TW201605285A - Laser packaging system and method - Google Patents

Abstract

The present invention discloses a laser packaging system for heating glass material (122) distributed along a predetermined trajectory in a glass package (120). The system includes a controller module (201), a laser module (202) and a laser scanning module (203). The controller module (201) is used for controlling the laser scanning module (203) to project laser (100) generated by the laser module (202) onto the glass material (122), wherein the laser scanning module (203) enables the laser (100) to scan the glass material (122) periodically and quickly, so as to synchronously heat the glass material more uniformly and alleviate the problem of the non-uniform temperature distribution in the process of packaging in the prior art. The laser module (202) can emit laser with a predetermined power curve, thereby controlling the heating process of the glass material (122) on the basis of the predetermined power curve. This invention further discloses a laser packaging method.

Description

Laser packaging system and method

The present invention relates to the field of optoelectronic semiconductors, and more particularly to a system and method for encapsulating a glass package using a laser.

Photoelectric semiconductor devices have been widely used in various fields of life. Among them, OLED (organic light-emitting diode) has become a research hotspot due to its good color ratio, wide viewing angle and high response speed, and has a good application prospect. However, the electrodes and organic layers in OLED displays are very sensitive to oxygen and moisture. Oxygen and moisture penetrating into the interior of the OLED device from the external environment can seriously shorten the life of the OLED device. Therefore, it is very important to provide an effective hermetic seal for an OLED device. Some of the factors that make it difficult to properly seal an OLED device are discussed below:

• Hermetic seals should provide a barrier to oxygen (10 ^-3 cm ³ /m ² /day) and water (10 ^-6 g/m ² /day).

‧ The size of the hermetic seal should be as small as possible (eg less than 2mm) so that it does not have a large impact on the size of the OLED display.

• The temperature generated during the sealing process should not damage the materials (such as electrodes and organic layers) in the OLED display. For example, in a OLED display, the first element of the OLED having a distance of about 1-2 mm from the sealing body should not be heated to a temperature higher than 100 ° C during the sealing process, which would otherwise invalidate the first picture element.

‧The gas released during the sealing process should not contaminate the substances in the OLED display dye.

‧ Hermetic seals should allow point-connecting components (such as thin-film chrome electrodes) to enter the OLED display.

In recent years, a sealing method using glass frit-assisted laser heating has been applied to the sealing of OLED displays. The frit described therein is doped with a material having a high absorption rate for a specific light wavelength and has a low melting point characteristic. By using a high energy laser to heat and soften the frit, a hermetic seal is formed between the cover glass on which the frit is placed and the substrate glass on which the OLED is placed. The frit is typically about 0.7-1 mm wide and 6-100 microns thick. The laser output controllable laser energy sequentially illuminates the sealing line of the glass frit, so that the glass frit is heated and softened successively to form a hermetic seal. However, this sequential heating of the frit creates an uneven temperature distribution inside the frit (as shown in Figure 1). This uneven temperature distribution inside the frit can cause cracks, residual stress or delamination problems, hinder or weaken the airtight connection between the cover glass and the substrate glass. At the same time, it is necessary to select the main parameters of the sealing process such as laser power, scanning speed, etc., which is restricted by this method and limits the improvement of the yield.

The object of the present invention is to provide a laser packaging system and method for sealing an OLED display or a glass package, which can solve the problem that the temperature field distribution of the glass frit is uneven, and has a wide technical window, which is beneficial to improve. The yield of OLED displays.

In order to achieve the above object, the present invention provides a laser packaging system for heating a glass frit distributed along a predetermined trajectory in a glass package to seal a glass package, the system comprising: a controller module; a laser module, and the controller a module connected and used to generate a laser; and a laser scanning module, the controller module and the laser The module is connected to project the laser generated by the laser module onto the glass frit, wherein the controller module is used for instantly controlling the laser scanning module to control the scanning direction of the laser on the glass frit. Thereby, the laser scans the glass frit along the predetermined trajectory; the controller module is further configured to instantly control the output power of the laser module, so that the generated laser has a power curve that instantly matches the predetermined trajectory.

Further, the laser packaging system further includes a temperature measuring module connected to the controller module for instantly measuring the surface temperature of the glass frit irradiated by the laser, and measuring the surface The temperature is instantly fed back to the controller module.

Further, the temperature measuring module is a pyrometer.

Further, the laser packaging system further includes a computer connected to the controller module for exchanging data with the controller module.

Further, the controller module is a single controller, a control system composed of multiple controllers or a control board integrated inside the computer.

Further, the laser scanning module is provided with a servo motion mechanism for changing the direction of the laser and scanning the speed and/or acceleration of the glass frit along the predetermined trajectory.

The invention also provides a laser packaging method for heating a glass frit distributed along a predetermined track in a glass package to seal the glass package, comprising the steps of: starting a laser module, causing the laser module to emit laser light; and starting the laser scanning module Projecting the laser light emitted by the laser module onto the glass frit; the controller module instantly controls the laser scanning module to project the laser onto the glass frit, so that the laser scans the glass frit along the predetermined trajectory; Instantly controlling the output power of the laser module by the controller module, so that the generated laser has a power curve that instantly matches the predetermined trajectory; and causing the laser to scan the frit along the predetermined trajectory for a plurality of cycles until the frit is Heat to the melting point.

Further, the predetermined trajectory includes one or more straight segments and one or more curved segments, the power curve including one or more straight segment heating power curves corresponding to the one or more straight segments and the one or The one or more curved segments corresponding to the plurality of curved segments heat the power curve, and the output power corresponding to the straight segment heating power curve is different from the output power corresponding to the curved segment heating power curve.

Further, the scanning of the plurality of cycles uses the output power of the unchanged or gradually decreasing laser module.

Further, the laser packaging method further comprises: measuring and feeding back the instantaneous temperature of the surface of the frit to the controller module by using a temperature measuring module, and adjusting the number of scanning cycles and the output power of the laser module by the controller module And at least one of the rates at which the laser scans the frit along the predetermined trajectory causes the temperature change of the frit to conform to a predetermined temperature profile.

Further, the laser scans the frit along the predetermined trajectory at a rate ranging from 1 m/s to 5 m/s.

Further, before the laser module is activated, the laser scanning module is activated until the laser scanning module can project the laser along the predetermined trajectory to the glass frit at a predetermined speed to restart the laser module.

Further, the laser packaging method further comprises: immediately after the glass frit is heated to a melting point, the laser module is turned off, and the glass frit is naturally cooled.

Further, the laser packaging method further includes turning off the laser module After that, the laser scanning module continues to operate for a period of time, and then stops the laser scanning module.

Further, the laser packaging method further comprises: after the glass frit is heated to a melting point, reducing the output power of the laser module to a cooling power value, and continuing to cause the laser to periodically scan the glass frit along the predetermined trajectory until: The frit is cooled to a predetermined temperature.

Further, the laser packaging method further includes continuing the natural cooling after the glass frit is cooled to a predetermined temperature.

Further, in the laser packaging method, the laser module and the laser scanning module are synchronously activated, and the output power of the laser module is gradually increased, so that the laser scanning module can project the laser along the predetermined trajectory at a predetermined speed. The output power of the laser module reaches a predetermined power while on the frit.

Further, the laser packaging method further comprises: after the glass frit is heated to a melting point, synchronously adjusting the output power of the laser module and the rate at which the laser scans the frit along the predetermined trajectory, so that the output power and the scanning rate are gradually reduced. Small until it is zero at the same time.

Compared with the prior art, the beneficial effects of the present invention are mainly embodied in: the laser scanning module enables the laser to be periodically scanned on the glass frit, thereby enabling relatively uniform simultaneous heating of the glass frit, improving the prior art packaging process. The problem of uneven temperature field distribution; in the proposed laser packaging method, the laser module can emit a laser with a predetermined power curve, so that the heating process of the frit can be controlled according to a predetermined power curve.

Further, the added temperature measuring module can measure and feed back the instantaneous temperature of the surface of the frit, and the glass frit can be heated or cooled according to a predetermined heating or cooling curve by a preset heating or a preset cooling.

100‧‧‧Laser

110‧‧‧ spot

120‧‧‧OLED display

121‧‧‧ Cover glass

122‧‧‧Frit

123‧‧‧Substrate glass

124‧‧‧Electrode

125‧‧‧OLED layer

200‧‧‧ computer

201‧‧‧Controller Module

202‧‧‧ laser module

203‧‧‧Laser scanning module

204‧‧‧Temperature measurement module

210‧‧‧ computer

220‧‧‧ Controller

230‧‧‧Scanning galvanometer group

240‧‧‧ pyrometer

250‧‧‧Laser

1 is a view showing a temperature distribution of a sequential heat-cured glass material at different times in the prior art; FIG. 2 is a plan view of a glass-sealed OLED display; FIG. 3 is a block diagram of a laser packaging system according to a first embodiment of the present invention; FIG. 5 is a schematic diagram of a laser predetermined power curve in a single scanning period according to Embodiment 1 of the present invention; FIG. 6A and FIG. 6B are laser rates in Embodiment 1 of the present invention; FIG. 7 is a schematic diagram showing the first synchronous control mode of the laser scanning module and the laser output in the start-stop area according to the first embodiment of the present invention; FIG. 8 is a schematic diagram of the first embodiment of the present invention; 2 is a schematic diagram of a laser packaging system; FIG. 9 is a schematic structural view of a laser packaging system according to a second embodiment of the present invention; FIG. 10 is a schematic diagram of a second synchronous control mode of a laser scanning module and a laser output in a start-stop region; 11 is a schematic diagram of a preset temperature rise and a preset temperature drop in the second embodiment of the present invention; and FIG. 12 is a laser used in the first or second embodiment of the present invention. Loading system and method for heating glass frit temperature profile of different times.

The laser scanning sealing glass seal of the present invention will be described below in conjunction with the schematic diagram. The system and method of the present invention are described in more detail, which is a preferred embodiment of the present invention, and it is understood that those skilled in the art can modify the invention described herein while still achieving the advantageous effects of the present invention. Therefore, the following description is to be understood as a broad understanding of the invention.

In the interest of clarity, not all features of the actual embodiments are described. In the following description, well-known functions and structures are not described in detail, as they may obscure the invention in unnecessary detail. It should be understood that in the development of any actual embodiment, a large number of implementation details must be made to achieve a particular goal of the developer, such as changing from one embodiment to another in accordance with the limitations of the system or related business. Additionally, such development work should be considered complex and time consuming, but is only routine work for those skilled in the art.

The invention is more specifically described in the following paragraphs by way of example with reference to the accompanying drawings. Advantages and features of the present invention will be apparent from the description and appended claims. It should be noted that the drawings are in a very simplified form and both use non-precise proportions, and are only for convenience and clarity to assist the purpose of the embodiments of the present invention.

[Example 1]

Referring to FIG. 2 and FIG. 3, in the embodiment, a laser packaging system is proposed for forming a hermetic seal on the OLED display 120 by using a glass frit, wherein the OLED display 120 is a typical glass package. The main structure of the OLED display 120 includes a cover glass 121, a frit 122, a substrate glass 123, an OLED layer 125, and a plurality of electrodes 124. The frit 122 is located on the substrate glass 123 of the OLED display 120, and its cross-sectional view is as shown in FIG. 3, and the top view is as shown in FIG. 2. The frit 122 is pre-cured on the substrate glass 123 by a screen printing, pre-sintering step to form a certain thickness. Rounded rectangular seal line. The OLED layer 125 on the substrate glass 123 is located inside the sealing line of the frit 122, while the substrate glass 123 has a plurality of electrodes 124 connected to the outside of the OLED display 120.

In this embodiment, the laser package system includes a controller module 201, a laser module 202, and a laser scanning module 203. The controller module 201 and the laser module 202 and the laser scanning module 203 are respectively included. Connected to control the laser module 202 and the laser scanning module 203. The laser module 202 is connected to a laser scanning module 203. The laser module 202 is configured to generate a laser to transmit laser light to the laser at a predetermined power. The scanning module 203 is configured to change the direction and motion characteristics of the laser 100. The system further includes a computer 200 connected to the controller module 201 for use with the controller module. 201 for data exchange.

The controller module 201 can be a single controller, a control system formed by combining a plurality of controllers, or a control board that can be integrated and installed inside the computer 200.

In this embodiment, the laser scanning module 203 can be a scanning galvanometer. The laser scanning module 203 has a servo motion mechanism (not shown) having a function of changing the direction in which the laser light 100 is transmitted, so that the laser light 100 can be deflected by a certain angle θ in any direction based on a fixed axis of the space, and the deflection angle is θ has the largest upper limit. The deflection direction and the deflection angle θ of the laser 100 are controllable, and the variation law is determined by the control signal sent from the controller module 201 to the laser scanning module 203. The servo motion mechanism can quickly and accurately change the deflection posture of the laser 100, and can control the deflection motion characteristics of the laser light 100 during the scanning process according to the control signal, such as angular velocity, angular acceleration, and the like. The laser scanning module 203 projects the laser light 100 onto the frit 122. The laser light 100 forms a spot 110 having a specific shape and size on the surface of the frit 122.

The laser module 202 is capable of generating a laser 100 of a specific wavelength and transmitting the light energy of the laser 100 to the laser scanning module 203 at a predetermined power. The light energy of the laser 100 of the predetermined power is instantly adjustable, and the adjustment of the light energy of the laser 100 and the opening and stopping of the laser 100 transmission are determined by the control signals sent from the controller module 201 to the laser module 202.

The controller module 201 can synchronously control the laser module 202 and the laser scanning module 203, so that the laser module 201 outputs the opening and stopping of the laser 100, the adjustment of the laser power, and the movement of the servo motion mechanism in the laser scanning module 203. Match. Alternatively, the controller module 201 can control the laser module 202 with a high resolution higher than the resolution controlled by the laser scanning module 203, and match the control of the two. The controller module 201 and the computer 200 can perform data communication, and the controller module 201 receives the motion trajectory, speed curve, power curve, delay, target temperature, start and stop information sent by the computer 200, and simultaneously Information such as the group work status is transmitted to the computer.

In another aspect of the embodiment, a laser packaging method is further provided, which adopts a laser packaging system as described above, the method comprising the steps of: S100: the controller module 201 controls the laser module 202 to make the laser module 202 emits a laser 100 having a predetermined power curve; S200: the controller module 201 controls the laser scanning module 203 to cause the laser 100 to be projected onto the glass frit 122 by the laser scanning module 203, the laser scanning module 203 maintains the laser 100 at a predetermined speed and motion trajectory along the frit 122 for periodic scanning, and heats the frit 122 until the frit 122 reaches a melting point, forming a hermetic seal.

Specifically, the control laser module 202 and the laser scanning module 203 will The laser 100 is projected onto the frit 122 to move the laser 100 having a predetermined power and a higher rate along the pattern of the frit 122 (i.e., the seal line) as shown by the arrowed motion trajectory in FIG. 4, wherein the rate range Is 1m / s - 5m / s, for example, 3m / s; laser 100 with a certain shape and size of the spot 110 is irradiated on the a2 point frit 122 in Figure 4, start output, scan a week along the seal line, back to a2 The count is counted as one scan cycle. The point a2 is an example point, and the output point of the laser 100 output here is not limited to this position. In one scanning cycle, the frit 122 absorbs the energy of the laser 100 and is sequentially heated. Due to the faster scanning speed, it can be approximated that the frit on the sealing line is heated simultaneously; under normal circumstances, one scanning cycle cannot be a frit. 122 provides sufficient energy so that it is not possible to join the two glass substrates 121 and 123 together by only one scanning cycle to form a hermetic seal.

In one scan cycle, the scan control mode is controlled by the controller module 201 to control the laser module 202 and the laser scanning module 203 (hereinafter also referred to as a scanning galvanometer or galvanometer in the drawings) to move the laser 100 and The laser power adjustment operation is synchronized. According to the predetermined power curve mode, as shown by the laser power curve in FIG. 5, but not limited to such a power curve, the laser power is linear or non-linear at predetermined positions b1-b2, c1-c2, d1-d2, and e1-e2. Linear change, as shown in Figure 4, the predetermined positions b1-b2, c1-c2, d1-d2, and e1-e2 are the corners of the rounded rectangle. Since the energy required at the corner is less than the straight line, the laser power here should be less than The laser power at the line, ie, the predetermined power curve, includes heating segment power and laser segment power, the heating segment power being the laser power at the laser 100 scanning straight line, the bending segment power being the laser power at the laser 100 scanning corner, both There are certain differences in that the frit 122 on the seal line is able to achieve relatively uniform energy, with a relatively uniform temperature rise.

Control the laser module and the galvanometer to cause the laser 100 to repeat the above scan The cycle is performed by using the laser 100 of a plurality of scanning cycles to obtain sufficient energy for the frit 122 to connect the two glass substrates 121 and 123 together to form a hermetic seal. After the laser 100 completes a periodic scan The power value can be kept constant or the next periodic scan can be performed with the power value gradually decreasing, and the latter can heat the frit 122 with a temperature profile whose temperature rise is gradually reduced, by increasing the scan. The number of times to reach the target temperature, or for each scan cycle, a different power curve.

Please refer to FIG. 6A and FIG. 6B, wherein 6A shows that the laser power P is 400W, and the glass frit 122 with the length L of 0.3m is scanned 10 times (n=10), but the scanning rate of the curve a laser 100 is v. It is 3m/s, and the rate v of the curve b is 1m/s. It can be seen that the temperature rise curves of the two are also greatly different because of the large difference in the rates; the curves 1, 2 and 3 in Fig. 6B show the number of scans. When n and the scanning rate v are the same, the laser power p is different from the obtained temperature rise graph, and at the same time, the curve 4 also provides the temperature rise curve which can be obtained when the power p is the same and the rate v and the number of scans n are different. Therefore, as can be seen from FIGS. 6A and 6B, a suitable temperature rise curve can be obtained by changing the three parameters of the number of scans, the rate, and the laser power.

After the scanning cycle of absorbing the sufficient energy (after reaching the predetermined temperature) of the frit 122 on the sealing line is completed, the frit 122 is cooled, and a cooling method is adopted to cool the laser output directly, so that the frit 122 is naturally Cooling, since the frit 122 on the seal line is heated synchronously, the cooling rate is more moderate than the sequential type; the other cooling method is to periodically scan the cooling power value lower than the heating power value until the frit After cooling to a predetermined temperature, that is, after the heating is completed, the scanning cycle is repeated, and the frit 122 is scanned at a lower laser power by a predetermined power curve to cause the frit 122 to follow a predetermined cooling curve. Line cooling. The ability to control the cooling curve has a moderate cooling rate, so better thermal stress can be produced during the small temperature difference cooling process. The latter method of controlling the cooling of the frit 122 may be the control of the whole process of cooling the frit 122, or may be controlled for the portion of the frit 122 which has a relatively fast cooling rate during the natural cooling process, and the rest is cooled by natural cooling. .

An optimized control method is employed for the open area and the stop area of the laser 100 scan. An optimization method is: in the open area, as in the area of a1 to a2 in FIG. 4, the galvanometer motion is controlled without opening the laser output, so that the internal servo of the galvanometer enters a predetermined motion trajectory and motion rate before reaching the a2 point. Then, the laser output is turned on at point a2, at which time the laser 100 has a predetermined motion trajectory and motion rate. When all the scanning periods are completed, the laser output is turned off at point a2, and the internal servo of the galvanometer maintains a predetermined motion trajectory and The rate runs for a while, stopping the motion of the servo at point a3, as shown in Figure 7.

[Embodiment 2]

Referring to FIG. 8 , in the embodiment, the proposed laser package system has a temperature measurement module 204 compared to the first embodiment. The temperature measurement module 204 is connected to the controller module 201 for measuring the laser 100. The instantaneous temperature of the spot 110 on the surface of the frit 122 is illuminated and the instantaneous temperature of the spot is fed back to the controller module 201. The temperature measuring module 204 can measure the temperature of the frit 122 at the location of the spot 110 in a non-contact manner and feed it back to the controller module 201. The feature is that when the spot 110 is moving at a high speed, the temperature measuring module 204 The temperature measurement module 204 can still have sufficient time/space resolution to measure the temperature of the frit 122 where the spot 110 is located. The controller module 201 is capable of collecting the temperature signal fed back by the processing temperature measuring module 204, and is controlled by the laser module 202. The signal forms a closed loop control loop. The closed loop control loop has a control resolution that matches or is higher than the laser scanning module 203.

Referring to FIG. 9, a system for laser scanning a sealed glass package includes a computer 210, a controller 220, a laser 250, a scanning galvanometer 230, and a pyrometer 240. The pyrometer 240 is a temperature measuring module.

Therefore, the laser packaging method proposed in the embodiment has the following difference from the first embodiment: the glass frit 122 can be heated by a preset temperature profile by using a preset temperature rise; the glass frit is preset by a cooling method. 122 is cooled by a preset temperature profile.

Specifically, in one scan period, the laser 250 and the scanning galvanometer group 230 are controlled by the controller 220 to synchronize the laser 100 moving operation with the laser power adjusting operation, and the pyrometer 240 is used to detect the instant at the spot 110 of the current laser 100. Temperature, the controller 220 controls the instantaneous change of the laser power by collecting the temperature information fed back by the pyrometer 240 and comparing and calculating with the preset target temperature, so that the frit 122 around the sealing line can obtain relatively uniform energy. The predetermined temperature is reached, and the closed loop control aiming at the temperature of the glass frit 122 is completed; in the temperature feedback control mode, the glass frit 122 is heated by a preset temperature curve by using a preset temperature rise, and finally reaches the target. Temperature, as shown in the ab section of Figure 11, the temperature profile.

After the scanning cycle in which the frit on the seal line absorbs sufficient energy (after reaching a predetermined temperature) is completed, the cooling mode may be that the scan cycle is still repeated, and the frit 122 is scanned at a lower laser power by the temperature feedback control mode. The frit 122 is cooled according to a predetermined cooling curve, as shown by the temperature curve shown in paragraph bc of FIG. This way of controlling the frit cooling can be to cool the frit 122 The control of the process may also be controlled for a portion of the frit 122 that has a relatively fast cooling rate during natural cooling, while the remainder is naturally cooled, as shown by the temperature profile shown by c-d in FIG.

For the open area and the stop area of the laser 100 scanning, another optimization control method is proposed in the embodiment, in which the galvanometer motion and the laser output are synchronously turned on at the a1 point, and the control laser output power is gradually increased from the lower power. At a point a2, the predetermined power is reached, and the galvanometer also enters a predetermined motion state, and then a normal periodic scan is performed; at the end stage, the laser output power is adjusted at a2 point to gradually decrease, and the laser is stopped synchronously at point a3. Output and galvanometer motion, the specific control curve is shown in Figure 10.

With the laser packaging system and method proposed in this embodiment, the uniformity of heating can be seen from the temperature distribution of FIG. 12, which has a more uniform temperature field distribution and space than the sequential circumferential packaging method used in the prior art. The scan results also show a more uniform spatial temperature field distribution than prior art frit 122.

At the same time, the technical solution has a wide technical window, which is beneficial to the improvement of the yield of the OLED display: taking a 4.3-inch OLED display as an example, the total length of the sealed glass frit circumference is about 0.3 m. The existing sequential circumferential packaging method is technically constrained, and the highest laser scanning speed is about 20 mm/s, and the single packaging time is about 15 s. When the method of the present technical solution is used for packaging, the scanning speed can be increased to more than 300 mm/s due to the wide technical window (the number of scanning times, laser power and speed can be selected), and the laser power can be increased to more than 200 W, which can greatly Improve packaging efficiency.

Since in the present technical solution, the temperature of the frit 122 varies approximately synchronously and uniformly throughout the sealing line, the present technical solution can approximate the control seal by controlling the number of periodic scans, the laser power per revolution, or the change of the laser motion rate. glass The temperature rise and temperature drop curves of the material 122 are controlled by the prior art solution to control the glass frit 122 according to a predetermined temperature rise curve and a temperature drop curve.

In addition, the technical solution can meet the requirements of the hermetic sealing of the OLED display, and can solve the sealing problem of the opening area and the stopping area in the laser sealing process of the OLED display.

In summary, in the laser packaging system and method provided by the embodiments of the present invention, the laser scanning module enables the laser to perform periodic scanning on the glass frit, thereby enabling uniform heating of the glass frit and improving the prior art packaging. The problem of uneven temperature field distribution in the process; in the proposed laser packaging method, the laser module can emit a laser with a predetermined power curve, so that the heating process of the frit can be controlled according to a predetermined power curve.

Further, the added temperature measuring module can measure and feed back the instantaneous temperature of the surface of the frit, and the glass frit can be heated or cooled according to a predetermined heating or cooling curve by a preset heating or a preset cooling.

The above are only the preferred embodiments of the present invention and do not limit the invention in any way. Any changes in the technical solutions and technical contents disclosed in the present invention may be made by those skilled in the art without departing from the technical scope of the present invention. The content is still within the scope of protection of the present invention.

100‧‧‧Laser

110‧‧‧ spot

120‧‧‧OLED display

121‧‧‧ Cover glass

122‧‧‧Frit

123‧‧‧Substrate glass

124‧‧‧Electrode

125‧‧‧OLED layer

200‧‧‧ computer

201‧‧‧Controller Module

202‧‧‧ laser module

203‧‧‧Laser scanning module

Claims (18)

A laser packaging system for heating a glass frit distributed along a predetermined trajectory in a glass package to seal the glass package, the system comprising: a controller module; a laser module, and the controller module Connected and used to generate a laser; and a laser scanning module coupled to the controller module and the laser module for projecting the laser generated by the laser module onto the frit, wherein the control The module is used for instantly controlling the laser scanning module, controlling the scanning direction of the laser on the frit, so that the laser scans the frit along the predetermined trajectory; the controller module is also used for controlling the laser in real time. An output power of the module causes the generated laser to have a power curve that instantly matches the predetermined trajectory. The laser package system of claim 1, wherein the laser package system further comprises a temperature measurement module, the temperature measurement module being connected to the controller module for instantly measuring the laser light being irradiated by the laser The surface temperature of the frit and the measured surface temperature is immediately fed back to the controller module. The laser packaging system of claim 2, wherein the temperature measuring module is a pyrometer. The laser package system of claim 1, wherein the system further comprises a computer connected to the controller module for exchanging data with the controller module. The laser package system of claim 4, wherein the controller module is a single controller, a control system composed of a plurality of controllers or a control board integrated in the computer. The laser packaging system of claim 1, wherein the laser scanning mode A servo motion mechanism is provided in the group for changing the direction of the laser and scanning the glass frit along the predetermined trajectory for a speed and/or an acceleration. A laser encapsulation method for heating a glass frit distributed along a predetermined trajectory in a glass package to seal the glass package, comprising the steps of: starting a laser module, causing the laser module to emit a laser; and starting a laser a scanning module, projecting the laser light emitted by the laser module onto the glass frit; and controlling, by a controller module, the laser scanning module to project the laser onto the glass frit, so that the laser edge The predetermined trajectory scans the glass frit; the controller module instantly controls an output power of the laser module, so that the generated laser has a power curve that instantly matches the predetermined trajectory; and the laser is advanced along the predetermined The trajectory scans the frit for multiple cycles until the frit is heated to the melting point. The laser encapsulation method of claim 7, wherein the predetermined trajectory comprises one or more straight segments and one or more curved segments, the power curve comprising one or more corresponding to the one or more straight segments a straight line segment heating power curve and one or more curved segment heating power curves corresponding to the one or more curved segments, the output power corresponding to the straight segment heating power curve and the output corresponding to the bending segment heating power curve The power is different. The laser packaging method of claim 7, wherein the scanning of the plurality of cycles uses the output power of the laser module that is constant or gradually decreasing. The laser packaging method of claim 7, wherein the method further comprises: measuring and feeding back an instantaneous temperature of the surface of the frit to the controller module by using a temperature measuring module, wherein the controller module adjusts a scanning period Number of times, the laser module At least one of the output power and the rate at which the laser scans the frit along the predetermined trajectory causes the temperature change of the frit to conform to a predetermined temperature profile. The laser encapsulation method of claim 10, wherein the laser scans the frit along the predetermined trajectory at a rate ranging from 1 m/s to 5 m/s. The laser packaging method of claim 7, wherein the laser scanning module is activated before the laser module is activated until the laser scanning module can project the laser along the predetermined trajectory at a predetermined speed to The laser module is activated on the frit. The laser encapsulation method of claim 7, wherein the laser module is immediately turned off after the glass frit is heated to a melting point, so that the glass frit is naturally cooled. The laser packaging method of claim 13, wherein the laser scanning module is further operated for a period of time after the laser module is turned off, and then the laser scanning module is stopped. The laser encapsulation method of claim 7, wherein the method further comprises: after the frit is heated to a melting point, reducing the output power of the laser module to a cooling power value, and continuing to cause the laser to follow the predetermined trajectory. The frit is periodically scanned until the frit cools to a predetermined temperature. The laser packaging method of claim 15, wherein the method further comprises: after the glass frit is cooled to the predetermined temperature, the natural cooling is continued. The laser packaging method of claim 7, wherein the laser module and the laser scanning module are synchronously activated, and the output power of the laser module is gradually increased, so that the laser scanning module can enable the laser The output power of the laser module reaches the pre-projection at a predetermined speed along the predetermined trajectory onto the frit The power is fixed. The laser encapsulation method of claim 17, further comprising, after the frit is heated to a melting point, synchronously adjusting the output power of the laser module and the rate at which the laser scans the frit along the predetermined trajectory, The output power and scan rate are gradually reduced until they are zero at the same time.