 encapsulation Methods 0.000 claims description 5
- 230000001678 irradiating effect Effects 0.000 claims description 4
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- 238000007789 sealing Methods 0.000 abstract description 7
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/875—Arrangements for extracting light from the devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0626—Energy control of the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/073—Shaping the laser spot
- B23K26/0732—Shaping the laser spot into a rectangular shape
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/20—Bonding
- B23K26/206—Laser sealing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
- H10K71/421—Thermal treatment, e.g. annealing in the presence of a solvent vapour using coherent electromagnetic radiation, e.g. laser annealing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
- H10K59/8722—Peripheral sealing arrangements, e.g. adhesives, sealants
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- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Laser Beam Processing (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The invention provides a laser packaging device and a packaging method, wherein the laser packaging device irradiates a laser beam onto a packaging substrate and forms a light spot, the light intensity from the edge of the light spot to the center of the light spot is gradually reduced on a surface vertical to the direction of the traveling route of the laser beam, the light spot comprises a first section close to the edge of the light spot and a second section close to the center of the light spot, the light intensity reduction ratio of the first section is smaller than that of the second section, and the boundary position of the first section and the second section is a first inflection point. The laser beam with the light spots provided by the invention is adopted to package the packaging substrate, so that the uniformity of the dose irradiated on the glass frit is effectively improved, and the sealing property of the glass frit is further improved.
Description
Technical Field
The invention relates to the field of photoelectric semiconductors, in particular to a laser packaging device and a packaging method.
Background
Among them, O L ED (Organic light Emitting Diode) has been a hot point of research due to its characteristics of good color ratio, wide viewing angle, high response speed, etc. however, electrodes and Organic layers in O L ED devices are very sensitive to oxygen and moisture, and oxygen and moisture permeating into O L ED devices from the external environment seriously shorten the life of O L ED devices, therefore, it is very important to provide an effective hermetic seal for O L ED devices, and the hermetic seal for O L devices has the following requirements:
the hermetic seal should provide oxygen (10)-3Centimeter3Rice/rice2Day) and water (10)-6Gram/meter2Day) barrier.
The size of the hermetic seal should be as small as possible (e.g., <2 mm) so that it does not adversely affect the size of the O L ED display.
The temperatures generated during the sealing process should not damage the materials (e.g., electrodes and organic layers, etc.) in the O L ED display.
The gases released during the sealing process should not contaminate the material in the O L ED display.
The hermetic seal should enable point-connected components (e.g., thin film chromium electrodes) to enter the O L ED display
In practical applications, the conventional scan packaging technology has difficulty meeting the requirements of packaging for O L ED displays, such as dense holes (bubbles) formed in the glass frit and near the edge, which affects the packaging quality, due to the characteristic constraints of the shape (circular TOP-HAT), poor uniformity and the like of the laser spot focused on the glass frit layer, and the upper limit of the size and scanning speed of the packaging pattern.
Disclosure of Invention
In view of the above, the present invention provides a laser packaging apparatus and a laser packaging method to solve the problem of poor sealing performance of a glass package.
In order to solve the above technical problem, the present invention provides a laser packaging device, wherein the laser packaging device irradiates a laser beam onto a packaging substrate and forms a light spot, the light intensity from an edge of the light spot to a center of the light spot gradually decreases on a surface perpendicular to a direction of a traveling route of the laser beam, the light spot includes a first section near the edge of the light spot and a second section near the center of the light spot, a light intensity decrease ratio of the first section is smaller than a light intensity decrease ratio of the second section, and a boundary position between the first section and the second section is a first inflection point.
Optionally, the energy distribution of the laser beam is symmetrically distributed with respect to the direction of the laser beam traveling route.
Optionally, the light intensity at the center of the light spot is greater than or equal to 95% of the light intensity at the first inflection point.
Optionally, the first segment includes a near-center segment in which the intensity of light near the center of the light spot gradually decreases, and a near-edge segment in which the rate of decrease near the edge portion is greater than that of the near-center segment, and the boundary position between the near-center segment and the near-edge segment is a second inflection point.
Optionally, the second inflection points are symmetrically distributed with respect to the center of the light spot.
Optionally, the first section is a curve section in which the descending ratio gradually decreases or a straight section in which the descending ratio is fixed.
Optionally, the first inflection points are symmetrically distributed with respect to the center of the light spot.
Optionally, the energy distribution of the light spot further includes a third section with uniform light intensity, and the third section is located outside the first section.
Optionally, the energy distribution of the light spot further includes a third section in which the light intensity decreases from inside to outside, the third section is located outside the first section, and the light intensity decrease ratio of the third section is greater than the light intensity decrease ratio of the first section.
Optionally, the laser packaging apparatus includes:
a light source assembly for providing a laser beam;
the shaping component is used for shaping the appearance of the light spot of the laser beam;
a scanning galvanometer for scanning the laser beam onto the package substrate;
the laser system comprises a light source assembly used for providing the laser beam, a shaping assembly used for shaping the spot shape of the laser beam, a scanning galvanometer used for scanning the laser beam, and an imaging mirror group used for imaging the laser beam.
Optionally, an imaging lens group is arranged on the scanning galvanometer, and the scanning galvanometer scans the laser beam onto the packaging substrate through the imaging lens group.
Optionally, the imaging lens group is a telecentric field lens group.
Optionally, the focal length of the imaging lens group ranges from 290mm to 310 mm.
Optionally, the laser packaging apparatus further includes:
the beam expanding lens group is used for zooming the laser beam;
the beam expander set is positioned between the light source assembly and the shaping assembly.
Optionally, the zoom range of the beam expander set is 1-2 times.
Optionally, the light source assembly is an infrared laser.
Optionally, the infrared laser includes a light source and a collimator set, and the light source emits a laser beam, and the laser beam is collimated by the collimator set to form a parallel laser beam.
Optionally, the shaping component is a diffractive optical element or a refractive optical element or a deformable mirror or a spatial light modulator.
Optionally, the scanning galvanometer is a two-dimensional scanning galvanometer, and the scanning angle range of the two-dimensional scanning galvanometer is ± 20 °.
Another aspect of the present invention provides a method for encapsulating a package substrate, in which a laser beam is irradiated to a region to be encapsulated of the package substrate to encapsulate the package substrate, including the steps of:
establishing an area to be encapsulated of the encapsulation substrate;
irradiating the laser beam to a region to be packaged of the packaging substrate, wherein the laser beam forms a light spot, the light intensity from the edge of the light spot to the center of the light spot is gradually reduced on a surface vertical to the direction of the traveling route of the laser beam, the light spot comprises a first section close to the edge of the light spot and a second section close to the center of the light spot, the light intensity reduction ratio of the first section is lower than that of the second section, and the boundary position of the first section and the second section is a first inflection point;
the laser beam advances along the area to be packaged of the packaging substrate for packaging.
Optionally, the energy distribution of the laser beam is symmetrically distributed with respect to the direction of the laser beam traveling route.
Optionally, the light intensity of the laser beam irradiated on the center of the substrate is greater than or equal to 95% of the light intensity at the first inflection point.
Optionally, the first segment includes a near-center segment in which the intensity of light near the center of the light spot gradually decreases, and a near-edge segment in which the rate of decrease near the edge portion is greater than that of the near-center segment, and the boundary position between the near-center segment and the near-edge segment is a second inflection point.
Optionally, the second inflection points are symmetrically distributed with respect to the center of the light spot.
Optionally, the first section is a curve section in which the descending ratio gradually decreases or a straight section in which the descending ratio is fixed.
Optionally, the first inflection points are symmetrically distributed with respect to the center of the light spot.
Optionally, the energy distribution of the light spot further includes a third section with uniform light intensity, and the third section is located outside the first section.
Optionally, the energy distribution of the light spot further includes a third section in which the light intensity decreases from inside to outside, the third section is located outside the first section, and the light intensity decrease ratio of the third section is greater than the light intensity decrease ratio of the first section.
In the laser packaging device and the packaging method provided by the invention, a novel light spot is designed, the novel light spot comprises a first section close to the edge of the light spot and a second section close to the center of the light spot, the light intensity reduction ratio of the first section is lower than that of the second section, and the laser beam of the light spot is adopted to package a packaging substrate, so that the uniformity of dose irradiated on frit is effectively improved, and the sealing property of the frit is further improved; in addition, the shaping of the laser beam spot morphology is realized by utilizing the light source component, the shaping element and the scanning galvanometer, the required spot morphology is formed, and the problem of bubbles caused by the dose uniformity of the glass packaging body is solved; and the shapes and sizes of light spots in different shapes can be realized by replacing the shaping element, the diameter range of the light spots can cover dozens of um-dozens of mm, the process adaptability is effectively improved, and the cost is saved.
Drawings
FIG. 1 is a schematic diagram of a laser packaging apparatus according to an embodiment of the present invention;
FIG. 2 is a top view of a glass package in accordance with an embodiment of the present invention;
FIG. 3 is a top view of an O L ED display in accordance with an embodiment of the present invention;
FIG. 4 is a two-dimensional spot profile generated in one embodiment of the present invention;
FIG. 5 is a plot of the integrated spot profile along the scan direction of a spot generated in an embodiment of the present invention;
FIG. 6 is a block diagram of a frit encapsulation system in accordance with an embodiment of the present invention;
FIG. 7 is a graph comparing a non-scanning temperature profile of an embodiment of the present invention with a conventional M-shaped spot;
FIG. 8 is an observation under a microscope of a glass package encapsulated in accordance with an embodiment of the present invention;
FIG. 9 is an observation image under a microscope of a prior art encapsulated glass package;
fig. 10 is a cross-sectional view of a cut piece of frit encapsulated by a laser beam spot formed in accordance with an embodiment of the present invention.
In the figure, 110-a control system, 111, 112, 113, 114, 115-a laser packaging device, 1110-a light source, 1111-a collimating lens group, 1112-a beam expander group, 1113-a shaping assembly, 1114-a scanning galvanometer, 1115-a telecentric field lens, 120-a glass substrate, 121-a glass packaging body, 1211-cover glass, 1212-frit, 1213-substrate glass, 1214-an electrode, 1215-O L ED layer, A-a second section, B-a first section and C-a third section.
Detailed Description
The laser packaging device and the packaging method proposed by the present invention will be further described in detail with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become more fully apparent from the appended claims and the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
Referring to fig. 1, the present embodiment provides a laser packaging apparatus, which can form a spot profile on a package substrate as shown in fig. 4 and 5, wherein the intensity of the light from the edge of the spot to the center of the spot gradually decreases on a surface perpendicular to the direction of the laser beam traveling path, and referring to fig. 4, the intensity distribution of the spot can be divided into a first section B and a second section a, the first section B decreases from the strongest intensity I2 to I1, the second section a decreases from I1 by 0-5% to I0, wherein the decrease rate of the second section a from I1 to I0 is greater than the decrease rate of the first section B from the strongest intensity I2 to I1, and a first inflection point is formed at I1. Fig. 5 is a shape of the scanning spot after integration along the scanning direction, and it can be seen from fig. 5 that the intensity of the central position of the scanning spot is lower than that of the periphery in the actual application scene, and since the region to be packaged is an approximately rectangular region, the accumulated light intensity along the center of the scanning path is consistent with the accumulated light intensity on both sides of the scanning path in this example, thereby ensuring the uniformity of the package. The energy distribution of the light spots formed by irradiating the substrate with the laser beam is distributed symmetrically relative to the plane of the parallel traveling route. And the intensity of light I0 at the center point is greater than or equal to 95% of the intensity of light I1 at the first inflection point, i.e., I0 = I1 × 95%. The first segment from the strongest intensity I2 to I1 may take various forms, such as a straight line segment with a fixed rate of decrease, a curved line segment with a gradually decreasing rate of decrease, and a broken line segment with a decreasing rate of decrease, wherein the broken line segment may have one or more inflection points, and the inflection points are symmetrically distributed with respect to the center line of the light spot.
The light spot may further include a third section C, which is located outside the first section B, may be a section in which the light intensity is uniformly distributed, and may also be a section in which the light intensity rapidly decreases from inside to outside, and is located in an edge area of the light spot irradiated by the laser beam in the area to be packaged on the substrate, where the third section C may or may not participate in the packaging, and is determined by a specific working condition.
Referring to fig. 1, the laser package apparatus provided in this embodiment includes: the light source assembly (including the light source 1110 and the collimating lens group 1111), the beam expanding lens group 1112, the shaping assembly 1113, the scanning galvanometer 1114 and the imaging lens group. The light source assembly 1110 is an infrared laser and includes a light source 1110 and a collimating lens group 1111, the light source 1110 emits a divergent laser beam, and the divergent laser beam is collimated by the collimating lens group 1111 to form a parallel laser beam, wherein the collimating lens group 1111 is configured to collimate the laser beam output by the light source 1110. The beam expander set 1112 is used for zooming the light spot of the laser beam, the shaping component 1113 is used for shaping the light spot appearance of the laser beam, the scanning galvanometer 1114 is used for scanning the laser beam to form scanning laser, the imaging set is a telecentric field lens 1115, and the telecentric field lens 1115 is used for imaging the formed scanning laser onto the glass packaging body. During operation, a divergent laser beam emitted by the light source 1110 reaches the collimating mirror group 1111, is collimated by the collimating mirror group 1111 to form a parallel laser beam, and reaches the beam expanding mirror group 1112, the beam expanding mirror group 1112 magnifies and adjusts a laser beam spot and then reaches the shaping component 1113, the shaping component 1113 shapes the spot shape and then reaches the scanning galvanometer 1114, the scanning galvanometer 1114 scans the laser beam, and forms a scanning laser to reach the telecentric field lens 1115, and the telecentric field lens 1115 images the laser beam onto the glass packaging body 121, so that the glass packaging body 121 is subjected to laser packaging.
The beam expander set 1112 is configured to magnify the laser beam and control the size of the laser beam spot to control the laser power. The beam expander set 1112 is located between the light source assembly and the scanning galvanometer 1114, and the beam expander set 1112 can realize zooming of 1-2 times. By adjusting the beam expander set 1112 and the switching shaping component 1113, the change of the light spot size can be realized.
The shaping component 1113 can be made of DOE (Diffractive Optical Elements), ROE (Refractive Optical Elements), deformable mirror or spatial light modulator, and the diameter of the shaping light spot that can be realized is 650 um. The laser beam generated by the light source 1110 is an infrared gaussian beam with a wavelength of 1064 nm. The scanning galvanometer 1114 is a two-dimensional scanning galvanometer, and the scanning angle range of the two-dimensional scanning galvanometer is ± 20 °. The focal length range of the telecentric field lens 1115 is 290-310 mm, and preferably 300 mm. The spot diameter of the laser beam incident on the shaping component 1113 can be calculated according to the following equation:
Dspot=4×λ×M2×f/(π×D)
where λ is the wavelength, M2Is Gaussian beam quality factor, f is field lens focal length, pi is circumferential ratio, DspotIs the spot diameter of the laser beam incident on the shaping assembly 1113. Through calculation, the minimum diameter of the light spot realized by the invention can reach dozens of um.
The two-dimensional profile of the formed light spot in this embodiment is shown in fig. 4, and the profile is symmetrically distributed, and after the light spot intensity continuously decreases from the highest light spot intensity I2 to I1, the light spot intensity suddenly decreases by 5% to the lowest light spot intensity I0. The spot topography after integration along the scan direction in this example is shown in fig. 5, with an I3 spot intensity about 5% below the strongest spot intensity I4.
Referring to fig. 2-3, a common form of the glass package processed according to the present invention is shown in fig. 2, a typical example of the glass substrate 120 is an O L ED display, the glass substrate 120 is covered with the same glass package 121, and the structure of the single glass package 121 includes a cover glass 1211, a frit 1212, a substrate glass 1213, an O L ED layer 1215 and an electrode 1214, wherein the number of the glass packages 121 can be configured for the laser packaging device according to the yield requirement.
The present embodiment provides a frit packaging system, and referring to fig. 6, the frit packaging system includes: the control system 110 and the laser packaging apparatus provided in the first embodiment are connected, and the control system 110 is connected to each of the laser packaging apparatuses, and is configured to control the laser packaging apparatuses to perform a frit packaging operation. In this embodiment, there are 5 laser packaging devices, including laser packaging devices 111, 112, 113, 114, and 115.
Specifically, the control system 110 is connected to the light source 1110 in the light source module, and the control system 110 can control the light source 1110 to be turned on or off and adjust the laser power of the laser beam emitted by the light source module. The control system 110 is further connected to the scanning galvanometer 1114, and the control system 110 controls the scanning galvanometer 1114 to form scanning laser and match the laser power of the light source module with the scanning speed of the scanning galvanometer 1114.
In order to facilitate grasping the temperature of the light spot on the glass package during laser scanning, the frit sealing system provided in this embodiment further includes a temperature measuring device, and the temperature measuring device is connected to the control system 110, and is configured to measure the real-time temperature of the light spot imaged on the glass package 121, and feed back the real-time temperature of the light spot to the control system 110.
The control system 110 includes a computer and a controller connected to the computer, wherein the controller controls the laser packaging apparatus to perform frit packaging operation, and performs data exchange with the computer.
The embodiment also provides a packaging method of a packaging substrate, which uses laser beam irradiation to a region to be packaged of the packaging substrate to package the packaging substrate, and the packaging method comprises the following steps:
the method comprises the following steps: establishing an area to be encapsulated of the encapsulation substrate;
step two: irradiating the laser beam to an area to be packaged of the packaging substrate;
wherein the laser beam forms a light spot, the light intensity from the edge of the light spot to the center of the light spot gradually decreases on a surface vertical to the direction of the traveling route of the laser beam, the light spot comprises a first section close to the edge of the light spot and a second section close to the center of the light spot, the light intensity decreasing ratio of the first section is lower than that of the second section, and the boundary position of the first section and the second section is a first inflection point;
step three: the laser beam advances along the area to be packaged of the packaging substrate for packaging.
Fig. 7 is a graph comparing the non-scan-direction temperature profile of the present embodiment with a conventional M-shaped spot, wherein the solid line is the profile of the conventional M-shaped spot and the dashed line is the profile of the spot in the present embodiment.
As shown in fig. 8, which is an observation result of the glass package encapsulated in the embodiment of the present invention under a microscope, and fig. 9, which is an observation result of the glass package encapsulated in the prior art under a microscope, it can be seen that many holes are generated in fig. 9, and the temperature uniformity of the laser beam spot generated in the embodiment of the present invention is significantly better than the temperature uniformity of the laser beam spot in the prior art. Fig. 10 is a cross-sectional view of a glass frit packaged by a laser beam spot formed in the embodiment of the present invention, which shows that the glass package body packaged by the laser beam spot generated in the embodiment of the present invention has no obvious hole and the packaging effect is good.
In summary, in the laser packaging device and the packaging method provided by the invention, a novel light spot is designed, which includes a first section near the edge of the light spot and a second section near the center of the light spot, the light intensity reduction ratio of the first section is lower than that of the second section, and the laser beam of the light spot is used for packaging the packaging substrate to effectively improve the uniformity of the dose irradiated on the frit, thereby further improving the sealing property of the frit; in addition, the shaping of the laser beam spot morphology is realized by utilizing the light source component, the shaping element and the scanning galvanometer, the required spot morphology is formed, and the problem of bubbles caused by the dose uniformity of the glass packaging body is solved; and the shapes and sizes of light spots in different shapes can be realized by replacing the shaping element, the diameter range of the light spots can cover dozens of um-dozens of mm, the process adaptability is effectively improved, and the cost is saved.
The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. For the system disclosed by the embodiment, the description is relatively simple because the system corresponds to the method disclosed by the embodiment, and the relevant points can be referred to the method part for description.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (26)
1. A laser packaging device is characterized in that a laser beam is irradiated onto a packaging substrate by the laser packaging device to form a light spot, the light intensity from the edge of the light spot to the center of the light spot is gradually reduced on a surface perpendicular to the direction of the traveling route of the laser beam, the light spot comprises a first section close to the edge of the light spot and a second section close to the center of the light spot, the light intensity reduction ratio of the first section is smaller than that of the second section, and the boundary position of the first section and the second section is a first inflection point;
wherein the first section comprises a near-center section with gradually reduced light intensity near the center of the light spot and a near-edge section with a reduced speed near the edge part larger than that of the near-center section, and the boundary position of the near-center section and the near-edge section is a second inflection point.
2. The laser packaging apparatus of claim 1, wherein the energy distribution of the laser beam is symmetrically distributed with respect to the direction of the path of travel of the laser beam.
3. The laser package of claim 1, wherein the intensity of light at the center of the spot is greater than or equal to 95% of the intensity of light at the first inflection point.
4. The laser packaging apparatus of claim 1, wherein the second inflection points are symmetrically distributed with respect to a center of the spot.
5. The laser packaging apparatus of claim 1, wherein the first section is a curved section in which a drop rate is gradually decreased or a straight section in which a drop rate is fixed.
6. The laser packaging apparatus of claim 1, wherein the first inflection points are symmetrically distributed with respect to a center of the spot.
7. The laser package of claim 1, wherein the energy profile of the spot further comprises a third segment of uniform intensity, the third segment being outside the first segment.
8. The laser packaging apparatus of claim 1, wherein the energy distribution of the light spot further comprises a third section with a light intensity decreasing from inside to outside, the third section is located outside the first section, and a light intensity decreasing rate of the third section is greater than a light intensity decreasing rate of the first section.
9. The laser packaging apparatus of any of claims 1-8, wherein the laser packaging apparatus comprises:
a light source assembly for providing a laser beam;
the shaping component is used for shaping the appearance of the light spot of the laser beam;
and the scanning galvanometer is used for scanning the laser beam to the packaging substrate.
10. The laser packaging apparatus of claim 9, wherein the scanning galvanometer is configured with a set of imaging mirrors, and the scanning galvanometer scans the laser beam onto the package substrate through the set of imaging mirrors.
11. The laser packaging apparatus of claim 10, wherein the imaging mirror is a telecentric field mirror.
12. The laser packaging apparatus of claim 10, wherein the focal length of the imaging lens group is in a range of 290mm to 310 mm.
13. The laser packaging apparatus of claim 9, further comprising:
the beam expanding lens group is used for zooming the laser beam;
the beam expander set is positioned between the light source assembly and the shaping assembly.
14. The laser packaging apparatus of claim 13, wherein the variable magnification range of the beam expander set is 1-2 times.
15. The laser package of claim 9, wherein the light source assembly is an infrared laser.
16. The laser packaging apparatus of claim 15, wherein the infrared laser comprises a light source and a set of collimating mirrors, the light source emitting a laser beam that is collimated by the set of collimating mirrors to form a parallel laser beam.
17. The laser packaging apparatus of claim 9, wherein the shaping component is a diffractive optical element or a refractive optical element or a deformable mirror or a spatial light modulator.
18. The laser packaging apparatus of claim 9, wherein the scanning galvanometer is a two-dimensional scanning galvanometer having a scanning angle range of ± 20 °.
19. A packaging method of a packaging substrate, which adopts laser beam irradiation to a region to be packaged of the packaging substrate to package the packaging substrate, comprises the following steps:
establishing an area to be encapsulated of the encapsulation substrate;
irradiating the laser beam to a region to be packaged of the packaging substrate, wherein the laser beam forms a light spot, the light intensity from the edge of the light spot to the center of the light spot is gradually reduced on a surface vertical to the direction of the traveling route of the laser beam, the light spot comprises a first section close to the edge of the light spot and a second section close to the center of the light spot, the light intensity reduction ratio of the first section is lower than that of the second section, and the boundary position of the first section and the second section is a first inflection point;
the laser beam is packaged along a region to be packaged of the packaging substrate;
wherein the first section comprises a near-center section in which the light intensity gradually decreases near the center of the light spot, and a near-edge section in which the light intensity gradually decreases near the edge portion at a rate greater than that of the near-center section, and the boundary position between the near-center section and the near-edge section is a second inflection point.
20. The packaging method of claim 19, wherein the energy distribution of the laser beam is symmetrically distributed with respect to the direction of the laser beam travel path.
21. The encapsulation method according to claim 19, wherein an intensity of light with which the laser beam is irradiated at the center of the substrate is 95% or more of an intensity of light at the first inflection point.
22. The packaging method of claim 19, wherein the second inflection points are symmetrically distributed with respect to a center of the light spot.
23. The method of claim 19, wherein the first section is a curved section in which a drop rate is gradually decreased or a straight section in which a drop rate is fixed.
24. The packaging method of claim 19, wherein the first inflection points are symmetrically distributed with respect to a center of the light spot.
25. The method of claim 19, wherein the energy distribution of the light spot further comprises a third segment of uniform intensity, the third segment being outside the first segment.
26. The packaging method according to claim 19, wherein the energy distribution of the light spot further includes a third section in which the intensity decreases from inside to outside, the third section is located outside the first section, and the rate of decrease in the intensity of the third section is greater than the rate of decrease in the intensity of the first section.
Priority Applications (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710470990.9A CN109093251B (en) | 2017-06-20 | 2017-06-20 | Laser packaging device and packaging method |
| PCT/CN2018/091756 WO2018233585A1 (en) | 2017-06-20 | 2018-06-19 | Laser encapsulation device and encapsulation method |
| JP2019568058A JP6872042B2 (en) | 2017-06-20 | 2018-06-19 | Laser packaging device and packaging method |
| KR1020197038733A KR20200041836A (en) | 2017-06-20 | 2018-06-19 | Laser encapsulation device and encapsulation method |
| TW107121066A TWI674691B (en) | 2017-06-20 | 2018-06-20 | Laser package device and packaging method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710470990.9A CN109093251B (en) | 2017-06-20 | 2017-06-20 | Laser packaging device and packaging method |
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| Publication Number | Publication Date |
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| CN109093251A CN109093251A (en) | 2018-12-28 |
| CN109093251B true CN109093251B (en) | 2020-08-04 |
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| CN201710470990.9A Active CN109093251B (en) | 2017-06-20 | 2017-06-20 | Laser packaging device and packaging method |
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|---|---|
| JP (1) | JP6872042B2 (en) |
| KR (1) | KR20200041836A (en) |
| CN (1) | CN109093251B (en) |
| TW (1) | TWI674691B (en) |
| WO (1) | WO2018233585A1 (en) |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108908995A (en) * | 2018-06-28 | 2018-11-30 | 胡智晶 | A kind of household garbage-compressing equipment |
| TWI765337B (en) * | 2019-12-13 | 2022-05-21 | 旺矽科技股份有限公司 | Laser chip inspection method and equipment |
| CN111055018B (en) * | 2019-12-29 | 2020-11-17 | 中国科学院西安光学精密机械研究所 | Anti-drag microstructure machining method |
| CN112630984A (en) * | 2020-12-30 | 2021-04-09 | 南京理工大学 | Laser scanning device and scanning method capable of changing size and shape of laser focus position light spot |
| CN113843499A (en) * | 2021-09-10 | 2021-12-28 | 深圳市海目星激光智能装备股份有限公司 | Laser film opening method and device |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI674691B (en) | 2019-10-11 |
| TW201906213A (en) | 2019-02-01 |
| CN109093251A (en) | 2018-12-28 |
| KR20200041836A (en) | 2020-04-22 |
| WO2018233585A1 (en) | 2018-12-27 |
| JP6872042B2 (en) | 2021-05-19 |
| JP2020524400A (en) | 2020-08-13 |
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