CN102248304A - CO2 laser high-speed slotting device and method for backlight source processing - Google Patents
CO2 laser high-speed slotting device and method for backlight source processing Download PDFInfo
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- CN102248304A CN102248304A CN2011100065426A CN201110006542A CN102248304A CN 102248304 A CN102248304 A CN 102248304A CN 2011100065426 A CN2011100065426 A CN 2011100065426A CN 201110006542 A CN201110006542 A CN 201110006542A CN 102248304 A CN102248304 A CN 102248304A
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Abstract
The invention relates to a CO2 laser high-speed slotting device and method for backlight source processing. An output end of a CO2 laser apparatus is provided with an XY movement scanning galvanometer which faces towards a processing platform, the laser emitted by the CO2 laser apparatus arrives the processing platform by passing through the XY movement scanning galvanometer; the CO2 laser is acted on the processed material of the processing platform, the processed material is heated to form a micro pit in 200-500 microns, a high-speed opened-closed laser is controlled to dig 5000-15000 micro-pits per second so as to form a series micro-pits on the time, and a plurality microgrooves are formed on a space plane by moving a scanning platform, the depth of each microgroove is 10-100 microns, and the moving speed is 5-15 m/s; the route of the scanning movement is controlled by controlling the speed of the platform in combination of the computer so as to form a plurality of grooves with different density distribution on the processed material plane, the length of the groove is 500-1000 microns, the width is 500 microns and the depth is 10-100 microns. The groove with required size, length, width and depth can be formed on an acrylic material to guide light.
Description
Technical field
The present invention relates to a kind of CO that is used for backlight processing
2Laser high-speed beam slotting device and method thereof.
Background technology
At present, the technological method for processing that is used for the large format backlight has following several
1) typography method: will obtain a film according to optics earlier, transfer to then on the screen template, clean the clean silk screen plate of silk (because silk screen plate comes out with acid corrosion, therefore to wash acid), the back is placed on the silk screen plate contraposition on the working plate well again, on silk screen plate, scrape a kind of ink special, use oven for drying at last.Therefore operation is many, and the acid that is corrosive produces, the poisonous not environmental protection of printing ink, and manually the starting point of printing local printing ink local and that mention at last is more can influence quality leaded light quality, the yielding and yield rate minuent (30%) of baking oven baking product, efficient is (2 minutes/sheet) generally.
2) traditional motion platform moves and CO
2Laser processing technology: this technology has overcome the many bad place of typography, non-corrosiveness acid, and the poison that no printing ink produces, it is heavy not have printing starting point and terminal point, does not also have the many problems of operation, because motion platform speed is limited, so efficient relatively poor (2.5 minutes/sheet).
3) the high speed optical galvanometer is swept and CO
2Laser processing technology: this technology drives reflecting optics (very light weight by optical scanner, about 100 grams), therefore form laser motion by the eyeglass reflector laser, speed can improve a lot in motion, improves 1～2 times than the bulk velocity of traditional motion platform.This process processing non-corrosiveness acid, the poison that no printing ink produces does not have the starting and terminal point reconstructed image, no percent defective, efficient (1 minute/sheet).
Summary of the invention
The objective of the invention is to overcome the deficiency that prior art exists, a kind of CO2 laser high-speed beam slotting device and method thereof that is used for backlight processing is provided.
Purpose of the present invention is achieved through the following technical solutions:
The CO that is used for backlight processing
2The laser high-speed beam slotting device, characteristics are: CO
2The output of laser instrument is provided with XY motion scanning galvanometer, and described XY motion scanning galvanometer is right against processing platform.
Further, the above-mentioned CO that is used for backlight processing
2The laser high-speed beam slotting device, wherein, described CO
2Laser instrument is that wavelength is the CO of 10.6um
2Laser instrument.
The present invention realizes the method for high speed paddle-tumble, CO
2Behind the laser process XY motion scanning galvanometer that laser instrument sends, arrive processing platform, CO
2Laser action is on the machined material of processing platform, machined material is subjected to little hole of 200～500um of thermosetting, control speed-sensitive switch laser, get 5000～15000 little holes each second, form the little hole of string in time, make it to form many microflutes by motion XY motion scanning galvanometer on space plane again, each microflute degree of depth is at 10um～100um, XY motion scanning galvanometer movement velocity 5～15m/s; The path of the speed combination computer control scanning motion by control XY motion scanning galvanometer forms the groove that many different densities distribute on the machined material plane, the length of groove is at 500～1000um, and width is 500um, and the degree of depth is 10～100um.
Substantive distinguishing features and obvious improvement that technical solution of the present invention is outstanding are mainly reflected in:
The present invention is in conjunction with laser dotting technology and high-velocity scanning motion control technology, by with CO
2The laser that laser instrument sends is handled through the optical beam-expanding focusing transform and is carried out the focal length adjustment in real time according to scanning angle, makes it produce laser facula and the energy that needs size; Again by scanning mirror with the moving of suitable high-speed motion driving laser, thereby on acrylic material, form need size and length, width, the degree of depth groove in order to leaded light; Can be applicable to the light source industry and the even illuminating industry of large format flat-panel monitor industry, lamp box advertisement.
Description of drawings
Below in conjunction with accompanying drawing technical solution of the present invention is described further:
Fig. 1: structural representation of the present invention.
The implication of each Reference numeral among the figure:
1-CO
2Laser instrument, 2-XY motion scanning galvanometer, 3-processing platform.
The specific embodiment
As shown in Figure 1, the CO that is used for backlight processing
2The laser high-speed beam slotting device, CO
2The output of laser instrument 1 is provided with XY motion scanning galvanometer 2, and XY motion scanning galvanometer 2 is right against processing platform 3; CO
2Laser instrument 1 is that wavelength is the CO of 10.6um
2Laser instrument.
Adopt CO
2Laser carries out etching, CO
2(wavelength=10.6um) be easy to absorb concerning acrylic material absorbs the back good microflute of generation and is beneficial to leaded light the laser of this wavelength; And CO
2The power of laser instrument can be very high, and the power of normal 100W can reach requirement, therefore provides assurance for process velocity.The spot size of laser also can be regulated with meet the demands (be generally the 0.3mm size, the degree of depth is 0.05mm) in addition.
The motion sweep test adopts XY motion scanning galvanometer 2, and this galvanometer speed can reach 30m/s (this speed is to be directly proportional with operating distance, and this operating distance is generally 900mm).In order to satisfy client's breadth requirement, therefore take the Three-Dimensional Dynamic galvanometer to guarantee, this breadth is 1500mm * 1500mm to the maximum, for size and the requirement of client's breadth that takes into account hot spot, adopts the size of 700 * 1200mm just can meet the demands.
When being used for the high speed paddle-tumble, CO
2Behind the laser process XY motion scanning galvanometer that laser instrument sends, arrive processing platform, CO
2Laser action is on the machined material of processing platform, machined material is subjected to little hole of 200～500um of thermosetting, control speed-sensitive switch laser, get 5000～15000 little holes each second, form the little hole of string in time, make it to form many microflutes by motion XY motion scanning galvanometer on space plane again, each microflute degree of depth is at 10um～100um, XY motion scanning galvanometer movement velocity 5～15m/s; The path of the speed combination computer control scanning motion by control XY motion scanning galvanometer forms the groove that many different densities distribute on the machined material plane, the length of groove is at 500～1000um, and width is 500um, and the degree of depth is 10～100um.
The present invention is in conjunction with laser dotting technology and high-velocity scanning motion control technology, by with CO
2The laser that laser instrument sends is handled through the optical beam-expanding focusing transform and is carried out the focal length adjustment in real time according to scanning angle, makes it produce laser facula and the energy that needs size.Again by scanning mirror with the moving of suitable high-speed motion driving laser, thereby on acrylic material, form need size and length, width, the degree of depth groove in order to leaded light.Can be applicable to the light source industry and the even illuminating industry of large format flat-panel monitor industry, lamp box advertisement.
What need understand is: the above only is a preferred implementation of the present invention; for those skilled in the art; under the prerequisite that does not break away from the principle of the invention, can also make some improvements and modifications, these improvements and modifications also should be considered as protection scope of the present invention.
Claims (3)
1. the CO that is used for backlight processing
2The laser high-speed beam slotting device is characterized in that: CO
2The output of laser instrument is provided with XY motion scanning galvanometer, and described XY motion scanning galvanometer is right against processing platform.
2. the CO that is used for backlight processing according to claim 1
2The laser high-speed beam slotting device is characterized in that: described CO
2Laser instrument is that wavelength is the CO of 10.6um
2Laser instrument.
3. utilize the described device of claim 1 to realize the method for high speed paddle-tumble, it is characterized in that: CO
2Behind the laser process XY motion scanning galvanometer that laser instrument sends, arrive processing platform, CO
2Laser action is on the machined material of processing platform, machined material is subjected to little hole of 200～500um of thermosetting, control speed-sensitive switch laser, get 5000～15000 little holes each second, form the little hole of string in time, make it to form many microflutes by motion XY motion scanning galvanometer on space plane again, each microflute degree of depth is at 10um～100um, XY motion scanning galvanometer movement velocity 5～15m/s; The path of the speed combination computer control scanning motion by control XY motion scanning galvanometer forms the groove that many different densities distribute on the machined material plane, the length of groove is at 500～1000um, and width is 500um, and the degree of depth is 10～100um.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100065426A CN102248304A (en) | 2011-01-13 | 2011-01-13 | CO2 laser high-speed slotting device and method for backlight source processing |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100065426A CN102248304A (en) | 2011-01-13 | 2011-01-13 | CO2 laser high-speed slotting device and method for backlight source processing |
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| CN102248304A true CN102248304A (en) | 2011-11-23 |
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| CN2011100065426A Pending CN102248304A (en) | 2011-01-13 | 2011-01-13 | CO2 laser high-speed slotting device and method for backlight source processing |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102179631A (en) * | 2011-05-18 | 2011-09-14 | 苏州德龙激光有限公司 | Device and method for processing large-breadth light guide plate |
| CN104303010A (en) * | 2012-03-30 | 2015-01-21 | 唯景公司 | Coaxial distance measurement via folding of triangulation sensor optics path |
| CN104858550A (en) * | 2015-05-28 | 2015-08-26 | 苏州德龙激光股份有限公司 | CO2 laser multi-beam high-speed slotting device for backlight source processing and method thereof |
| CN105336877A (en) * | 2014-07-29 | 2016-02-17 | 上海微电子装备有限公司 | System and method for sealing glass packaging body through laser scanning |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102179631A (en) * | 2011-05-18 | 2011-09-14 | 苏州德龙激光有限公司 | Device and method for processing large-breadth light guide plate |
| CN102179631B (en) * | 2011-05-18 | 2014-04-02 | 苏州德龙激光股份有限公司 | Device and method for processing large-breadth light guide plate |
| CN104303010A (en) * | 2012-03-30 | 2015-01-21 | 唯景公司 | Coaxial distance measurement via folding of triangulation sensor optics path |
| CN104303010B (en) * | 2012-03-30 | 2017-07-07 | 唯景公司 | By the coaxial range measurement for folding triangular measuring transducer optics path |
| US10112258B2 (en) | 2012-03-30 | 2018-10-30 | View, Inc. | Coaxial distance measurement via folding of triangulation sensor optics path |
| CN105336877A (en) * | 2014-07-29 | 2016-02-17 | 上海微电子装备有限公司 | System and method for sealing glass packaging body through laser scanning |
| CN105336877B (en) * | 2014-07-29 | 2018-01-26 | 上海微电子装备（集团）股份有限公司 | The system and method for laser scanning seal glass packaging body |
| CN104858550A (en) * | 2015-05-28 | 2015-08-26 | 苏州德龙激光股份有限公司 | CO2 laser multi-beam high-speed slotting device for backlight source processing and method thereof |
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| C53 | Correction of patent of invention or patent application | ||
| CB02 | Change of applicant information |
Address after: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Applicant after: Suzhou Delphi Laser Co., Ltd. Address before: 215021 Suzhou Industrial Park, Jiangsu, Hong Zhong Road, No. 77 Applicant before: Suzhou Delphi Laser Co., Ltd. |
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| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20111123 |