KR20110133806A - Apparatus marking pattern by using laser and method for marking pattern by using laser thereof - Google Patents

Abstract

PURPOSE: A pattern making device and a method using laser are provided to rapidly operate the light guide plate processing by emitting laser beam to first and second layer heads from one laser beam generator through a beam switch or a beam splitter. CONSTITUTION: A pattern making device comprises a first beam generator(110), a beam switch(130) or a beam splitter, first and second guide rails(133a,133b) and a light guide plate(163). The first beam generator generates a laser beam. The beam switch or the beam splitter supplies laser beams to the first and second laser heads. The first and second guide rails transfer the first and second laser heads. The light guide plate transfers first light guide plates(123a). The first light guide plate and second light guide plate are installed on the upper part of the light guide plate. The first and the second laser head comprise a reflective mirror and a focus lens.

Description

Apparatus marking pattern by using laser and method for marking pattern by using laser

The present invention relates to a laser pattern processing method and a processing apparatus thereof, and more particularly, to a laser pattern processing method and a processing apparatus for forming a pattern on a light guide plate with a laser beam, maximizing the working efficiency of the laser generator.

In line with the recent information age, the display field has also been rapidly developed, and a liquid crystal display device (FPD) is a flat panel display device (FPD) having advantages of thinning, light weight, and low power consumption. LCD, plasma display panel device (PDP), electroluminescence display device (ELD), field emission display device (FED), etc. : It is rapidly replacing CRT.

Among them, liquid crystal display devices are used most actively in the field of notebooks, monitors, TVs, etc. because of their excellent contrast ratio and high contrast ratio, and liquid crystal display devices do not have their own light emitting elements. Will be required.

Accordingly, a backlight unit having a light source is provided on a rear surface of the liquid crystal panel to irradiate light toward the front of the liquid crystal panel, thereby realizing an image of identifiable luminance.

Meanwhile, a general backlight unit is classified into a side light method and a direct type method according to an arrangement of light sources. The side light method is a structure in which one or a pair of light sources is disposed at one side of the light guide plate. It has, or two or two pairs of light sources have a structure arranged on each side of the light guide plate, the direct type has a structure in which several light sources are arranged under the optical sheet.

Here, the side light method is easier to manufacture than the direct type method, and has the advantages of lighter weight and lower power consumption than the direct type.

1 is an exploded perspective view of a side light type backlight unit.

As shown in the drawing, the general backlight unit 20 includes a lamp 29a which is a light source, a light guide plate 23 and a light guide plate 23 positioned on the same plane as the lamp 29a and facing at least one side thereof with the lamp 29a. It consists of a plurality of optical sheets 21 seated on the top.

Further, a reflector 25 for reflecting light exiting to the lower surface of the light guide plate 23 is further formed below the light guide plate 23, and a lamp guide 29b for guiding the lamp 29a is further provided.

Here, the optical sheet 21 on the light guide plate 23 includes a diffusion sheet, at least one light collecting sheet, and the like to diffuse or collect light passing through the light guide plate 23.

On the other hand, the light guide plate 123 is a pattern of a specific shape is formed on the back to supply a uniform surface light source, the pattern is an elliptical pattern (elliptical pattern), polygonal to guide the light incident into the light guide plate 123 The pattern (polygon pattern), hologram pattern (hologram pattern) and the like can be configured in various ways, such a pattern is formed on the lower surface of the light guide plate 123 by a printing method, an injection method or a V-cutting method.

The printing method has a long history and is stable, but the process is complicated and causes many defects in the printing process. In consideration of the cost loss, a non-printed LGP manufactured by a mechanical processing method has been developed and applied to mass production.

The injection method is a method of directly injecting a light guide plate by manufacturing a shape having a light scattering function, and may be classified into laser processing, sand blast, corrosion, pole, etc. according to a method of carving a shape on a mold.

Although this injection method is suitable for mass production, there are many defects due to the heat deformation of the light guide plate, and the increase in the cost and time required for manufacturing the mold is a disadvantage, and the mold cannot be easily modified when the pattern design is changed. Has the disadvantage of degrading.

Therefore, recently, V-cutting is in the spotlight, and V-cutting is a method of forming a V-shaped groove pattern using a laser on the surface of the light guide plate. However, this V-cutting has a long processing time, and there is a disadvantage that light is not scattered uniformly due to the roughness of the processing surface.

The disadvantage of this V-cutting is that the pattern processing time increases as the size of the light guide plate increases, and thus, there is a disadvantage in that the pattern forming operation of the large light guide plate cannot be performed quickly.

In order to solve the above problems, the present invention provides a sequential machining mode or a simultaneous machining mode in the process of forming a light guide plate pattern, and controls a plurality of processing points of a laser beam adjusted to correspond to pattern information for each position of the light guide plate. It is a first object of the present invention to provide a laser pattern processing method that enables efficient use of a laser beam by being supplied sequentially or simultaneously, and which can quickly perform a pattern processing operation of a large light guide plate.

In addition, another object of the present invention is to provide a laser pattern processing apparatus capable of supplying a laser beam to a plurality of points sequentially or simultaneously while using a single laser generator, improving work efficiency and performing a large light guide plate work. It is a second object to do.

In order to achieve the above object, a laser pattern processing apparatus for forming a pattern on a light guide plate, comprising: a first laser generator for generating a laser beam; A beam switch or beam splitter for supplying the laser beam to the first and second laser heads; First and second guide rails for moving the first and second laser heads; Provided is a laser pattern processing apparatus including a light guide plate mounting portion for moving a first light guide plate.

In this case, the first and second laser heads are sequentially supplied with the laser beam through the beam switch, and the first and second laser heads are simultaneously supplied by dividing the laser beam through the beam splitter.

The light guide plate may further include a second light guide plate mounted on a light guide plate mounting portion on one side of the first light guide plate, wherein the second guide rail and the second laser head correspond to the second light guide plate, and the first and second laser heads A reflection mirror and a focus lens.

An optical attenuator for adjusting the intensity of the laser beam between the selected one of the beam switch or the beam splitter and each of the first and second laser heads; A beam shaper for converting a Gaussian beam into a Tied Gaussian beam, and a beam expander for expanding the laser beam into a parallel light type, are selected from the beam switch or the beam splitter, and the first and second beam splitters. Between each of the laser heads is an AOto-optic modulator that turns the laser beam on / off.

In addition, between the selected one of the beam switch or the beam splitter and each of the first and second laser heads, a bi-prism and a platform for controlling the processing interval between the laser beams and simultaneously processing two rows of patterns Tooth is positioned, and a second laser generator for generating a laser beam is located on one side of the first laser generator.

In addition, the first and the second laser generator is an optical active device including an optical amplifier, a power meter module for measuring, monitoring and correcting the intensity of the laser beam, and not only to advance the laser beam in one polarization direction And an optical isolator for blocking the reflected laser beam.

In addition, the present invention comprises a first laser generator for generating a laser beam; A beam switch or beam splitter for supplying the laser beam to the first and second laser heads; First and second guide rails for moving the first and second laser heads; A laser pattern processing method using a laser pattern processing apparatus including a light guide plate mounting portion for moving a first light guide plate, the method comprising: supplying the first light guide plate for forming a pattern to the light guide plate mounting portion; Placing the first light guide plate at a processing standby position by the light guide plate mounting unit controlled by the control unit; Inputting pattern information into the controller; The first light guide plate is processed by the laser beam; It provides a laser pattern processing method comprising the step of returning the finished first light guide plate to the supply position.

In this case, further comprising a second light guide plate on one side of the first light guide plate, wherein the first light guide plate for forming a pattern is supplied to the light guide plate mounting unit, the second light guide plate is further supplied to the light guide plate mounting unit. The first light guide plate may be processed by the laser beam, wherein one of the first and second guide rails and the first and second laser heads is formed according to the pattern information. Disposing the upper end portion or the lower end portion of the first light guide plate at a processing standby position; When the first laser head is in a constant velocity state after acceleration, the laser beam is supplied to the first laser head through the beam switch so that one side of the first light guide plate is processed and the second laser head is accelerated. Wow; When the second laser head is in a constant velocity state after acceleration, supplying the laser beam to the second laser head through the beam switch to process the other side of the first light guide plate; Decelerating and stopping the first laser head; When the first laser head is in a decelerated or stopped state, the first guide rail moves by a pitch to a next machining position to cause the first laser head to wait at a next machining position; Simultaneously processing the second light guide plate and accelerating the first laser head; When the first laser head is in a constant velocity state after acceleration, the laser beam is supplied to the first laser head through the beam switch to process a portion moved by a pitch from one side portion of the first light guide plate; Decelerating and stopping the second laser head; And when the second laser head is in a decelerated or stopped state, the second guide rail moves by a pitch to the next machining position to cause the second laser head to wait at the next machining position.

The processing of the first light guide plate by the laser beam may include: moving the first guide rail and the first laser head to a processing standby position of the first light guide plate; Moving the second guide rail and the second laser head to a machining standby position of the second light guide plate when the first laser head is in an accelerated state; When the first laser head is in a constant velocity state, the laser beam is supplied to the first laser head through the beam switch to process the first light guide plate and simultaneously accelerate the second laser head; When the first laser head is decelerated or stopped, and the first laser head is in a constant velocity state after acceleration, the laser beam is supplied to the second laser head through the beam switch to process the second light guide plate. Wow; Decelerating and stopping the first laser head; When the first laser head is in a decelerated or stopped state, the first guide rail moves by a pitch to a next machining position to cause the first laser head to wait at a next machining position; Simultaneously processing the second light guide plate and accelerating the first laser head; When the first laser head is in a constant velocity state after acceleration, the laser beam is supplied to the first laser head through the beam switch to process a portion moved by a pitch from one side portion of the first light guide plate; Decelerating and stopping the second laser head; And when the second laser head is in a decelerated or stopped state, the second guide rail moves by a pitch to the next machining position to cause the second laser head to wait at the next machining position.

In addition, the processing of the first light guide plate by the laser beam may include moving the first and second guide rails and the first and second laser heads to the processing standby positions of the first and second light guide plates. Wow; Splitting and supplying the laser beam to the first and second laser heads through the beam splitter to process the first and second light guide plates; Moving the first and second guide rails to the next machining position, and waiting the first and second laser heads at the next machining position, wherein the first light guide plate is processed by the laser beam. Moving the first and second guide rails and the first and second laser heads to a processing standby position of the first light guide plate; Setting overlapping sections of the first and second guide rails; Dividing the laser beam by the beam splitter and supplying the first and second laser heads to process the first light guide plate; Moving the first and second guide rails toward the overlapping section; The movement of the first and second guide rails and the machining of the first light guide plate are repeated before entering the overlapping section.

The method may further include returning the first guide rail to the processing standby position when the first and second guide rails enter the overlap section. Repeating the movement of the second guide rail and the processing of the first light guide plate in the overlapping section, and processing the overlapping section; And after completion of the overlapping section, returning the second guide rail to the processing standby position. When the first and second laser heads are in a decelerated or stopped state, the light guide plate mounting part moves to move the light guide plate. Moving the pitch by a pitch corresponding to the next machining position.

As described above, according to the present invention, by sequentially supplying the laser beam irradiated from one laser generator to the first and second laser head through the beam switch, the processing time for forming a pattern on the first and second light guide plate By reducing, there is an effect that can maximize the work efficiency.

Therefore, the efficiency of the pattern processing operation can be improved, there is an effect that can be performed light guide plate processing quickly.

Further, according to the present invention, by simultaneously supplying the laser beam irradiated from one laser generator to the first and second laser heads through the beam splitter, there is an advantage that the light guide plate processing can be performed quickly.

In addition, since the laser beam generated from one laser generator is configured to be supplied to the plurality of laser heads, there is an advantage in that the mechanical configuration of the processing apparatus itself can be relatively reduced.

1 is an exploded perspective view of a side light backlight unit.
Figure 2 is a perspective view schematically showing a laser pattern processing apparatus according to a first embodiment of the present invention.
3 is a block diagram illustrating the configuration of FIG. 2 in more detail.
4 is a flowchart for explaining a laser pattern processing method.
5 is a plan view for explaining a cooperative laser pattern processing method according to a first embodiment of the present invention.
6 is a flow chart of FIG.
7 is a plan view of another embodiment of a laser pattern processing apparatus according to the first embodiment of the present invention.
8 is a plan view schematically showing a laser pattern processing apparatus according to a second embodiment of the present invention.
9 is a plan view of another embodiment of a laser pattern processing apparatus according to a second embodiment of the present invention.
10 is a flow chart of FIG.

Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings.

First Embodiment

FIG. 2 is a perspective view schematically showing a laser pattern processing apparatus according to a first embodiment of the present invention, and FIG. 3 is a block diagram illustrating the configuration of FIG. 2 in more detail.

As shown in FIG. 2, in the laser pattern processing apparatus 100, a laser generator 110 is disposed on one side of the table 101 on which the first and second light guide plates 123a and 123b are seated, and the laser generator 110. ) Is installed so that the exit of the laser beam is directed toward the table 101.

At this time, the laser pattern processing apparatus 100 of the present invention locates a beam switch 130 in front of the exit of the laser beam of the laser generator 110. The beam switch 130 serves to adjust the direction of the laser beam coming from the laser generator 110. We will discuss this in more detail later.

The first and second light guide plates 123a and 123b seated on the table 101 are respectively seated on the light guide plate mounting unit 163 installed on the table 101 and are mounted on the light guide plate mounting unit 163. The two light guide plates 123a and 123b are arranged at regular intervals along the longitudinal direction of the table 101 (hereinafter referred to as the "Y-axis direction").

At this time, although not shown in the drawings, the light guide plate mounting portion 163 may be formed from the light guide plate supply position (not shown) located in one of the Y-axis direction of the table 101 or the X-axis direction of the table 101. 123b) is slidable to a processing standby position (not shown) for forming a pattern.

One side of each of the light guide plates 123a and 123b is provided with first and second guide rails 133a and 133b along the longitudinal direction of the table 101 in the X-axis direction.

That is, the first guide rail 133a is positioned at one side of the first light guide plate 123a, the second guide rail 133b is positioned at one side of the second light guide plate 123b, and the first and second guide rails 133a and 133b slide along the Y-axis direction of the table 101 through the rails 171 and 173 provided on the table 101.

Each of the first and second guide rails 133a and 133b is attached with first and second laser heads 135a and 135b to receive a laser beam generated from the laser generator 110. The laser heads 135a and 135b slide along the X-axis direction of the table 101 along the longitudinal directions of the first and second guide rails 133a and 133b, respectively.

In this case, the first and second guide rails 133a and 133b and the first and second laser heads 135a and 135b are respectively controlled by the control unit 150, X-axis moving means (not shown) or Y-axis moving means. (Not shown), wherein the X-axis moving means (not shown) or the Y-axis moving means (not shown) is a drive mechanism using a ball screw, belt or chain, etc. It can be composed of a linear motor and a guide device with excellent positional accuracy and repeatability.

Accordingly, patterns are formed on the first and second light guide plates 123a and 123b through laser beams irradiated from the first and second laser heads 135a and 135b. The first and second laser heads 133a and 133b slide along the Y-axis direction of the table 101 through the rails 171 and 173, respectively, and are attached to the first and second guide rails 133a and 133b. As the 135a and 135b slide along the X-axis direction of the table 101, the patterns formed through the first and second laser heads 135a and 135b respectively form the first and second light guide plates 123a and 123b. Can be formed on the front of the panel.

Although not shown in the drawing, the bottom surface of the table 101 is provided with a dust collecting duct, and the smoke generated during pattern forming with a laser beam is applied to the first and second light guide plates 123a and 123b provided on the table 101. Inhale and discharge to outside.

Here, referring to FIG. 3, the laser pattern processing apparatus 100 according to the first embodiment of the present invention will be described in more detail. The laser pattern processing apparatus 100 according to the present invention may be formed on the light guide plate mounting portion 163, respectively. The first and second LGPs 123a and 123b are seated, and the laser generator 110 for generating a laser beam and the beam switch 130 are disposed on the first and second LGPs 123a and 123b. The optical attenuator 141, the beam shaper 145, the beam expander 147, the first and second laser heads 135a and 135b, and the controller 150 Located.

This may include an AO modulator (acousto-optic modulator: 143).

The laser generator 110 may generate a laser having an infrared-red wavelength such as a CO ₂ laser suitable for processing the materials of the first and second light guide plates 123a and 123b and is controlled by the controller 150. The laser beam is controlled through a pulse repetition rate, a pulse width, and a duty cycle in which the RF signal is modulated so that the laser beam is continuously oscillated and irradiated toward the light attenuator 141.

The laser generator 110 may further include a photoactive device 111 including an optical amplifier.

The laser generator 110 may further include a power meter module 113 for measuring, monitoring, and correcting the intensity of the laser beam output from the photoactive element 111.

In addition, the laser generator 110 may further include an optical isolator 115 to allow the laser beam to proceed in only one polarization direction. The optical isolator 115 may play a role of preventing the reflected light generated at a long distance from returning to the laser generator 110 and destabilizing the operation of the laser generator 110.

The beam switch 130 changes the direction of the laser beam emitted from the laser generator 110 and serves to sequentially supply the laser beams to the first and second laser heads 135a and 135b.

The beam switch 130 is a driving mechanism using a galvano scanner or a solenoid, a ball screw, a belt or a chain, or a linear motor and a guide device having excellent efficiency, guaranteeing a constant speed, positioning accuracy and repeatability. Can be configured.

Between the beam switch 130 and the first laser head 135a, and between the beam switch 130 and the second laser head 135b, the optical attenuator 141 and the AO modulator 143 along the direction in which the laser beam passes. ), The beam shaper 145 and the beam expander 147 may be installed in the frame of the processing apparatus of the present invention, respectively.

The optical attenuator 141 serves to adjust the intensity of the laser beam or the output power of the laser beam. The optical attenuator 141 may be either a tunable attenuator that combines a step change in parallel with a continuous change in attenuation, or a fixed attenuator that makes the attenuation constant.

As the AO modulator 143 switches the path of the laser beam generated from the laser generator 110 and exits the optical attenuator 141, the laser beams irradiated to the first and second light guide plates 123a and 123b are turned on. It is responsible for turning on / off.

The beamshaper 145 converts a laser beam in the form of a Gaussian beam into a parallel flat top beam or a truncated Gaussian beam to smooth the cutting surface or prevent thermal damage. It can play a role.

The beam expander 147 plays a role of enlarging the laser beam into a parallel light type of a predetermined diameter. The beam expander 147 may be installed on the movement path of the lazy beam used for pattern formation in the first and second light guide plates 123a and 123b.

The first and second laser heads 135a and 135b are sequentially supplied with the laser beams emitted from one laser generator 110 through the beam switch 130, respectively, on the first and second light guide plates 123a and 123b. It is in charge of conducting pattern processing by investigating.

The first and second laser heads 135a and 135b focus the processing surfaces of the first and second light guide plates 123a and 123b on the reflection mirrors 137a and 137b provided on the upper side and the laser beams passing and installed on the lower side. It may include a focus lens 139.

The first and second laser heads 135a and 135b divide the laser beam into two between the reflective mirrors 137a and 137b and the focus lens 139 to adjust the distance between the divided laser beams. It may include a bi-prism (not shown) and a lifting device (not shown) capable of line processing.

In this case, the laser pattern processing apparatus 100 of the present invention sequentially supplies the laser beams irradiated from one laser generator 110 to the first and second laser heads 135a and 135b through the beam switch 130. In addition, the processing time for forming the patterns on the first and second light guide plates 123a and 123b may be shortened to maximize work efficiency.

That is, the laser pattern processing apparatus 100 according to the first embodiment of the present invention configures the beam switch 130 to adjust the direction of the laser beam, thereby generating a laser beam generated from one laser generator 110. And second laser heads 135a and 135b, respectively, so that patterns may be sequentially formed on the first and second light guide plates 123a and 123b through the first and first laser heads 135a and 135b. Can be.

Therefore, the laser pattern processing apparatus 100 of the present invention can improve the efficiency of the pattern processing operation, there is an advantage that can quickly perform the light guide plate (123a, 123b) processing.

Hereinafter, the laser pattern processing method of the present invention will be described in more detail with reference to FIG. 4.

4 is a flowchart illustrating a laser pattern processing method.

First, the laser pattern processing method of the present invention may be made by a controller.

In the processing condition setting step (S10), a laser processing condition such as a frequency, laser power, etc. corresponding to the processing of the first and second light guide plates is set in the control unit, and the first and second guide rails, the first and second laser heads, and Offset setting values for each light guide plate mounting portion and their moving speed setting values are set.

When the processing condition setting step S10 is completed, the first and second guide rails, the first and second laser heads, and the light guide plate mounting portion are returned to a predetermined home position.

At this time, the light guide plate mounting portion is positioned at the light guide plate supply position.

Thereafter, the light guide plate supplying step S20 in which the control unit and the light guide plate supplying device of the present invention are interlocked is performed.

In the light guide plate supply step (S20), the light guide plate supply device picks up the first and second light guide plates from the light guide plate supply position and places them on the light guide plate mounting unit, respectively.

Subsequently, in the light guide plate mounting portion processing standby position moving step (S30), the light guide plate mounting portion moves from the light guide plate supply position to the processing standby position to place the first and second light guide plates at the processing standby position.

In the pattern loading step (S40), the analysis of the pattern information input from the control unit is performed, the laser on / off time is set according to the analysis result, the first and second guide rails and the first and first 2 The machining position for each laser head is set.

Thereafter, the processing step S50 is performed, and after completion of the processing step, the light guide plate supply position returning step S60 is performed.

That is, the light guide plate mounting portion maintains the stopped state after moving the first and second light guide plates having the pattern processing from the processing standby position to the light guide plate supply position.

In this case, the LGP supply device may lift each LGP, move it to a work completion area, and return to the LGP supply step S20.

Here, the processing step (S50) will be described in more detail with reference to FIGS. 5 and 6.

5 is a plan view for explaining a cooperative laser pattern processing method according to a first embodiment of the present invention, Figure 6 is a flow chart of FIG.

As shown in FIG. 5, the first and second light guide plates 123a and 123b are respectively mounted on the light guide plate mounting portion 163 provided on the table 101 of FIG. 2, and each of the first and second light guide plates 123a. The first and second guide rails 133a and 133b reciprocate in both directions (for example, in the + Y axis direction or the -Y axis direction) along the Y axis direction through rails 171 and 173 at one side of 123b. Located.

Each of the first and second guide rails 133a and 133b has a bidirectional direction (for example, the + X axis direction or the -X axis direction along the X axis direction along the longitudinal direction of the first and second guide rails 133a and 133b). Direction and first and second laser heads 135a and 135b are provided.

Accordingly, the laser beams irradiated from the laser generator 110 are sequentially supplied to the first and second laser heads 135a and 135b through the beam switch 130, and the first and second laser heads are supplied with the laser beams. The patterns 135a and 135b form patterns on the first and second light guide plates 123a and 123b respectively.

At this time, each of the first and second laser heads 135a and 135b reciprocates more distances than the total width of the first and second light guide plates 123a and 123b.

This is because the speeds of the sections A, B, and C of the first and second laser heads 135a and 135b which are reciprocally driven at high speed are not constant, and from each of the first and second laser heads 135a and 135b, respectively. This is because the output characteristics (including the intensity of the laser beam) of the irradiated laser beam are also not constant.

In particular, in the case of constant velocity and deceleration sections B and C of the first and second laser heads 135a and 135b, the output characteristics of the laser beams irradiated from the first and second laser heads 135a and 135b are more uniform. Since the first and second laser heads 135a and 135b are positioned in the constant velocity section A, it is preferable to form patterns in the first and second light guide plates 123a and 123b using the laser beam. .

Accordingly, in the laser pattern processing apparatus 100 of the present invention, the first and second laser heads 135a and 135b are sequentially positioned in the acceleration section B, the constant speed section A, and the deceleration section C, respectively. When the first laser head 135a is positioned in the constant velocity section A, the second laser head 135b is positioned in the acceleration and deceleration sections B and C, and the first laser head 135a is accelerated and decelerated. When positioned in the sections B and C, the second laser head 153b is positioned in the constant velocity section A. FIG.

In addition, the laser pattern processing apparatus 100 of the present invention may sequentially supply the laser beams irradiated from one laser generator 110 to the first and second laser heads 135a and 135b through the beam switch 130. It is.

That is, after the laser beam is supplied to the first laser head 135a positioned in the constant velocity section A to form a pattern in the first light guide plate 123a, the first laser head 135a accelerates and decelerates (B). And C), the laser beam supplied to the first laser head 135a through the beam switch 130 is supplied to the second laser head 135b positioned in the constant velocity section A.

In this case, the laser beam is not supplied to the first laser head 135a, and the second laser head 135b receiving the laser beam forms a pattern on the second light guide plate 123b.

When the second laser head 135b is positioned in the acceleration and deceleration sections B and C, the laser beam supplied to the second laser head 135b through the beam switch 130 is transferred to the beam switch 130. The pattern is formed on the first light guide plate 123a by supplying the same to the first laser head 133a positioned in the constant velocity section A.

The contents thereof are repeated to form a pattern on the front surfaces of the first and second light guide plates 123a and 123b.

Therefore, the laser pattern processing apparatus 100 of the present invention shortens the waiting time for supplying the laser beam according to the acceleration and deceleration sections B and C in which the first and second laser heads 135a and 135b do not form a pattern. It is possible to maximize the work efficiency, it is possible to quickly perform the light guide plate (123a, 123b) processing.

This will be described in more detail with reference to FIG. 6.

On the other hand, prior to the description, the light guide plate processing may be understood to mean that the laser beam is irradiated to the light guide plate through the first and second laser heads to perform pattern processing.

The pitch shift may mean that the positions of the first and second laser heads are moved to the next line processing position along the Y-axis direction after finishing any one line processing and in the laser beam supply standby state.

As shown in Fig. 6, the first and second guide rails and the first and second laser heads are moved to the processing standby position according to the pattern information (S51).

Here, the processing standby position of the first guide rail may be a position where the first laser head may be disposed at the lower left side of the light guide plate, and the processing standby position of the second guide rail may be disposed at the lower left side of the light guide plate. It may be a location that can be.

When the laser beam is supplied to the first laser head, the first guide rail is moved in the Y-axis direction (S52).

After the movement of the first guide rail, the first laser head is accelerated in the X-axis direction, and the second guide rail is moved in the Y-axis direction when the second laser head is waiting to be supplied (S53a and S53b).

After the acceleration of the first laser head, the first laser head is in a constant velocity state in the X-axis direction, receives the laser beam to process the light guide plate in accordance with the light guide plate pattern information, and the second laser head is accelerated in the X axis direction (S54a). , S54b).

Instead of decelerating the first laser head after processing, the second laser head is in a constant velocity state in the X-axis direction before the first laser head is decelerated so that the laser beam is supplied to process the light guide plate according to the light guide plate pattern information. do.

At this time, the laser beam is stopped from being supplied to the first laser head, and the first laser head is ready to supply the laser beam.

Then, the finished first laser head is decelerated, and the first laser head is stopped. Then, the first guide rail moves to the next machining position by a predetermined pitch, and as a result, the first laser head is waited at the next machining position (S55a, S55b).

Thereafter, the second laser head is decelerated and stopped. At this time, the second laser head is stopped from being supplied to the second laser head, and the second laser head waits to supply the laser beam.

Then, the second guide rail moves to the next machining position by a predetermined pitch, and as a result, the second laser head is waited at the next machining position (S56).

From step S52 to step S56 is repeated to the last machining position of the first guide rail and the second guide rail (S57).

When the pattern processing is completed to the last machining position, the first and second guide rails return to the machining standby positions of the first and second guide rails and the first and second laser heads (S58).

Further, in the pitch movement according to the pattern information, when the first and second guide rails move to the processing standby position of one or more light guide plates and stop, and the first and second laser heads are in a decelerated or stopped state, The light guide plate mounting unit may be moved instead of the first and second guide rails to move the light guide plate by a pitch corresponding to the next machining position.

FIG. 7 is a plan view illustrating a cooperative laser pattern processing method in the case of forming a pattern along a uniaxial length direction of the light guide plate on the light guide plate according to another embodiment of the laser pattern processing apparatus according to the first embodiment of the present invention. to be.

Prior to the description, the light guide plate differently forms the direction of the pattern formed on the light guide plate according to the position of the light source.

That is, when the light source is positioned in the longitudinal direction of the light guide plate, the pattern is formed along the longitudinal direction of the light guide plate, as shown in FIG. 5. It is formed along the direction. Through this, the light emitted from the light source can be spread more evenly over the entire light guide plate.

As shown in FIG. 7, the first and second LGPs 123a and 123b are respectively mounted on the LGP mounting portion 163 provided on the table 101 of FIG. 2, and each of the first and second LGPs 123a. The first and second guide rails 133a, which are reciprocated in both directions (for example, in the + Y axis direction or the -Y axis direction) along the Y axis direction through rails 171 and 173 on one side of the short edge of the 123b, 133b) is located.

Each of the first and second guide rails 133a and 133b has a bidirectional direction (for example, the + X axis direction or the -X axis direction along the X axis direction along the longitudinal direction of the first and second guide rails 133a and 133b). Direction and first and second laser heads 135a and 135b are provided.

At this time, in the process of reciprocating along the longitudinal direction of the first guide rail 133a, the first laser head 135a reciprocates only the first region P1 corresponding to the short edge width of the first light guide plate 123a. In the process of reciprocating along the longitudinal direction of the second guide rail 133b, the second laser head 135b reciprocates only the second region P2 corresponding to the short edge width of the second light guide plate 123b. do.

Accordingly, the laser beams irradiated from the laser generator 110 are sequentially supplied to the first and second laser heads 135a and 135b through the beam switch 130, and the first and second laser heads are supplied with the laser beams. The patterns 135a and 135b form patterns on the first and second light guide plates 123a and 123b respectively.

As described above, in the laser pattern processing apparatus according to the first embodiment of the present invention, the laser beams irradiated from one laser generator 110 are first and second laser heads 135a and 135b through the beam switch 130. By sequentially supplying), the processing time for forming patterns on the first and second light guide plates 123a and 123b can be shortened, thereby maximizing work efficiency.

Therefore, the laser pattern processing apparatus 100 of the present invention can improve the efficiency of the pattern processing operation, there is an advantage that can quickly perform the light guide plate (123a, 123b) processing.

In addition, since the laser beam generated from one laser generator 110 is configured to be supplied to the plurality of laser heads 135a and 135b, the mechanical configuration of the processing apparatus itself may be relatively reduced.

Second embodiment

8 is a plan view schematically showing a laser pattern processing apparatus according to a second embodiment of the present invention, and FIG. 9 is a plan view of another embodiment of a laser pattern processing apparatus according to a second embodiment of the present invention.

As shown in FIG. 8, the first and second light guide plates 123a and 123b are respectively mounted on the light guide plate mounting portion 163 provided on the table 101 of FIG. 2, and each of the first and second light guide plates 123a. The first and second guide rails 133a and 133b reciprocate in both directions (for example, in the + Y axis direction or the -Y axis direction) along the Y axis direction through rails 171 and 173 at one side of 123b. Located.

Each of the first and second guide rails 133a and 133b has a bidirectional direction (for example, the + X axis direction or the -X axis direction along the X axis direction along the longitudinal direction of the first and second guide rails 133a and 133b). Direction and first and second laser heads 135a and 135b are provided.

At this time, the laser generator 110 is disposed on one side of the table (101 in FIG. 2) on which the first and second light guide plates 123a and 123b are seated, and the exit of the laser beam of the laser generator 110 is first and second. 2 are installed to face the light guide plates 123a and 123b.

Then, a beam splitter 180 is positioned in front of the exit of the laser beam of the laser generator 110.

The beam splitter 180 divides the laser beam irradiated from the laser generator 110 and serves to supply the first and second laser heads 135a and 135b, respectively. We will discuss this in more detail later.

Although not shown in the drawing, between the beam splitter 180 and the first laser head 135a and between the beam splitter 180 and the second laser head 135b along the direction in which the laser beam passes. An optical attenuator, an AO modulator, a beam shaper, and a beam expander may be installed in the frame of the processing apparatus of the present invention, respectively.

The first and second laser heads 135a and 135b have a focusing lens for focusing the reflective mirrors provided on the upper side and the laser beams passing through the first and second light guide plates 123a and 123b. It may include.

The first and second laser heads 135a and 135b divide the laser beam into two between the reflection mirror and the focus lens to adjust the spacing of the divided laser beams so that two lines can be simultaneously processed and the platform thereof. May include a device.

Therefore, the laser beams irradiated from the laser generator 110 are dividedly supplied to the first and second laser heads 135a and 135b through the beam splitter 180, and the first and second laser heads are supplied with the laser beams. The patterns 135a and 135b form patterns on the first and second light guide plates 123a and 123b respectively.

As a result, patterns can be simultaneously formed on the first and second LGPs 123a and 123b, thereby reducing processing time for forming patterns on the first and second LGPs 123a and 123b, thereby maximizing work efficiency. Can be.

In addition, in the second embodiment of the present invention, as shown in FIG. 9, two laser beams may be supplied to one light guide plate 123 to simultaneously process a plurality of patterns.

That is, as shown in the drawing, a pattern is formed on the light guide plate 123 through the first and second laser heads 135a and 135b for one light guide plate 123.

Therefore, as two laser beams are supplied to one light guide plate 123 to simultaneously process a plurality of patterns, the overall processing time may be reduced to maximize work efficiency.

In particular, by dividing and supplying the laser beam to the first and second laser heads 135a and 135b through one laser generator 110, there is an advantage that the mechanical configuration of the processing apparatus itself can be relatively reduced.

On the other hand, when the pattern is formed on one light guide plate 123 at the same time, since the first and second guide rails 133a and 133b face each other and move toward the center line CL of the pattern information, the pattern center line CL ), An overlapping section Q in which interference between the first and second guide rails 133a and 133b occurs may be formed.

Such pattern processing of the overlapping section Q can be avoided through the steps described in detail with reference to FIG. 10 below.

FIG. 10 is a flowchart illustrating a cooperative laser pattern processing method of FIG. 9.

As shown, the cooperative laser pattern processing method according to the second embodiment of the present invention is a processing condition setting step (S10 of Fig. 4), the light guide plate supply step (S20 of Fig. 4), the light guide plate mounting portion processing standby position moving step ( S30 of FIG. 4), and after the pattern loading step (S40 of FIG. 4), in the processing step S50, the first and second guide rails and the first and second laser heads are moved to the processing standby position according to the pattern information. (S81).

The controller sets the overlap section of the first and second guide rails using the pattern information (S82).

Thereafter, when the first and second laser heads move, the laser generator supplies the laser beams to the first and second laser heads, and simultaneously performs pattern processing on the light guide plate corresponding to the pattern information (S83).

When the machining step is finished (S84) and not in the overlapping section (S85), the laser beam is in a supply standby state which is not supplied to the first laser head and the second laser head, wherein the first guide rail is -Y pitch, 2 The guide rail moves by + Y pitch (S86).

When the pitch movement is finished (S87), the process returns to the machining step (S83) again, and the pattern processing and the pitch movement are continued until entering the overlap section.

When the first and second guide rails enter the overlapping section, the first guide rail returns to the processing standby position of the first guide rail for pattern processing of the overlapping section (S88).

The second guide rail and the second laser head repeat the pattern processing and the pitch shift in the overlap section to proceed the pattern processing of the overlap section (S89).

After the pattern processing of the overlapping section is completed, the second guide rail returns to the processing standby position of the aforementioned second guide rail (S90).

As described above, in the laser pattern processing apparatus according to the second embodiment of the present invention, the laser beams irradiated from one laser generator 110 are transmitted through the beam splitter 180 to the first and second laser heads 135a, By separately supplying to 135b), patterns can be simultaneously formed on the first and second light guide plates 123a and 123b, thereby reducing the processing time for forming patterns on the first and second light guide plates 123a and 123b, and Efficiency can be maximized.

In addition, as two laser beams are supplied to one light guide plate 123 to simultaneously process a plurality of identical patterns, the overall processing time may be reduced to maximize work efficiency.

In addition, by dividing and supplying the laser beam to the first and second laser heads 135a and 135b through one laser generator 110, there is an advantage that the mechanical configuration of the processing apparatus itself can be relatively reduced.

The invention is not limited to the above embodiments, and various modifications can be made without departing from the spirit of the invention.

100: laser pattern processing apparatus, 101: table, 110: laser generator
123a and 123b: first and second light guide plates
130: beam switch, 133a, 133b: first and second guide rail
135a, 135b: first and second laser heads
163: light guide plate mounting portion
171, 173: rail 180: beam splitter

Claims (18)

In the laser pattern processing apparatus for forming a pattern on a light guide plate,
A first laser generator for generating a laser beam;
A beam switch or beam splitter for supplying the laser beam to the first and second laser heads;
First and second guide rails for moving the first and second laser heads;
Light guide plate mounting portion for moving the first light guide plate
Laser pattern processing apparatus comprising a.
The method of claim 1,
And the first and second laser heads are sequentially supplied with the laser beam through the beam switch.
The method of claim 1,
And the first and second laser heads are simultaneously supplied by dividing the laser beam through the beam splitter.
The method of claim 1,
And a second light guide plate mounted on a light guide plate mounting portion on one side of the first light guide plate, wherein the second guide rail and the second laser head correspond to the second light guide plate.
The method of claim 1,
The first and second laser heads include a reflecting mirror and a focus lens.
The method of claim 1,
An optical attenuator for adjusting the intensity of the laser beam between a selected one of the beamswitch or beamsplitter and each of the first and second laser heads, the laser beam being a flattop beam or truncated Gaussian And a beam shaper for converting the beam into a beam shaper, and a beam expander for expanding the laser beam into a parallel light type.
The method of claim 1,
A laser pattern in which an AO module laser is located between the selected one of the beam switch or the beam splitter and each of the first and second laser heads to turn on / off the laser beam. Processing equipment.
The method of claim 1,
Between the selected one of the beamswitch or beamsplitter and each of the first and second laser heads is a bi-prism and a lifting device which can adjust the processing interval between the laser beams and simultaneously process two rows of patterns Laser pattern processing equipment
The method of claim 1,
Laser pattern processing apparatus is located on one side of the first laser generator is a second laser generator for generating a laser beam.
The method of claim 9,
The first and second laser generators include an optical active device including an optical amplifier, a power meter module for measuring, monitoring, and correcting the intensity of the laser beam, and not only traveling the laser beam in one polarization direction but also being reflected. Laser pattern processing apparatus comprising an optical isolator for blocking the returning laser beam.
A first laser generator for generating a laser beam; A beam switch or beam splitter for supplying the laser beam to the first and second laser heads; First and second guide rails for moving the first and second laser heads; In the laser pattern processing method using a laser pattern processing apparatus comprising a light guide plate mounting portion for moving the first light guide plate,
Supplying the first LGP for forming a pattern to the LGP mounting portion;
Placing the first light guide plate at a processing standby position by the light guide plate mounting unit controlled by the control unit;
Inputting pattern information into the controller;
The first light guide plate is processed by the laser beam;
Returning the finished light guide plate to a supply position
Laser pattern processing method comprising a.
The method of claim 11,
Further comprising a second light guide plate on one side of the first light guide plate, the step of supplying the first light guide plate for forming a pattern to the light guide plate mounting portion, further comprising the step of supplying the second light guide plate to the light guide plate mounting portion Laser pattern processing method.
12. The method of claim 11,
The step of processing the first light guide plate by the laser beam,
According to the pattern information, any one of the first and second guide rails and the first and second laser heads are disposed at a processing standby position of a center line of the pattern information or one upper end portion or a lower end portion of the first light guide plate; ;
When the first laser head is in a constant velocity state after acceleration, the laser beam is supplied to the first laser head through the beam switch so that one side of the first light guide plate is processed and the second laser head is accelerated. Wow;
When the second laser head is in a constant velocity state after acceleration, supplying the laser beam to the second laser head through the beam switch to process the other side of the first light guide plate;
Decelerating and stopping the first laser head;
When the first laser head is in a decelerated or stopped state, the first guide rail moves by a pitch to a next machining position to cause the first laser head to wait at a next machining position;
Simultaneously processing the second light guide plate and accelerating the first laser head;
When the first laser head is in a constant velocity state after acceleration, supplying the laser beam to the first laser head through the beam switch to process a portion shifted by a pitch from one side portion of the first light guide plate;
Decelerating and stopping the second laser head;
When the second laser head is in a decelerated or stopped state, moving the second guide rail by a pitch to the next machining position and waiting the second laser head at the next machining position;
Laser pattern processing method comprising a.
The method of claim 11,
The step of processing the first light guide plate by the laser beam,
Moving the first guide rail and the first laser head to a processing standby position of the first light guide plate;
Moving the second guide rail and the second laser head to a machining standby position of the second light guide plate when the first laser head is in an accelerated state;
When the first laser head is in a constant velocity state, the laser beam is supplied to the first laser head through the beam switch to process the first light guide plate and simultaneously accelerate the second laser head;
When the first laser head is decelerated or stopped, and the first laser head is in a constant velocity state after acceleration, the laser beam is supplied to the second laser head through the beam switch to process the second light guide plate. Wow;
Decelerating and stopping the first laser head;
When the first laser head is in a decelerated or stopped state, the first guide rail moves by a pitch to a next machining position to cause the first laser head to wait at a next machining position;
Simultaneously processing the second light guide plate and accelerating the first laser head;
When the first laser head is in a constant velocity state after acceleration, the laser beam is supplied to the first laser head through the beam switch to process a portion moved by a pitch from one side portion of the first light guide plate;
Decelerating and stopping the second laser head;
When the second laser head is in a decelerated or stopped state, moving the second guide rail by a pitch to the next machining position and waiting the second laser head at the next machining position;
Laser pattern processing method comprising a.
The method of claim 11,
The step of processing the first light guide plate by the laser beam,
Moving the first and second guide rails and the first and second laser heads to a processing standby position of the first and second light guide plates;
Splitting and supplying the laser beam to the first and second laser heads through the beam splitter to process the first and second light guide plates;
Moving the first and second guide rails to the next machining position, causing the first and second laser heads to wait at the next machining position;
Laser pattern processing method comprising a.
The method of claim 11,
The step of processing the first light guide plate by the laser beam,
Moving the first and second guide rails and the first and second laser heads to a processing standby position of the first light guide plate;
Setting overlapping sections of the first and second guide rails;
Dividing the laser beam by the beam splitter and supplying the first and second laser heads to process the first light guide plate;
Moving the first and second guide rails toward the overlapping section;
Repeating movement of the first and second guide rails and processing of the first light guide plate before entering the overlapping section;
Laser pattern processing method comprising a.
17. The method of claim 16,
Returning the first guide rail to the processing standby position when the first and second guide rails enter the overlap section;
Repeating the movement of the second guide rail and the processing of the first light guide plate in the overlapping section, and processing the overlapping section;
After the machining of the overlap section is completed, returning the second guide rail to the machining standby position.
Laser pattern processing method comprising a.
The method according to any one of claims 13 to 17,
And moving the light guide plate mounting portion by a pitch corresponding to a next processing position when the first and second laser heads are in a decelerated or stopped state.

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