JP6373193B2 - 製造機構及び製造方法 - Google Patents
製造機構及び製造方法 Download PDFInfo
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- JP6373193B2 JP6373193B2 JP2014556502A JP2014556502A JP6373193B2 JP 6373193 B2 JP6373193 B2 JP 6373193B2 JP 2014556502 A JP2014556502 A JP 2014556502A JP 2014556502 A JP2014556502 A JP 2014556502A JP 6373193 B2 JP6373193 B2 JP 6373193B2
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- 238000004519 manufacturing process Methods 0.000 title claims description 79
- 238000000151 deposition Methods 0.000 claims description 74
- 239000011888 foil Substances 0.000 claims description 72
- 230000008021 deposition Effects 0.000 claims description 69
- 238000007740 vapor deposition Methods 0.000 claims description 41
- 238000000034 method Methods 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
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- 238000004804 winding Methods 0.000 claims description 5
- 238000005137 deposition process Methods 0.000 claims description 4
- 230000008859 change Effects 0.000 claims description 3
- 238000011417 postcuring Methods 0.000 claims description 3
- 238000007639 printing Methods 0.000 claims description 3
- 238000002679 ablation Methods 0.000 claims description 2
- 238000000137 annealing Methods 0.000 claims description 2
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- 238000005245 sintering Methods 0.000 claims description 2
- 238000007689 inspection Methods 0.000 claims 1
- 239000010410 layer Substances 0.000 description 19
- 239000012528 membrane Substances 0.000 description 5
- 238000004544 sputter deposition Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
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- 239000003814 drug Substances 0.000 description 1
- 229940079593 drug Drugs 0.000 description 1
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- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0221—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work characterised by the means for moving or conveying the objects or other work, e.g. conveyor belts
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67173—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers in-line arrangement
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05B—SPRAYING APPARATUS; ATOMISING APPARATUS; NOZZLES
- B05B13/00—Machines or plants for applying liquids or other fluent materials to surfaces of objects or other work by spraying, not covered by groups B05B1/00 - B05B11/00
- B05B13/02—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work
- B05B13/0207—Means for supporting work; Arrangement or mounting of spray heads; Adaptation or arrangement of means for feeding work the work being an elongated body, e.g. wire or pipe
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/14—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation involving heating or cooling
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D1/00—Processes for applying liquids or other fluent materials
- B05D1/36—Successively applying liquids or other fluent materials, e.g. without intermediate treatment
- B05D1/38—Successively applying liquids or other fluent materials, e.g. without intermediate treatment with intermediate treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/02—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by baking
- B05D3/0254—After-treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/6719—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the processing chambers, e.g. modular processing chambers
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Physical Vapour Deposition (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Paper (AREA)
Description
−蒸着ゾーンにおいて、第1の蒸着工程によって箔上に第1の層を蒸着しS1、
−前記第1の層を有する箔を、前記蒸着ゾーンから離れる第1の方向の第1の通路に沿って蒸着ゾーンの外側に案内しS2、前記蒸着ゾーンに向かう第2の通路に沿って後戻りさせて、一方で第1の及び/又は第2の通路に沿って前記第1の層を処理しS3、
−前記蒸着ゾーンに戻った後、第2の蒸着工程によって箔上に第2の層を蒸着するS4
工程を含む。
Claims (14)
- 箔(FO)上に製品を製造するための製造機構であって、
前記製造機構が、蒸着ゾーン(10)を含み、前記蒸着ゾーン内で少なくとも第1の蒸着機構(21)及び第2の蒸着機構(22)が、箔上に材料の層を蒸着するために、各蒸着工程が続く経路により定義されるy方向に配置され、
前記製造機構が、蒸着された層を処理するための少なくとも1つの処理機構(31)をさらに含み、箔が、前記処理機構を介して、少なくとも前記第1の蒸着機構及び前記第2の蒸着機構に沿って案内され、前記処理機構が、前記蒸着ゾーンの外に配置され、前記蒸着ゾーンから離れて回動機構(41)に向かう、−x方向、とも示される第1の方向に第1の通路(31a)と、前記回動機構から前記蒸着ゾーンに向かう、+x方向、に従って戻る第2の通路(31b)とを有する処理経路を含み、
前記製造機構が、前記蒸着ゾーン内部の箔を方向転換するためのリダイレクション機構をさらに含み、前記蒸着ゾーン(10)が、出口(11a)及び入口(11b)を有するクリーンルームであり、前記第1の通路(31a)が、前記出口(11a)から離れる前記第1の方向に導かれ、前記第2の通路が前記入口(11b)に向かって戻る、
製造機構であって、
前記少なくとも1つの処理機構(31)の前記処理経路が、ハウジング(35)によって囲まれて、処理室(60)内に配置され、前記処理室が、前記クリーンルーム(10)のものよりも少なくとも10倍高いクリーンルームクラスを有し、前記リダイレクション機構が、少なくとも第1のリダイレクション機構(51)及び第2のリダイレクション機構(52)を含み、前記第1のリダイレクション機構(51)が、リダイレクションバー(511)及びペアの回動ロール(512a、b)を含み、前記リダイレクションバー(511)が、箔をy方向から+x方向に方向転換し、前記ペアの回動ロール(512a、b)が、次に箔を−x方向に方向転換し、前記第2のリダイレクション機構(52)が、更なるリダイレクションバー(511)及び更なるペアの回動ロール(512a、b)を含み、前記更なるペアの回動ロールが、箔を+x方向から−x方向に方向転換し、前記更なるリダイレクションバー(511)が、次に箔を−x方向からy方向に方向転換する、
ことを特徴とする、製造機構。 - 前記第1のリダイレクション機構及び前記第2のリダイレクション機構が、少なくとも前記第2の蒸着機構(22)の入力部に向かって箔を方向転換する、請求項1記載の製造機構。
- 前記蒸着ゾーンが、少なくとも前記第1の蒸着機構及び前記第2の蒸着機構(21、22)が配置された第1のサブゾーン(10a)と、少なくとも前記第1のリダイレクション機構、及び前記第2のリダイレクション機構が配置され、第2のサブゾーンが前記第1のサブゾーンから分断された第2のサブゾーン(10b)とを含む、請求項1記載の製造機構。
- 並んで配置された少なくとも3つの蒸着機構(21、22、23、24)を含む、請求項1記載の製造機構。
- 前記処理機構(31)の前記第1の通路及び前記第2の通路(31a、31b)が、箔(FO)の幅の最大で20倍、好ましくは最大で10倍の距離(D)で、互いに対して平行に配置される、請求項1記載の製造機構。
- 前記回動機構(41)が、各々が前記第1の方向(−x)に対して斜めである方向を有する、箔用の第1及び第2のガイダンスバー(411、412)を含み、前記第1及び第2のガイダンスバーが、互いに対して横に配置される、請求項1記載の製造機構。
- 前記回動機構(41)及び前記処理機構(31)が、前記ハウジング(35)を共有する、請求項1記載の製造機構。
- 前記回動機構(41)に、及び/又は前記リダイレクション機構(52)に組み込まれたアライメント機構(413;523)を含む、請求項1記載の製造機構。
- 前記第1の蒸着機構及び/又は前記第2の蒸着機構(21、22)が、印刷機構及びコーティング機構から選択される、請求項1記載の製造機構。
- 前記少なくとも1つの処理機構(31)が、乾燥機構、焼結機構、アニーリング機構、硬化機構及び溶融機構、アブレーション機構から選択される、請求項1記載の製造機構。
- 前記第1の蒸着機構及び前記第2の蒸着機構(21、22)の1つ又はそれ以上が、箔(FO)上に層を蒸着するための蒸着ユニット(213)に加えて、アンワインドユニット(211)、第1の洗浄及び/又はアライメントユニット(212)、第1のアライメントユニット(212)、後硬化(214)、検査ユニット、第2の洗浄及び/又はアライメントユニット(215)並びに巻きユニット(216)の1つ又はそれ以上を含む、請求項1記載の製造機構。
- 前記処理経路が前記処理室(60)内に配置され、前記クリーンルーム(10)の面積が、前記クリーンルーム(10)及び前記処理室(60)によって占有される総面積の最大で1/3である、請求項1記載の製造機構。
- 前記回動機構が、空気浮上式軸受を含む、請求項1記載の製造機構。
- 箔上に製品を製造するための方法であって、
クリーンルームである蒸着ゾーンにおいて、第1の蒸着工程によって箔上に第1の層を蒸着する(S1)工程と、
−前記蒸着ゾーンから離れる第1の方向、−x方向と定義される、の第1の通路と前記蒸着ゾーンに向かって戻る、+x方向と定義される、第2の通路を含む少なくとも1つの処理機構(31)の処理経路に沿って、前記第1の層を有する前記箔を前記蒸着ゾーンの外に案内し(S2)、同時に前記第1の通路及び/又は前記第2の通路に沿って前記第1の層を処理する(S3)工程と、
−前記蒸着ゾーンに戻った後、第2の蒸着工程によって、前記箔上に第2の層を蒸着し、その経路が前記第1の蒸着工程及び前記第2の蒸着工程がy方向を定義することにより定義される(S4)工程と、
を有し、
前記処理経路が、ハウジング(35)によって囲まれて、処理室(60)内に配置され、前記処理室が、前記クリーンルーム(10)のものよりも少なくとも10倍高いクリーンルームクラスを有し、さらに、前記第1の蒸着工程の後に、続いて、前記箔をy方向から+x方向、及び、+x方向から−x方向に方向転換し、前記箔を前記処理した後に、次に前記箔を+x方向から−x方向に、及び、−x方向からy方向に方向転換する、
ことを特徴とする方法。
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP12154222.9A EP2626144A1 (en) | 2012-02-07 | 2012-02-07 | Roll to roll manufacturing system having a clean room deposition zone and a separate processing zone |
EP12154222.9 | 2012-02-07 | ||
PCT/NL2013/050063 WO2013119110A1 (en) | 2012-02-07 | 2013-02-06 | Manufacturing facility and method of manufacturing |
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JP2017252985A Division JP2018076599A (ja) | 2012-02-07 | 2017-12-28 | 製造機構及び製造方法 |
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JP2015516500A JP2015516500A (ja) | 2015-06-11 |
JP2015516500A5 JP2015516500A5 (ja) | 2016-03-03 |
JP6373193B2 true JP6373193B2 (ja) | 2018-08-15 |
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JP2017252985A Pending JP2018076599A (ja) | 2012-02-07 | 2017-12-28 | 製造機構及び製造方法 |
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Country Status (6)
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---|---|
US (1) | US9610602B2 (ja) |
EP (2) | EP2626144A1 (ja) |
JP (2) | JP6373193B2 (ja) |
KR (1) | KR102152354B1 (ja) |
CN (1) | CN104203433B (ja) |
WO (1) | WO2013119110A1 (ja) |
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JPS57107267A (en) * | 1980-12-25 | 1982-07-03 | Daido Steel Co Ltd | Continuous drying and baking device |
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JP5335319B2 (ja) * | 2008-08-25 | 2013-11-06 | 富士フイルム株式会社 | 塗布装置及び塗布方法 |
JP5241383B2 (ja) * | 2008-08-27 | 2013-07-17 | 株式会社神戸製鋼所 | 連続成膜装置 |
JP4853526B2 (ja) * | 2009-02-09 | 2012-01-11 | トヨタ自動車株式会社 | 電極製造装置及び電極の製造方法 |
JP2010188229A (ja) * | 2009-02-16 | 2010-09-02 | Fujifilm Corp | 塗布装置及び塗布方法 |
EP2292339A1 (en) | 2009-09-07 | 2011-03-09 | Nederlandse Organisatie voor toegepast -natuurwetenschappelijk onderzoek TNO | Coating method and coating apparatus |
-
2012
- 2012-02-07 EP EP12154222.9A patent/EP2626144A1/en not_active Withdrawn
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2013
- 2013-02-06 US US14/376,955 patent/US9610602B2/en active Active
- 2013-02-06 WO PCT/NL2013/050063 patent/WO2013119110A1/en active Application Filing
- 2013-02-06 EP EP13704833.6A patent/EP2812129B1/en active Active
- 2013-02-06 KR KR1020147023121A patent/KR102152354B1/ko active IP Right Grant
- 2013-02-06 CN CN201380014696.7A patent/CN104203433B/zh active Active
- 2013-02-06 JP JP2014556502A patent/JP6373193B2/ja active Active
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Also Published As
Publication number | Publication date |
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EP2812129A1 (en) | 2014-12-17 |
JP2015516500A (ja) | 2015-06-11 |
EP2812129B1 (en) | 2016-04-13 |
KR20140133525A (ko) | 2014-11-19 |
EP2626144A1 (en) | 2013-08-14 |
CN104203433A (zh) | 2014-12-10 |
WO2013119110A1 (en) | 2013-08-15 |
US20150037506A1 (en) | 2015-02-05 |
KR102152354B1 (ko) | 2020-09-07 |
US9610602B2 (en) | 2017-04-04 |
CN104203433B (zh) | 2016-06-29 |
JP2018076599A (ja) | 2018-05-17 |
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