JP6341662B2 - Piezoelectric oscillator and method for manufacturing the same - Google Patents

Description

  The present invention relates to a piezoelectric oscillator substrate, a piezoelectric oscillator, and a method for manufacturing a piezoelectric oscillator.

  A piezoelectric oscillator having a substrate, a vibration element mounted on one main surface of the substrate, and an integrated circuit element mounted on the one main surface is known (for example, Patent Document 1). Further, as a method for manufacturing a piezoelectric oscillator, a step of measuring electrical characteristics of a vibration element via an external terminal provided on the substrate after the vibration element is mounted on the substrate and before the integrated circuit element is mounted on the substrate. (For example, patent document 1) is known.

  Patent Document 1 discloses a technique for forming a cutting pattern on a substrate in order to reduce the size of a piezoelectric oscillator manufactured by the above manufacturing method. The cutting pattern connects the external terminal connected to the pad on which the integrated circuit element is mounted and the pad on which the vibration element is mounted, and measures the electrical characteristics of the vibration element via the external terminal. Make it possible. In addition, by cutting the cutting pattern, the external terminal can be used as a normal external terminal connected only to a pad on which the integrated circuit element is mounted.

JP 2011-199577 A

  Piezoelectric oscillators are required to be further downsized or thinned at low cost, and a piezoelectric oscillator substrate, a piezoelectric oscillator, and a method for manufacturing the piezoelectric oscillator that can meet such requirements are provided. Is desirable.

  A piezoelectric oscillator substrate according to the present invention is a substrate on which a vibration element and an integrated circuit element including an oscillation circuit are mounted side by side on the same main surface, and has a first main surface and a second main surface on the back surface thereof. An insulating substrate; a predetermined number of external terminals of 2 or more provided on the second main surface; a pair of vibration element pads provided on the first main surface on which the vibration element is mounted; The predetermined number of first integrated circuit element pads and a pair of second integrated circuit element pads provided on the first main surface and connected to the integrated circuit elements, and the predetermined number of external terminals The predetermined number of front and back connection conductors extending in the thickness direction of the insulating substrate and exposed to the first main surface, and the predetermined number of first integrations from the predetermined number of front and back connection conductors on the first main surface The same number of first wirings extending to the circuit element pads; and A pair of second wirings extending from the pair of second integrated circuit element pads to the pair of vibration element pads on one main surface; and the first wirings from the front and back connection conductors on the first main surface. From any position from the first integrated circuit element pad to the first integrated circuit element pad through the second wiring to the vibrating element pad. A pair of cutting patterns that electrically connect the two external terminals of the predetermined number of external terminals and the pair of vibration element pads, from a single-layer substrate Become.

  The piezoelectric oscillator according to the present invention includes the above-described piezoelectric oscillator substrate, the vibration elements mounted on the pair of vibration element pads, the predetermined number of first integrated circuit element pads, and the pair of second elements. The integrated circuit element connected to the integrated circuit element pad, and the pair of cutting patterns are cut.

  Preferably, the pair of vibration element pads are arranged in a direction crossing an arrangement direction of the vibration element and the integrated circuit element, and the pair of second integrated circuit element pads are the arrangement line. They are arranged in a direction that intersects the direction.

  Preferably, the pair of second wirings have the same width and length.

  Preferably, the pair of second integrated circuit element pads are provided at positions symmetrical with respect to each other with respect to the symmetry axis extending in the arrangement direction, and the pair of vibration element pads are lined with each other with respect to the symmetry axis. Provided at symmetrical positions, the pair of second wirings have a line-symmetric shape with respect to the symmetry axis.

  Preferably, the predetermined number is an even number, the predetermined number of external terminals are provided at positions symmetrical with respect to the symmetry axis, and the predetermined number of front and back connection conductors are line symmetrical with respect to the symmetry axis. The predetermined number of first integrated circuit element pads are provided at positions that are line-symmetric with respect to the symmetry axis, and the predetermined number of first wirings are line-symmetric with respect to the symmetry axis. is there.

  Preferably, in the arrangement direction, the pair of second integrated circuit element pads are positioned on the side of the pair of vibration element pads with respect to the predetermined number of first integrated circuit element pads, and the arrangement is performed. The predetermined number of first integrated circuit element pads are located outside the pair of second integrated circuit element pads in a direction crossing the direction.

  The piezoelectric oscillator manufacturing method of the present invention includes a mounting step of mounting the vibration element on the pair of vibration element pads of the piezoelectric oscillator substrate, and the pair of vibration elements by the pair of cutting patterns. A measuring step of measuring the electrical characteristics of the vibration element via the two external terminals connected to the pad, and a cutting step of cutting the pair of cutting patterns after the measuring step.

  According to said structure or procedure, size reduction or thickness reduction is realizable at low cost.

The perspective view which shows the structure of the piezoelectric oscillator which concerns on embodiment of this invention. The disassembled perspective view of the piezoelectric oscillator of FIG. Sectional drawing of the piezoelectric oscillator in the III-III line | wire of FIG. 4A is a view showing the upper surface of the substrate of the piezoelectric oscillator of FIG. 1, and FIG. 4B is a view showing the lower surface of the substrate of FIG. 4A. The flowchart which shows the procedure of the manufacturing method of the piezoelectric oscillator of FIG.

  Hereinafter, an oscillator according to an embodiment of the present invention will be described with reference to the drawings. Note that the drawings used in the following description are schematic, and the dimensional ratios and the like on the drawings do not necessarily match the actual ones.

  Moreover, the same code | symbol may be attached | subjected about the same or similar structure. In this case, the same or similar configurations may be distinguished from each other by adding capital letters to the reference numerals such as “external terminal 3” as “external terminal 3A” and “external terminal 3B”.

  FIG. 1 is a perspective view showing a configuration of an oscillator 1 according to an embodiment of the present invention. In FIG. 1, a part of the configuration on the upper side of the oscillator 1 is indicated by a dotted line, and the inside of the oscillator 1 is indicated by a solid line.

  Note that the oscillator 1 may have either direction upward or downward, but in the following embodiments, for convenience, the orthogonal coordinate system xyz is defined and the positive side in the z direction is defined as the upward direction. , Upper surface, lower surface, etc. may be used.

  For example, the oscillator 1 is generally formed in a thin, rectangular parallelepiped shape as a whole. A plurality (four in this embodiment) of external terminals 3 are exposed on the lower surface (see also FIG. 4B). The oscillator 1 is mounted on a circuit board, for example, with a lower surface facing a circuit board (not shown) and pads provided on the circuit board and four external terminals 3 are fixed by soldering or the like.

  Three of the four external terminals 3 are generated by, for example, a GND terminal to which a reference potential is applied, a Vcc terminal to which a drive potential is applied (a terminal to which DC power is supplied by a potential difference from the reference potential), and an oscillator 1 An output terminal for outputting an oscillation signal to be output. The remaining one is, for example, an E / D terminal to which a signal for controlling the output and stop of the oscillation signal from the oscillator 1 is input, or a Vcon terminal to which a frequency adjustment signal for controlling the frequency of the oscillation signal is input. It is.

  As described above, all the external terminals 3 are used for inputting or outputting signals (potentials) necessary for the operation of the oscillator 1 as a product. That is, the oscillator 1 does not have an external terminal that is used only in the manufacturing process. The specific arrangement and shape of the external terminal 3 will be described later.

  2 is an exploded perspective view of the oscillator 1 (however, some members are omitted), and FIG. 3 is a cross-sectional view of the oscillator 1 taken along line III-III in FIG.

  As shown in FIGS. 1 to 3, the oscillator 1 includes, for example, a substrate 5, a vibration element 7 (FIGS. 2 and 3) mounted on the substrate 5, an integrated circuit element 9 mounted on the substrate 5, A cap 11 covering the vibration element 7 and a sealing resin 12 (shown by dotted lines in FIGS. 1 and 3) for sealing the integrated circuit element 9 and the like are provided.

  The external terminal 3 described above is provided on the substrate 5 and connected to the integrated circuit element 9. The integrated circuit element 9 is connected to the vibration element 7 via the substrate 5, and generates an oscillation signal by applying a voltage to the vibration element 7. The cap 11 and the sealing resin 12 seal the vibration element 7 and the integrated circuit element 9. Specific configurations of these members are as follows.

  The substrate 5 is configured by a so-called single layer substrate. Here, the single-layer substrate has a conductive layer parallel to these principal surfaces only on one principal surface or both principal surfaces of the insulation substrate, and the insulation substrate has a conductive layer parallel to the principal surface. The one that does not have a layer. The single-layer substrate may have a conductor (which may be a conductive layer) extending in the thickness direction of the insulating substrate on the side surface or inside of the insulating substrate in order to connect the conductive layers on both main surfaces to each other. For this reason, since it is not necessary to provide a conductive layer parallel to the main surface inside the substrate 5, the thickness of the conductive layer can be reduced.

  In the present embodiment, the substrate 5 includes an insulating substrate 13, a first conductive layer 15A provided on one main surface (first main surface 13a) of the insulating substrate 13, and the other main surface (first surface) of the insulating substrate 13. A plurality of (four in this embodiment) front and back connecting conductors 17 (four in the present embodiment) that connect the second conductive layer 15B (FIG. 1) provided on the second main surface 13b) to the first conductive layer 15A and the second conductive layer 15B. 1 and 2).

  The insulating substrate 13 does not have flexibility, for example. That is, the substrate 5 is a so-called rigid circuit substrate. The material of the insulating substrate 13 is mainly ceramic or resin, for example. The planar shape of the insulating substrate 13 may be set as appropriate, but is, for example, generally rectangular.

  As shown particularly in FIG. 2, the first conductive layer 15A includes a plurality of (four in the present embodiment) to which the pair of vibration element pads 19 on which the vibration element 7 is mounted and the integrated circuit element 9 are connected. A first integrated circuit element pad 21, a pair of second integrated circuit element pads 23, and a plurality of wirings connecting the pads and the front and back connection conductors 17. Specific positions and shapes of these pads and wiring will be described later.

  The second conductive layer 15B includes the plurality of external terminals 3B described above.

  The plurality of front and back connection conductors 17 are constituted by, for example, a conductive layer formed on the inner surface of a groove (castellation) extending in the thickness direction of the substrate 5 formed on the side surface (which may include corners) of the substrate 5. Yes.

  The first conductive layer 15A, the second conductive layer 15B, and the front / back connection conductor 17 are made of, for example, a metal such as Cu or Al. These may be formed of materials and thicknesses different from each other. Further, the material and thickness may be different between the pad and the wiring in the first conductive layer 15A. For example, the wiring may be formed of a Cu layer, and the pad may be configured by performing nickel plating and gold plating on the Cu layer.

  The configuration of the vibration element 7 may be a known configuration. For example, as shown in FIGS. 2 and 3, the vibration element 7 includes a piezoelectric body 25 formed in a flat plate shape, a pair of excitation electrodes 27 provided on both main surfaces of the piezoelectric body 25, and a pair of excitation electrodes 27. And a pair of extraction electrodes 29 connected to the excitation electrode 27.

  The piezoelectric body 25 is made of, for example, quartz, and its planar shape is rectangular. The pair of excitation electrodes 27 are layered electrodes that cover a relatively wide range of the main surface of the piezoelectric body 25, and the planar shape thereof is rectangular. For example, the pair of extraction electrodes 29 are provided side by side in the lateral direction at one end in the longitudinal direction of the piezoelectric body 25.

  For example, the vibration element 7 is mounted on the substrate 5 by fixing the pair of extraction electrodes 29 and the pair of vibration element pads 19 by the conductive adhesive 31 (FIG. 3). The vibration element 7 is disposed, for example, with the end on the side where the pair of extraction electrodes 29 are provided facing the integrated circuit element 9 side. In other words, the piezoelectric body 25 is arranged with the longitudinal direction of the vibration element 7 and the integrated circuit element 9 being aligned (x direction).

  The integrated circuit element 9 operates by being supplied with DC power from the GND terminal and the Vcc terminal (external terminal 3). Further, the integrated circuit element 9 outputs an oscillation signal having a predetermined frequency generated by applying a voltage to the vibration element 7 from the Output terminal (external terminal 3). Further, the integrated circuit element 9 allows or prohibits the output of the oscillation signal from the Output terminal based on the signal from the E / D terminal (external terminal 3), or uses the signal from the Vcon terminal (external terminal 3) as a signal. Based on this, the frequency of the oscillation signal is adjusted.

  The configuration of the integrated circuit element 9 may be a known configuration including the configuration of the oscillation circuit. The integrated circuit element 9 may be a so-called bare chip or a packaged one.

  For example, the integrated circuit element 9 is formed in a substantially rectangular parallelepiped shape and has a plurality of connection pads 33 (FIGS. 1 and 2) on the upper surface thereof. The plurality of connection pads 33 are connected to the plurality of integrated circuit element pads (21 and 23) by a plurality of bonding wires 35 (FIG. 1). The integrated circuit element 9 is fixed to the first main surface 13a of the substrate 5 with an appropriate adhesive or the like.

  The cap 11 is formed, for example, in a substantially box shape, and is placed on the first main surface 13 a of the substrate 5 so as to cover the vibration element 7. The cap 11 and the first main surface 13a are fixed by, for example, an adhesive 14 (FIG. 3) over the entire circumference of the lower end of the cap 11. Thereby, the vibration element 7 is sealed. The cap 11 is made of, for example, a metal, and thereby the thickness is reduced while ensuring the strength.

  The sealing resin 12 covers, for example, the first main surface 13a, the cap 11, and the integrated circuit element 9. The shape of the outer surface of the sealing resin 12 may be set as appropriate. For example, it is a thin rectangular parallelepiped shape having an area equivalent to that of the substrate 5. The sealing resin 12 may include a filler made of an inorganic material.

  4A is a diagram showing the first main surface 13a of the substrate 5, and FIG. 4B is a diagram showing the second main surface 13b of the substrate 5. As shown in FIG. 4B is a view seen from above (a view showing the second main surface 13b through the oscillator 1), similarly to FIG. 4A.

  As described above, the plurality of external terminals 3 are connected to the integrated circuit element 9. Between the plurality of external terminals 3 and the integrated circuit element 9, a plurality of front and back connection conductors 17, a plurality of first wirings 37, and a plurality of first integrated circuit element pads 21 are sequentially disposed. Note that these are the same number (four in this embodiment).

  The integrated circuit element 9 is connected to the vibration element 7. Between the integrated circuit element 9 and the vibration element 7, a pair of second integrated circuit element pads 23, a pair of second wirings 39, and a pair of vibration element pads 19 are sequentially disposed.

  In the manufacturing process of the oscillator 1, two of the plurality of external terminals 3 are also connected to the vibration element 7. For example, the substrate 5 is provided with a pair of cutting patterns 41 that connect two of the plurality of first wirings 37 to a pair of second integrated circuit element pads 23. This cutting pattern is cut before the oscillator 1 is completed. FIG. 1 shows a state after cutting, and FIGS. 2 and 4 (a) show a state before cutting.

  As described above, the substrate 5 is composed of a single-layer substrate that does not have a conductive layer parallel to the main surface. The wirings (first wiring 37 and the like) for connecting the front and back connection conductors 17, the first integrated circuit element pads 21, the second integrated circuit element pads 23, and the vibration element pads 19 to each other are all first main surfaces. 13a.

  Specifically, the first wiring 37 extends from the front / back connection conductor 17 to the first integrated circuit element pad 21 on the first main surface 13a. The second wiring 39 extends from the second integrated circuit element pad 23 to the vibration element pad 19 on the first main surface 13a. The cutting pattern 41 extends from the first wiring 37 to the second integrated circuit element pad 23 on the first main surface.

  Various pads and wirings are suitably arranged so that these wirings do not cross each other. Specifically, for example, it is as follows.

  A plurality (four) of the front and back connection conductors 17 (external terminals 3) are arranged in two rows in the x direction. Similarly, a plurality (four) of first integrated circuit element pads 21 are arranged in two rows in the x direction. The plurality of (four) first wirings 37 include a plurality of front and back connection conductors 17 arranged in two rows in the x direction and a plurality of first integrated circuit element pads 21 arranged in two rows in the x direction. Are arranged so as to be sequentially connected, and do not cross each other.

  The vibration element pads 19 are arranged in a direction (y direction) intersecting (orthogonal) with the arrangement direction of the vibration elements 7 and the integrated circuit elements 9. Similarly, the second integrated circuit element pads 23 are also arranged in the y direction. The pair of second integrated circuit element pads 23 are positioned on the vibration element pad 19 side with respect to the plurality of first integrated circuit element pads 21 in the x direction, and the plurality of first integrated circuit element pads 23 in the y direction. It is located on the center line CL side with respect to the integrated circuit element pad 21 (and the first wiring 37). The center line CL is a line that passes through the center of the first major surface 13a in the short direction (y direction) and extends in the longitudinal direction (x direction) of the first major surface 13a. The second wiring 39 extends without intersecting with the first wiring 37 disposed outside the second wiring 39 and without intersecting each other.

  The pair of cutting patterns 41 are, for example, two first wirings 37 on the vibration element pad 19 side among the plurality of first wirings 37, and positioned on the center line CL side with respect to the first wirings 37. Is connected to the pair of second integrated circuit element pads 23 and does not cross the first wiring 37 or the like.

  Arrangements or shapes of various pads, wirings, and the like of the substrate 5 are provided so as to be symmetric with respect to the center line CL as an axis of symmetry so that the electrical characteristics of the oscillator 1 are favorable. Specifically, such an arrangement or shape is as follows.

  The plurality of external terminals 3 are provided at positions symmetrical with respect to the center line CL in a plan view of the first main surface 13a. Specifically, the external terminal 3A and the external terminal 3D are in a line-symmetric position, and the external terminal 3B and the external terminal 3C are in a line-symmetric position.

  In the present embodiment, the plurality of external terminals 3 pass through the center in the longitudinal direction (x direction) of the first major surface 13a and extend in the short direction (y direction) of the first major surface 13a. Also, the arrangement is symmetrical with respect to each other. In addition, the external terminals 3B to 3D have the same shape (and area), whereas the external terminal 3A has a different shape from the external terminals 3B to 3D. However, the external terminals 3A to 3D may have the same shape.

  When the shapes of the external terminals 3 are different from each other as described above, whether or not the plurality of external terminals 3 are in a line-symmetric position may be comprehensively determined in consideration of the external shape of the external terminals 3, for example. . For example, since the external terminal 3A has a shape in which corners of the rectangular external terminals 3B to 3D are chamfered, the positions of the external terminals 3 may be compared on the assumption that the chamfer is not made. When such a determination is difficult, for example, the position may be compared using the graphic center of gravity of the external terminal 3. Hereinafter, the same applies to conductors other than the external terminal 3.

  The external terminals 3 </ b> A to 3 </ b> D are symmetrical with respect to the center line CL except that the corners of the external terminal 3 </ b> A are chamfered.

  Note that, when the shape is axisymmetric with respect to the center line CL, it is also assumed that the position is axisymmetric with respect to the center line CL. Hereinafter, the same applies to conductors other than the external terminal 3.

  The plurality of front and back connecting conductors 17 are provided at positions that are line-symmetric with respect to the center line CL at least in a portion exposed to the first main surface 13a, and more preferably have a line-symmetric shape. Specifically, at least in a portion exposed to the first main surface 13a, the front and back connection conductors 17A and the front and back connection conductors 17D are in a line-symmetrical position with each other, and more preferably have a line-symmetric shape. The front and back connecting conductors 17C are in a line-symmetric position with each other, and more preferably have a line-symmetric shape. In the present embodiment, the front and back connection conductors 17 have the same shape as the whole, and pass through the center in the longitudinal direction (x direction) of the first main surface 13a, and the short side of the first main surface 13a. A center line (not shown) extending in the direction (y direction) is also symmetrical with respect to each other.

  The plurality of first integrated circuit element pads 21 are provided at positions that are line-symmetric with respect to the center line CL, and more preferably have a line-symmetric shape. Specifically, the first integrated circuit element pad 21A and the first integrated circuit element pad 21D are in a line-symmetrical position with respect to each other, more preferably in a line-symmetrical shape. The first integrated circuit element pads 21C are in a line-symmetric position with each other, and more preferably have a line-symmetric shape.

  Similarly, the pair of second integrated circuit element pads 23 are provided at positions that are line-symmetric with respect to the center line CL, and more preferably have a line-symmetric shape.

  Similarly, the pair of vibration element pads 19 is provided in a line-symmetric position with respect to the center line CL, and more preferably has a line-symmetric shape.

  The plurality of first wirings 37 have a line-symmetric shape with respect to the center line CL. Specifically, the first wiring 37A and the first wiring 37D have a line-symmetric shape, and the first wiring 37B and the first wiring 37C have a line-symmetric shape. Since the first wiring 37 </ b> A and the first wiring 37 </ b> D are symmetrical with each other, the impedance is equal to each other on the assumption that the material and the thickness are the same. The same applies to the first wiring 37C and the first wiring 37B.

  Similarly, the pair of second wirings 39 has a line-symmetric shape with respect to the center line CL. Since these are shapes symmetrical with each other, the impedance is equal to each other on the assumption that the material and the thickness are the same.

  Similarly, the pair of cutting patterns 41 have a line-symmetric shape with respect to the center line CL. Since these are shapes symmetrical with each other, the impedance is equal to each other on the assumption that the material and the thickness are the same.

  As understood from the above, the pair of patterns from the external terminal 3A or 3D to the vibration element pad 19 via the cutting pattern 41, the second wiring 39, and the like are also symmetrical with each other. , Impedance is equal to each other.

  FIG. 5 is a flowchart showing an example of the procedure of the method for manufacturing the oscillator 1.

  First, the substrate 5, the vibration element 7 and the integrated circuit element 9 are prepared. These manufacturing methods may be similar to known methods. The substrate 5 is in a state where the cutting pattern 41 has not been cut yet.

  Next, the vibration element 7 is mounted on the substrate 5 (step ST1). This corresponds to the mounting process. Specifically, for example, the conductive adhesive 31 is disposed on the pair of vibration element pads 19, and then the vibration element 7 is disposed so that the extraction electrode 29 contacts the conductive adhesive 31. . Then, the conductive adhesive 31 is heated and cured.

  Next, the frequency of the vibration element 7 is adjusted (step ST2). Specifically, for example, first, the substrate 5 on which the vibration element 7 is mounted is placed in a vacuum atmosphere. Further, the probe of the electrical characteristic test apparatus (not shown) is brought into contact with the external terminals 3A and 3D. That is, the electrical characteristic test apparatus and the vibration element 7 are connected via the external terminal 3. Then, the oscillation frequency of the vibration element 7 is measured, and the excitation electrode 27 is etched with a laser or the like based on the measurement result, or conversely, a metal is deposited on the piezoelectric body 25. Thus, the oscillation frequency of the vibration element 7 is adjusted.

  Next, the vibration element 7 is sealed (step ST3). Specifically, for example, a glass sealing material is applied to one of the substrate 5 and the cap 11. Then, the cap 11 is placed on the substrate 5 in a vacuum atmosphere. Then, the glass sealing material is heated and then cooled to join the cap 11 to the substrate 5 and seal the vibration element 7.

  Next, the characteristic inspection of the vibration element 7 is performed (step ST4). This corresponds to the measurement process. Specifically, for example, first, a probe of an electrical characteristic test apparatus (not shown) is brought into contact with the external terminals 3A and 3D. That is, the electrical characteristic test apparatus and the vibration element 7 are connected via the external terminal 3. Then, for example, the oscillation frequency and crystal impedance value (CI value) of the vibration element 7 are measured.

  In addition, compared with the measurement result at the time of the frequency adjustment in step ST2, the inspection result includes a characteristic change accompanying the attachment of the cap 11 in step ST3. The inspection result is used for adjustment of the oscillation frequency by the integrated circuit element 9, for example. For example, the capacitance of the variable capacitance element included in the oscillation circuit of the integrated circuit element 9 is set based on the inspection result.

  Next, the pair of cutting patterns 41 are cut (step ST5). This corresponds to the cutting process. Specifically, for example, the cutting pattern 41 is cut by irradiating laser light, and the first wiring 37 and the second wiring 39 are electrically disconnected. At this time, depending on the intensity of the laser beam or the irradiation time, not only the cutting pattern 41 but also a part of the surface of the substrate 5 is removed at the cutting position, and a recess is formed in the first main surface 13a. There is a case. This concave portion is evidence that the cutting pattern 41 exists in the oscillator 1 completed as a product.

  Next, the integrated circuit element 9 is mounted on the substrate 5 (step ST6). Specifically, for example, an adhesive made of a thermosetting resin is applied to the substrate 5 or the integrated circuit element 9, the integrated circuit element 9 is placed on the substrate 5, and the adhesive is heated and cured.

  Thereafter, the bonding wire 35 is provided (step ST7), and the sealing resin 12 is provided on the substrate 5 (step ST8). These may be the same as known methods.

  Next, an electrical characteristic inspection is performed (step ST9). Specifically, for example, first, a probe of an electrical characteristic inspection device (not shown) is brought into contact with the external terminal 3. That is, the electrical characteristic inspection apparatus is connected to the integrated circuit element 9 through the external terminal 3. Then, the oscillation frequency and the like are measured.

  As described above, the substrate 5 for the oscillator 1 according to the present embodiment is a substrate on which the vibration element 7 and the integrated circuit element 9 are mounted side by side on the same main surface, and the two external terminals 3A and 3A of the external terminals 3 It has a pair of cutting patterns 41 that electrically connect 3D and a pair of vibration element pads 19 and is made of a single layer substrate.

  Accordingly, the substrate 5 does not have a conductive layer parallel to the main surface inside, and it is not necessary to provide an external terminal dedicated to the inspection of the vibration element 7. It is advantageous.

  In the oscillator 1 of the present embodiment, the pair of vibration element pads 19 are arranged in a direction (y direction) intersecting the arrangement direction (x direction) of the vibration element 7 and the integrated circuit element 9. The pair of second integrated circuit element pads 23 are arranged in the y direction.

  Therefore, for example, it is easy to make a pair of second wirings straight and simple, and the width and length of the pair of second wirings 39 are the same or have the same shape. It is easy to make them symmetrical with each other. As a result, for example, it is easy to make the impedances of the pair of second wirings 39 the same. By making the impedance of the pair of second wirings 39 the same, for example, setting and adjustment of the oscillation frequency is facilitated.

  In particular, in the present embodiment, the pair of second integrated circuit element pads 23 are provided at positions symmetrical with respect to each other with respect to the symmetry axis (center line CL) extending in the x direction. Since the pair of second wirings 39 are provided symmetrically with respect to the center line CL and are symmetrical with respect to the center line CL, the impedances of the two lines 39 are set to be the same, and the oscillation frequency is set. And the effect of facilitating adjustment is remarkable.

  In the oscillator 1 of this embodiment, the plurality of external terminals 3, the plurality of front and back connection conductors 17, the plurality of first wirings 37, and the plurality of first integrated circuit element pads 21 are each even in number. In addition, the plurality of external terminals 3, the plurality of front and back connection conductors 17, and the plurality of first integrated circuit element pads 21 are provided at positions symmetrical with respect to the center line CL. The plurality of first wirings 37 are symmetrical with respect to the center line CL.

  Therefore, for example, the wiring pattern can be easily simplified as a whole, and the oscillator 1 can be easily downsized. Further, for example, a pair of patterns from the plurality of front and back connection conductors 17A and 17D to the vibration element pad 19 via the cutting pattern 41 and the second wiring 39 are symmetrical with each other. Impedances can be the same. As a result, the error when measuring the electrical characteristics of the vibration element 7 via the external terminals 3A and 3D can be reduced.

  Further, in the oscillator 1 of the present embodiment, the pair of second integrated circuit element pads 23 is positioned on the side of the pair of vibration element pads 19 with respect to the plurality of first integrated circuit element pads 21 in the x direction. In the y direction, the plurality of first integrated circuit element pads 21 are located outside the pair of second integrated circuit element pads 23.

  Therefore, it is easy to make the second wiring 39 simple and short so that the first wiring 37 and the second wiring 39 do not cross each other. By shortening the first wiring 37, the influence of the impedance of the first wiring 37 on the oscillation frequency can be reduced.

  The present invention is not limited to the above embodiment, and may be implemented in various aspects.

  The predetermined number (number of external terminals, front and back connecting conductors, first integrated circuit element pads, first wiring, etc.) is not limited to four. Since it is sufficient that the electrical characteristics of the vibration element can be measured via two external terminals, it is sufficient that the number of external terminals is two or more. For example, only the GND terminal and the Vcc terminal may be provided, and the oscillation signal may be output wirelessly from the integrated circuit element. For example, six external terminals may be provided. In this case, for example, two output terminals that output the same or different oscillation signals may be provided as external terminals, or a terminal that outputs the temperature around the oscillator may be provided.

  The direction of the vibration element is not limited to the direction in which the arrangement direction of the vibration element and the integrated circuit element is the longitudinal direction. For example, the direction of the vibration element may be a direction in which the longitudinal direction is orthogonal to the arrangement direction. Further, in the case where the direction of the vibration element is made to coincide with the arrangement direction, the vibration element is preferably arranged with the extraction electrode side facing the integrated circuit element side, but the extraction electrode side is opposite to the integrated circuit element. You may arrange | position toward.

  Note that since the vibration element and the integrated circuit element have different shapes and sizes, the arrangement direction thereof may be comprehensively specified including the shape of these elements, the shape of the substrate, and the like. For example, in this embodiment, a rectangular substrate having a side extending in the x direction and a side extending in the y direction is used, and most of one of the vibration element and the integrated circuit element overlaps the other when viewed in the x direction. Therefore, even if the positions of the vibration element and the integrated circuit element (for example, the position of the center of gravity of the figure) are shifted from each other in the y direction, it may be specified that they are arranged in the x direction (the position of the center of gravity of both figures is the y direction). Even if they are deviated from each other, it is not necessary to determine the direction oblique to the x direction as the alignment direction. In addition, when it cannot judge in this way, you may specify a row direction using both figure centroids.

  The integrated circuit elements are not limited to those connected to the integrated circuit element pads by bonding wires, and may be mounted (surface mounted) on the integrated circuit element pads via bumps (solder or the like). .

  Further, the various pads and wirings do not have to be in a line-symmetric position or shape with respect to the symmetry axis extending in the arrangement direction. Note that the pair of second wirings can have the same width and length even if they are not line symmetric. For example, they are not line symmetric and can be the same in width and length even if they have the same shape, such as inclining in the same direction or bending in the same direction. Note that the length of the wiring may be measured with reference to a line passing through the center in the width direction of the wiring, for example. When the width of each wiring is not constant over the length direction, the lengths of the same width parts are compared between the two wirings, and if the lengths match in each width, the width and the length May be determined to be the same.

  The symmetry axis may not be the center line of the substrate. For example, the symmetry axis may be a line closer to one side of the substrate than the center line of the substrate.

  The pair of second integrated circuit element pads may not be located on the side of the pair of vibration element pads with respect to the plurality of first integrated circuit element pads, and in a direction intersecting the arrangement direction. The plurality of first integrated circuit element pads may not be located outside the pair of second integrated circuit element pads. For example, in a total of six integrated circuit element pads arranged in two rows in the arrangement direction (x direction), two of the vibration element pad sides are the pair of second integrated circuit element pads. Two in the center in the direction may be a pair of pads for the second integrated circuit element.

  The cutting pattern is not limited to a pattern that connects the first wiring and the second integrated element pad. The cutting pattern is a vibrating element from any position of the pattern from the front and back connecting conductors through the first wiring to the first integrated circuit element pad, and from the second integrated circuit element pad through the second wiring. It only needs to extend to any position of the pattern reaching the pad for use.

  The front and back connection conductors are not limited to the conductive layer formed on the inner surface of the side groove. For example, the front and back connection conductors may be a conductive layer formed on the inner surface of a through hole (through hole) penetrating the insulating substrate or a conductor filled in the through hole.

  In addition, from the detailed description of the present invention, it is possible to extract the following other inventions that do not require that the substrate is a single-layer substrate and that the substrate is provided with a cutting pattern.

(Invention 1)
A vibration element and an integrated circuit element including an oscillation circuit are substrates mounted side by side on the same main surface,
An insulating substrate having a first main surface and a second main surface behind the first main surface;
A predetermined number of external terminals that are two or more provided on the second main surface;
A pair of vibration element pads provided on the first main surface and on which the vibration element is mounted;
A predetermined number of first integrated circuit element pads and a pair of second integrated circuit element pads provided on the first main surface and connected to the integrated circuit elements;
The same number of front and back connection conductors extending from the predetermined number of external terminals in the thickness direction of the substrate and exposed to the first main surface,
A predetermined number of first wirings extending from the predetermined number of front and back connection conductors to the predetermined number of first integrated circuit element pads on the first main surface;
A pair of second wirings extending from the pair of second integrated circuit element pads to the pair of vibration element pads on the first main surface;
Have
The pair of vibration element pads are arranged in a direction intersecting with the arrangement direction of the vibration element and the integrated circuit element,
The pair of second integrated circuit element pads are arranged in a direction crossing the arrangement direction.

  In the above-described another invention, of course, a preferable mode is adopted in which the width and length of the pair of second wirings are the same, or the pair of second wirings are symmetrical with each other. May be.

  DESCRIPTION OF SYMBOLS 1 ... Oscillator, 3 ... External terminal, 5 ... Board | substrate, 7 ... Vibration element, 9 ... Integrated circuit element, 13 ... Insulation board | substrate, 13a ... 1st main surface, 13b ... 2nd main surface, 17 ... Front and back connection conductor, 19 DESCRIPTION OF SYMBOLS ... Pad for vibration element, 21 ... Pad for first integrated circuit element, 23 ... Pad for second integrated circuit element, 37 ... First wiring, 39 ... Second wiring, 41 ... Cutting pattern.

Claims (7)

A piezoelectric oscillator substrate;
A vibration element mounted on the main surface of the piezoelectric oscillator substrate ;
An integrated circuit element including an oscillation circuit mounted on the main surface side by side with the vibration element ;
A cap made of metal that covers only the vibration element of the vibration element and the integrated circuit element, and
Have
The piezoelectric oscillator substrate is:
An insulating substrate having a first main surface and a second main surface behind the first main surface;
A predetermined number of external terminals that are two or more provided on the second main surface;
A pair of vibration element pads provided on the first main surface and on which the vibration element is mounted;
A predetermined number of first integrated circuit element pads and a pair of second integrated circuit element pads provided on the first main surface and connected to the integrated circuit elements;
The same number of front and back connecting conductors that extend in the thickness direction of the insulating substrate from the predetermined number of external terminals and are exposed on the first main surface,
A predetermined number of first wirings extending from the predetermined number of front and back connection conductors to the predetermined number of first integrated circuit element pads on the first main surface;
A pair of second wirings extending from the pair of second integrated circuit element pads to the pair of vibration element pads on the first main surface;
On the first main surface, the second integrated circuit element pad is connected to the second integrated circuit element pad from any position from the front and back connection conductors to the first integrated circuit element pad via the first wiring. A pair of cutting patterns provided along a path extending to any position up to the vibration element pad via the wiring and interrupted at any position on the path;
Has, Ri Do a single layer substrate,
The pair of vibration element pads are arranged in a direction intersecting an arrangement direction of the vibration element and the integrated circuit element in the cap,
The pair of second integrated circuit element pads are located on the integrated circuit element side with respect to the cap, and are arranged in the intersecting direction,
The two first wirings directly or indirectly connected to the pair of the paths extend from both sides of the cap in the intersecting direction from the integrated circuit element side to the cap side,
The pair of paths extend from the pair of second integrated circuit element pads to the inside of the two first wirings at a position between the cap and the integrated circuit element in the arrangement direction. It reaches any position up to the pair of second wires
Piezoelectric oscillator. The piezoelectric oscillator according to claim 1 , wherein the pair of second wirings have the same width and length. The pair of second integrated circuit element pads are provided at positions symmetrical with respect to each other with respect to an axis of symmetry extending in the arrangement direction,
The pair of vibration element pads are provided at positions symmetrical with respect to the symmetry axis.
The 1 second wire pair, the piezoelectric oscillator according to claim 1 or 2 in the form of a line-symmetric with respect to said axis of symmetry. The predetermined number is an even number;
The predetermined number of external terminals are provided at positions symmetrical with respect to each other with respect to the symmetry axis,
The predetermined number of front and back connecting conductors are provided at positions symmetrical with respect to each other with respect to the symmetry axis,
The predetermined number of first integrated circuit element pads are provided at positions symmetrical with respect to the symmetry axis.
The piezoelectric oscillator according to claim 3 , wherein the predetermined number of first wirings have a line-symmetric shape with respect to the symmetry axis. In the arrangement direction, the pair of second integrated circuit element pads are located on the side of the pair of vibration element pads with respect to the predetermined number of first integrated circuit element pads,
In a direction crossing the arrangement direction, either the first integrated circuit device pad of the predetermined number of the preceding claims which is located outside with respect to the second integrated circuit element for pads of the one-to-one The piezoelectric oscillator according to item. The piezoelectric oscillator substrate has a recess in a portion of the first main surface where the pair of cutting patterns are interrupted.
The piezoelectric oscillator of any one of Claims 1-5. A method for manufacturing a piezoelectric oscillator according to claim 1 ,
A mounting step of mounting the vibration element on the pair of vibration element pads of the piezoelectric oscillator substrate in a state where the pair of cutting patterns extend over the entire length of the path ;
After the mounting step, a sealing step of covering the vibration element with the cap;
After the sealing step, a measuring step of measuring the electrical characteristics of the vibrating element via the pair two external terminals connected to the pad vibration element of the pair by cutting patterns,
A cutting step of cutting the pair of cutting patterns after the measuring step;
A method of manufacturing a piezoelectric oscillator having

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