JP6345376B1 - 複合樹脂組成物、及び当該複合樹脂組成物から成形された電子部品 - Google Patents

複合樹脂組成物、及び当該複合樹脂組成物から成形された電子部品 Download PDF

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JP6345376B1
JP6345376B1 JP2018508238A JP2018508238A JP6345376B1 JP 6345376 B1 JP6345376 B1 JP 6345376B1 JP 2018508238 A JP2018508238 A JP 2018508238A JP 2018508238 A JP2018508238 A JP 2018508238A JP 6345376 B1 JP6345376 B1 JP 6345376B1
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resin composition
composite resin
structural unit
mol
respect
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JPWO2018066416A1 (ja
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博樹 深津
博樹 深津
智弘 瀧
智弘 瀧
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Polyplastics Co Ltd
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Polyplastics Co Ltd
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L67/00—Compositions of polyesters obtained by reactions forming a carboxylic ester link in the main chain; Compositions of derivatives of such polymers
    • C08L67/02—Polyesters derived from dicarboxylic acids and dihydroxy compounds
    • C08L67/025—Polyesters derived from dicarboxylic acids and dihydroxy compounds containing polyether sequences
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/66—Polyesters containing oxygen in the form of ether groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G63/00—Macromolecular compounds obtained by reactions forming a carboxylic ester link in the main chain of the macromolecule
    • C08G63/68—Polyesters containing atoms other than carbon, hydrogen and oxygen
    • C08G63/685—Polyesters containing atoms other than carbon, hydrogen and oxygen containing nitrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G69/00—Macromolecular compounds obtained by reactions forming a carboxylic amide link in the main chain of the macromolecule
    • C08G69/44—Polyester-amides
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/34—Silicon-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L77/00—Compositions of polyamides obtained by reactions forming a carboxylic amide link in the main chain; Compositions of derivatives of such polymers
    • C08L77/12—Polyester-amides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Polyamides (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
JP2018508238A 2016-10-07 2017-09-26 複合樹脂組成物、及び当該複合樹脂組成物から成形された電子部品 Active JP6345376B1 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2016199061 2016-10-07
JP2016199061 2016-10-07
PCT/JP2017/034794 WO2018066416A1 (ja) 2016-10-07 2017-09-26 複合樹脂組成物、及び当該複合樹脂組成物から成形された電子部品

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JP6345376B1 true JP6345376B1 (ja) 2018-06-20
JPWO2018066416A1 JPWO2018066416A1 (ja) 2018-10-04

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JP2018508238A Active JP6345376B1 (ja) 2016-10-07 2017-09-26 複合樹脂組成物、及び当該複合樹脂組成物から成形された電子部品

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JP (1) JP6345376B1 (ko)
KR (1) KR102058121B1 (ko)
CN (1) CN109790379B (ko)
TW (1) TWI711644B (ko)
WO (1) WO2018066416A1 (ko)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6898163B2 (ja) * 2017-07-04 2021-07-07 住友化学株式会社 液晶ポリエステル樹脂組成物および成形体
KR102627886B1 (ko) 2017-12-05 2024-01-19 티코나 엘엘씨 카메라 모듈에 사용하기 위한 방향족 중합체 조성물
JP7461959B2 (ja) 2019-03-20 2024-04-04 ティコナ・エルエルシー カメラモジュールのためのアクチュエータアセンブリ
KR20210148198A (ko) 2019-03-20 2021-12-07 티코나 엘엘씨 카메라 모듈에서 사용하기 위한 중합체 조성물
KR20220095185A (ko) * 2019-10-31 2022-07-06 스미또모 가가꾸 가부시끼가이샤 액정 폴리에스테르 분말, 및 액정 폴리에스테르 용액 조성물의 제조 방법
MY197276A (en) * 2020-05-13 2023-06-09 Polyplastics Co Liquid-crystalline resin composition for surface-mounted relays and surface-mounted relay using same
US20230407019A1 (en) * 2020-11-19 2023-12-21 Toyobo Mc Corporation Inorganic material-reinforced thermoplastic polyester resin composition and method for producing same
JP2024506294A (ja) 2021-02-04 2024-02-13 ティコナ・エルエルシー 電気回路保護デバイスのためのポリマー組成物
WO2022168706A1 (ja) * 2021-02-05 2022-08-11 ポリプラスチックス株式会社 ファンインペラ用液晶性樹脂組成物及びそれを用いたファンインペラ

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998056578A1 (fr) * 1997-06-13 1998-12-17 Nippon Petrochemicals Company, Limited Composite lie et composition adhesive pour ledit composite
WO2012137636A1 (ja) * 2011-04-01 2012-10-11 ポリプラスチックス株式会社 全芳香族ポリエステル及びポリエステル樹脂組成物
WO2014050371A1 (ja) * 2012-09-26 2014-04-03 ポリプラスチックス株式会社 電子部品用複合樹脂組成物、及び当該複合樹脂組成物から成形された電子部品
JP2014533325A (ja) * 2011-11-15 2014-12-11 ティコナ・エルエルシー 低ナフテン系液晶ポリマー組成物
WO2016088714A1 (ja) * 2014-12-05 2016-06-09 ポリプラスチックス株式会社 複合樹脂組成物及び平面状コネクター
JP2016124947A (ja) * 2014-12-26 2016-07-11 ポリプラスチックス株式会社 成形品の製造方法及び複合樹脂組成物

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI472574B (zh) 2006-08-24 2015-02-11 Polyplastics Co 非對稱電子零件
JP5325442B2 (ja) * 2008-03-28 2013-10-23 Ｊｘ日鉱日石エネルギー株式会社 カメラモジュール用液晶ポリエステル樹脂組成物
KR101987280B1 (ko) * 2012-12-20 2019-06-10 삼성전기주식회사 인쇄회로기판용 수지 조성물, 절연필름, 프리프레그 및 인쇄회로기판
WO2017068869A1 (ja) * 2015-10-21 2017-04-27 ポリプラスチックス株式会社 全芳香族ポリエステルアミド及びその製造方法

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998056578A1 (fr) * 1997-06-13 1998-12-17 Nippon Petrochemicals Company, Limited Composite lie et composition adhesive pour ledit composite
WO2012137636A1 (ja) * 2011-04-01 2012-10-11 ポリプラスチックス株式会社 全芳香族ポリエステル及びポリエステル樹脂組成物
JP2014533325A (ja) * 2011-11-15 2014-12-11 ティコナ・エルエルシー 低ナフテン系液晶ポリマー組成物
WO2014050371A1 (ja) * 2012-09-26 2014-04-03 ポリプラスチックス株式会社 電子部品用複合樹脂組成物、及び当該複合樹脂組成物から成形された電子部品
WO2016088714A1 (ja) * 2014-12-05 2016-06-09 ポリプラスチックス株式会社 複合樹脂組成物及び平面状コネクター
JP2016124947A (ja) * 2014-12-26 2016-07-11 ポリプラスチックス株式会社 成形品の製造方法及び複合樹脂組成物

Also Published As

Publication number Publication date
CN109790379A (zh) 2019-05-21
TWI711644B (zh) 2020-12-01
KR102058121B1 (ko) 2019-12-20
TW201827483A (zh) 2018-08-01
WO2018066416A1 (ja) 2018-04-12
JPWO2018066416A1 (ja) 2018-10-04
KR20190026037A (ko) 2019-03-12
CN109790379B (zh) 2020-04-07

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