KR100985018B1 - Apparatus for processing a substrate - Google Patents

Abstract

PURPOSE: A substrate processing apparatus which forms a pattern by emitting laser to a substrate by moving a laser head at a regular speed along a guide rail is provided to increase the efficiently of a patterning process by emitting laser to a plurality of substrates. CONSTITUTION: A substrate processing apparatus comprises a body(100), a substrate transfer module(200), and a processing module(300). The body comprises the upper side. The body comprises an opening(112). The opening passes through the central part from the upper side. The substrate transfer module has the plane vector of a processing target surface supports one substrate in a horizontal or vertical direction. The substrate transfer module transfers the substrate in order to pass through the upper side.

Description

Substrate processing device {APPARATUS FOR PROCESSING A SUBSTRATE}

The present invention relates to a substrate processing apparatus, and more particularly, to an apparatus for processing a light guide plate using a laser.

BACKGROUND With the recent rapid development of semiconductor and information technology, a liquid crystal display (LCD) device having light weight, high resolution, low power, and environmentally friendly advantages has been widely used. Due to these advantages, the application range of these devices has recently been rapidly spread from small display devices such as screens of mobile communication terminals to large display devices such as monitors of computers and televisions.

However, since the LCD device itself is a light-receiving element that does not form an image by emitting light, but receives light from the outside to form an image, a separate light source must be provided. Accordingly, it is common to arrange a back light unit (BLU), which is a surface light emitting body, behind the liquid crystal panel displaying processed information such as text, images, and images.

The backlight unit is divided into a direct method and an edge method according to the position of the light source, and the edge type backlight unit in which the light source is disposed at both side ends of the liquid crystal panel to uniformly guide the line light source generated from the light source to the lower part of the liquid crystal panel. It includes a light guide plate for. The light emitted from the light source disposed in the side part is incident through the side surface of the light guide plate and scattered by the scattering pattern formed on the rear surface while passing through the inside of the light guide plate and uniformly enters the liquid crystal panel through the front surface of the backlight unit. In general, the scattering pattern is formed by regularly or irregularly arranging protrusions such as cutting grooves or dots having various shapes on the rear surface of the light guide plate.

In order to form a scattering pattern on the back surface of the light guide plate, a printing method including an exposure process using a mask, a mechanical method using cutting and injection processing, and a laser processing method are widely used.

The printing method is a method of forming a scattering pattern on a medium-large light guide plate, and a photolithography process using a mask is mainly used. However, the cleaning solution penetrates between the mask and the surface of the light guide plate during the photolithography process, resulting in a high defect rate and insufficient luminance. The mechanical method of forming the scattering pattern by a cutting process using a cutter or an injection process using a mold has a disadvantage of long processing time, low production efficiency, and difficulty in freely controlling the shape of the pattern.

Therefore, in recent years, the pattern formation method by laser processing is widely used. According to the conventional laser processing method, by irradiating a laser beam directly to the surface of the acrylic light guide plate to form a local dot and by moving the laser head along a predetermined pattern by arranging a plurality of dots having a certain rule on the surface of the light guide plate The scattering pattern is formed.

However, according to the conventional pattern forming method by laser processing, there is a problem in that the moving speed of the laser head is slow and is not suitable for mass production. According to the printing method or the mechanical method, the pattern forming process is performed in the unit of the light guide plate according to the shape of the mask pattern or the mold pattern serving as the transfer pattern, but the laser method is separately formed in dots by the movement of the laser head. Since the scattering pattern is completed, the process speed of the scattering pattern depends on the moving speed of the laser head. When increasing the moving speed of the laser head to improve the process speed, there is a problem that the pattern is difficult to form a curved pattern, when moving the heavy laser head at high speed, it is difficult to precise control due to mechanical vibration have.

In particular, the decrease in the process speed of the scattering pattern forming process by the laser processing as described above causes a serious decrease in process efficiency as the size of the light guide plate increases, and there is a problem in that the size of the LCD / LED panel cannot be recently increased.

One object of the present invention is to provide a substrate processing apparatus that can process a plurality of substrates at the same time to improve the process efficiency.

Substrate processing apparatus according to an embodiment of the present invention for achieving the above object has a top surface defined by the x-axis and y-axis perpendicular to each other, the body having an opening penetrating through the central portion from the top surface, the object to be processed The plane vector of the surface supports at least one substrate parallel to the x or y axis and is parallel to the plane vector of the surface to be processed while moving along the top surface and the substrate transfer module for transferring the substrate to penetrate the top surface. It includes a processing module for irradiating a laser to the substrate.

In one embodiment, the processing module is at least one laser generator for generating the laser, at least one laser head for irradiating the laser to the substrate to form a pattern on the surface to be processed, the upper surface to surround the opening The laser head is detachably fixed to the guide rail and one side disposed on the other side, and the other side is movably coupled to the guide rail to transfer the laser head along the circumference of the opening on a plane parallel to the upper surface. It includes a unit.

The processing module further includes a path changer for changing the path of the laser emitted from the laser generator to guide the laser head, wherein the path changer and the laser generator are disposed on the upper surface and parallel to the upper surface. It is supplied from the laser generator to the laser head on one surface.

In some embodiments, the substrate may include a first processed substrate having the plane vector parallel to the x axis, a second processed substrate parallel to the y axis, a third processed substrate parallel to the -x axis, and parallel to the -y axis. And a fourth processing substrate, wherein the path changer is positioned between the first processing substrate and the second processing substrate to change the irradiation direction of the laser from the -x axis direction to the -y axis direction. A second modifier disposed between the first modifier, the second processed substrate, and the third processed substrate, the second modifier disposed in a second boundary region in which the irradiation direction of the laser is changed from the -y axis direction to the x axis direction; A third modifier positioned between a third processing substrate and a fourth processing substrate and disposed at a third boundary region in which the irradiation direction of the laser is changed from the x-axis direction to the y-axis direction, wherein the laser generator includes the fourth processing substrate And between the first processing substrate The second is disposed in the fourth border region and emits the laser in parallel to the processing target surface of the first processed substrate. In this case, the laser head may be arranged in correspondence with each of the substrates so that the laser may be irradiated independently of each other with respect to the substrates.

In one embodiment, the processing module has a power transmission unit disposed on the upper surface side by side with the guide rail and coupled to the laser head transfer unit and a power source for transmitting a driving force to the power transmission unit, It includes a laser head driver for moving the laser transfer unit fixed to the laser head along the guide rail.

In one embodiment, the processing module guides the first support part in which the laser generator is disposed on the upper surface and the path of the laser emitted from the laser generator to the laser head located in the lower part of the first support part. It further comprises a laser head driver for moving along the guide rail the second support portion and the laser header transfer unit connected to the second support is disposed the path changer.

The first support portion extends in a direction parallel to the upper surface from the first vertical member and the first vertical member extending in a z-axis direction perpendicular to the x-axis and y-axis from the first region of the upper surface. A first plate disposed with the laser generator and a first path changer reflecting downwardly the laser emitted from the laser generator, wherein the second support portion extends in the z-axis direction from a second region of the upper surface; And a second flat plate extending in a direction parallel to the upper surface from the second vertical member and the second vertical member, and having a second path changer disposed on a surface of the first vertical path changer. In this case, the laser head driver is connected to the third vertical member, the second flat plate and the third vertical member which extend in the z-axis direction from the laser head transfer unit, between the second flat plate and the third vertical member. It includes a stretch joint member for variably adjusting the separation distance and the power source to transfer the driving force to the second vertical member to move the laser head transfer unit in accordance with the rotation of the second vertical member. The processing module may be disposed on the same plane as the second path changer on the third vertical member to guide the laser reflected from the second path changer to the laser head along the third vertical member. It also includes a route modifier.

In one embodiment, the processing module further includes a spectroscope for spectroscopy of the laser from the laser generator into a plurality of spectroscopic lasers, and a path changer for individually changing the paths of the spectroscopic lasers and directing them to the laser head. can do.

In one embodiment, the substrate transfer module is disposed so as to penetrate through the opening, a central axis capable of linear movement along the axial direction of the opening and rotational movement about the z axis, a frame connected to the central axis, the frame It is fixed to the substrate transfer plate on which the substrate is mounted and a substrate driver for linear and rotational movement of the central axis.

According to the present invention, the laser head is irradiated to each substrate to form a pattern while the laser head moves at a constant speed along the guide rail surrounding the plurality of substrates. In particular, it is possible to form a uniform pattern by irradiating a laser while moving the laser head in a constant velocity linear motion. In addition, by simultaneously irradiating a plurality of substrates with a laser, the efficiency of the patterning process can be significantly improved.

1 is a perspective view schematically showing a substrate processing apparatus according to a first embodiment of the present invention.
FIG. 2 is a plan view of the substrate processing apparatus shown in FIG. 1. FIG.
3 is a perspective view showing in detail the processing module of the substrate processing apparatus shown in Figure 1 according to an embodiment of the present invention.
4 is a perspective view showing a substrate processing apparatus according to a second embodiment of the present invention.
5A is a perspective view showing a substrate processing apparatus according to a third embodiment of the present invention.
FIG. 5B is a plan view of the substrate processing apparatus shown in FIG. 5A.
6 is a flowchart illustrating a method of forming a pattern using a pattern forming apparatus according to an embodiment of the present invention.
7 is a flowchart illustrating a substrate mounting step of the pattern forming method illustrated in FIG. 6.
8 is a flowchart illustrating a first pattern forming step of the pattern forming method illustrated in FIG. 6.
10 and 11 are schematic views illustrating a process of transferring a laser head by using the head driver shown in FIG. 1.
12 is a flowchart illustrating a transfer step of the substrate transfer plate shown in FIG. 6 according to an embodiment of the present invention.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In each of the drawings of the present invention, the size or dimensions of the structures are shown to be enlarged or reduced than actual for clarity of the invention.

In the present invention, the terms first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

For the embodiments of the invention disclosed herein, specific structural and functional descriptions are set forth for the purpose of describing an embodiment of the invention only, and it is to be understood that the embodiments of the invention may be practiced in various forms, But should not be construed as limited to the embodiments set forth in the claims.

That is, the present invention may be modified in various ways and may have various forms. Specific embodiments are illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to a specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

Substrate Processing Equipment I

1 is a perspective view schematically showing a substrate processing apparatus according to a first embodiment of the present invention, and FIG. 2 is a plan view of the substrate processing apparatus shown in FIG. 1.

1 and 2, the substrate processing apparatus 1000 according to the first embodiment of the present invention includes an upper surface 110 defined by an x-axis and a y-axis perpendicular to each other, and penetrates a central portion from the upper surface. A body 100 having an opening 112, a planar vector of a surface to be processed, supports at least one substrate S parallel to the x-axis or y-axis and penetrates through the upper surface 110 to allow the substrate ( A laser beam is irradiated onto the substrate S in parallel with a plane vector of the surface to be processed while moving along the circumference of the opening 112 and disposed on the substrate transfer module 200 and the upper surface 110 for transferring S). It includes a processing module 300.

In one embodiment, the body 100 has an upper surface 100 processed to have a flat plane, and the opening 112 penetrating the central portion of the body 100 from the upper surface 110 is disposed. The opening 112 is formed to have a sufficient size so that a plurality of substrates S to be processed may be transported while the frame on which the substrate transfer plate on which the substrate is mounted is fixed is penetrated through the body 100. In addition, since the laser head transfer unit for irradiating the laser to the substrate (S) along the guide rail disposed on the upper surface 110 to surround the opening 112, as described later the body 100 is It is formed to have sufficient shock resistance and durability and rigidity.

For example, the body 100 may be integrally formed with the upper surface 110 by forming the opening 112 in the center of the flat rock or quartz having a sufficient thickness. Alternatively, a plurality of assembly members having sufficient strength and rigidity are used to form a lower structure having an opening of a sufficient size in the central portion and the body 100 at the central portion of the upper surface 110 and the upper surface 110 in the opening. It may also be formed by assembling the upper structure having an opening 112 through). The integrated body 100 is used as a large processing device is fixed to a certain position can be used to improve process stability and the assembly body 100 is excellent in the assembly processability is advantageous for small processing devices that require maneuverability.

In one embodiment, the body 10 is provided to have a width along the x direction, a length along the y direction, and a thickness along the z direction with respect to the coordinate axis shown in FIG. 1 and the position of the laser generator to generate the laser. It is configured to have a length larger than the width to ensure that.

On the other hand, a substrate cassette (not shown) for loading a substrate to be processed into the substrate processing apparatus 1000 or unloading a substrate on which the processing is completed from the substrate processing apparatus may be disposed above or below the body 100. have. Therefore, the substrate S may be loaded or unloaded along the z-axis direction perpendicular to the top surface 110 of the body 100.

In one embodiment, the substrate transfer module 200 is disposed to penetrate through the opening, the central axis 210 and the central axis 210 capable of linear movement along the z-axis direction and rotational movement about the z-axis. ) And a substrate driver 240 fixed to the frame 220 and the frame 220 to linearly and rotationally move the substrate transfer plate 230 on which the substrate S is mounted and the central axis 210. Include. The present embodiment discloses an embodiment that penetrates along the z-axis so as to be perpendicular to the upper surface, but it is obvious that the upper surface may have a predetermined inclination with the upper surface as long as it is conveyed through the upper surface.

The central axis 210 is disposed to penetrate the body 100 via the center of the opening 112 and is connected to the frame 220. In this case, it is apparent that the central axis 210 may have various shapes such as a circle or a polygon depending on the shape of the frame 220 and the use environment or processing conditions of the substrate processing apparatus 1000. The frame 220 includes an assembly structure for assembling a plurality of slender members to be fixed to the central axis 210 and to mount the substrate transfer plate 230. In this case, the frame 220 is configured to have a smaller size than the opening 112 to move freely through the body 100 through the opening 112.

For example, the frame 220 may include a rectangular parallelepiped angle assembly that can move freely through the body 100 through the opening 112. Accordingly, the substrate transfer plate 230 may be disposed on each side of the frame 230, and the substrate S to be processed is fixed to the substrate transfer plate 230. Accordingly, the shape of the frame 220 may have various shapes as long as the substrate S having various shapes can be easily fixed, and its size may be changed according to the size of the substrate S. FIG. In the present embodiment, since the substrate (S) may be supplied in various ways to have a length of about 40 inches to about 70 inches, the frame 220 may be configured to have a rectangular side of at least 70 inches or more.

The substrate transfer plate 230 is disposed in the frame 220 is configured to be linear and rotational movement at the same time by the linear movement along the z-axis and the rotational movement around the z-axis of the frame 220. In particular, a plurality of substrate transfer plates 230 are disposed on each side of the frame 220 having a rectangular parallelepiped shape, and the substrate S fixed to the substrate transfer plate 230 is a plane vector defining a surface to be processed. Are arranged to be perpendicular to each other with a plane vector defining the top surface 110. That is, the plane vector of the upper surface 110 is parallel with the z axis, but the plane vector defining the surface to be processed of the substrate is parallel with the x axis or the y axis.

In this case, each substrate transfer plate 230 may be moved at the same time by the transfer of the frame 220 or may be moved through the respective relative movement with respect to the frame 220. Therefore, the plurality of processing target substrates S fixed to the substrate transfer plate 230 may be individually moved or simultaneously moved as required by the driver.

In particular, when the frame 220 has a rectangular parallelepiped shape, planar vectors of the first to fourth substrates S1 to S4 respectively disposed on the four substrate transfer plates 230 disposed on each side of the frame 220. Are respectively directed to the x-axis, y-axis, -x-axis and -y-axis and are all parallel to the top surface 110.

The substrate S is fixed to the surface of the substrate transfer plate 230 and is not separated from the substrate transfer plate 230 even by linear and rotational movement of the frame. For example, a separate fixing member (not shown) for fixing the substrate S on the surface of the substrate transfer plate 230 or a vacuum pressure is formed inside the plate 230 and the vacuum pressure is formed. It may include a separate vacuum pump (not shown) for adsorbing and fixing the substrate (S).

The substrate S is not limited to its use and shape as long as it is a substrate for forming a predetermined pattern on the surface through laser processing. For example, the semiconductor substrate may include a semiconductor substrate for processing a semiconductor device such as a wafer, a glass substrate for manufacturing a flat panel display, and a light guide plate of a backlight assembly of the flat panel display. In the present exemplary embodiment, the dot pattern for light scattering is exemplarily described for the light guide plate for the backlight assembly of the liquid crystal display device. However, it is apparent that the pattern forming apparatus of the present invention can be used to form not only the dot pattern for the light guide plate but also various patterns.

The substrate driver 240 supplies power to the central axis 210 to linearly move the central axis along the z axis or to rotate the central axis with respect to the z axis. For example, the substrate driver 240 includes a housing (not shown) having a bearing surrounding the central axis 210, a servo motor, and a linear scale for the z-axis transfer.

The substrate S fixed to the substrate transfer flat plate 230 is processed by the processing module 300 to have a predetermined pattern on the surface to be processed.

3 is a perspective view showing in detail the processing module of the substrate processing apparatus shown in Figure 1 according to an embodiment of the present invention.

In one embodiment, the processing module 300 for processing the substrate (S) fixed to the substrate transfer plate 230 is at least one laser generator 310 for generating the laser, the laser to the substrate (S) at least one laser head 320 to form a pattern on the surface to be processed, the guide rail 330 disposed on the upper surface 110 to surround the opening 112 and the laser on one side The head 320 is detachably fixed and the other side is movably coupled to the guide rail 330 along the circumference of the opening 112 on a surface parallel to the upper surface 110 of the laser head 320. It includes a laser head transfer unit 340 to transfer.

The laser generator 310 is disposed on at least one upper surface 110 of the body 100 to generate a laser processing the substrate. For example, the laser generated by the laser generator 310 may be generated in the form of a pulse having a certain period and continuously supplied to the laser head or may be supplied to the laser head by intermittently controlling the laser. The laser melts or dissolves the surface to be processed of the substrate S to form a predetermined dot pattern on the surface of the substrate. Therefore, the laser generator 310 may generate a laser having a wavelength suitable for melting or melting the surface of the substrate according to the material of the substrate. For example, the laser generator 310 generates gas lasers such as CO2 lasers, excimer lasers, Ar lasers, Kr lasers, or YAG lasers, YVO4 lasers, YLF lasers, YAlO3 lasers, glass lasers, ruby lasers, and alexandrite lasers. And solid state lasers such as Ti: sapphire laser and Y2O3 laser. The solid state laser may use crystals such as YAG, YVO 4, YLF, YAlO 3 doped with Cr, Nd, Er, Ho, Ce, Co, Ti, Yb or Tm. In this embodiment, the laser generator 310 generates a pulse oscillation type CO2 laser as a laser beam having a wavelength band of 1㎛.

The laser generator 310 is disposed on the upper surface 110 such that the generated laser has a traveling path parallel to the surface of the substrate S to be processed. In the present exemplary embodiment, the laser generator 310 is disposed at an edge between the fourth substrate S4 and the first substrate S1 to emit the laser in parallel with the first substrate S1. At this time, the laser generated by the laser generator 310 is supplied to the laser head 320 in parallel with the first substrate (S1).

In another embodiment, the laser generator 310 may be installed in plurality in order to increase the processing efficiency. For example, it may be disposed not only in the boundary region between the fourth substrate S4 and the first substrate S1 but also in the boundary region between the second substrate S2 and the third substrate S3 so as to be symmetrical thereto. . In this case, the laser may be generated at two points at the same time and proceed in parallel with the first substrate S1 and the third substrate S3. In this case, the laser head 320 may be disposed in a plurality so as to correspond to each of the laser generator 310. That is, the laser generator 310 and the laser head 320 may be variously arranged according to the shape and structure of the frame 220 and the degree of processing efficiency.

The laser head 320 moves along the guide rail 330 to irradiate the laser generated by the laser generator 310 to the substrate S to melt or melt the surface of the substrate to form a pattern. In particular, when the substrate (S) is moved separately with respect to the frame 220, since the independent processing for each substrate (S) is required, each laser head 320 corresponding to each substrate (S) is disposed Thus, independent processing of each substrate S may be performed.

For example, the laser head 320 may be disposed at one end of the head housing so as to be located on the same plane as the head generator (not shown) having the three-dimensional shape and the laser generator 310, and the laser head 310 may be separated from the laser generator 310. And a reflector (not shown) to which the generated laser is incident, and a focus lens (not shown) disposed at the other end of the head housing so as to face the surface of the substrate and focusing the laser reflected from the reflector to the surface of the substrate. In this embodiment, since the laser proceeds in parallel with the surface of the substrate (S), the path of the laser is vertically changed inside the head housing and irradiated onto the substrate.

The laser reflected from the reflector is focused onto the focus lens to form a laser beam. Preferably, a focal length adjusting member (not shown) is further disposed on the side of the focal lens to maximize the energy of the laser irradiated onto the substrate surface by adjusting the focal length between the surface of the substrate S and the focal lens. can do.

The laser head 320 irradiates the laser onto a plurality of substrates having different plane vectors while moving along the guide rail 330 disposed to surround the opening 112. Thus, a path changer 350 is provided on the top surface 110 to change the path of the laser emitted from the laser generator 310 so as to form the same plane as the laser generator 310.

For example, when the laser head 320 moves along the guide rail 330 to irradiate the second substrate S2 after irradiating the laser toward the first substrate S1, The irradiation direction is changed from the -x axis direction toward the machining surface of the first substrate S1 to the -y axis direction towards the machining surface of the second substrate S2. Accordingly, the path of the laser is changed into a path parallel to the x-axis direction from the path parallel to the y-axis direction and supplied to the laser head 310.

At this time, the path of the laser is located between the first substrate (S1) and the second substrate (S2) is disposed in the first boundary region where the irradiation direction of the laser is changed from the -x axis direction to the -y axis direction Is performed by the first modifier 350a. That is, the laser generated by the laser generator 310 travels along the y-axis direction in parallel with the first substrate S1 to be incident to the first modifier 350a and the first modifier 350a is the laser. The reflection is changed to proceed in parallel with the second substrate S2.

Similarly, the path change of the laser is disposed between the second substrate S2 and the third substrate S3 and is disposed at a second boundary region in which the irradiation direction of the laser is changed from the -y axis direction to the x axis direction. A third interposed between a second modifier 350b and the third substrate S3 and the fourth substrate S4 and disposed in a third boundary region in which the irradiation direction of the laser is changed from the x-axis direction to the y-axis direction Performed by modifier 350c. Therefore, the laser generated by the laser generator 310 while the laser head 320 is moved to circulate around the opening 112 along the guide rail 330 is the boundary region in which the traveling direction of the guide rail changes Is changed by the path changer 350 is supplied to the laser head 320.

Therefore, it is apparent that the position and number of the path changer 350 may be changed according to the shape of the frame 220, the number of processed substrates, and the position and number of the laser generators. In particular, when a plurality of the laser generators are arranged to increase processing efficiency, it is preferable that the laser head corresponding to each laser generator is disposed and the path changer is disposed at each boundary region where the movement direction of each laser head is changed. .

For example, first and second laser generators may be disposed between the boundary area between the fourth and first substrates S4 and S1 and between the second and third substrates S2 and S3 so that the x-axis direction and − When irradiating the first and the second laser in the x-axis direction, respectively, they move in parallel with the first substrate S1 and move in parallel with the first laser head and the third substrate S3 to which the first laser is supplied. The second laser head to which the second laser is supplied may be disposed on the guide rail 330. In this case, when the first and second laser heads change direction and move in parallel with the second substrate S2 and the fourth substrate S4, the first and second lasers are respectively the first and second laser beams. 3 The progress path may be changed by the route changer disposed in the boundary area. As such, the arrangement and number of the path changers may vary depending on the structure of the substrate processing apparatus and the use environment.

When a plurality of laser heads are disposed corresponding to each substrate S, the laser head 320 moves to the surface of the substrate S while reciprocating along the width direction of each substrate on the guide rail 330. The laser can be irradiated. At this time, the number of the laser generator and the path changer can be adjusted by appropriately adjusting the arrangement of the laser generator and the path changer.

The guide rail 330 is disposed on the upper surface 110 to surround the opening 112, and the laser head 320 irradiates a laser onto the substrate S while moving along the guide rail. For example, the guide rail 330 is integrally formed on the rail upper surface 332 having the groove 332a formed along the extending direction and the rail upper surface 332 and fixed to the upper surface of the rail body 334. It includes. The rail body 334 has a receiving space (S) therein. In the present embodiment, the laser head conveying unit 340 equipped with the laser head 320 is coupled to the guide rail 330 to be disposed in the receiving space (S) of the body 334 through the groove 332a. . Therefore, as the laser head transfer unit 340 moves along the guide rail, the laser head also moves along the guide rail.

The laser head transfer unit 340 to which the laser head is fixed is a transfer body (not shown) coupled with the guide rail 330, fixed to the transfer body, and physically contacted with the upper surface 110 to perform relative movement. A fixing plate 346 is coupled to a moving member (not shown) and the transfer body and fixed to the surface of the laser head 320.

For example, the body and the movement member are disposed in the receiving space (S) of the guide rail 330 and the movement member is in contact with the upper surface 110 to allow relative movement. A portion of the body 320 is connected to the fixing plate 346 through the rail upper surface of the guide rail 320. Preferably, the body 342 and the fixing plate 346 is detachably connected so that the laser head transfer unit and the laser head 320 can be easily separated if necessary. Therefore, it is possible to respond quickly when there is a need to change the structure of the laser head according to the processing conditions or when there is a demand for maintenance.

The laser head transfer unit 340 is moved along the guide rail 330 by the laser head driver 360.

For example, the laser head driver 360 is disposed on the upper surface 110 side by side with the guide rail 330 and coupled to the laser head transfer unit 340, the power transmission unit 362, the power transmission. A movement direction changer (not shown) connected to the unit 362 to change the movement direction of the power transfer unit 362 and a power source 364 for driving the power transfer unit 362.

The power transfer unit 362 is coupled to the fixed plate 346 of the laser head transfer unit 340 to transfer the driving force applied from the power source 364 to the laser head transfer unit 340. For example, the power transmission unit 362 may variously include a power transmission member between a driven part and a driving part spaced apart from each other such as a chain, a belt, and a driving rack. In particular, in the case of tooth coupling such as a chain or a driving rack, driven teeth corresponding to the driving teeth of the power transmission unit 362 are also formed on the surface of the fixed plate 346. Is placed. Accordingly, as the power transmission unit 362 moves in a constant direction, the driving plate 346 moves together with the body 342 of the laser head transfer unit 340 fixed to the driving plate 346. Move it.

In the present embodiment, the power transmission unit 362 extends side by side along the guide rail 330 is arranged to circulate around the opening 112 so that the laser head transfer unit 340 is also guide rail And moves along 330. In particular, since the extension direction of the guide rail 330 is changed in the boundary region in which the plane vector of the plane to be processed is changed, the power transmission unit 362 is also changed in conjunction with this. That is, the guide is arranged by arranging a movement route modifier 364 for changing the movement route of the power transmission unit 362 on the upper surface 110 corresponding to the boundary region where the extension direction of the guide rail 330 is changed. In response to the path change of the rail 330, the direction of movement of the power transmission unit 362 is changed so that the power transmission unit 362 is disposed in parallel with the guide rail 330 of the power transmission unit 362. Change the direction of movement.

The substrate driver 240 and the power source 364 of the laser head driver 360 are electrically connected to the controller 400 so that the laser irradiation on the first to fourth substrates S1 to S4 is completed. It is organically controlled to block laser irradiation to and linearly move the frame by the feed pitch along the z axis. For example, the substrate processing apparatus 1000 may include a first laser path between the laser generator 310 and the laser head 320, a path changer 330 for changing the path of the laser, and the laser head ( A laser absorbing member (not shown) capable of absorbing the laser in at least one of a second laser path between 320 and a third laser path between the path changer 330 and another path changer 330 adjacent to each other. It may further include a laser cutout 500 for disposing. The laser cut off unit 500 may include a detector (not shown) for detecting the position of the laser head transfer unit 340, an absorbing member driver (not shown) for controlling the laser absorbing member, and the control unit 400. An interface (not shown) for exchanging electrical signals may be provided.

The controller 400 processes the substrate while moving the laser head transfer unit 340 along the circumference of the frame on which the plurality of substrates are loaded, and laser machining the respective substrates along the same plane (xy plane) as the upper surface. When this is completed, the frame is moved by the feed pitch along the z axis, which is perpendicular to the upper surface, and then the same laser processing is repeated for each of the substrates. Thus, for a plurality of substrates, it is possible to form a pattern having a constant feed pitch along a constant z axis and having a constant distance from each other in the x-y plane.

Although not shown, the substrate processing apparatus 1000 may further include a substrate loader on which a substrate to be processed is loaded or a substrate unloader capable of storing a substrate on which processing is completed. For example, a substrate cassette capable of loading a predetermined number of substrates and moving at a time may be used, and a substrate loaded on the substrate cassette may be transferred between the frame and the substrate cassette by using a substrate extraction means such as a robot arm. 230 may be loaded / unloaded.

Substrate Processing Equipment II

4 is a perspective view showing a deformation substrate processing apparatus according to a second embodiment of the present invention. The substrate processing apparatus 1100 illustrated in FIG. 4 is different from the substrate processing apparatus 1000 illustrated in FIGS. 1 and 2 except for the arrangement of the laser generator 310 and the path changer 330 and the structure of the laser head driver. Have substantially the same configuration. Therefore, the same reference numerals are used for the same components as those of the substrate processing apparatus 1000 illustrated in FIGS. 1 and 2, and further descriptions thereof will be omitted. That is, the laser head 320, the guide rail 330, and the laser head transfer unit 340 of the processing module 300 are substantially the same as those described with reference to FIGS. 1 and 2, and thus, further description thereof will be omitted. Hereinafter, the laser generator 310, the path changer 350, and the laser head driver 390 will be described.

Referring to FIG. 4, the processing module 300 may include a first support part 370 having the laser generator 310 disposed on the upper surface 110, and a path of the laser emitted from the laser generator 310. Transfer of the laser header connected to the second support 380 and the second support 380 and the second support 380, the path changer 350 is disposed to guide the laser head 320 located below the first support 370 The laser head driver 390 further moves the unit 340 along the guide rail 330.

In an embodiment, the first support part 370 may include a first vertical member 372 extending from the first area of the upper surface 110 in the z-axis direction and the upper surface 110 from the first vertical member 372. A first flat plate 374 extending in a direction parallel to the first side and having a first path modifier 352a disposed on a surface of the laser generator 310 and reflecting the laser emitted from the laser generator 310 vertically downward. It includes.

The first vertical member 372 extends to a first height H1 in the z-axis direction in a first area located at the periphery of the upper surface 110, and the first flat plate 374 is formed of the first vertical member ( It is fixed to the top of 372 and extends toward the center of the body (100). Therefore, the first flat plate 374 is spaced apart from the upper surface 110 by the first height H1, and the laser generator 310 generating the laser is higher than the upper surface 110 by the first height H1. It is located That is, the first height H1 measured from the upper surface 110 is formed to be larger than the projecting height h of the substrate transfer plate 230 protruding from the upper surface along the z-axis direction so that the first flat plate 374 is The substrate transfer plate 230 is disposed so as to intersect. The first height H1 may be formed larger than the overall length of the substrate measured along the z-axis direction and transferred as much as the transfer pitch along the z-axis direction, thereby sufficiently forming a pattern from an upper end portion to a lower end portion of the substrate S. FIG. .

In the present exemplary embodiment, the first flat plate 374 extends from the first area to the center portion of the body 100, but the extension direction and the first path changer 352a of the first flat plate 374. ) May be variously arranged according to the arrangement of the second path changer 352b to which the laser reflected from the first path changer 352a is incident.

In an embodiment, the second support part 380 may include a second vertical member 382 extending in the z-axis direction from a second area of the upper surface 110 and the upper surface 110 from the second vertical member 382. And a second flat plate 384 extending in a direction parallel to the second surface and having a second path changer 352b disposed on a surface of the first path changer 352a.

The second vertical member 382 extends to a second height H2 in the z-axis direction in a second region located at the center of the upper surface 110, and the second flat plate 384 is formed of the second vertical member ( It is rotatably connected to the top of 382 and extends toward the periphery of the body 100. That is, the second flat plate 384 is disposed to be rotatable in parallel with the upper surface 110 about the second operation member 382 on the central axis. In this case, the second path modifier 382b is disposed on the central axis so that the incident path of the laser does not change despite the rotation of the second flat plate 384.

In this case, the second height H2 is greater than the height of the protrusion h of the substrate transfer plate 230 and smaller than the first height H1 of the first vertical member 372 so that the second path modifier ( 352b is disposed above the substrate transfer plate 230 below the first plate 374. Accordingly, the first and second flat plates 374 and 384 both intersect the substrate transport flat plate 230 at the top of the substrate transport flat plate 230 and the second flat plate 384 at the bottom of the first flat plate 374. Is placed.

The second height H2 is also formed to be greater than the entire length of the substrate transfer plate 230 measured along the z-axis direction so that the substrate is in a region defined from the upper surface 110 to the second plate 384 along the z-axis. (S) is configured to be included from the upper end to the lower end.

The laser head driver 390 is connected to the third vertical member 392, the second flat plate 384, and the third vertical member 392 extending in the z-axis direction from the laser head transfer unit 340. And transmit a driving force to the expansion joint member 394 and the second vertical member 382 to variably adjust the separation distance between the second flat plate 384 and the third vertical member 392. It includes a power source (not shown) for moving the laser head transfer unit 340 in accordance with the rotation of the member 382.

For example, the third vertical member 392 protrudes along the z-axis direction from the side of the laser head transfer unit 340 to which the laser head for irradiating the laser onto the substrate S is fixed and has a second height ( H2) to have a greater third height. The third vertical member 392 is formed in a hollow cylindrical shape and has a third path modifier 352c positioned to face each other on the same surface as the second path modifier 352b. Therefore, the laser reflected by the second path changer 352b is incident to the third path changer 352c. Thereafter, the laser is reflected vertically downward in the third vertical member 392 by the third path modifier 352c and is incident to the reflector of the laser head 320. The laser incident on the reflector is irradiated onto the surface to be processed of the substrate via the focus lens to process the substrate.

The third vertical member 392 and the second flat plate 384 may be connected by the expansion joint member so that the third vertical member 392 may move together with the rotation of the second flat plate 384. . The second vertical member 382 performs a rotational motion by the power source, and also rotates the second flat plate 384 connected to the second vertical member 382. Accordingly, the third vertical member receives a rotation moment in conjunction with the rotation of the second vertical member by the expansion joint member 394.

Since the laser head transfer unit 340 moves to circulate the opening 112 along the guide rail 330, the laser head transfer unit 340 moves linearly in the section irradiating the laser to the machining surface of the substrate and changes the plane vector of the machining surface. Curved motion is performed in the boundary region. Accordingly, the third vertical member 392 alternately performs a linear motion and a curved motion by the rotation driving force applied to the second vertical member 382.

Since the curvature of the movement trajectory does not change when the linear motion is performed along the guide rail 330, the expansion joint member 394 elastically spaces the separation distance between the second flat plate 384 and the third vertical member 392. Adjust with

For example, a third vertical member 392 and a second flat plate 384 may be formed by forming a slot (not shown) along the longitudinal direction of the second flat plate 384 and inserting a connecting road into the slot. It can be moved freely along the connection direction of. Accordingly, the second flat plate 384 performs the rotational movement, but the third vertical member connected to the second flat plate may perform the linear movement along the guide rail. The second vertical plate 384 connected to the third vertical member 392 while the third vertical member 392 performs linear movement along the guide rail 330 moves the second vertical member 382 as the rotation axis. One rotational movement can be performed. In this embodiment, the connecting rod moving along the slot is disclosed as the expansion joint member, but various expansion joint members can be used as long as the third vertical member can be moved while adjusting the separation distance between the third vertical member and the second flat plate. It is self-evident. For example, a pneumatic or hydraulic cylinder can be used as the expansion joint member.

When the laser head transfer unit 340 moves a boundary region in which the plane vector of the processing plane is changed, the laser head transfer unit 340 rotates the third vertical member 392 according to the curvature of the boundary region. The joint member 394 adjusts the separation distance between the second flat plate 384 and the third vertical member 392 by a difference between the radius of rotation of the second flat plate and the curvature of the boundary region.

While the laser head transfer unit 340 moves the boundary region, the laser blocking member is configured to include a first path, a first path changer 352a and a second path changer between the laser generator and the first path changer 352a. A second path between the second path 352b and a third path between the second path changer 352b and the third path changer 352c to block the laser from being supplied to the laser head 320. .

In the present embodiment, the first flat plate 374 extends from the first area to the center of the body 100 and the second flat plate 384 extends from the center of the body to the periphery of the body. Although disclosed, it is apparent that the structures of the first and second flat plates may be variously modified according to the method of applying the rotational driving force to the second vertical member. For example, when the second vertical member 382 is disposed in a second area that is a periphery of the body 110, the first flat plate 374 is moved from the first area of the body periphery to the other periphery of the body. It may be arranged to extend to the second area. However, in order for the third vertical member 392 connected to the second flat plate 384 to circulate through the opening 112, the expansion joint member or the second flat plate is longer or the movement distance by the expansion joint member is longer. The larger the resistance, the greater the resistance to convert the rotational moment into linear motion.

In the substrate processing apparatus 1000 illustrated in FIGS. 1 and 2, a laser beam travels with the upper surface and is irradiated onto the substrate, whereas in the modified substrate processing apparatus 1100 illustrated in FIG. 4, an upper portion of the substrate transfer module 200 is provided. Is generated at and travels along the vertical path along the z-axis direction and along a horizontal path parallel to the top surface and irradiated onto the substrate.

According to the substrate processing apparatus according to the embodiments of the present invention as described above, by processing a substrate by irradiating a laser with a laser head moving along a guide rail surrounding a plurality of substrates to process a plurality of substrates at the same time Can significantly improve.

In particular, the substrate processing efficiency can be easily increased by controlling the moving speed of the laser head. As the substrate to be processed increases, the linear movement section of the laser head increases, so that the processing speed of the substrate processing process can be significantly increased, which can easily cope with the recent trend of larger substrates such as LCD / LED panels. .

Example III

5A is a perspective view showing a substrate processing apparatus according to a third embodiment of the present invention, and FIG. 5B is a plan view of the substrate processing apparatus shown in FIG. 5A.

The substrate processing apparatus 1200 illustrated in FIGS. 5A and 5B may include the first to fourth laser heads individually processing the first to fourth substrates S1 to S4 using the laser generated from the single laser generator 310. The substrate according to the first embodiment except for the arrangement of the spectroscope 354 for guiding to 320a to 320d and the first to fourth path modifiers 352a to 352d for supplying the spectroscopic lasers to the respective laser heads. It has a structure substantially the same as the processing apparatus 1000. Therefore, the same reference numerals are used for the same components as those of the substrate processing apparatus 1000 illustrated in FIGS. 1 and 2, and further descriptions thereof will be omitted. That is, the laser head 320, the guide rail 330, the laser head transfer unit 340, and the laser driver 360 of the processing module 300 are substantially the same as those described with reference to FIGS. 1 and 2. Detailed description thereof will be omitted and will be described below with reference to the laser generator 310 and the path changer 350.

5A and 5B, the processing module 300 may include a first support part 370 having the laser generator 310 disposed on the upper surface 110, and the laser emitted from the laser generator 310. And a second support 380 on which a spectrometer 359 is disposed to guide a path of the path to the path changers 352, 354, 356, and 358 disposed on the upper surface. In the present embodiment, the first to fourth substrates S1 to S4 fixed to the substrate transfer module are processed independently and separately from each other by the first to fourth laser heads 320a to 320d, respectively. First to fourth path modifiers for supplying the spectroscopic laser are respectively disposed. It is apparent that the number and position of the laser head and the path changer may be variously changed according to the working environment or process conditions of the substrate processing apparatus.

In an embodiment, the first support part 370 may include a first vertical member 372 extending from the first area of the upper surface 110 in the z-axis direction and the upper surface 110 from the first vertical member 372. And a first flat plate 374 extending in a direction parallel to the surface of which the laser generator 310 is disposed. The first vertical member 372 and the first flat plate 374 are the same as the first vertical member 372 and the first flat plate 374 of the substrate processing apparatus 1100 shown in FIG. Description is omitted. In this embodiment, the length of the first flat plate 374 may be variously modified. For example, it may be disposed in the periphery of the body 110, as shown in Figure 4 may extend to the center of the opening 112 as shown in Figure 4 may be integrally formed with the second flat plate 384. . It is also apparent that the spectrometer 359 can be positioned at various positions as well as the top of the frame as long as the laser can be spectroscopy with each path changer.

In an embodiment, the second support part 380 may include a second vertical member 382 extending in the z-axis direction from a second area of the upper surface 110 and the upper surface 110 from the second vertical member 382. And a second flat plate 384 extending in a direction parallel to the top surface and having a spectrometer 359 disposed thereon for spectroscopy the laser.

The second vertical member 382 extends to a predetermined height in the z-axis direction in a second region located at the center of the upper surface 110, and preferably the upper surfaces of the first and second flat plates are the same. Configured to be disposed on. However, it is apparent that various arrangements of the first and second plates can be formed by the addition of various path changers in the vertical direction. In the present embodiment, the second plate 384 on which the spectrometer 359 is disposed and the first plate 374 on which the laser generator 310 is disposed are arranged to have the same height from the surface of the body 110. The upper portion of each path changer is disposed to have the same height as the second flat plate 384.

The spectrometer 359 includes a plurality of prisms for spectroscopy by a spectroscopic laser having four different paths to supply the laser incident from the laser generator 310 to each path changer.

First to fourth path modifiers 352, 354, 356, and 358 to which the spectroscopic lasers are incident are disposed in the boundary regions of the first to fourth substrates S1, S2, S3, and S4. For example, each path changer may include a light receiving unit to which each spectroscopic laser radiated from the spectrometer 359 is incident, a light emitting unit for emitting the spectroscopic laser to respective laser heads corresponding to each other, and a connector connecting the light receiving unit and the light emitting unit. It is provided.

The connector may be configured to have a hollow cylindrical shape, and the light exit portion is disposed to be located on the same plane as the reflecting mirror of each laser head. Thus, the connector corrects the vertical distance between the position of the spectrometer 359 and the position of the laser head 320 to form an optical path between the spectrometer and the laser head.

Thus, even with a single laser generator, the various arrangements of the laser head and the path changer enable individual processing of each of the multiple substrates.

Pattern Formation Method I

Hereinafter, a method of forming various types of patterns on the surface of the substrate using the substrate processing apparatus shown in FIGS. 1 and 2 will be described. For example, in the present embodiment, a method of forming a dot pattern for scattering light on a surface of a light guide plate for a backlight will be described. However, it is obvious that the present invention is not applied only to the formation of the dot pattern for the light guide plate.

6 is a flowchart illustrating a method of forming a pattern using a pattern forming apparatus according to an embodiment of the present invention. 7 is a flowchart illustrating a substrate mounting step of the pattern forming method illustrated in FIG. 6.

1 and 2 and 6 and 7, an upper surface 110 defined by an x-axis and a y-axis perpendicular to each other to form a pattern on a surface of a substrate according to an embodiment of the present invention is provided. The substrate S is disposed on the at least one substrate transfer plate 230 disposed in the opening 112 penetrating the central portion of the body 100 to enable linear movement along the axial direction of the opening and rotational movement about the axis of the opening. ) (S100).

In one embodiment, the substrate transfer plate 230 of the substrate processing apparatus 1000 is a plurality of transfer disposed on each side of the rectangular parallelepiped frame 220 fixed to the central axis 210 extending along the z-axis Includes a reputation. First, the empty transfer plate on which the substrate is not fixed is aligned with a substrate cassette (not shown) in which a plurality of processing target substrates S are stacked (step S110). For example, when the process chamber in which the pretreatment process is performed on the substrate S and the substrate processing apparatus 1000 are spaced apart from each other, the substrate cassette having a predetermined loading space may include a plurality of process target substrates on which the pretreatment process is completed. After storage in the substrate cassette, the substrate cassette may be moved to prepare a patterning process in the substrate processing apparatus 1000. The substrate may be loaded in a predetermined number of sheets in the cassette and moved to the processor at once. On the contrary, when the process chamber in which the pretreatment process is performed on the substrate and the substrate processing apparatus 1000 are disposed adjacent to each other, a predetermined buffer capable of storing the substrate on which the pretreatment process is completed is located in an area adjacent to the process chamber for pretreatment. It is obvious that space can be provided.

Subsequently, the substrate is extracted from the substrate cassette and fixed to the aligned transfer plates (step S120). A transfer means such as a robot arm is disposed between the substrate cassette and the frame 220, and one substrate is removed from the cassette and loaded into the transfer plate. A load lock chamber may be disposed between the substrate cassette and the frame 220 and the transfer means may be disposed inside the load lock chamber to prevent a sudden environmental change in the substrate transfer process. Obviously, the frame 220 may be individually loaded by a process worker in a workspace provided with allowable cleanliness. The substrate S loaded into the transfer plate is fixed to the transfer plate 230 by a vacuum adsorption method.

When the fixing of the substrate S to the substrate plate 230 is completed, the frame 220 is rotated with respect to the central axis 210 to align another empty transfer plate with the substrate cassette (step S130). Repeat the same process. Accordingly, a plurality of substrates S are fixed to the substrate transfer plate 230 disposed in the frame 220. On the contrary, when the substrate transfer plate 230 is individually transportable, since the individual pattern process is possible for each substrate S, the substrate S may be independently fixed without rotation of the frame 220. .

When the substrate mounting is completed, the central axis 210 is fixed at a specific position in the z-axis direction to prepare a patterning process for the substrate. Subsequently, the laser is irradiated onto the surface of the substrate S while moving in parallel with the upper surface 110 along the circumference of the opening 112 to form a first pattern on the surface of the substrate (step S200). 8 is a flowchart illustrating a first pattern forming step of the pattern forming method illustrated in FIG. 6.

1, 2, 6, and 8, first, a laser is generated from the laser generator 310 to form a first pattern on the substrate fixed to the substrate transfer plate 230 (step S210). ). In this embodiment, the laser generator 310 generates a laser beam having a pulse oscillation type CO2 laser having a wavelength range of 1㎛.

The generated laser is supplied to the laser head 320 having a focus lens disposed to face the substrate S. In one embodiment, when the laser is generated as a pulse wave having a predetermined period and emitted from the laser generator 310, the laser may be supplied to the laser head 320 with a predetermined period.

Meanwhile, the laser head transport unit 340 to which the laser head 320 is fixed while the laser is supplied moves along the guide rail 330 disposed on the upper surface 110 to surround the opening 112. Thus, the laser head 320 is moved to circulate around the frame 220 on which the substrate is mounted (step S230).

Therefore, while the laser head 320 continuously moves around the substrate S, the laser passing through the condenser lens is irradiated onto the substrate to form a plurality of processing portions on the surface of the substrate (step S240). In this case, since the laser is supplied to the laser head 320 at a constant period, the opening irradiated through the condenser lens is also irradiated onto the substrate at a constant period.

Meanwhile, since the laser head 320 continuously moves at a constant speed along the guide rail, a plurality of processing parts are formed by being spaced apart from each other by a time corresponding to the period of the laser and an interval corresponding to the moving speed of the laser head. . The plurality of processing units are arranged in a line in parallel along the moving direction of the guide rail 320 to complete the first pattern.

In this case, the laser head 320 is moved by a laser head driver for driving the laser head transfer unit 340. 10 and 11 are schematic views illustrating a process of transferring a laser head by using the head driver shown in FIG. 1.

9 and 10, the laser head 320 is fixed to the laser head transfer unit 340, and the laser head transfer unit 340 is coupled to the guide rail. Subsequently, the power transfer unit 362 of the laser head driver 360 is coupled with the transfer unit 340 in parallel with the guide rail 320 to drive the laser head transfer unit 340. A driving force is applied from the power source 364 of the laser head driver 360 to move the power transmission unit 362 along the circumference of the opening 112. For example, the fixed plate 346 of the laser head transfer unit 340 and the power transfer unit 362 are connected by a tooth coupling and drive the laser transfer unit 340 by driving the power transfer unit 362. You can move it.

At this time, the plurality of substrates (S1 to S4) are arranged in the opening 112 so that the planar vectors of the surface to be processed are different from each other, the power transmission unit 362 is a linear movement along the guide rail 330 and Perform curve shifts alternately. That is, the laser head 320 is uniformly moved in the linear movement region in which the laser head 320 moves in parallel with the surface to be processed to irradiate the laser to uniformly maintain the spacing of the processing portion.

When the machining of the first substrate S1 having the first plane vector parallel to the x axis direction is completed, the second substrate S2 moves to the second substrate S2 having the second plane vector parallel to the y axis direction. In this case, since the extension direction of the guide lane 330 is changed, the laser head transfer unit 340 also moves along the curve trajectory in the boundary region where the extension direction of the guide rail is changed. Therefore, even if the plane vector is changed, the laser head 320 can always maintain the opposite arrangement with respect to the surface to be processed.

Preferably, the movement direction of the power transmission unit 362 corresponds to the extension direction of the guide rail 330 by using the rotation of the movement direction changer disposed in the boundary region and connected to the power transmission unit 362. Can be changed. At this time, it is apparent that the power source 364 may drive the power transfer unit 362 by applying a driving force to the central axis of the movement direction changer using the rotation moment of the movement direction changer.

In addition, since the focus lens of the laser head 320 is always disposed to face the substrate S, the path of the laser emitted from the laser generator 310 fixedly disposed on the upper surface 110 is also changed.

The path changer for changing the path of the laser is disposed at a position corresponding to each boundary area, and the path of the laser emitted from the laser generator is changed to be parallel to the guide rail 330. Therefore, even if the transfer path of the laser head 320 is changed, it is possible to smoothly supply the laser. For example, the laser emitted from the laser generator 310 is supplied to the laser head 320 and irradiated to the first substrate S1 having a first plane vector parallel to the x-axis direction. Subsequently, when the laser head 320 moves and is positioned in parallel with the second substrate S2 having a second plane vector parallel to the y-axis direction, the laser emitted from the laser generator 310 may be aligned with the y-axis direction. It is supplied to the first path changer 350a along side by side paths. The laser is reflected by the first path modifier and travels in a path parallel to the x-axis direction. The laser whose path is changed is supplied to the laser head 320 positioned in parallel with the second substrate S2 and irradiated to the second substrate S2.

As such, the path of the laser may be changed to circulate along the opening 112 by changing the transport path of the laser in parallel with the guide rail 330 surrounding the opening. Therefore, the laser beam may be sequentially irradiated to the plurality of substrates that are transported to penetrate the upper surface 110 by appropriately changing the traveling path while supplying the laser in a direction parallel to the upper surface 110.

Although the present embodiment discloses a method of processing the substrate using a plurality of path changers and a single laser generator and laser head, it is obvious that a plurality of laser generators and laser heads can be used to improve the patterning process speed. Do. For example, a pair of laser generators, a laser head, and a pair of path changers may be disposed at each corner of a frame having a cuboid shape to irradiate the laser with a pair of laser heads moving independently of each other.

In particular, it is apparent that a plurality of laser heads arranged in parallel with the first to fourth substrates may form a pattern by independently irradiating a laser to the first to fourth substrates, respectively. That is, each laser head may irradiate a laser in parallel with the upper surface 110 to the surface of each substrate S while independently moving in parallel with the first to fourth substrates. Therefore, it is possible to simultaneously perform pattern forming processes that are independent of four substrates. At this time, each substrate (S) that has completed the pattern formation is individually removed from the substrate transfer plate 230 and replaced with a new substrate

Alternatively, the laser generator and the laser head may be arranged in different planes so that the laser generated by the laser generator may be supplied to the laser head through vertical and horizontal path changes.

Extending in the z-axis direction from the second flat plate 384 and the laser head transfer unit 340 extending from the upper portion of the second vertical member 382 penetrating the opening 112 to the periphery of the body 110. The third vertical member 392 is connected to each other by the expansion joint member 394. Accordingly, the separation distance between the third vertical member 392 and the second flat plate 384 may be variably adjusted. Therefore, the driving force is applied to the second vertical member 382 to move the laser head transfer unit 340 along the circumference of the opening 112. In this case, in the linear movement region in which the laser head 320 moves in parallel with the substrate S, the rotational motion of the second flat plate 384 connected to the second vertical member 382 is the guide rail 330. The change in the constant velocity linear motion of the laser head transfer unit 340 along the gap between the third vertical member and the second flat plate between the rotational motion and the linear motion can be controlled by the expansion joint member 394.

In this case, the laser generator 310 is disposed on the first flat plate 374 positioned on the substrate transfer flat plate 230 to generate a laser. The laser may include a first path changer 352a disposed in parallel with a first plate, a second path changer 352b disposed at a vertical lower portion of the first path changer 352a, and the reflected laser may enter the second path changer 352b. Located on the same plane as the path changer, the laser reflected from the second path changer is supplied to the laser head 320 via a third path changer 352c through which the laser beam is incident. That is, it is supplied from the laser generator to the laser head through a path change in a direction parallel to the upper surface 110 and in a direction perpendicular to the upper surface 110.

Subsequently, when the first pattern is completed, the substrate transfer plate 230 is linearly moved by a feed pitch along a z-axis direction to move the substrate by a predetermined distance in a direction perpendicular to the upper surface (step S300). 11 is a flowchart illustrating a transfer step of the substrate transfer plate shown in FIG. 6 according to an embodiment of the present invention.

Referring to FIG. 11, it is detected whether the laser head transfer unit 340 moving along the guide rail 330 moves to circulate the opening 112 (step S310).

For example, sensing the circulation start point and the circulation end point displayed on the guide rail 330, and the laser head 320 to the laser head 320 as soon as the laser head transfer unit 340 passes the circulation end point The supply of is cut off (step S320) and the substrate transfer plate 230 is transferred along the z-axis direction (step S330). For example, the plurality of substrate transfer plates may be simultaneously moved by moving the frames 220 of the plurality of substrate transfer plates 230 along the z axis. By using the servo motor to linearly move the central axis 210 along the z axis, it is possible to simultaneously move a plurality of substrate transfer plates. Accordingly, a plurality of substrates fixed to each substrate transfer plate may be simultaneously moved along the z axis. .

Subsequently, as soon as the laser head transfer unit 340 passes the circulation start point, the transfer of the substrate transfer plate 230 is stopped and the laser supply to the laser head 320 is resumed. Thereafter, a second pattern is formed on the surface of the substrate through the same process as that of forming the first pattern (step S400). Accordingly, the first pattern and the second pattern are formed on the same substrate to have an interval as much as the transfer pitch along the z axis.

On the contrary, when the pattern forming process for the first to fourth substrates is performed separately by each laser head, each laser head is reciprocated along the guide rail 330 parallel to each of the substrates to be processed. One pattern and a second pattern can be formed.

12 is a flowchart illustrating a transfer step of the substrate transfer plate shown in FIG. 6 according to an embodiment of the present invention.

Referring to FIG. 12, the laser beam 320 disposed in parallel with each of the substrates S to be processed is moved in a first direction to perform a process as described above to form a first pattern on the surface of each substrate. One. Next, it is detected whether the laser head 320 has reached the boundary region of each substrate (step S350).

For example, first and second positions are displayed at both ends of each guide rail 330 corresponding to an effective width of each substrate S, respectively, and the first and second positions are directed from the first position to the second position. The first pattern is formed by moving each laser head 320 along a direction. Subsequently, when the laser head 320 detects the second position, the laser supply from the laser head 320 to the substrate S to be processed is blocked (step S360), and the substrate transfer plate 230 is In the direction passing through the upper surface 130 is linearly conveyed by the conveyance pitch (step S370). The laser head 320 is then moved in a second direction from the second position towards the first position and the laser supply resumes. Thus, a second pattern spaced apart from the first pattern by the transfer pitch is formed (step S400). Accordingly, the first pattern and the second pattern are formed on the same substrate to have an interval as much as the transfer pitch along the z axis.

By repeatedly performing the process of forming the first pattern and the second pattern from the upper end to the lower end of the substrate, a plurality of patterns spaced apart by the transfer pitch may be formed through the entire surface of the substrate. Therefore, it is possible to simultaneously form a pattern having a uniform spacing for a plurality of substrates.

When the patterning process for each substrate is completed, the frame is aligned with the substrate cassette, and then the substrate on which the pattern is formed is removed from the substrate transfer plate by using the transfer robot.

According to embodiments of the present invention, the laser head may be irradiated to each substrate to form a pattern while the laser head moves along a guide rail surrounding the plurality of substrates at a constant speed. In particular, it is possible to form a uniform pattern by irradiating a laser while moving the laser head in a constant velocity linear motion. In addition, by simultaneously irradiating a plurality of substrates with a laser, the efficiency of the patterning process can be significantly improved.

The present embodiment may be applied to various processes of forming a pattern by irradiating a laser onto a flat plate such as a process of forming a scattering pattern of a light guide plate for a backlight unit of a flat panel display device or a laser marking process such as a microcircuit pattern of a semiconductor device.

As described above, although described with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and modified within the scope of the present invention without departing from the spirit and scope of the invention described in the claims below. It will be appreciated that it can be changed.

100: body 110: upper surface
112: opening 200: substrate transfer module
210: central axis 220: frame
230: substrate transfer plate 240: substrate driver
300: processing module 310: laser generator
320: laser head 330: guide rail
340: laser head feed unit 350, 352: path changer
360, 390: laser head driver 370: first support
380: second support portion 400: control unit
500: laser cutout 1000, 1100: substrate processing apparatus

Claims (16)

A body having an upper surface defined by an x-axis and a y-axis perpendicular to each other, the body having an opening passing through the central portion from the upper surface;
A substrate transfer module for transporting the substrate such that a plane vector of the surface to be processed supports at least one substrate parallel to the x or y axis and penetrates the upper surface; And
And a processing module for irradiating a laser to the substrate in parallel with a plane vector of the surface to be processed while moving along the upper surface while moving along the upper surface. The method of claim 1, wherein the processing module,
At least one laser generator for generating the laser;
At least one laser head irradiating the laser onto the substrate to form a pattern on the surface to be processed;
A guide rail disposed on the upper surface to surround the opening; And
The laser head is detachably fixed to one side and the other side is movably coupled to the guide rail comprises a laser head transfer unit for transferring the laser head along the circumference of the opening on a plane parallel to the upper surface Substrate processing apparatus made. The method of claim 2, wherein the processing module further comprises a path changer for changing the path of the laser emitted from the laser generator to the laser head and the path changer and the laser generator on the upper surface A substrate processing apparatus, characterized in that it is disposed and supplied from the laser generator to the laser head on a surface parallel to the upper surface. The substrate of claim 3, wherein the substrate comprises: a first processed substrate having the plane vector parallel to the x axis, a second processed substrate parallel to the y axis, a third processed substrate parallel to the -x axis, and a -y axis; A first boundary region including a parallel fourth processing substrate, wherein the path changer is positioned between the first processing substrate and the second processing substrate so that the irradiation direction of the laser is changed from the -x axis direction to the -y axis direction A second modifier disposed between the first modifier, the second processed substrate, and the third processed substrate, the second modifier disposed in a second boundary region in which the irradiation direction of the laser is changed from the -y axis direction to the x axis direction; A third modifier positioned between a third processing substrate and a fourth processing substrate and disposed at a third boundary region in which the irradiation direction of the laser is changed from the x-axis direction to the y-axis direction, and the laser generator includes the fourth machining Between the substrate and the first processing substrate 4 is arranged in a border area substrate processing apparatus, characterized in that for emitting the side-by-side with the laser processing target surface of said first processed substrate. 5. The substrate processing apparatus of claim 4, wherein a plurality of the laser heads are disposed corresponding to the substrates, and the lasers are irradiated to the substrates independently from each other. According to claim 3, wherein the processing module is disposed on the upper side parallel to the guide rail and has a power transmission unit for coupling with the laser head transfer unit and a power source for transmitting a driving force to the power transmission unit (power source) And a laser head driver for moving the laser transfer unit to which the laser head is fixed along the guide rail. The substrate processing apparatus of claim 6, wherein the power transmission unit includes any one of a chain, a belt, and a driving rack, and the power source includes a servo motor. 3. The processing module of claim 2, wherein the processing module guides a first support part in which the laser generator is disposed on the upper surface, and a path of the laser emitted from the laser generator to the laser head located in the lower part of the first support part. And a laser head driver configured to move the laser header conveying unit connected to the second support part and the second support part on which the path changer is disposed along the guide rail. 10. The method of claim 8, wherein the first support portion is parallel to the upper surface from the first vertical member and the first vertical member extending in the z-axis direction perpendicular to the x-axis and y-axis from the first region of the upper surface A first plate extending in a direction and having a first flat path changer disposed on a surface thereof, the first path changer being downwardly reflecting the laser beam emitted from the laser generator and the second support portion being formed from the second region of the upper surface. A second flat member extending in an axial direction and a second flat plate extending from the second vertical member in a direction parallel to the upper surface and having a second path changer disposed on a surface of the first vertical path changer; The substrate processing apparatus characterized by the above-mentioned. 10. The method of claim 9, wherein the laser head driver is connected to the third vertical member, the second flat plate and the third vertical member extending from the laser head transfer unit in the z-axis direction, the second flat plate and the third 3, an expansion joint member for variably adjusting the separation distance between the vertical members, and a power source for transmitting the driving force to the second vertical member to move the laser head transfer unit according to the rotation of the second vertical member. Substrate processing equipment. The laser beam of claim 10, wherein the processing module is disposed on the same plane as the second path changer on the third vertical member and reflects the laser reflected from the second path changer along the third vertical member. And a third path changer leading to the head. The method of claim 2, wherein the processing module further comprises a spectroscope for spectroscopy the laser from the laser generator to a plurality of spectroscopic laser and a path changer for changing the path of each spectroscopic laser to the laser head individually. Substrate processing apparatus comprising a. According to claim 1, The substrate transfer module is disposed to penetrate through the opening is a central axis capable of linear movement along the axial direction of the opening and the rotational movement about the axis of the opening, the frame connected to the central axis, A substrate processing apparatus comprising a substrate transfer plate fixed to a frame and a substrate driver configured to linearly and rotationally rotate the central axis and the substrate transfer plate on which the substrate is mounted. The substrate processing apparatus of claim 13, wherein the substrate transfer plate comprises a vacuum pump that generates a vacuum pressure to fix the substrate to the substrate transfer plate. The substrate processing apparatus according to claim 13, wherein the frame has a rectangular parallelepiped shape and the substrate transfer plate is disposed on each side of the rectangular parallelepiped so that the substrate transfer module mounts four substrates. 3. The axial direction of the opening of claim 2, wherein the laser head transfer module is transferred in parallel to the upper surface with respect to the plurality of surfaces to be processed having different plane vectors, and the laser beam is irradiated to the surface to be processed. And a control unit for linearly moving the substrate by a transfer pitch accordingly.

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