KR101015201B1 - Apparatus for forming a pattern on a substrate and method of forming a pattern using the same apparatus - Google Patents

Apparatus for forming a pattern on a substrate and method of forming a pattern using the same apparatus Download PDF

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Publication number
KR101015201B1
KR101015201B1 KR1020100005476A KR20100005476A KR101015201B1 KR 101015201 B1 KR101015201 B1 KR 101015201B1 KR 1020100005476 A KR1020100005476 A KR 1020100005476A KR 20100005476 A KR20100005476 A KR 20100005476A KR 101015201 B1 KR101015201 B1 KR 101015201B1
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South Korea
Prior art keywords
substrate
laser
pattern
disposed
along
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KR1020100005476A
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Korean (ko)
Inventor
김성일
맹지예
이규홍
이균원
Original Assignee
주식회사 엘앤피아너스
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
    • B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
    • B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
    • B23K26/0626—Energy control of the laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65G—TRANSPORT OR STORAGE DEVICES, e.g. CONVEYORS FOR LOADING OR TIPPING, SHOP CONVEYOR SYSTEMS OR PNEUMATIC TUBE CONVEYORS
    • B65G49/00—Conveying systems characterised by their application for specified purposes not otherwise provided for
    • B65G49/05—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles
    • B65G49/06—Conveying systems characterised by their application for specified purposes not otherwise provided for for fragile or damageable materials or articles for fragile sheets, e.g. glass
    • B65G49/063—Transporting devices for sheet glass
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt

Abstract

An apparatus for forming a pattern in an inline manner is disclosed. The pattern forming apparatus forms a pattern trace by arranging a plurality of patterns along a rotational trace on a surface of a substrate, and a processor for processing the substrate such that the pattern traces adjacent to each other are spaced apart by a transfer pitch of the substrate, on one side of the processor. A substrate loader which is arranged and sequentially supplied to the processor, and a substrate loader which is arranged on the other side of the processing machine and sequentially receives the substrates which are processed in the processing machine, and is arranged in a line according to the substrate loader and the processing order with the processor And a substrate unloader disposed to form the pattern on the surface of the substrate by an in-line process. Patterns can be formed for multiple substrates in an inline manner.

Description

Pattern Forming Apparatus and Pattern Forming Method Using The Same {APPARATUS FOR FORMING A PATTERN ON A SUBSTRATE AND METHOD OF FORMING A PATTERN USING THE SAME APPARATUS}

The present invention relates to a pattern forming apparatus and a pattern forming method using the same, and more particularly, to a pattern forming apparatus for forming a pattern on a substrate using a laser and a pattern forming method using the same.

BACKGROUND With the recent rapid development of semiconductor and information technology, liquid crystal display (LCD) devices having light weight, small size, high resolution, low power, and environmentally friendly advantages are widely used. Due to these advantages, the application range of these devices has recently been rapidly spread from small display devices such as screens of mobile communication terminals to large display devices such as monitors of computers and televisions.

However, since the LCD device itself is a light-receiving element that does not form an image by emitting light, but receives light from the outside to form an image, a separate light source must be provided. Accordingly, it is common to arrange a back light unit (BLU), which is a surface light emitting body, behind the liquid crystal panel displaying processed information such as text, images, and images.

The backlight unit is divided into a direct method and an edge method according to the position of the light source, and the edge type backlight unit in which the light source is disposed at both side ends of the liquid crystal panel to uniformly guide the line light source generated from the light source to the lower part of the liquid crystal panel. It includes a light guide plate for. The light emitted from the light source disposed in the side part is incident through the side surface of the light guide plate and scattered by the scattering pattern formed on the rear surface while passing through the inside of the light guide plate and uniformly enters the liquid crystal panel through the front surface of the backlight unit. In general, the scattering pattern is formed by regularly or irregularly arranging protrusions such as cutting grooves or dots having various shapes on the rear surface of the light guide plate.

In this case, in order to form the scattering pattern on the back surface of the light guide plate, a printing method, an injection method, an exposure method, and the like have been conventionally used, but complicated pre-treatment and post-treatment processes are required, and there is a problem in that it does not meet the enlargement of the panel. Accordingly, in recent years, a laser method capable of forming a scattering pattern in an environmentally friendly manner that does not use chemicals and can reduce the time required and cost of panel changes.

1 is a perspective view schematically showing a pattern forming apparatus using a conventional laser.

Referring to FIG. 1, a conventional pattern forming apparatus 100 for forming a scattering pattern on a light guide plate S using a laser transfers and aligns the light guide plate S to form a scattering pattern. A laser generator 30 for generating a laser, a laser inducer 40 for guiding a laser generated from the laser generator 30 to the light guide plate S, and a patterning position P on a surface of the light guide plate S A positioner 50 for determining and the substrate transporter 20, a laser generator 30, a laser inducer 40, and a support 10 on which the positioner 50 is disposed are included.

The support 10 is positioned on the first support 12 and the first support 12, which is a flat plate on which the substrate transporter 20 is disposed, so that the laser generator 30, the laser inducer 40, and the position thereof are positioned on the first support 12. And a second support 14 on which the crystallite 50 is disposed. The first and second supports 12 and 14 are made of stone having a specific gravity and excellent heat resistance, so that the thermal expansion according to the temperature is small and the occurrence of vibration due to the movement of the positioner 50 can be suppressed.

The substrate transporter 20 is detachably connected to the transport table 22 on which the light guide plate serving as the processing target substrate S is seated and the lower surface of the transport table 22 to linearly transport the transport table 22. And a transfer guide 21. The transfer guide 21 is disposed on an upper surface of the first support 12 and is coupled with a carrier (not shown) disposed on a lower surface of the transfer table 22. The conveyer has a linear motor (not shown) and a scale (not shown) so that the conveying table 22 is linearly conveyed by a predetermined unit along the conveying guide 21 extending in the y direction and supplied to the laser machining position. do.

The laser generator 30 is disposed on an upper surface of the second support 14 disposed at an end of the first support 12. In consideration of the efficiency of the patterning process may be disposed in pairs along the x-axis direction.

The laser inductor 40 is fixed to the first and second reflectors 41 and 42 and the positioner 50 fixed on the second support 14 to linearly move in the x direction along the second support. And a third reflecting mirror and focusing lenses 43 and 44. The first reflector 41 is disposed in parallel with the laser generator 30 to change the path of the laser emitted from the laser generator 30 in the direction of the second reflector 42. The laser reflected from the second reflector is incident on the third reflector 43, and the third reflector 43 is configured to reflect the incident laser toward the focus lens 44. Therefore, the laser generated by the laser generator 30 is incident to the patterning position P of the substrate S fixed on the transfer table 22 via a plurality of reflecting mirrors and focusing lenses.

The positioner 50 moves along the guide rail 54 and the guide rail 54 disposed along the X direction on the side surface of the second support 14, and the patterning position P on the substrate S. Determination unit 52 for determining the. The determination unit 52 includes a linear motor (not shown) for driving on the flat plate attached to the guide rail 54, the third reflector 43, and a focus lens 44 disposed below the third reflector. Include. Thus, the third reflector and the focus lens move along the guide rail 54 and guide the laser to each patterning position P on the substrate.

The laser generated by the laser generator 30 is guided to the third reflector through the first and second reflectors 41 and 42 fixed to the second support 14, and the lower part of the third reflector and the third reflector. The focus lens disposed at the laser beam is irradiated to the surface of the substrate S disposed below the focus lens while moving forward in the X direction along the guide rail fixed to the second support 14. Therefore, the substrate S forms a pattern at intervals corresponding to the moving distance of the positioning unit 52 in the widthwise X direction. At this time, when the determination unit 52 reaches the boundary of the substrate S in the width direction, the transfer table 22 moves by one pitch along the transfer guide 21 in the Y direction. Subsequently, the determination unit 52 irradiates a laser onto the surface of the substrate S at equal intervals while moving backward along the X direction to form a pattern on the substrate. Usually, a pair of substrates (S) are supplied at the same time to improve productivity, and are driven in a dual mode in which a pair of laser generators 30 and laser inductors 40 corresponding to each substrate are disposed.

However, according to such a conventional pattern forming apparatus 90, by using the support 10 made of stone in order to prevent vibration and thermal expansion caused by the driving of the determination unit 52 by the heavy load of the pattern forming apparatus There is a difficulty in increasing maintenance costs and difficulty in mass production. In particular, by arranging a plurality of reflectors in the laser inductor there is a problem that causes a non-uniformity of the laser power and a pattern non-uniformity caused by the difference in the laser power loss and laser induction distance. In addition, when using the dual type, since the same transfer table is shared, even if only one of the left and right laser generator and the laser inductor has a problem that the whole equipment must be stopped. In addition, as the size of the substrate increases, there is a problem that it is difficult to secure an efficient working space and installation space as the apparatus increases in order to cope with this.

One object of the present invention is to provide a pattern forming apparatus capable of processing a pattern by an inline process while minimizing the path loss of the laser and reducing the load.

Another object of the present invention is to provide a method of processing a pattern using the pattern forming apparatus described above.

The pattern forming apparatus according to an embodiment of the present invention for achieving the above object is to form a pattern trace by arranging a plurality of patterns along the rotation trajectory on the surface of the substrate and the pattern traces adjacent to each other are the transfer pitch of the substrate A processing machine for processing the substrate so as to be spaced apart, a substrate loader which is arranged on one side of the processing machine to be sequentially supplied to the processing machine and a substrate loader that is disposed on the other side of the processing machine is sequentially And a substrate unloader configured to receive and form the pattern on the surface of the substrate by an in-line process.

In one embodiment, the processing apparatus includes a support plate having a support plate adjacent to the substrate loader and having a flat upper surface, a support pier protruding from the support plate, and a rotating member rotatably fixed to an upper portion of the support pier;

A substrate feeder disposed on an upper surface of the support plate and having a transfer guide extending along a longitudinal direction of the support plate and a transfer table detachably connected to the transfer guide and having the substrate fixed on an upper surface thereof; A laser generator disposed on an upper surface of the rotating member to generate a laser for processing the substrate; And a body rotating according to the rotation of the rotating member, a reflector disposed at one end of the body to face the laser generator and reflecting the laser emitted by the laser generator, and disposed at the other end of the body and reflected from the reflector. And a laser inductor having a focus lens for focusing the laser and concentrating the laser onto the substrate.

In one embodiment, the support pier includes a pair of legs protruding from the width direction peripheral portion of the support plate and a top plate fixed to the upper surface of the pair of legs to cross the support plate along the width direction, The rotating member is rotatably fixed to the center of the upper plate.

In one embodiment, the laser generator and the laser inductor is fixed to the rotating member to rotate with the rotating member. At this time, the rotating member alternately rotates along a first rotation direction that rotates in a clockwise or counterclockwise direction and a second rotation direction opposite to the first rotation direction, and the second rotation direction from the first rotation direction. The substrate is transferred by the transfer pitch while being changed to.

In one embodiment, the laser generator is disposed on the upper surface of the rotating member and the reflector may reflect the laser emitted in parallel with the upper surface of the rotating member to the vertical downward of the rotating member. In this case, the body has a cylindrical shape having a cavity therein and the laser reflected from the reflector is introduced into the focus lens via the cavity of the cylindrical body.

In one embodiment, the transfer table is moved in the transfer pitch unit along the transfer guide. In addition, the laser generator and the laser inductor are disposed at each end of the rotary member and disposed in pairs, and the transfer table is moved to align the initial patterning position of the substrate under the respective focus lenses.

In one embodiment, the substrate loader and substrate unloader includes a substrate cassette capable of loading a plurality of the substrates. The substrate includes a light guide plate of a backlight unit for a flat panel display device, and the pattern includes a scattering pattern formed on the light guide plate.

According to a pattern forming method according to another embodiment of the present invention for achieving the above object, the substrate is accommodated in a substrate loader disposed on one side of the processing machine for forming a pattern on the surface of the substrate. Subsequently, the substrate is sequentially removed from the substrate loader and supplied to the processing machine. A plurality of pattern traces having a plurality of patterns arranged along a rotational trajectory are formed, and the substrates are processed such that adjacent pattern traces are spaced apart by a transfer pitch of the substrate. The substrate on which the pattern is formed is sequentially received by a substrate unloader disposed on the other side of the processing machine.

In one embodiment, the step of supplying the substrate to the processor is performed by fixing the substrate to a transfer table moving along the processor and the extended transfer guide.

In one embodiment, the processing of the substrate may include: applying a laser pulse to the surface of the substrate while rotating a laser inducer for guiding the laser from the first boundary region of the substrate to the substrate along a first direction of rotation; Forming a pattern trace; When the first pattern trace is completed to the second boundary region corresponding to the first boundary region along the width direction of the substrate, the rotation of the laser injector is stopped and the substrate is transferred by the transfer pitch along the transfer direction. Making a step; And irradiating the laser pulse from the second boundary region to the first boundary region along the second rotation direction while irradiating the laser pulse to the surface of the substrate to be spaced apart by the first pattern trace and the transfer pitch. And forming a second pattern trace.

In this case, the first and second rotation directions are opposite to each other and the laser inductor alternately rotates along the first and second rotation directions on the substrate. Alternatively, the first and second rotation directions are the same direction and the laser inducer rotates 360 degrees.

In one embodiment, the substrate loader, the processor and the substrate unloader are arranged in a line according to the process sequence for forming the pattern to perform an inline process.

According to the present invention, a substrate loader, a processor, and a substrate unloader may be arranged in a line to form a pattern on a substrate to be processed by an inline process. Accordingly, the operation efficiency of the pattern forming apparatus can be improved as compared with the conventional pattern forming apparatus in which a pair of substrates are placed on the same substrate and processed simultaneously, and a pattern is formed on the substrate surface in large quantities by introducing a conveyor system. can do. In particular, by increasing the internal loading space of the loader and unloader can increase the size of the substrate and the number of substrates that can be processed at one time can also increase. Thereby, the efficiency of a patterning process can be improved. In addition, it is possible to minimize the space occupied by the support for supporting the laser inductor by replacing the linear movement of the conventional laser inductor with rotational movement. Accordingly, installation convenience and maintenance cost of the pattern forming apparatus can be reduced. In addition, by minimizing the path loss of the laser, it is possible to increase the uniformity of the generated pattern by maintaining the intensity of the laser irradiated onto the substrate uniformly.

1 is a perspective view schematically showing a pattern forming apparatus using a conventional laser.
2 is a configuration diagram schematically showing a pattern forming apparatus according to an embodiment of the present invention.
3 is a flowchart illustrating a method of forming a pattern using the pattern forming apparatus shown in FIG. 2 according to one embodiment of the present invention.
4 is a process flowchart showing in detail the pattern forming step shown in FIG. 3 according to an embodiment of the present invention.
5A to 5D are diagrams illustrating process steps corresponding to the process flow diagram illustrated in FIG. 4.

Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the accompanying drawings.

In each of the drawings of the present invention, the size or dimensions of the structures are shown to be enlarged or reduced than actual for clarity of the invention.

In the present invention, the terms first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The terms are used only for the purpose of distinguishing one component from another.

The terminology used herein is for the purpose of describing particular example embodiments only and is not intended to be limiting of the present invention. Singular expressions include plural expressions unless the context clearly indicates otherwise. In the present application, the terms "comprises" or "having" and the like are used to specify that there is a feature, a number, a step, an operation, an element, a component or a combination thereof described in the specification, But do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, or combinations thereof.

For the embodiments of the invention disclosed herein, specific structural and functional descriptions are set forth for the purpose of describing an embodiment of the invention only, and it is to be understood that the embodiments of the invention may be practiced in various forms, But should not be construed as limited to the embodiments set forth in the claims.

That is, the present invention may be modified in various ways and may have various forms. Specific embodiments are illustrated in the drawings and described in detail in the text. However, this is not intended to limit the present invention to a specific disclosed form, it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention.

Pattern Forming Device

2 is a configuration diagram schematically showing a pattern forming apparatus according to an embodiment of the present invention.

Referring to FIG. 2, the pattern forming apparatus 1000 according to an exemplary embodiment of the present disclosure processes a substrate loaded with a patterning target substrate and a substrate introduced from the substrate loader 500 to form a predetermined pattern. To form a pattern at a surface location of a predetermined substrate by organically controlling the processor 600, a substrate unloader 700 for receiving the substrate on which the pattern is formed, and the loader, the processor, and the unloader. It includes a central controller 800 for controlling.

In one embodiment, the substrate loader 500 is disposed on the first side of the processing machine 600 so that the substrate to be patterned waits at the substrate loader 500 before being introduced into the processing machine 600. Accordingly, the patterning target substrate is sequentially introduced from the substrate loader 500 to the processing machine 600 to form a predetermined pattern on the substrate surface.

For example, the substrate loader 500 includes a substrate cassette in which a plurality of substrates having a predetermined process on the substrate are stacked at regular intervals in a vertical direction. In this case, the substrate loader 500 and the processing machine 600 are connected to each other by a transfer guide as described below, so that the substrates may be sequentially supplied in the order of loading from the substrate loader 500 to the processing machine 600. Can be. On the other hand, the transfer guide is disposed between the substrate loader 500 and the processing machine 600 so that individual transfer means such as a robot arm (not shown) is disposed to elastically supply according to the process flow of the processing machine 600. It can be obvious.

In particular, when a specific cleanness or vacuum degree is required according to the characteristics of the process in which the substrate is processed, the substrate loader 500 may include a load lock between a loading space (not shown) on which the substrate is loaded and the processing machine 600. A chamber (not shown) may be further provided. The load lock chamber may prevent a sudden change between the process environment of the processing machine 600 and the environment of the loading space to ensure the continuity of the process conditions.

In one embodiment, the substrate unloader 700 is disposed on the second side of the processing machine 600 which is symmetrical to the first side to accommodate the substrate on which the patterning process is completed. Therefore, the substrate flows into the processing machine 600 from the substrate loader 500, undergoes a patterning process, and is then received by the substrate unloader 700 to complete the patterning process. For example, the substrate unloader 700 also includes a substrate cassette capable of accommodating a plurality of substrates, similar to the substrate loader 500.

In this case, the substrate loader 500, the processing machine 600, and the substrate unloader 700 constitute a linear process path that is continuously arranged so that the substrate is loaded by the in-line process. ), The patterning process may be completed via the processor 600 and the substrate unloader 700 sequentially.

Therefore, once the patterning process for a certain number of substrates is completed, it can be moved to the next process at once. The number of substrates that can be accommodated in the substrate loader 500 and the substrate unloader 700 may vary depending on the size of the loading space disposed therein. In this embodiment, a loader and an unloader capable of loading 20 substrates can be used. However, it is apparent that the number of substrates that can be loaded into the substrate loader and unloader can be adjusted differently according to the process efficiency of the patterning process.

The substrate S is not limited to its use and shape as long as it is a substrate for forming a predetermined pattern on the surface through laser processing. For example, the semiconductor substrate may include a semiconductor substrate for processing a semiconductor device such as a wafer, a glass substrate for manufacturing a flat panel display, and a light guide plate of a backlight assembly of the flat panel display. In the present exemplary embodiment, the dot pattern for light scattering is exemplarily described for the light guide plate for the backlight assembly of the liquid crystal display device. However, it is apparent that the pattern forming apparatus of the present invention can be used to form not only the dot pattern for the light guide plate but also various patterns.

In one embodiment, the processing machine 600 includes a support 100, a substrate feeder 200, a laser generator 300, and a laser inducer 400.

The support 100 is a flat plate on which the substrate feeder 200 is disposed, the support plate 120, protrudes to have a bridge shape to the support plate 120 has a transport space for transporting the substrate at the bottom It includes a support pier 140 and a rotating member 160 which is disposed on the upper surface of the support pier 140 to rotate at a predetermined angle.

The support plate 120 has a top surface processed to have a flat plane, and a substrate feeder 200 for transferring the substrate S is disposed on the top surface. In one embodiment, the support plate 120 is made of a material having sufficient shock resistance and heat resistance to accommodate the vibration caused by the movement of the substrate feeder and the thermal expansion by the laser processing. In addition, it has a thickness as thin as possible to sufficiently absorb the vibration and thermal expansion and to have a load that does not impair the installation convenience of the apparatus 1000. For example, the matrix plate 120 may be formed of a plate rock or quartz having a predetermined thickness.

In one embodiment, the support plate 120 is provided to have a width extending in the X direction, a length extending in the Y direction and a thickness extending in the Z direction based on the coordinate axis shown in FIG. The substrate loader 500 is disposed on a first side of the first end in the longitudinal direction and has a length having a length of twice or more, and the substrate unloader 700 on a second side of the second end corresponding to the first end. ) Is placed. Thus, the substrate undergoes a patterning process by an inline process while being sequentially transferred along the Y direction.

The support bridge 140 is a pair of legs (141a, 141b, hereinafter referred to as reference number 141 disposed on the periphery of the support plate 120 so as to be symmetrical with each other along the Y axis in the longitudinal direction of the support plate 120) And an upper plate 142 which contacts the upper surface of the pair of legs and extends in the X direction to cross the support plate 120 and each other in space.

For example, the leg 141 has a hexagonal cylinder or a circular cylindrical shape and has a constant height from an upper surface of the support plate 120. In this case, the leg 141 may be sufficiently positioned to focus the focus lens of the laser inductor 400 on the surface of the substrate S in consideration of the shape and arrangement of the laser inductor 400 to be described later. Place it to have a height. In addition, the leg 141 is strong and rigid enough to absorb vibrations and strains generated by the rotation of the rotating member 160 disposed to be rotatable on the surface of the upper plate 142. Has In particular, it is arranged to have a cross-sectional area as wide as possible in a range that does not interfere with the transfer of the substrate is configured to sufficiently resist the vibration and strain. The top plate 142 is in contact with each top surface of the pair of legs 141a and 141b to cross the support plate 120 at the top. Thereby, it is comprised by the slender type member extended along an X direction. In addition, the surface of the top plate 142 is processed to have a flat surface similar to the top surface of the support plate 120 so that the top surface of the support plate 120 and the surface of the top plate 142 are substantially parallel to each other Configure.

The rotating member 160 is disposed to be rotatable on the surface of the upper plate 142. For example, the rotating member 160 is composed of a slender member and is disposed in parallel with the support flat plate 120. Accordingly, the top plate 142 and the rotating member 160 cross each other, and in this embodiment, the intersection point of the top plate and the rotating member is disposed on a center line along the Y axis of the support plate 120. That is, the intersection of the upper plate 142 and the rotating member 160 is located on the midpoint of the width of the support plate 120. However, it is apparent that the position of the rotating member 160 may be different depending on the use environment of the pattern forming apparatus 1000 or the characteristics of the substrate to be processed. In addition, the surface of the rotating member 160 is processed to have a flat surface similar to the upper surface of the support plate 120 and the surface of the upper plate 142 to the upper surface of the support plate 120 and the upper plate 142 Constitute a plane substantially parallel to the surface.

Although not shown, the rotation member 160 may include a rotation motor (not shown) and a rotation controller (not shown) for controlling the amount of rotation of the rotation member by controlling the driving force of the rotation motor. At this time, the rotary motor includes a one-way motor for rotating the rotating member 160 in a clockwise or counterclockwise direction or a bidirectional motor capable of forward and reverse rotation along the clockwise and counterclockwise directions at a predetermined period. can do.

The substrate feeder 200 may be detachably connected to a transfer table 220 on which a processing target substrate S, such as a light guide plate, is seated, and a lower surface of the transfer table 220 to linearly transfer the transfer table 220. And a conveying guide 210. For example, the transfer table 220 includes a plurality of vacuum suction holes to fix the substrate by vacuum suction. Preferably, the substrate may further include a substrate aligner (not shown) for aligning the substrate on the transfer table 220 such that the patterning position P corresponds to an initial position of a focus lens described later.

The transfer guide 210 is disposed on an upper surface of the support plate 120 and is coupled to a transferer (not shown) disposed on a lower surface of the transfer table 220. The conveyer includes a driving means (not shown) and a scale (not shown), such as a linear motor or a ball screw motor, so that the conveying table 220 has a predetermined unit along the conveying guide 210 extending along the Y axis. Linear feed. Preferably, the sensor may further include a detection sensor (not shown) capable of sensing a position of the scale to detect a feeding speed and a feeding distance.

In this case, the transfer guide 210 may extend to the inside of the substrate loader 500 and the substrate unloader 700. Accordingly, the substrate to be patterned is integrally loaded with the transfer table and sequentially supplied from the substrate loader 500 to the transfer table 220. In addition, the substrate on which the patterning process is completed is accommodated in the substrate uploader 700 together with the transfer table 220. Alternatively, the substrate may be individually moved by using a transfer means such as a robot arm on an upper surface of the transfer table 220 that individually moves along the transfer guide 210 on the support plate 120. Do.

The laser generator 300 is disposed at an end of the rotating member 160 disposed on the upper plate 142 of the support bridge 140. Therefore, in the present embodiment, the laser generator 300 is initially arranged in parallel with the central axis of the support plate 120 parallel to the Y axis. The laser generator 300 melts or dissolves the surface of the substrate S to form a predetermined pattern on the surface of the substrate. Therefore, the laser generator 300 may generate a laser having a wavelength suitable for melting or melting the surface of the substrate according to the material of the substrate. Lasers selectable from infrared (IR) and ultraviolet (UV) lasers include pulsed or continuous wave gas lasers and solid state lasers. Examples of gas lasers include CO 2 lasers, excimer lasers, Ar lasers, Kr lasers, and the like. Examples of solid state lasers include YAG laser, YVO4 laser, YLF laser, YAlO3 laser, glass laser, ruby laser, alexandrite laser, Ti: sapphire laser, Y2O3 laser and the like. Here, the solid-state laser may use crystals of YAG, YVO 4, YLF, YAlO 3, and the like doped with Cr, Nd, Er, Ho, Ce, Co, Ti, Yb, or Tm. These lasers provide a laser beam having a fundamental wave of 1 탆 wavelength band. Preferably, a pulse oscillation type CO2 laser is selected and used.

In the present embodiment, the laser generator 300 includes a first generator 300a and a second generator 300b disposed in pairs at both ends of the rotating member 160 to increase the process efficiency of the patterning process. have.

The laser inductor 400 guides the laser generated by the laser generator 300 to the substrate S disposed below, thereby dissolving or melting the surface of the substrate to form a pattern. For example, the laser inductor 400 is disposed perpendicular to the surface of the substrate S and has a hollow cylindrical body 410 having a cavity therein, and the cylindrical body 410. Disposed at one end of the reflector 420 and disposed on the same plane as the laser generator 300, and disposed at the other end of the body 410, and arranged in a line along the Z axis with the reflector 420 from the reflector. Focus lens 430 for focusing the reflected laser to the surface of the substrate.

The body 410 is integrally formed with the rotating member 160 or connected to the rotating member 160 by a separate connection means (not shown) to rotate according to the rotation of the rotating member 160. That is, when the rotating member 160 rotates, the body 410 also rotates together with the reflector 420 and the focus lens 430 disposed at the upper and lower ends of the body according to the rotation of the body 410. Rotates together. Accordingly, the focus lens 430 is relatively moved along the rotational trajectory of the rotating member 160 with respect to the surface of the substrate (S). That is, the focus lens 430 has the center of the intersection of the rotating member 160 and the upper plate 142 and rotates along the rotational trajectory to rotate the radius between the intersection and the focus lens 430 as a radius. It can move on the upper surface of the substrate (S).

The reflector 420 is disposed to face the laser emission stage (not shown) of the laser generator 300 so that the laser emitted from the laser generator is reflected by the reflector to change the optical path. Therefore, the laser generated by the laser generator can be guided to the substrate S by appropriately adjusting the incident angle and the reflection angle on the reflector surface. Accordingly, if the incident angle and the reflection angle of the laser light can be properly adjusted by adjusting the reflector, it is obvious that the position of the substrate S may be variously modified without being limited to the upper surface of the support plate 120.

The laser reflected from the reflector 420 is focused onto the focus lens 430 to form a laser beam. Preferably, a focal length adjusting member (not shown) is arranged on the side of the focal lens to maximize the energy of the laser irradiated onto the substrate surface by adjusting the focal length between the surface of the substrate S and the focal lens 430. ) Can be placed further.

Since the laser inductor 400 is disposed to be fixed to the rotating member 160, the relative position with respect to the substrate S may change according to the arrangement of the rotating member 160. In this embodiment, the rotating member 160 is disposed along the centerline of the support plate 120 and the substrate S is also disposed so that the y-axis centerline is aligned with the centerline of the support plate 120. The lens 430 is disposed to be positioned at the center of the substrate. However, it is obvious that the relative position of the substrate S and the focus lens 430 may be different depending on the use environment of the pattern forming apparatus 1000, the characteristics of the substrate to be processed, and other processing conditions.

In the present embodiment, the laser inductor 400 is also disposed in a patterned process by arranging a pair of first and second laser inductors 400a and 400b disposed corresponding to the pair of laser generators 300a and 300b. The efficiency can be improved. In this case, since the first and second laser guides are disposed symmetrically with respect to the upper plate 142, the movement directions of the focus lens are made in opposite directions. This will be described later.

The central controller 800 is electrically connected to the substrate loader 500, the processor 600, and the substrate unloader 700 to form a pattern at a patterning position P of the substrate S. 500, the processor 600 and the unloader 700 are controlled.

In particular, the substrate transporter 200, the laser generator 300, and the laser inducer 400 are organically controlled by a central controller (not shown) to provide linear transport of the substrate S. The generation of the laser and the rotation of the focus lens are performed organically with each other. Accordingly, a pattern that is repeated on the surface of the substrate S in a predetermined shape can be formed.

According to the pattern forming apparatus according to the embodiment of the present invention as described above, the substrate loader 500, the patterning processing machine 600 and the substrate unloader 700 are arranged in a line to apply the pattern to the substrate to be processed in an inline process Can be formed. Accordingly, the operation efficiency of the pattern forming apparatus can be improved as compared with the conventional pattern forming apparatus in which a pair of substrates are placed on the same substrate and processed simultaneously, and patterning is formed on the substrate surface in a large amount by introducing a conveyor system. can do. In particular, by increasing the internal loading space of the loader and unloader can increase the size of the substrate and the number of substrates that can be processed at one time can also increase. Thereby, the efficiency of a patterning process can be improved.

Pattern Formation Method

Hereinafter, a method of forming various types of patterns on the surface of the substrate using the pattern forming apparatus shown in FIG. 2 will be described. For example, in the present embodiment, a method of forming a dot pattern for scattering light on a surface of a light guide plate for a backlight will be described. However, it is obvious that the present invention is not applied only to the formation of the dot pattern for the light guide plate.

3 is a flowchart illustrating a method of forming a pattern using the pattern forming apparatus shown in FIG. 2 according to one embodiment of the present invention.

2 and 3, in order to form a pattern on the surface of a substrate according to an embodiment of the present invention, a plurality of process target substrates are first stored in the substrate loader 500 (step S100). For example, when the process chamber in which the pretreatment process is performed with respect to the substrate and the processing machine are spaced apart from each other, the substrate cassette may be stored in a substrate cassette having a predetermined loading space after storing a plurality of substrates to be processed before the process is completed. Move to prepare for the patterning process in the machine. On the contrary, when the processing chamber in which the pretreatment process is performed on the substrate is disposed adjacent to the substrate, a predetermined buffer space for accommodating the substrate on which the pretreatment process is completed may be provided in an area adjacent to the process chamber for pretreatment. have. Thus, the substrate loader 500 includes a substrate cassette and a buffer space for storage.

Subsequently, the substrate is sequentially removed from the substrate loader and supplied to the processing machine 600 (step S200).

In an embodiment, the substrate cassette in which the substrate is stored is disposed on one side of the processor, and the substrate is sequentially removed from the cassette and supplied to the processor. The transfer guide 210 integrally provided with the substrate table 220 extends into the cassette, and the substrate to be processed is moved to the substrate table 220 in the cassette, and then the transfer guide 210 is moved. It can be supplied to the processor 600 accordingly. In this case, the substrate may be loaded in a predetermined number of sheets in the cassette and moved to the processor at once.

In another embodiment, a transfer means such as a robot arm may be disposed between the buffer space in which the substrate is stored and the processor 600, and the substrate on which the pretreatment process is completed may be sequentially supplied to the processor. Preferably, a load lock chamber may be disposed between the buffer space and the processing machine, and the transfer means may be disposed inside the load lock chamber to prevent a sudden process environment change between the buffer space and the processing machine.

In the present embodiment, the substrate may be seated on the transfer table 220 of the substrate feeder 200 and moved on the support plate 120. In this case, the substrate S disposed on the transfer table 220 is fixed to the transfer table 220 by a vacuum suction method. In addition, the substrate S is transferred along the transfer guide 210 along the X-axis direction in the longitudinal direction of the support plate 120 and disposed below the laser inductor 400. In this case, the laser inductor 400 is disposed above the boundary region of the substrate S.

Subsequently, a patterning process using a laser generated by the laser generator is repeatedly performed on the surface of the substrate S to form a plurality of patterns aligned on a rotational trajectory of the laser inductor 400 on the substrate S. (Step S300). Forming a pattern on the substrate will be described in detail with reference to FIGS. 4 and 5A to 5D.

FIG. 4 is a process flowchart showing in detail a pattern forming step shown in FIG. 3 according to an embodiment of the present invention, and FIGS. 5A to 5D are diagrams showing process steps corresponding to the process flowchart shown in FIG. 4. In the present exemplary embodiment, the pattern forming apparatus 1000 is exemplarily disclosed as a dual pattern forming apparatus including a pair of laser generators and a pair of laser inductors and simultaneously forming a pattern on a pair of substrates. . However, it is obvious that the present invention is not limited to the dual pattern forming apparatus.

2, 4, and 5A, the substrate S is disposed under the laser inducer 400 using the substrate feeder 200, and an initial position P is set (S310).

In one embodiment, when the substrate S is fixed on the transfer table 220, the transfer table 220 is a longitudinal direction of the support plate 120 along the transfer guide 210 by the central controller 800. It is conveyed along the Y direction. In this case, the substrate table 220 aligns the first end S1a of the first substrate S1 under the focus lens 430a of the first laser inductor 400a and focuses the second laser inductor 400b. It is controlled to align the first end S2a of the second substrate S2 under the lens 430b.

The first end of each substrate refers to an end facing the substrate unloader 700 along the Y direction, which is the transport direction of the substrate, and the second end is symmetrical to the first end and faces the end facing the substrate loader 500. Refer. Therefore, the substrates are aligned on the transfer table 200 based on the intersection of the Y-direction center line of the substrates S and the first ends S1a and S2a.

The laser requires a stabilization step to reach normal power. To this end, the output state of the laser is checked while checking the output on the test substrate or the absorbent in the region outside the upper region of the substrate S to be processed.

2, 4 and 5B, when the output of the laser reaches a steady state, the rotating member 160 is rotated to irradiate the laser onto the substrate S with a pulse. The pattern on the substrate S is programmed in advance in the size of the groove and the pitch interval along the width direction and the longitudinal direction of the substrate and stored in the controller.

The laser generator 300 is disposed on the upper surface of the rotating member 160 to emit a laser in a direction parallel to the rotating member 160. The emitted laser beam is vertically changed by the reflector 420 to be incident to the focus lens 430. The focus lens 430 disposed on the substrate focuses the laser to irradiate the laser onto the substrate surface. As a result, the surface corresponding to the patterning position of the substrate S is melted or melted to form a dot pattern.

In this case, the rotating member 160 continuously rotates along the first rotation direction and generates the laser in the form of a pulse having a constant frequency in the laser generator 300 ms. Accordingly, the laser inductor 400 to which the rotating member 160 is fixed irradiates laser pulses at regular intervals toward the surface of the substrate S while rotating along the first rotation direction. Therefore, on the substrate S, a plurality of dot patterns having an interval corresponding to the period of the laser pulse are aligned in the first rotation direction along the rotation trajectory of the laser inductor 400 to form the first pattern trace AC1. It forms (step S320).

After forming the pattern along the rotational trajectory from the start point corresponding to the patterning position P, the rotating member 160 to which the laser inductor 400 is connected is controlled by the central controller 800 to control the first pattern. It rotates by a predetermined rotation angle in the rotation direction and moves to the first boundary region and the second boundary region symmetrical along the width direction of the substrate. Therefore, the first pattern trace AC1 extends from the first boundary region to the second boundary region across the substrate S and is completed. The first rotation direction may be clockwise or counterclockwise. In particular, when a pair of rotating members (160a, 160b) is disposed symmetrically with respect to the top plate 142, when any one of the rotating member is rotated in the clockwise direction, the other rotating member rotates in the counterclockwise direction The direction of rotation may be selected in either the clockwise or counterclockwise direction.

Specifically, the laser inductor 400 connected to the rotating member 160 rotates along the first rotation direction together with the rotating member 160. Accordingly, the focus lens 430 continuously moves along the rotation trajectory corresponding to the rotation angle on the substrate S, and the laser pulses of the substrate are moved at regular intervals while the focus lens 430 moves. Irradiated to the surface. Accordingly, a plurality of patterns arranged at regular intervals along the rotational trajectory of the laser inductor 400 are aligned to form the first pattern trace AC1 extending from the first boundary region to the second boundary region.

In this case, the central controller 800 may control the rotation controller (not shown) of the rotation member 160 to adjust the rotation angle to sufficiently cover the width of the substrate (S). In the present exemplary embodiment, the first pattern trace AC1 extending from the first boundary region to the second boundary region is completed in the region adjacent to the first ends S1a and S2a of the respective substrates.

2, 4 and 5C, when the first pattern trace AC1 is completed and the laser inductor 400 is disposed in the second boundary region, the rotating member may be moved by the central controller 800. The rotation of the 160 is stopped and the substrate feeder 200 is driven. Accordingly, the substrate on which the first pattern trace is formed is transferred by a predetermined feed pitch d along the X direction, which is the transfer direction of the substrate (step S330).

Accordingly, the first and second focus lenses 430a and 430b are disposed behind the first and second substrates S1 and S2. That is, as the substrate moves in the X direction, the laser inductor 400 moves relatively in the -X direction by the transfer pitch d.

2, 4 and 5D, the laser pulse is irradiated while rotating the laser inducer 400 in a second rotational direction opposite to the first rotational direction, thereby irradiating the first boundary from the second boundary region. A plurality of patterns are aligned at regular intervals to form a second pattern trace AC2 extending along the rotation trace of the laser inductor 400 (step S340).

The rotational movement of the rotating member 160 to which the laser inductor 400 is connected is substantially the same except for the rotational movement and the moving direction while forming the first pattern trace AC1. Therefore, a detailed description of the rotational movement of the rotating member 160 and the rotational movement of the laser inductor 400 thereby will be omitted. Accordingly, the first and second pattern traces AC1 and AC2 are disposed on the substrate S at intervals corresponding to the transfer pitch d.

When the rotating member 160 continues to rotate along the second rotation direction and the laser inductor 400 is again placed on the first boundary region of the substrate S, the rotation of the rotating member 160 is performed as described above. Is stopped and the substrate S is again conveyed by the conveying pitch d along the conveying direction. Accordingly, the first and second focus lenses 430a and 430b are disposed behind the first and second substrates S1 and S2. That is, as the substrate moves in the X direction, the laser inductor 400 moves relatively in the −X direction by the transfer pitch d to be spaced apart by 2d from the first ends S1a and S2a of the substrate, respectively. Is placed.

Thereafter, a plurality of first pattern traces extending from the first boundary region to the second boundary region along the first rotation direction and extending from the second boundary region to the first boundary region along the second rotation direction A plurality of second pattern traces are repeatedly formed. In this case, the first and second pattern traces are formed alternately along the first and second rotation directions, and the alternate formation of the first and second pattern traces is repeated from the front end to the rear end of the substrate. A laser processed pattern is formed on the whole surface of the substrate.

In this case, since the patterning process is performed on the first and second substrates S1 and S2 at the same time, the patterning process on the pair of substrates is completed at the same time. Accordingly, the plurality of patterns formed on the substrate S have a separation distance equal to the arc length corresponding to the period of the laser pulse within the same trajectory and correspond to the transfer pitch d along the longitudinal direction of the substrate. It is arranged while forming a pattern trace with an interval.

In this embodiment, the rotation member 160 rotates alternately along the first and second rotation directions having opposite directions, but according to the operating environment of the pattern forming apparatus or the characteristics of the target substrate. Obviously, it can be controlled to rotate only in one of the first rotation direction and the second rotation direction. That is, in the present embodiment, the first and second rotating members 160a and 160b start rotating periodically in a range of a predetermined center angle, but the first and second rotating members are integrally formed to be 360 degrees. A pattern may be formed on the surface of the substrate while rotating. In this case, the laser generated by the laser generator is guided to another path by the central controller 800 while the laser inducer 400 moves between the first substrate S1 and the second substrate S2. Can be. For example, a laser absorbent may be installed at a rotation radius of the rotating member 160 to absorb the laser pulse. Accordingly, the laser generator can be stably operated by continuously generating the laser pulse regardless of the standby state or the operating state of the laser generator 300.

Subsequently, the substrate S on which the patterning process is completed is sequentially stored in the substrate unloader 700 (step S400). Like the substrate loader 500, the substrate unloader 700 may be a buffer space connected to a substrate cassette or a process chamber of another post-treatment process. Since the configuration between the processor 600 and the substrate unloader 700 is substantially the same as the configuration between the substrate loader 500 and the processor 600, a detailed description thereof will be omitted.

According to the pattern formation method as described above, the substrate to be processed is sequentially moved along the substrate loader 500, the processor 600, and the substrate unloader 700, and a pattern is formed on the surface thereof. Accordingly, the patterning process may be performed on a group of substrates in an inline manner using a conveyor system to increase process efficiency. That is, a batch patterning process for a plurality of substrates may be performed using the pattern forming apparatus.

In addition, by replacing the linear movement of the conventional laser inductor 400 by the rotational movement it is possible to minimize the space occupied by the support for supporting the laser inductor 400. Accordingly, installation convenience and maintenance cost of the pattern forming apparatus can be reduced. In addition, by minimizing the path loss of the laser, it is possible to increase the uniformity of the generated pattern by maintaining the intensity of the laser irradiated onto the substrate uniformly.

According to embodiments of the present invention, the substrate loader 500, the patterning processor 600, and the substrate unloader 700 may be arranged in a line to form a pattern on the substrate to be processed by an inline process. Accordingly, the operation efficiency of the pattern forming apparatus can be improved as compared with the conventional pattern forming apparatus in which a pair of substrates are placed on the same substrate and processed simultaneously, and patterning is formed on the substrate surface in a large amount by introducing a conveyor system. can do. In particular, by increasing the internal loading space of the loader and unloader can increase the size of the substrate and the number of substrates that can be processed at one time can also increase. Thereby, the efficiency of a patterning process can be improved.

In addition, by replacing the linear movement of the conventional laser inductor 400 by the rotational movement it is possible to minimize the space occupied by the support for supporting the laser inductor 400. Accordingly, installation convenience and maintenance cost of the pattern forming apparatus can be reduced. In addition, by minimizing the path loss of the laser, it is possible to increase the uniformity of the generated pattern by maintaining the intensity of the laser irradiated onto the substrate uniformly.

In the present embodiment, a method of forming a scattering pattern of a light guide plate for a backlight unit of a flat panel display device is disclosed, but the present invention is not limited thereto. Obviously, it can be used in various ways.

As described above, although described with reference to a preferred embodiment of the present invention, those skilled in the art will be variously modified and modified within the scope of the present invention without departing from the spirit and scope of the invention described in the claims below. It will be appreciated that it can be changed.

100: support 200: substrate transfer machine
300: laser generator 400: laser inductor
1000: pattern forming apparatus

Claims (17)

A pattern for forming a pattern trace by arranging a plurality of patterns along a rotational trace on a surface of a substrate, and the pattern traces adjacent to each other are disposed on one side of the machine to sequentially process the substrate to be spaced apart by a transfer pitch of the substrate. A substrate loader on which a plurality of substrates supplied to the processing machine are waiting and disposed on the other side of the processing machine sequentially receive the processed substrates in the processing machine, and are arranged in a line according to the processing order with the substrate loader and the processing machine. In the pattern forming apparatus comprising a substrate unloader for forming the pattern on the surface of the substrate by an in-line process,
The processing machine,
A support plate having a support plate adjacent to the substrate loader and having a flat upper surface, a support pier protruding from the support plate, and a rotating member rotatably fixed to an upper portion of the support pier;
A substrate feeder disposed on an upper surface of the support plate and having a transfer guide extending along a longitudinal direction of the support plate and a transfer table detachably connected to the transfer guide and having the substrate fixed on an upper surface thereof;
A pair of laser generators disposed on an upper surface of the rotating member to generate a laser for processing the substrate; And
A body rotating according to the rotation of the rotating member, a reflector disposed at one end of the body to face the laser generator and reflecting the laser emitted by the laser generator, and disposed at the other end of the body and reflected by the reflector A laser inductor having a focus lens for focusing the laser and concentrating on the substrate,
The support pier includes a pair of legs protruding from the width direction peripheral portion of the support plate and an upper plate fixed to an upper surface of the pair of legs to cross the support plate along the width direction, and the rotating member includes: It is rotatably fixed to the center of the upper plate, the laser generator and the laser induction apparatus is fixed to the rotating member pattern forming apparatus, characterized in that for rotating with the rotating member. delete delete delete The rotating member of claim 1, wherein the rotating member alternately rotates along a first rotational direction that rotates clockwise or counterclockwise and a second rotational direction opposite to the first rotational direction, and from the first rotational direction. And the substrate is transferred as much as the transfer pitch while being changed in a second rotation direction. delete The pattern forming apparatus of claim 1, wherein the body has a cylindrical shape having a cavity therein, and the laser reflected from the reflector is introduced into the focus lens via the cavity of the cylindrical body. The pattern forming apparatus of claim 1, wherein the transfer table moves in the transfer pitch unit along the transfer guide. According to claim 1, wherein the laser generator is located on one side of the center of the rotating member and the laser inductor is located in the other end of the rotating member is disposed in a pair and the laser inductor is located in the lower portion of each of the focusing lens of the substrate Patterning device characterized in that the patterning position is positioned so as to be aligned. The pattern forming apparatus of claim 1, wherein the substrate loader and the substrate unloader include a substrate cassette capable of loading a plurality of the substrates. The pattern forming apparatus of claim 1, wherein the substrate comprises a light guide plate of a backlight unit for a flat panel display device, and the pattern includes a scattering pattern formed on the light guide plate. Storing the substrate in a substrate loader disposed on one side of a processing machine for forming a pattern on a surface of the substrate, sequentially removing the substrate from the substrate loader and supplying the substrate to the processing machine; a plurality of patterns arranged along a rotational trajectory Forming a plurality of pattern traces having a plurality of pattern traces and adjoining the pattern traces to be spaced apart by a transfer pitch of the substrate; and processing the substrate on which the pattern is formed by a substrate unloader disposed on the other side of the processing machine. In the pattern forming method comprising the step of sequentially receiving,
The step of supplying the substrate to the processor is performed by fixing the substrate to a transfer table moving along the processor and the extended transfer guide,
The step of processing the substrate,
Irradiating a laser pulse while rotating a laser inducer for guiding a laser from the first boundary region of the substrate to the substrate along a first rotation direction to form a first pattern trace on the surface of the substrate;
When the first pattern trace is completed to a second boundary region corresponding to the first boundary region along the width direction of the substrate, the rotation of the laser inductor is stopped and the substrate is transferred by the transfer pitch along a transfer direction. Making a step; And
Irradiating the laser pulse while rotating the laser injector from the second boundary region of the substrate to the first boundary region along a second rotation direction to form a second pattern trace on the surface of the substrate; Pattern forming method characterized in that. delete delete The pattern forming method of claim 12, wherein the first and second rotation directions are opposite to each other, and the laser inductor alternately rotates along the first and second rotation directions on the substrate. Way. The method of claim 12, wherein the first and second rotation directions are the same direction and the laser inducer is rotated 360 degrees. The method of claim 12, wherein the substrate loader, the processing machine, and the substrate unloader are arranged in a line in a process sequence for forming the pattern to perform an inline process.
KR1020100005476A 2010-01-21 2010-01-21 Apparatus for forming a pattern on a substrate and method of forming a pattern using the same apparatus KR101015201B1 (en)

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KR101721443B1 (en) * 2015-12-16 2017-03-30 주식회사 씨케이엘 Apparatus for dicing product using laser beam
JP7370140B2 (en) 2019-01-23 2023-10-27 大船企業日本株式会社 A substrate conveyance method, a substrate conveyance device equipped with the substrate conveyance method, and a substrate processing device with a substrate conveyance device comprising the substrate conveyance device and a substrate processing device

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JP7370140B2 (en) 2019-01-23 2023-10-27 大船企業日本株式会社 A substrate conveyance method, a substrate conveyance device equipped with the substrate conveyance method, and a substrate processing device with a substrate conveyance device comprising the substrate conveyance device and a substrate processing device

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